Wafer moving system and wafer processing equipment

Abstract

The embodiment of the utility model provides a wafer moving system and wafer processing equipment, and the system comprises a machine table, a mechanical arm, a transmitting device, a receiving device, a signal processing unit, and a control unit. The mechanical arm is installed on the machine table, at least one of the transmitting device and the receiving device is installed on the mechanical arm, and the receiving device is matched with the transmitting device; the transmitting device transmits a position detection signal to the wafer, and the receiving device receives the position detection signal and then transmits the position detection signal to the signal processing unit; and the signal processing unit is used for processing the position detection signal to judge whether the placement position of the wafer is abnormal or not. When it is judged that the wafer placement position is abnormal, the control unit can control the mechanical arm to move the wafer to the preset position again. Thus, production accidents caused by deviation of the wafer placement position can be avoided, the operation of opening a cavity for troubleshooting and correction is omitted, and the wafer production capacity can be stabilized and improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more particularly to a wafer moving system and wafer processing equipment. Background Technology

[0002] In the plasma etching process for wafers, automated equipment such as robotic arms are typically used to move the wafer from the holding device to the stage for etching. However, due to limitations such as the thinness of the wafer or motion errors during robotic arm movement, abnormalities may occur in the wafer's placement on the stage during actual production. These could include wafer backlash or arcing due to the wafer being too close to the focusing ring, potentially triggering various alarms.

[0003] However, current processing equipment lacks the function of effectively detecting the actual position of the wafer in the stage. Once an alarm occurs, it is necessary to open the cavity for troubleshooting and correction, which is extremely detrimental to stabilizing and improving wafer production capacity.

[0004] How to increase wafer production capacity is a question worth discussing. Utility Model Content

[0005] In view of this, this application provides a wafer moving system that can improve wafer production capacity.

[0006] To address the aforementioned technical problems, this disclosure provides a wafer moving system, which includes:

[0007] Machine tool;

[0008] A robotic arm equipped with grippers is mounted on a machine base. The grippers are used to acquire and move the wafers to be processed.

[0009] The transmitting device is used to detect the position of the transmitter toward the wafer;

[0010] A receiving device adapted to the transmitting device, used to receive the position detection signal emitted by the transmitting device;

[0011] At least one of the transmitting device and the receiving device is mounted on the robotic arm;

[0012] The signal processing unit is adapted to receive and process the position detection signal from the receiving device to determine whether the wafer placement position is abnormal.

[0013] The control unit is adapted to control the robotic arm based on the judgment information fed back by the signal processing unit, so as to reposition the wafer to a preset position.

[0014] Optionally, the transmitting device is an optical device that transmits optical signals toward the wafer, and the receiving device receives the optical signals reflected back from the wafer; or the transmitting device is an acoustic device that transmits acoustic signals toward the wafer, and the receiving device receives the acoustic signals reflected back from the wafer.

[0015] Alternatively, the optics may be an LED light source or an optical fiber with the shielding removed.

[0016] Optionally, the gripper is provided with a mounting section, on which the transmitting device and / or receiving device are placed.

[0017] Optionally, the mounting portion is a hole or groove, and the transmitting device and / or receiving device is placed in the hole or groove.

[0018] Optionally, the gripper is configured as a U-shaped, V-shaped, or annular structure adapted to the size of the wafer, and the gripper has several limiting parts in the circumferential direction whose side shapes are adapted to the wafer.

[0019] Optionally, at least one limiting part has a guide slope on its upper part.

[0020] Optionally, the relative distance between the limiting parts in the radial direction is adjustable to accommodate wafers of different sizes.

[0021] Optionally, the gripper includes a beveled portion distributed in a circumferential direction, which abuts against the wafer after the gripper acquires the wafer.

[0022] Optionally, the gripper also includes a pressure sensor disposed on the beveled surface.

[0023] Optionally, the gripping component may also include a cantilever and a pressure sensor connected to the cantilever.

[0024] This disclosure provides a wafer processing apparatus, which includes a wafer moving system and a stage as described in any of the foregoing embodiments. The stage is provided with a vertically movable ejector pin, and the wafer moving system can place the wafer on the ejector pin.

[0025] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0026] The wafer moving system disclosed herein includes a robotic arm, a transmitting device, a receiving device, a signal processing unit, and a control unit. The transmitting device emits a position detection signal toward the wafer. After receiving the position detection signal, the receiving device transmits it to the signal processing unit. The signal processing unit processes the position detection signal to determine whether there is an abnormality in the wafer's placement position. When an abnormality is detected, the control unit can control the robotic arm to move the wafer back to a preset position. This technical solution not only avoids production accidents caused by wafer placement deviations but also eliminates the need for invasive troubleshooting and correction operations, thus stabilizing and improving wafer production capacity. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of a wafer processing apparatus according to an embodiment of the present disclosure is shown;

[0029] Figure 2 A schematic diagram of the structure of a stage according to an embodiment of the present disclosure is shown;

[0030] Figure 3 It shows Figure 2 A top view of the platform in the middle;

[0031] Figure 4 A three-dimensional structural schematic diagram of a gripper according to an embodiment of the present disclosure is shown;

[0032] Figure 5 for Figure 4 The diagram shows the structure of the gripper from another perspective.

[0033] Figure 6 A three-dimensional structural schematic diagram of another gripping component in an embodiment of this disclosure is shown;

[0034] Figure 7 A three-dimensional structural schematic diagram of another gripping component in an embodiment of this disclosure is shown;

[0035] Figure 8 A cross-sectional schematic diagram of a gripper holding a wafer is shown in an embodiment of the present disclosure.

[0036] Figure label:

[0037] Stage 100, ejector pin 110;

[0038] 200 wafers;

[0039] Wafer moving system 300, robotic arm 300A, transmitter 300B, receiver 300C;

[0040] The components include: gripper 310, body 311, cantilever part 311A, mounting part 3111, first slide 3112, inclined part 3113, first limiting part 312, first guide inclined surface 3121, second limiting part 313, second guide inclined surface 3131, anti-slip pad 314, rotating shaft 315, and pressure sensor 316. Detailed Implementation

[0041] As is known from the background art, in the process of plasma etching of wafers, automated equipment such as robotic arms are typically used to move the wafer from the holding device to the stage for etching. However, due to limitations such as the thinness of the wafer or motion errors during robotic arm movement, abnormalities may occur in the wafer's placement on the stage during actual production. These abnormalities include wafer backlash or arcing caused by the wafer being too close to the focusing ring, which may trigger various alarms.

[0042] However, current processing equipment lacks the function of effectively detecting the actual position of the wafer in the stage. Once an alarm occurs, it is necessary to open the cavity for troubleshooting and correction, which is extremely detrimental to stabilizing and improving wafer production capacity.

[0043] To address the aforementioned technical problems, this disclosure provides a wafer moving system, including a robotic arm, a transmitting device, a receiving device, a signal processing unit, and a control unit. The transmitting device transmits a position detection signal towards the wafer. The receiving device receives the position detection signal and transmits it to the signal processing unit. The signal processing unit processes the position detection signal to determine if the wafer's placement position is abnormal. When an abnormal wafer placement position is detected, the control unit can control the robotic arm to move the wafer back to a preset position. This technical solution not only avoids production accidents caused by wafer placement deviations but also eliminates the need for invasive troubleshooting and correction operations, thus stabilizing and improving wafer production capacity.

[0044] To make the above-mentioned objectives, features, and beneficial effects of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0045] Combined with reference Figures 1 to 5 ,in, Figure 1 A schematic diagram of the structure of a wafer processing apparatus according to an embodiment of the present disclosure is shown. Figure 2A schematic diagram of the structure of a stage according to an embodiment of this disclosure is shown. Figure 3 It shows Figure 2 Top view of the platform in the middle. Figure 4 A three-dimensional structural schematic diagram of a gripper according to an embodiment of the present disclosure is shown. Figure 5 for Figure 4 The diagram shows the structure of the gripper from another perspective.

[0046] In this embodiment, the wafer moving system 300 includes: a machine platform (not shown in the figure); a robotic arm 300A equipped with a gripper 310, the robotic arm 300A being mounted on the machine platform, the gripper 310 being used to acquire and move the wafer 200 to be processed; a transmitting device 300B for transmitting a position detection signal toward the wafer 200; a receiving device 300C adapted to the transmitting device 300B for receiving the position detection signal emitted by the transmitting device 300B; wherein at least one of the transmitting device 300B and the receiving device 300C is mounted on the robotic arm 300A; a signal processing unit adapted to receive and process the position detection signal from the receiving device 300C to determine whether the placement position of the wafer 200 is abnormal; and a control unit that can control the robotic arm 300A based on the judgment information fed back by the signal processing unit to reposition the wafer 200 to a preset position.

[0047] As can be seen, the transmitting device 300B transmits a position detection signal towards the wafer 200. The receiving device 300C receives this position detection signal and transmits it to the signal processing unit. The signal processing unit processes the position detection signal to determine whether there is an abnormality in the placement position of the wafer 200, that is, whether the placement position of the wafer 200 deviates from the preset position. When an abnormality is detected in the placement position of the wafer 200, the control unit can control the robotic arm 300A to move the wafer 200 back to the preset position. This not only avoids production accidents caused by wafer placement deviations but also eliminates the need for invasive troubleshooting and correction operations, thus contributing to stable and improved wafer production capacity.

[0048] It should be noted that although this application does not use too much space to describe the structure and shape of the machine tool in detail, the structure and function of the machine tool are obvious to those skilled in the art, including but not limited to the platform and frame.

[0049] In some embodiments, the transmitting device 300B may be an optical device.

[0050] Specifically, the optical device emits an optical signal toward the wafer 200, and the receiving device 300C receives the optical signal reflected back from the wafer 200. Using the detection principle of machine vision, the device performs three-dimensional imaging of the stage 100 and the wafer 200 to determine the positional error between them.

[0051] It should be noted that machine vision technology is relatively mature and highly reliable. Applying it to the wafer moving system 300 can greatly reduce equipment development costs.

[0052] In some embodiments, the optical device may be an LED light source or an optical fiber with the shielding layer removed.

[0053] Specifically, because LED light sources and optical fibers are small in size, light in weight, and low in cost, they can not only effectively reduce the size and weight of the wafer moving system 300, but also help to further reduce R&D costs.

[0054] Furthermore, the LED light source can be a white light source or a blue light source.

[0055] Specifically, blue LED light sources can effectively avoid the impact of ambient light on imaging quality and improve the position detection capability of the wafer moving system 300.

[0056] In some embodiments, the transmitting device 300B may also be an acoustic device.

[0057] Specifically, the acoustic device emits acoustic wave signals toward the wafer 200, and the receiving device 300C receives the acoustic wave signals reflected back from the wafer 200. Using the detection principle of acoustic imaging, the device performs three-dimensional imaging of the stage 100 and the wafer 200 to determine the positional error between them.

[0058] It should be noted that, on the one hand, since acoustic imaging technology is relatively mature and highly reliable, its application in the wafer moving system 300 can greatly reduce the equipment development cost; on the other hand, since the surface of the wafer 200 is relatively smooth, the principle of acoustic imaging can be used to better image the wafer 200.

[0059] It is understood that this application does not impose any particular limitation on the installation position of the receiving device 300C, as long as the installation position allows it to receive the signal emitted by the transmitting device 300B and fed back by the wafer 200 and the stage 100. Therefore, the receiving device 300C can be installed on a machine tool or on the robotic arm 300A.

[0060] Reference Figure 5 , Figure 5 for Figure 4The diagram shows the structure of the gripper from another perspective. In some embodiments, the gripper 310 has a mounting portion 3111 on the back of its body 311, and the transmitting device 300B or the receiving device 300C is placed in the mounting portion 3111.

[0061] This allows the robotic arm 300A to utilize its own flexibility to drive the transmitter 300B or receiver 300C to perform position detection on the wafer 200, eliminating the need for additional devices to move the transmitter 300B or receiver 300C.

[0062] In some embodiments, both the transmitting device 300B and the receiving device 300C are mounted on the gripper 310. Specifically, a mounting portion 3111 is provided on the back of the main body 311, and both the transmitting device 300B and the receiving device 300C are placed within the mounting portion 3111. Thus, integrating both the transmitting device 300B and the receiving device 300C onto the gripper 310 avoids excessive unnecessary movement by the robotic arm 300A, reduces wear and tear on its internal moving parts, simplifies the number of components in the wafer moving system 300, and improves the system's imaging speed.

[0063] Furthermore, the mounting part 3111 can be a hole or a groove, in which the transmitting device 300B and / or the receiving device 300C are placed. This effectively prevents the transmitting device 300B and / or the receiving device 300C from colliding with other components during movement.

[0064] It is understood that the transmitting device 300B can be integrated with the receiving device 300C to form a single component, or it can be separately installed at different locations on the gripping member 310; this is not limited here. For example, in Figure 5 In some of the embodiments shown, the transmitting device 300B and the receiving device 300C are respectively mounted on both sides of the U-shaped body 311.

[0065] Reference Figure 4 and Figure 5 In some embodiments, the gripper 310 includes a body 311, which is configured in a U-shaped, V-shaped or annular structure adapted to the size of the wafer 200, and has a plurality of limiting portions in the circumferential direction of the body 311 whose side shapes are adapted to the wafer 200.

[0066] Specifically, the side of the limiting part is arc-shaped, and the diameter of the arc matches the diameter of the wafer 200, so that the position of the wafer 200 can be stably maintained during the movement of the robotic arm 300A.

[0067] It should be noted that in some other embodiments, the side shape of the limiting part can also be planar or other shapes, as long as it can ensure stable contact with the 200 circumferential side of the wafer. The term "matching" should be interpreted broadly and does not mean that the two shapes must be completely identical.

[0068] In some more specific embodiments, the body 311 of the gripper 310 has a U-shaped structure.

[0069] This is equivalent to reserving a space in the middle of the gripper 310 for the lifting and lowering of the ejector pin 110, which facilitates the transfer of the wafer 200 from the gripper 310 to the stage 100.

[0070] In some embodiments, the limiting portion includes a first limiting portion 312 and a second limiting portion 313. The first limiting portion 312 is located at one end of the U-shaped structure, and the two second limiting portions 313 are disposed on both sides of the other end of the U-shaped structure in the width direction.

[0071] Specifically, this allows the three components to enclose a circle in the circumferential direction. This circular structure can match the shape of the wafer 200. Compared to the gripper 310 which has no obstructions on all sides, the gripper 310 provided in this embodiment is beneficial for maintaining the stability of the wafer 200's position.

[0072] It should be noted that this application does not limit the specific number of limiting parts; for example, the number of limiting parts can be four or more.

[0073] In some specific embodiments, for example Figure 4 As shown, the upper edge of the limiting part can be configured as a guide slope. In this way, when the gripper 310 picks up the wafer 200, the wafer 200 can be easily placed onto the gripper 310 along the guide slope.

[0074] Furthermore, guide ramps can be provided on one or more limiting components, for example... Figure 4 In some specific embodiments shown, both the first and second limiting members are provided with guide slopes, so that when the gripper 310 picks up the wafer 200 from the wafer 200 placement box, it can be accurately positioned to prevent the gripper 310 from colliding with the wafer 200 and to prevent the wafer 200 from not being accurately placed in the gripper 310.

[0075] To meet the needs of different customers, the wafer 200 production equipment may need to perform etching processing on wafers 200 of different sizes. If the relevant dimensions in the gripper 310 are not adjustable, then the gripper 310 of different specifications must be replaced as a whole, which is too costly for the enterprise.

[0076] In some embodiments, such as Figure 4 and Figure 5As shown, the gripper 310 has a first groove 3112 on its body 311, and a first limiting part 312 is radially adjustable within the first groove 3112. Thus, when gripping wafers 200 of different sizes, only the mounting position of the first limiting part 312 needs to be adjusted, greatly improving the versatility of the gripper 310 and thus better reducing costs.

[0077] Of course, in other embodiments, such as the second limiting part 313 mentioned above, it can also be configured to be adjustable. Alternatively, the limiting part can be configured to be detachable and installable, so that when it is necessary to move wafers 200 of other sizes, only the limiting part of different specifications needs to be replaced, which is also beneficial to reducing the cost of use compared to replacing the entire gripper 310.

[0078] However, considering that in some production scenarios, in order to improve the space utilization of the wafer 200 placement box, the wafers 200 are placed too close together with very small gaps between them. This places higher demands on the thinner and lighter design of the gripper 310.

[0079] In some embodiments, such as Figure 6 As shown, the gripper 310 does not have a protruding limiting part on its free end. The gripper 310 includes a beveled part 3113, which is distributed in the circumferential direction. When the gripper 310 acquires the wafer 200, the beveled part 3113 abuts against the wafer 200.

[0080] Specifically, an inclined surface can be provided on the body 311, and the inclined surface is the body 311.

[0081] Specifically, on the one hand, since the free end of the gripper 310 does not have a protruding limiting part, even if the spacing between the wafers 200 is very small, the gripper 310 can easily reach into the gap to pick up the wafers 200; on the other hand, the inclined surface 3113 can not only serve as a guide for the inclined surface, which is conducive to the wafers 200 being picked up quickly and smoothly, but also, since the inclined surface 3113 is distributed in the circumferential direction of the wafers 200, it can effectively limit the displacement of the wafers 200, ensuring that the wafers 200 will not be abnormally displaced during the movement.

[0082] It should be noted that the distribution of the inclined surface 3113 in the circumferential direction is not limited to the inclined surface 3113 extending in a circular shape. Some embodiments in which only two inclined surface 3113 are arranged opposite each other, but the two inclined surface 3113 are located on a virtual circle, also belong to the case of the inclined surface 3113 being distributed in the circumferential direction.

[0083] Continue to refer to Figure 1 and Figure 6Since the robotic arm 300A is composed of multiple joints, it relies on the rotation and other movements of multiple joints to transfer the wafer 200. This means that even if the wafer 200 is precisely positioned when it is placed on the gripper 310, its position on the gripper 310 may change abnormally due to the movement fluctuations of the robotic arm 300A. If the system cannot detect this anomaly in time, it will also cause the wafer 200 to be placed abnormally on the stage 100, increasing the time cost of subsequent position detection and readjustment, which is not conducive to improving the production capacity of the wafer 200.

[0084] Therefore, in order to overcome these potential problems, in some embodiments of this application, corresponding sensing components are provided on the gripper 310, so that the wafer moving system 300 can sense and adjust in a timely manner.

[0085] In some embodiments, the gripper 310 further includes a pressure sensor disposed on the inclined surface 3113. Specifically, the pressure sensor may be a piezoelectric film that covers the surface of the inclined surface 3113 and is in contact with the wafer 200. Under normal circumstances, the wafer 200 is laid flat on the surface of the gripper 310, at which time the piezoelectric film is subjected to uniform force at different positions. However, if the wafer 200 is tilted, the pressure on the piezoelectric film at different positions will be different. This difference can be sensed by the system, and the movement posture of the robotic arm 300A can be quickly adjusted so that the wafer 200 returns to a flat position.

[0086] Furthermore, to enhance the mobile system's ability to detect positional anomalies during the movement of the wafer 200, in some embodiments of this application, the gripper 310 further includes a cantilever portion 311A, one end of which is fixedly connected to the body 311. Utilizing the characteristic that the cantilever portion 311A ​​is easily deformable under stress, strain gauges (a type of pressure sensor, not shown in the figure) are placed on the cantilever portion 311A. When the wafer 200, which is in contact with the cantilever portion 311A, tilts, there will be excessive pressure on the cantilever portion 311A ​​at a certain location. After the mobile system detects the anomaly, it can quickly adjust the posture of the robotic arm 300A.

[0087] Of course, multiple cantilevered parts 311A ​​can be set at different locations in the circumferential direction to increase the all-round perception capability of the wafer moving system 300 and better ensure that the wafer 200 is always in a flat state during the movement.

[0088] It should be noted that the inclined surface 3113 in this application can refer to an inclined surface, and not just a component with an inclined surface. For example, in some embodiments, the cantilever portion 311A ​​can be inclined, and the inclined surface of the cantilever portion 311A ​​can be equivalent to the inclined surface 3113, such as... Figure 7 As shown.

[0089] In fact, the stronger the deformation capacity of the cantilever portion 311A, the better its ability to detect abnormal positions of the wafer 200. Therefore, in some other embodiments of this application, the structure of the cantilever portion 311A ​​has been further optimized.

[0090] In some embodiments, refer to Figure 8 One end of the cantilevered part 311A ​​is rotatably mounted on the body 311 via the rotating shaft 315 and abuts against the pressure sensor 316, while the other end of the cantilevered part 311A ​​abuts against the wafer 200.

[0091] Compared to a design where one end of the cantilever 311A ​​is fixed to the main body 311, a design where one end of the cantilever 311A ​​is rotatably mounted on the main body 311 allows for a significant change in position even under slight force, greatly enhancing its sensing capability. Obviously, the pressure sensor 316 can be, but is not limited to, piezoelectric films, piezoelectric ceramics, strain gauges, etc. Furthermore, the rotatable mounting of the cantilever 311A ​​on the main body 311 effectively creates a lever. When one end of the wafer 200 is tilted, the pressure exerted on the pressure sensor 316 by the other end is amplified compared to a flat position. The differences in pressure sensor readings at different locations become more pronounced, further enhancing the sensing capability of the moving system.

[0092] Furthermore, to make the wafer 200 move more smoothly, anti-slip pads 314 can be provided on the body 311 of the gripper 310 or on the surfaces of other components that come into contact with the wafer 200, such as... Figure 4 As shown. Specifically, the anti-slip mat 314 can be made of materials such as rubber with a high coefficient of friction.

[0093] It is understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0094] It is understood that, in this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0095] It is understood that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0096] It is understandable that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0097] It is understood that the above description provides multiple embodiment solutions, and the optional methods described in each embodiment solution can be combined and cross-referenced with each other without conflict, thereby extending to a variety of possible embodiment solutions, all of which can be considered as the embodiment solutions disclosed in this disclosure.

[0098] While the embodiments disclosed herein are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A wafer moving system, characterized in that, include: Machine tool; A robotic arm equipped with a gripper is mounted on the machine platform, and the gripper is used to acquire and move the wafer to be processed; The transmitting device is used to transmit a position detection signal toward the wafer; A receiving device adapted to the transmitting device is used to receive the position detection signal, wherein at least one of the transmitting device and the receiving device is mounted on the robotic arm; A signal processing unit is provided, which is adapted to receive and process the position detection signal from the receiving device to determine whether the wafer placement position is abnormal. The control unit is adapted to control the robotic arm based on the judgment information fed back by the signal processing unit, so as to reposition the wafer to a preset position.

2. The wafer moving system according to claim 1, characterized in that, The launching device includes: An optical device, wherein the optical device emits an optical signal toward the wafer, and the receiving device receives an optical signal reflected back from the wafer; Alternatively, an acoustic device, wherein the acoustic device emits an acoustic signal toward the wafer, and the receiving device reflects the acoustic signal back from the wafer.

3. The wafer moving system according to claim 2, characterized in that, The gripper is equipped with: The mounting section is in which the transmitting device and / or the receiving device are placed.

4. The wafer moving system according to claim 3, characterized in that, The mounting portion is a hole or groove, and the transmitting device and / or the receiving device is placed in the hole or groove.

5. The wafer moving system according to claim 1, characterized in that, The gripper is configured in a U-shaped, V-shaped, or annular structure that is adapted to the size of the wafer, and the gripper has a plurality of limiting portions in the circumferential direction whose side shapes are adapted to the wafer.

6. The wafer moving system according to claim 5, characterized in that, The relative distance between the limiting parts in the radial direction is adjustable to accommodate wafers of different sizes and specifications.

7. The wafer moving system according to claim 1, characterized in that, The grabber includes: The inclined portion is distributed in a circumferential direction; When the gripper acquires the wafer, the beveled part abuts against the wafer.

8. The wafer moving system according to claim 7, characterized in that, The grabber also includes: A pressure sensor is disposed on the inclined surface.

9. The wafer moving system according to claim 8, characterized in that, The grabber also includes: The pressure sensor is connected to the cantilever section.

10. A wafer processing equipment, characterized in that, include: The wafer moving system as described in any one of claims 1 to 9; The stage is equipped with a vertically movable pin, and the wafer moving system can place the wafer on the pin.

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