Mechanical arm device
By designing rotating and limiting components in the robotic arm device, the problem of the robotic arm's inability to selectively grasp wafers was solved, resulting in savings in wafer box resources and reduction in production costs.
Patent Information
- Application Number
- CN202520007751.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-01-02
AI Technical Summary
Existing robotic arms cannot selectively grasp wafers, resulting in wasted wafer cassette resources and increased production costs.
Design a robotic arm device, including a robotic arm body, wafer chucks and a rotating component. Multiple wafer chucks are connected through the rotating component to achieve independent or group rotation. A limiting component is provided to ensure positional accuracy and support selective wafer gripping.
It enables selective grasping by robotic arms, saving wafer cell resources, reducing manpower, and lowering production costs.
Smart Images
Figure CN223786501U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer processing equipment and relates to a robotic arm device. Background Technology
[0002] In semiconductor manufacturing, wafers are an important raw material for semiconductor products. Their main component is silicon, and their outer contour is a thin sheet structure, often referred to as silicon wafers. Various circuit element structures can be processed on wafers to ultimately form chips, which realize the functional control of circuits and are indispensable in high-end manufacturing.
[0003] Currently, after wafers are sliced and polished, they typically need to be sent to multiple subsequent processing stations for etching, polishing, cleaning, and inspection. During these processing steps, the entire wafer cassette doesn't need to be processed; instead, individual wafers need to be processed separately. Since current slotted wafer chucks have 25 chucks fixed to the arm and required to be used simultaneously—meaning the arm grips 25 silicon wafers at a time—technicians usually need to physically separate these wafers before processing. However, this occupies a large number of wafer cassettes, increases manufacturing workload, reduces efficiency, and increases production costs.
[0004] Therefore, it is essential to provide a robotic arm device that can selectively grasp silicon wafers.
[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content
[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a robotic arm device to solve the problem that existing robotic arms cannot selectively grasp chips.
[0007] To achieve the above objectives, this utility model provides a robotic arm device, the robotic arm device comprising:
[0008] The main body of the robotic arm includes multiple robotic arm connecting parts;
[0009] Multiple wafer chucks, each wafer chuck including a chuck carrying part and a chuck connecting part, wherein the wafer is carried by the chuck carrying part;
[0010] A rotating component is located between the robotic arm connecting part and the chuck connecting part, connecting the robotic arm connecting part and the chuck connecting part, and driving the wafer chuck to rotate through the rotating component.
[0011] Optionally, the robotic arm device further includes a limiting member disposed on the limiting member of the robotic arm connecting part and / or the limiting member of the chuck connecting part, thereby limiting the rotation angle of the wafer chuck.
[0012] Optionally, the limiting member includes a snap-on limiting member or an electromagnetic limiting member.
[0013] Optionally, the wafer chuck can be rotated independently or selectively in groups by the action of a rotating component.
[0014] Optionally, the robotic arm connecting part is provided with a first through hole, the chuck connecting part is provided with a second through hole, and the robotic arm device also includes a rotating central shaft, the rotating central shaft passing through the first through hole and the second through hole, and the rotating component is sleeved on the rotating central shaft and located in the first through hole.
[0015] Optionally, the wafer chuck can rotate in the range of 90 to 180°.
[0016] Optionally, the robotic arm device further includes a main body rotation shaft connected to the main body of the robotic arm, which drives the main body of the robotic arm to rotate.
[0017] Optionally, the robotic arm device further includes a control unit that communicates with the rotating component to achieve automatic control of the rotating component.
[0018] Optionally, the wafer chuck includes an adsorption-type wafer chuck or a snap-on wafer chuck.
[0019] Optionally, the wafer chuck comprises N units, where 2 ≤ N ≤ 50.
[0020] This invention provides a robotic arm device. The robotic arm body is connected to multiple robotic arm connecting parts, and these connecting parts are connected to multiple wafer chucks via rotating components. Each wafer chuck includes a chuck bearing part and a chuck connecting part. The rotating component is located between the robotic arm connecting parts and the chuck connecting parts, and the chuck bearing part carries the wafers. This structure allows the wafer chucks to rotate independently or selectively in groups under the action of the rotating component. Additionally, the structure includes a limiting component to ensure the positional accuracy of the wafer chucks when they return to their original position. This invention effectively enables the robotic arm to selectively grasp target wafers, solving the problem of physically batching wafers in actual production, effectively saving wafer cassette resources, reducing labor, and lowering production costs. Attached Figure Description
[0021] Figure 1 The diagram shown is a structural schematic of the robotic arm device provided by this utility model.
[0022] Figure 2 The diagram shows the structure of the wafer chuck of this invention when gripping a target wafer.
[0023] Figure 3 The diagram shows the structure of the rotating component connecting the robotic arm and the wafer chuck of this utility model.
[0024] Figure 4 The diagram shown is an exploded view of the rotating component connecting the robotic arm and the wafer chuck of this utility model.
[0025] Figure 5 The diagram shown is an operation flowchart of the robotic arm device in this utility model.
[0026] Explanation of reference numerals in the attached figures
[0027] 100 Robotic Arm Main Body
[0028] 200 Main body rotation axis
[0029] 300 Robotic Arm Connector
[0030] 400 Rotating Part
[0031] 401 First Component
[0032] 402 Second Component
[0033] 410 Rotating central axis
[0034] 420 First Through Hole
[0035] 430 Second Through Hole
[0036] 500 wafer chucks
[0037] 501 Chuck Carrying Unit
[0038] 502 Chuck Connection Section
[0039] 600 limit component
[0040] 601 Card Slot
[0041] 602 Card Block
[0042] 700 wafers Detailed Implementation
[0043] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.
[0044] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0045] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0046] See Figures 1-4 This embodiment provides a robotic arm device, which includes: a robotic arm body 100, multiple wafer chucks 500 and a rotating component 400.
[0047] The robotic arm body 100 includes multiple robotic arm connecting parts 300; the wafer chuck 500 includes a chuck bearing part 501 and a chuck connecting part 502, and the wafer 700 is carried by the chuck bearing part 501; the rotating member 400 is located between the robotic arm connecting parts 300 and the chuck connecting part 502, connects the robotic arm connecting parts 300 and the chuck connecting part 502, and drives the wafer chuck 500 to rotate through the rotating member 400.
[0048] See Figure 1 As an example, the robotic arm body 100 is also connected to a main body rotation shaft 200, which drives the robotic arm body 100 to rotate.
[0049] Specifically, the rotating component 400 can drive the wafer chuck 500 to rotate horizontally. When the main body rotation axis 200 is connected to the main body of the robotic arm 100, the main body rotation axis 200 can realize the overall vertical rotation of the main body of the robotic arm 100, thereby enabling the adjustment of the rotation angle of the wafer chuck 500 in three dimensions, expanding the application range and improving the ease of operation.
[0050] As an example, the wafer chuck 500 includes an adsorption wafer chuck or a snap-on wafer chuck.
[0051] In this embodiment, the wafer chuck 500 is an adsorption-type wafer chuck. The adsorption-type wafer chuck uses electrostatic adsorption to fix and clamp the wafer 700, that is, it uses Coulomb force to adsorb the wafer 700, allowing the wafer 700 to fit tightly against the surface of the chuck support portion 501. The chuck support portion 501 not only fixes the wafer 700, but also controls the surface temperature of the wafer 700 by blowing air from the back. In some other embodiments, the wafer chuck 500 may also be a snap-on type wafer chuck; the working principle of the snap-on type wafer chuck will not be described here.
[0052] As an example, the number of wafer chucks 500 can be N, where 2 ≤ N ≤ 50.
[0053] In this embodiment, the number of wafer chucks 500 is 25. In some other embodiments, the number of wafer chucks 500, that is, the value of N of the wafer chucks 500 mounted on the robotic arm body 100, can be such as 2, 5, 10, 15, 25, 30, 45, 50, etc., and the value of N can be set according to actual needs.
[0054] As an example, the shape of the chuck support portion 501 may include one of the following: U-shaped, V-shaped, or X-shaped.
[0055] In this embodiment, as Figure 2 As shown, the chuck support portion 501 is U-shaped, but it is not limited to this. It can also be a combination of V-shape, X-shape, or U-shape, V-shape, and X-shape.
[0056] As an example, see Figure 3 and Figure 4 The robotic arm connecting part 300 may be provided with a first through hole 420, the chuck connecting part 502 may be provided with a second through hole 430, and the robotic arm device may also include a rotating central shaft 410, the rotating central shaft 410 passing through the first through hole 420 and the second through hole 430, and the rotating component 400 is sleeved on the rotating central shaft 410 and located in the first through hole 420.
[0057] Specifically, the rotating component 400 can be divided into a first component 401 and a second component 402, and the first component 401 can be located within the second through hole 430. A stepped surface is formed between the first component 401 and the second component 402 to support the wafer chuck 500. The connection between the rotating component 400 and the wafer chuck 500 can include threaded connection, snap-fit connection, etc.
[0058] As an example, the wafer chuck 500 can be rotated independently by the action of the rotating member 400, or the wafer chuck 500 can be selectively rotated in groups by the rotating member 400.
[0059] Specifically, as needed, the wafer chuck 500 can be rotated independently by adjusting the rotating member 400. Of course, multiple rotating members 400 can also maintain the same operation, thereby realizing the selective group rotation operation of the wafer chuck 500. The specific operation method will not be described here.
[0060] As an example, the robotic arm device also includes a control unit (not shown) that communicates with the rotating component 400 to achieve automatic control of the rotating component 400.
[0061] Specifically, when the control component is set, the automatic control of the rotating component 400 can be achieved through communication between the control component and the rotating component 400, thus realizing convenient and accurate operation. Of course, the control component can also be omitted, and the rotation angle of the rotating component 400 can be adjusted manually to achieve the adjustment of the rotation angle of the wafer chuck 500.
[0062] The communication method between the control component and the rotating component 400 may include wired communication and / or wireless communication, which can be selected as needed.
[0063] In some other embodiments, the second component 402 of the rotating component 400 may further include an up-and-down adjustment structure to adjust the spacing between the wafer chucks 500, so that the wafer chucks 500 can be adapted to wafers 700 of different thicknesses. The distance between the upper and lower parts of the wafer chucks 500 may be in the range of 9.5 to 10.5 mm, such as 9.5 mm, 9.8 mm, 10 mm, 10.2 mm, 10.5 mm, etc.
[0064] Furthermore, see Figure 2The rotating component 400 controls the rotation of the wafer chuck 500 by an angle α ranging from 90° to 180°. For example, the angle α can be any value within this range, such as 90°, 100°, 120°, 140°, 160°, or 180°.
[0065] As an example, see Figure 3 The robotic arm device may further include a limiting member 600 on the robotic arm connecting part 300 and / or the chuck connecting part 502, and the limiting member 600 limits the rotation angle of the wafer chuck 500.
[0066] As an example, see Figure 4 The limiting member 600 may include a snap-on limiting member or an electromagnetic limiting member.
[0067] In this embodiment, the limiting member 600 is a snap-on limiting member, and the limiting member 600 includes a locking block 602 located on the robotic arm connecting part 300 and a locking groove 601 located on the chuck connecting part 502.
[0068] In this embodiment, both the limiting member 600 and the rotating member 400 preferably communicate with the control member. When the control member controls the rotating member 400 to rotate, the control member simultaneously communicates with the limiting member 600. When the locking block 602 is in a sunken state, the wafer chuck 500 can be rotated under the control of the rotating member 400. When the wafer chuck 500 returns to its original position, the control member disconnects from the circuits of the wafer chuck 500 and the limiting member 600, the locking block 602 floats up and locks into the slot 601, thereby fixing the wafer chuck 500 in its original position. In some other embodiments, the limiting member 600 may further include a first self-locking magnet and a second self-locking magnet. When the control member communicates with the rotating member 400 and the limiting member 600, the first self-locking magnet and the second self-locking magnet are disconnected, and the rotating member 400 can drive the wafer chuck 500 to rotate. When the wafer chuck 500 returns to its original position, the control member is disconnected from the circuit of the wafer chuck 500 and the limiting member 600, and the first self-locking magnet and the second self-locking magnet will attract each other magnetically, automatically locking the wafer chuck 500.
[0069] See Figure 5In this embodiment, taking the selective processing of wafers located at odd-numbered positions in a wafer cassette (not shown) as an example, the specific operation process of the robotic arm device is described in detail. First, the wafer cassette is placed on the machine tool, and the wafer cassette door is opened. Then, the machine tool reads all wafers and their positions in the wafer cassette. The machine tool's control unit receives the work order and determines the wafers and their positions to be processed. After the machine tool completes the reading, the control unit transmits the instruction to the rotating component 400 and the main rotation axis 200 on the robotic arm device. According to the processing requirements, the rotating component 400 rotates the wafer chuck located at an even-numbered position in the wafer cassette. Next, the wafer chuck 500 of the robotic arm device picks up the wafers located at odd-numbered positions in the wafer cassette that need to be processed. Afterward, the non-working chuck returns to its original position. The robotic arm device places the wafers to be processed into the processing tray of the machine tool via the main rotation axis 200. Once the wafers located at odd-numbered positions in the wafer cassette have been processed, the wafer chuck 500 removes the processed wafers. At this time, the non-operation chuck rotates, and the robotic arm returns the processed wafers to the wafer cassette. The non-operation chuck returns to its original position, and the operation is complete.
[0070] In summary, this utility model provides a robotic arm device that connects the main body of the robotic arm to multiple robotic arm connecting parts. These connecting parts are then connected to multiple wafer chucks via rotating components. Each wafer chuck includes a chuck bearing part and a chuck connecting part. The rotating component is located between the robotic arm connecting parts and the chuck connecting parts, and the chuck bearing part carries the wafers. This structure allows the wafer chucks to rotate independently or selectively in groups under the action of the rotating component. Additionally, a limiting component is included to ensure the positional accuracy of the wafer chucks when they return to their original position. This utility model effectively enables the robotic arm to selectively grasp target wafers, solving the problem of physically batching wafers in actual production. It effectively saves wafer cassette resources, reduces labor, and lowers production costs. This utility model effectively overcomes the various shortcomings of existing technologies and has high industrial application value.
[0071] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A robotic arm device, characterized in that, The robotic arm device includes: The main body of the robotic arm includes multiple robotic arm connecting parts; Multiple wafer chucks, each wafer chuck including a chuck carrying part and a chuck connecting part, wherein the wafer is carried by the chuck carrying part; A rotating component is located between the robotic arm connecting part and the chuck connecting part, connecting the robotic arm connecting part and the chuck connecting part, and driving the wafer chuck to rotate through the rotating component.
2. The robotic arm device according to claim 1, characterized in that: The robotic arm device also includes a limiting member disposed on the robotic arm connecting part and / or the chuck connecting part, which limits the rotation angle of the wafer chuck.
3. The robotic arm device according to claim 2, characterized in that: The limiting component includes a snap-on limiting component or an electromagnetic limiting component.
4. The robotic arm device according to claim 1, characterized in that: The wafer chuck can be rotated independently or selectively in groups by rotating components.
5. The robotic arm device according to claim 1, characterized in that: The robotic arm connecting part is provided with a first through hole, the chuck connecting part is provided with a second through hole, and the robotic arm device also includes a rotating central shaft, which passes through the first through hole and the second through hole. The rotating component is sleeved on the rotating central shaft and located in the first through hole.
6. The robotic arm device according to claim 1, characterized in that: The wafer chuck can rotate in the range of 90 to 180 degrees.
7. The robotic arm device according to claim 1, characterized in that: The robotic arm device also includes a main body rotation shaft connected to the main body of the robotic arm, which drives the main body of the robotic arm to rotate.
8. The robotic arm device according to claim 1, characterized in that: The robotic arm device also includes a control unit that communicates with the rotating component and enables automatic control of the rotating component.
9. The robotic arm device according to claim 1, characterized in that, The wafer chuck includes an adsorption type wafer chuck or a snap-on type wafer chuck.
10. The robotic arm device according to claim 1, characterized in that, The wafer chuck comprises N units, where 2 ≤ N ≤ 50.