Wafer clamping structure

Abstract

The utility model relates to a wafer clamping structure, and belongs to the technical field of wafer processing auxiliary equipment.The wafer clamping structure comprises a rotating shaft and a plurality of clamping arms arranged in the circumferential direction of the rotating shaft, the lower side of each clamping arm is provided with two oppositely-arranged clamping plates, the lower ends of the clamping plates are bent in the direction close to each other, and the clamping plates are arranged on the rotating shaft. The upper sides of the bent ends of the clamping plates are fixedly connected with mounting blocks, and the ends, close to each other, of the mounting blocks on the same clamping arm are arranged to be inclined faces which are upward and inclined in the direction away from each other. The wafer clamping device has the effect of being convenient to clamp wafers of different specifications.

Description

Technical Field

[0001] This application relates to the technical field of wafer processing auxiliary equipment, and in particular to a wafer clamping structure. Background Technology

[0002] Reflow soldering is an important process in electronic manufacturing, primarily used for soldering tiny components. Advanced semiconductor packaging processes employ a more advanced formic acid reflow process, eliminating the need for spin coating and flux cleaning, offering advantages such as simplicity, low cost, and high throughput.

[0003] Chinese patent CN114029578A discloses a reflow soldering process and its modular structure, including a lower heating plate, an upper heating plate, a loading unit, a cold plate unit, a rotary transfer unit, an upper sealing cavity, and a lower sealing cavity. The loading unit and the rotary transfer unit are responsible for transferring the wafer from the FOUP to the lower heating plate. During the reflow process, the upper sealing cavity descends to form a sealed vacuum cavity with the lower sealing cavity, controlling the temperature of the lower heating plate and the upper heating plate. At the same time, nitrogen gas containing formic acid is filled into the cavity. After the wafer reflow process is completed, the cold plate unit is used to cool the wafer after the process. It is suitable for reflow soldering in wafer packaging processes and has the characteristics of simple process, high throughput, and low per-wafer process cost.

[0004] In related technologies, wafers are inserted into slots on a wafer transfer unit by lowering and rotating the unit. Since the specifications of the slots on the wafer transfer unit are fixed, the wafer transfer unit can only accommodate wafers of one specification and is not suitable for wafers of different specifications, which can easily lead to limitations in the use of the wafer transfer unit. Utility Model Content

[0005] To facilitate the clamping of wafers of different sizes, this application provides a wafer clamping structure.

[0006] The wafer clamping structure provided in this application adopts the following technical solution:

[0007] A wafer clamping structure includes a rotating shaft and a plurality of clamping arms arranged circumferentially along the rotating shaft. Each clamping arm has two clamping plates arranged opposite each other on its lower side. The lower ends of the clamping plates are bent toward each other. Mounting blocks are fixedly connected to the upper side of the bent ends of the clamping plates. The ends of the mounting blocks on the same clamping arm that are close to each other are all set as inclined surfaces that are inclined upward and away from each other.

[0008] By adopting the above technical solution, when clamping wafers of different specifications by clamping plates, the connection between the relative clamping plates coincides with the wafer diameter, the sidewall of the wafer contacts the inclined surface of the mounting block on the clamping plate, and the inclined surface at the end of the mounting block enables the clamping plate to clamp wafers of different specifications within a certain range, thereby improving the applicability of wafer clamping.

[0009] Optionally, the clamping arm has an even number of insertion slots on its lower side, and the upper ends of the clamping plates arranged opposite to each other are inserted into the corresponding insertion slots. The clamping arm is provided with a fixing member that is detachably connected to the clamping plate.

[0010] By adopting the above technical solution, when the distance between the clamping plates is difficult to adapt to wafers with larger diameters, the clamping plates are removed from the clamping arms and inserted into new insertion slots until the distance between the clamping plates is adapted to the wafer diameter. The clamping plates are then fixed back onto the clamping arms by fasteners, which further facilitates the clamping of wafers of different specifications.

[0011] Optionally, the fastener includes bolts adapted to the clamping plate, and the clamping arm and the clamping plate are fixedly connected by the bolts.

[0012] By adopting the above technical solution, the clamping plate and the clamping arm are fixed by bolts, which facilitates the disassembly and installation of the clamping plate, and thus facilitates the adjustment of the distance between the relative clamping plates, making it convenient to clamp wafers of different specifications.

[0013] Optionally, a sliding groove is provided on the lower side of the clamping arm, and the upper ends of the oppositely arranged clamping plates are inserted into the corresponding sliding grooves and slidably connected to the clamping arm. The clamping arm is provided with a driving component that drives the oppositely arranged clamping plates to slide in a direction that moves closer to or further away from each other.

[0014] By adopting the above technical solution, the driving component drives the opposing clamping plates to move along the sliding groove in a direction that is closer to or further away from each other, which makes it easier to adjust the distance between the clamping plates to adapt to the wafers to be clamped, and further facilitates the clamping of wafers of different specifications.

[0015] Optionally, the drive assembly includes a bidirectional lead screw that corresponds one-to-one with the clamping arm and is rotatably connected to the clamping arm. The bidirectional lead screw passes through and is threadedly connected to the corresponding clamping plate.

[0016] By adopting the above technical solution, the bidirectional lead screw is driven to rotate and the clamping plates are driven to move closer or further apart from each other, which makes it easy to adjust the distance between the clamping plates and to clamp wafers of different specifications.

[0017] Optionally, the bidirectional lead screw is a ball screw, and a drive block is threadedly connected to one end of the bidirectional lead screw near the rotating shaft. A spring is installed between the drive block and the corresponding clamping arm. A cavity is opened in the rotating shaft, and the end of the drive block away from the bidirectional lead screw is inserted into the cavity. A drive column located on the rotation axis of the rotating shaft is provided in the cavity. The end of the drive column near the drive block is set as a cone with a gradually decreasing diameter and abutting against the end of the drive block. A first hydraulic cylinder is provided in the rotating shaft to drive the drive column to move.

[0018] By adopting the above technical solution, the first hydraulic cylinder drives the drive column to move closer to or further away from the drive block. At this time, the drive block slides closer to or further away from the corresponding clamping arm under the drive of the conical surface at the lower end of the drive column and the spring, which facilitates the rotation of the bidirectional lead screw and the adjustment of the distance between the clamping plates.

[0019] Optionally, the lower end of the rotating shaft is provided with a movable shaft that is slidably connected to the rotating shaft. A second hydraulic cylinder is provided between the movable shaft and the rotating shaft to connect the two. A limiting plate corresponding to each of the clamping arms is provided on the outside of the movable shaft. The limiting plates all pass through the corresponding clamping plates and are slidably connected to the clamping plates. When the clamping plates clamp the wafer and move, the limiting plates contact the upper side of the wafer.

[0020] By adopting the above technical solution, the moving shaft drives the clamping arm to rotate until the line connecting the opposite clamping plates coincides with the wafer diameter. At this time, the limiting plate is located at the end of the opposite clamping plate near the clamping arm. The second hydraulic cylinder drives the rotating shaft to move the clamping arm upward until the limiting plate contacts the upper side of the wafer, thereby limiting the wafer in the vertical direction and improving the stability of the wafer movement.

[0021] Optionally, a buffer pad is provided on the lower side of each limiting plate.

[0022] By adopting the above technical solution, when the bent end of the limiting plate and clamping plate limits the wafer, the buffer pad contacts the wafer, reducing the possibility of the limiting plate damaging the wafer surface, and further improving the stability of wafer movement.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] When clamping wafers of different specifications by clamping plates, the connection between the relative clamping plates coincides with the wafer diameter, the sidewall of the wafer contacts the inclined surface of the mounting block on the clamping plate, and the inclined surface at the end of the mounting block enables the clamping plate to clamp wafers of different specifications within a certain range, thus improving the applicability of wafer clamping.

[0025] Remove the clamping plate from the clamping arm and insert it into a new insertion slot until the distance between the clamping plates is adapted to the wafer diameter. Then, fix the clamping plate back onto the clamping arm using the fasteners to facilitate clamping wafers of different sizes.

[0026] The first hydraulic cylinder drives the drive column to move closer to or further away from the drive block. At this time, the drive block slides closer to or further away from the corresponding clamping arm under the drive of the conical surface at the lower end of the drive column and the spring, which facilitates the rotation of the bidirectional lead screw and the adjustment of the distance between the clamping plates. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the wafer clamping structure in Embodiment 1 of this application.

[0028] Figure 2 This is a structural schematic diagram illustrating the positional relationship between the moving axis and the rotating axis in Embodiment 1 of this application.

[0029] Figure 3 yes Figure 2 Enlarged view of the structure at point A in the middle.

[0030] Figure 4 This is a structural diagram illustrating the positional relationship between the limiting plate and the worktable in Embodiment 2 of this application.

[0031] Figure 5 This is a structural diagram illustrating the positional relationship between the drive component and the worktable in Embodiment 2 of this application.

[0032] Figure 6 yes Figure 5 Enlarged view of the structure at point B.

[0033] Explanation of reference numerals in the attached drawings: 1. Worktable; 11. Work plate; 12. Support column; 2. Moving shaft; 21. Rotating shaft; 211. Insertion column; 212. Cavity; 22. Mounting slot; 23. Second hydraulic cylinder; 3. Clamping arm; 31. Clamping plate; 311. Insertion plate; 32. Mounting block; 33. Insertion slot; 34. Sliding slot; 35. Drive slot; 4. Drive assembly; 41. Two-way lead screw; 42. Drive block; 43. Spring; 44. Drive column; 45. First hydraulic cylinder; 5. Limiting plate; 51. Buffer pad. Detailed Implementation

[0034] The present application will be further described in detail below with reference to the accompanying drawings.

[0035] This application discloses a wafer clamping structure. Example

[0036] Reference Figure 1 and Figure 2A wafer clamping structure includes a moving shaft 2 that passes through the center of a disc-shaped worktable 1 and is rotatably connected to the worktable 1. A motor (not shown in the figure) that drives the moving shaft 2 to rotate is installed on the lower side of the worktable 1. The worktable 1 is provided with six disc-shaped work disks 11 that are evenly distributed around the circumference of the moving shaft 2. Each work disk 11 is inserted into and fixedly connected with three support columns 12 that are evenly distributed around the circumference of the center line of the work disk 11. When the wafer is placed on the work disk 11, the lower side of the wafer abuts against the corresponding support column 12.

[0037] Reference Figure 2 The upper end of the movable shaft 2 is provided with a rotating shaft 21, and the lower end of the rotating shaft 21 is fixedly connected to a plug-in post 211. The plug-in post 211 has a square cross-section (not shown in the figure). The upper end of the movable shaft 2 is provided with a mounting groove 22, and the rotating shaft 21 is slidably connected to the movable shaft 2 by inserting the plug-in post 211 into the mounting groove 22. A second hydraulic cylinder 23 is provided in the mounting groove 22 and is fixedly connected to the side wall of the movable shaft 2. The telescopic rod of the second hydraulic cylinder 23 faces the plug-in post 211 and is fixedly connected to the plug-in post 211.

[0038] Reference Figure 1 and Figure 2 A clamping arm 3, corresponding to the working disc 11 and evenly distributed around the circumference of the rotating shaft 21, is fixedly connected to the outer side of the rotating shaft 21. Each clamping arm 3 has two vertically arranged clamping plates 31 on its lower side, and the lower ends of the clamping plates 31 are bent at right angles towards each other. A mounting block 32, with a length shorter than the length of the bent end of the clamping plate 31, is fixedly connected to the upper side of the bent end of each clamping plate 31. The ends of the mounting blocks 32 that are far apart from each other abut against the vertical ends of the corresponding clamping plates 31, and the ends of the mounting blocks 32 that are close to each other are set as inclined surfaces that are upward and incline towards each other.

[0039] The moving shaft 2 drives the clamping arm 3 to rotate until the line connecting the opposite clamping plates 31 coincides with the wafer diameter. The second hydraulic cylinder 23 drives the rotating shaft 21 to move the clamping arm 3 upward. When the wafer diameter and the distance between the mounting blocks 32 and one end of each other are appropriate, the lower side of the wafer abuts against the bent end of the clamping plate 31, and the sidewall of the wafer contacts the side of the mounting blocks 32 that are close to each other.

[0040] When the wafer diameter is greater than the distance between the adjacent ends of the mounting blocks 32, the wafer sidewall contacts the inclined surface of the mounting block 32 on the clamping plate 31. Thus, the inclined surface at the end of the mounting block 32 enables the clamping plate 31 to clamp wafers of different specifications within a certain range, thereby improving the applicability of the clamping plate 31.

[0041] Reference Figure 2 and Figure 3Each clamping arm 3 has an even number of insertion slots 33 extending through the width of the clamping arm 3 on its lower side. In this embodiment, four slots are provided and symmetrically arranged on both sides of the center line of the corresponding working plate 11. Each clamping plate 31 has an insertion plate 311 fixedly connected to its upper end, which is adapted to the insertion slots 33. The clamping arm 3 is also provided with a fixing member for fixing the clamping plate 31. In this embodiment, the fixing member is a bolt (not shown in the figure), which passes through the clamping arm 3 and is threadedly connected to the insertion plate 311.

[0042] When the distance between the clamping plates 31 is difficult to accommodate wafers with larger diameters, the clamping plates 31 are removed from the clamping arms 3 and inserted into new insertion slots 33. At this time, the distance between the clamping plates 31 is adapted to the wafer diameter. The clamping plates 31 are then fixed back onto the clamping arms 3 with bolts, which facilitates the disassembly and installation of the clamping plates 31 and makes it easier to adjust the distance between the relative clamping plates 31.

[0043] The implementation principle of Example 1 is as follows: When the wafer diameter is adapted to the distance between the two ends of the mounting blocks 32, the lower side of the wafer abuts against the bent end of the clamping plate 31, and the sidewall of the wafer contacts the side of the mounting blocks 32 that are close to each other; when the wafer diameter is larger than the distance between the two ends of the mounting blocks 32, the sidewall of the wafer contacts the inclined surface of the mounting blocks 32 on the clamping plate 31; when the distance between the two ends of the mounting blocks 32 is difficult to accommodate wafers with larger diameters, the clamping plate 31 is removed from the clamping arm 3 and inserted into a new insertion slot 33, thereby adjusting the distance between the clamping plates 31 to accommodate wafers with larger diameters, making it easier to clamp wafers of different specifications. Example

[0044] Reference Figure 4 and Figure 5 The difference between this embodiment and embodiment 1 is that each clamping arm 3 has a sliding groove 34 on its lower side, which is arranged along the length of the clamping arm 3. The upper ends of the clamping plates 31 arranged opposite each other are inserted into the corresponding sliding grooves 34 and are slidably connected to the clamping arm 3. Each clamping arm 3 is provided with a driving component 4 that drives the clamping plates 31 arranged opposite each other to slide towards each other or away from each other.

[0045] Reference Figure 5 and Figure 6 The drive assembly 4 includes a bidirectional lead screw 41 that corresponds to and is rotatably connected to the clamping arm 3. The upper ends of the opposing clamping plates 31 are all sleeved on the corresponding bidirectional lead screw 41 and threadedly connected to the bidirectional lead screw 41. The bidirectional lead screw 41 is a ball screw, and the end of the bidirectional lead screw 41 near the rotating shaft 21 is sleeved and threadedly connected to a drive block 42 with a square cross section in the vertical direction.

[0046] Each clamping arm 3 has a drive groove 35 inside that is adapted to the drive block 42. The drive block 42 is slidably connected to the clamping arm 3 through the drive groove 35, and each drive groove 35 is provided with a spring 43 that connects the clamping arm 3 and the drive block 42.

[0047] Reference Figure 4 , Figure 5 and Figure 6 The rotating shaft 21 has a cavity 212 inside. The end of the drive block 42 away from the corresponding bidirectional lead screw 41 passes through the side wall of the rotating shaft 21 and is inserted into the cavity 212. The cavity 212 has a vertical drive column 44 located above the drive block 42. The rotation axis of the drive column 44 coincides with the rotation axis of the rotating shaft 21, and the lower end of the drive column 44 is set as a cone with a diameter that gradually decreases towards the drive block 42. The end of the drive block 42 away from the bidirectional lead screw 41 can always abut against the conical surface of the drive column 44. The upper end of the cavity 212 is fixedly connected to a first hydraulic cylinder 45. The extension rod of the first hydraulic cylinder 45 faces the drive column 44 and is fixedly connected to the drive column 44.

[0048] The first hydraulic cylinder 45 drives the drive column 44 to move closer to or further away from the drive block 42. At this time, the drive block 42 slides closer to or further away from the corresponding clamping arm 3 under the drive of the conical surface at the lower end of the drive column 44 and the spring 43, which facilitates the rotation of the bidirectional lead screw 41 and the adjustment of the distance between the clamping plates 31.

[0049] A limiting plate 5 is fixedly connected to the outside of the moving shaft 2, located on the lower side of the clamping arm 3 and corresponding to each clamping arm 3. The limiting plate 5 passes through the two clamping plates 31 on the lower side of the corresponding clamping arm 3 and is slidably connected to the clamping plate 31 in the vertical direction. A buffer pad 51 is fixedly connected to the lower side of each limiting plate 5. When the clamping plate 31 drives the wafer to move, the buffer pad 51 contacts the upper side of the wafer.

[0050] The moving shaft 2 drives the clamping arm 3 to rotate until the line connecting the opposite clamping plates 31 coincides with the wafer diameter. At this time, the limiting plate 5 is located at the end of the opposite clamping plate 31 near the clamping arm 3. The second hydraulic cylinder 23 drives the rotating shaft 21 to move the clamping arm 3 upward until the limiting plate 5 and the bent end of the clamping plate 31 limit the wafer. At this time, the buffer pad 51 contacts the wafer, reducing the possibility of the limiting plate 5 damaging the wafer surface, and further improving the stability of the wafer movement.

[0051] The implementation principle of Example 2 is as follows: the first hydraulic cylinder 45 drives the drive column 44 to move closer to or further away from the drive block 42. At this time, the drive block 42 slides closer to or further away from the corresponding clamping arm 3 under the drive of the conical surface at the lower end of the drive column 44 and the spring 43, which facilitates the rotation of the bidirectional lead screw 41 and the adjustment of the distance between the clamping plates 31.

[0052] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer clamping structure, characterized in that: It includes a rotating shaft (21) and a plurality of clamping arms (3) arranged circumferentially along the rotating shaft (21). Each clamping arm (3) has two clamping plates (31) arranged opposite each other on its lower side. The lower ends of the clamping plates (31) are bent toward each other. An installation block (32) is fixedly connected to the upper side of the bent end of each clamping plate (31). The ends of the installation blocks (32) on the same clamping arm (3) that are close to each other are all set as inclined surfaces that are inclined upward and away from each other.

2. The wafer clamping structure according to claim 1, characterized in that: The clamping arm (3) has an even number of insertion slots (33) on its lower side. The upper ends of the clamping plates (31) arranged opposite to each other are inserted into the corresponding insertion slots (33). The clamping arm (3) is provided with a fixing member that can be detachably connected to the clamping plates (31).

3. The wafer clamping structure according to claim 2, characterized in that: The fastener includes bolts adapted to the clamping plate (31), and the clamping arm (3) and the clamping plate (31) are fixedly connected by the bolts.

4. The wafer clamping structure according to claim 1, characterized in that: The clamping arm (3) has a sliding groove (34) on its lower side. The upper ends of the clamping plates (31) arranged opposite to each other are inserted into the corresponding sliding groove (34) and are slidably connected to the clamping arm (3). The clamping arm (3) is provided with a driving component (4) that drives the clamping plates (31) arranged opposite to each other to slide in a direction closer to or further away from each other.

5. A wafer clamping structure according to claim 4, characterized in that: The drive assembly (4) includes a bidirectional lead screw (41) that corresponds to and is rotatably connected to the clamping arm (3). The bidirectional lead screw (41) is threaded through and connected to the corresponding clamping plate (31).

6. The wafer clamping structure according to claim 5, characterized in that: The bidirectional lead screw (41) is a ball screw. The end of the bidirectional lead screw (41) near the rotating shaft (21) is fitted with a drive block (42) and threadedly connected. A spring (43) is installed between the drive block (42) and the corresponding clamping arm (3). A cavity (212) is opened in the rotating shaft (21). The end of the drive block (42) away from the bidirectional lead screw (41) is inserted into the cavity (212). A drive column (44) located on the rotation axis of the rotating shaft (21) is provided in the cavity (212). The end of the drive column (44) near the drive block (42) is set as a cone with a gradually decreasing diameter and abutting against the end of the drive block (42). A first hydraulic cylinder (45) is provided in the rotating shaft (21) to drive the drive column (44) to move.

7. A wafer clamping structure according to claim 6, characterized in that: The lower end of the rotating shaft (21) is provided with a movable shaft (2) that is slidably connected to the rotating shaft (21). A second hydraulic cylinder (23) is provided between the movable shaft (2) and the rotating shaft (21) to connect the two. A limiting plate (5) corresponding to the clamping arm (3) is provided on the outside of the movable shaft (2). The limiting plate (5) passes through the corresponding clamping plate (31) and is slidably connected to the clamping plate (31). When the clamping plate (31) clamps the wafer and moves, the limiting plate (5) contacts the upper side of the wafer.

8. A wafer clamping structure according to claim 7, characterized in that: Each of the limiting plates (5) is provided with a buffer pad (51) on its lower side.

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