Liquid cooling heat dissipation structure of power module

Abstract

The utility model belongs to the technical field of heat dissipation of power modules, and relates to a liquid cooling heat dissipation structure of a power module, which comprises a heat dissipation substrate, a plurality of heat dissipation assemblies fixed on one side surface of the heat dissipation substrate, and flow guide holes distributed on two sides of the plurality of heat dissipation assemblies, and is characterized in that the heat dissipation substrate is provided with a welding surface and a heat dissipation surface which are oppositely arranged; the welding surface is welded to the copper-clad ceramic substrate through welding flux, the side, away from the welding surface, of the copper-clad ceramic substrate is used for welding a chip, the heat dissipation assemblies are arranged in parallel, a plurality of flow guide parts are arranged on the two sides of each heat dissipation assembly, and the flow guide parts on the two sides are arranged at intervals in a staggered mode. The adjacent heat dissipation assemblies are crossed through the flow guide pieces which are arranged at intervals in a staggered mode to form an S-shaped liquid cooling flow channel. According to the utility model, the uniformity of flow distribution can be improved while the heat dissipation performance is improved, so that the junction temperature difference among the chips is reduced, the reliability of the module is improved, and the heat dissipation module has the advantages of simple structure, stability, reliability, excellent heat dissipation performance, uniform temperature distribution and the like.

Description

Technical Field

[0001] This utility model belongs to the field of power module heat dissipation technology, specifically relating to a liquid cooling heat dissipation structure for power modules. Background Technology

[0002] Heat dissipation is a crucial factor affecting the reliability of power electronic equipment. Generally, if the operating temperature of components in power electronic equipment exceeds a certain limit, the performance of the components will significantly degrade, and they will become unstable, thus impacting the reliability of the system. In terms of power module heat dissipation, an important solution is to reduce the chip junction temperature by lowering the module's thermal resistance. Currently, one of the research hotspots is the use of direct cooling technology in the design of power module heat dissipation structures.

[0003] In recent years, silicon carbide MOSFETs have been increasingly used in industry due to their superior performance in high voltage, high temperature, and high frequency. On the one hand, higher operating frequencies lead to greater power consumption, placing higher demands on heat dissipation in the packaging. On the other hand, since silicon carbide modules generally use a multi-chip parallel connection, the junction temperature differences between the silicon carbide chips can further lead to uneven current distribution in the parallel connection. Therefore, designing a heat dissipation substrate with better heat dissipation performance and uniform temperature distribution is an important issue for module simulation. Utility Model Content

[0004] The purpose of this invention is to address the defects and shortcomings in the existing technology by designing a power module liquid cooling structure that is simple in structure, stable and reliable, has excellent heat dissipation performance, and uniform temperature distribution.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a liquid cooling heat dissipation structure for a power module, including a heat dissipation substrate, a plurality of heat dissipation components fixed to one side of the heat dissipation substrate, and flow guide holes distributed on both sides of the plurality of heat dissipation components. The plurality of heat dissipation components are arranged in parallel, and a plurality of flow guides are arranged on both sides of each heat dissipation component. The flow guides on both sides are staggered and spaced apart. Adjacent heat dissipation components intersect to form an S-shaped liquid cooling flow channel through the staggered flow guides.

[0006] Preferably, the heat dissipation substrate has a welding surface and a heat dissipation surface disposed opposite to each other. The welding surface is welded to the copper-clad ceramic substrate by solder, and the side of the copper-clad ceramic substrate away from the welding surface is used for welding chips.

[0007] Preferably, the plurality of heat dissipation components are fixed on the heat dissipation surface and are distributed corresponding to the heat source area formed by the chip.

[0008] Preferably, the heat dissipation component is selected from heat dissipation fins or heat dissipation columns.

[0009] Preferably, the flow guide is a triangular fin or a triangular column.

[0010] Preferably, each of the guide holes includes a rectangular column and a plurality of circular through holes disposed on the rectangular column.

[0011] Preferably, multiple air guides are also provided on the side of the air guide hole that is close to several heat dissipation components.

[0012] After adopting the above technical solution, the liquid cooling heat dissipation structure for power modules provided by this utility model has the following beneficial effects:

[0013] This invention utilizes a parallel arrangement of heat dissipation components on one side of the heat dissipation substrate to form multiple parallel flow channels. This improves heat dissipation performance while increasing the uniformity of flow distribution, thereby reducing junction temperature differences between individual chips and enhancing module reliability. The cross-arrangement of the flow guides increases the heat dissipation area and enhances the turbulence of the fluid flow, further improving heat dissipation. It also allows for a reduction in the size of straight channels and an increase in fluid velocity. Therefore, this invention offers advantages such as simple structure, stability and reliability, excellent heat dissipation performance, and uniform temperature distribution. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the heat dissipation substrate of this utility model;

[0015] Figure 2 This is a bottom view of the heat dissipation substrate of this utility model;

[0016] Figure 3 This is a schematic diagram of the power module packaging structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the heat dissipation path of this utility model.

[0018] The components are: 1. Chip; 2. Copper-clad ceramic substrate; 3. Solder; 4. Heat dissipation substrate; 5. Heat source area; 7. Heat dissipation component. Detailed Implementation

[0019] The present invention will now be described in further clear and complete detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0021] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0022] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0023] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0024] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0025] This utility model discloses a liquid cooling heat dissipation structure for a power module, such as... Figure 1-4 As shown, the device includes a heat dissipation substrate 4, several heat dissipation components 7 fixed to one side of the heat dissipation substrate 4, and flow guide holes distributed on both sides of the several heat dissipation components 7. Specifically, the heat dissipation substrate 4 has a welding surface and a heat dissipation surface arranged opposite to each other. The welding surface is welded to a copper-clad ceramic substrate 2 by solder 3. The side of the copper-clad ceramic substrate 2 away from the welding surface is used to weld the chip 1. The several heat dissipation components 7 are fixed to the heat dissipation surface and are distributed corresponding to the heat source area 5 formed by the chip 1. It should be noted that the position of the heat source area 5 is not limited to the position shown in the figure and can be changed according to different layouts. Similarly, the position of the heat dissipation components 7 can also be adjusted according to actual needs. Furthermore, the flow guide holes located on both sides of the heat dissipation components 7 are also provided on the heat dissipation surface.

[0026] The plurality of heat dissipation components 7 are arranged in parallel, and each heat dissipation component 7 has a plurality of flow guides arranged on both sides, and the flow guides on both sides are staggered and spaced apart. Adjacent heat dissipation components 7 are intersected by the staggered flow guides to form an S-shaped liquid cooling channel. Specifically, the heat dissipation components 7 are made of metal material and are selected as heat dissipation fins or heat dissipation columns. The flow guides are selected as triangular fins or triangular columns to ensure the flow guiding effect.

[0027] Each of the flow guide holes includes a rectangular column and multiple circular through holes disposed on the rectangular column. Furthermore, multiple flow guides are also disposed on the side of the flow guide hole near the heat dissipation components 7.

[0028] This utility model discloses a liquid cooling heat dissipation structure for a power module. Through the parallel arrangement design of heat dissipation components 7 on one side of the heat dissipation substrate 4, multiple parallel flow channels are formed. This can improve heat dissipation performance while increasing the uniformity of flow distribution, thereby reducing the junction temperature difference between individual chips and improving module reliability. Through the cross arrangement design of the flow guides, the heat dissipation area can be increased, and the turbulence during fluid flow can be increased to improve the heat dissipation effect. Furthermore, the size of the straight channel can be reduced, and the fluid flow velocity can be increased.

[0029] In summary, the liquid cooling heat dissipation structure for power modules provided by this utility model has the advantages of simple structure, stability and reliability, excellent heat dissipation performance and uniform temperature distribution, and has great market value, making it worthy of widespread promotion and application.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A liquid cooling heat dissipation structure for a power module, characterized in that: It includes a heat dissipation substrate (4), a plurality of heat dissipation components (7) fixed to one side of the heat dissipation substrate (4), and flow guide holes distributed on both sides of the plurality of heat dissipation components (7). The plurality of heat dissipation components (7) are arranged in parallel, and a plurality of flow guides are arranged on both sides of each heat dissipation component (7). The flow guides on both sides are staggered and spaced apart. Adjacent heat dissipation components (7) intersect to form an S-shaped liquid cooling channel through the staggered flow guides.

2. The power module liquid cooling heat dissipation structure according to claim 1, characterized in that: The heat dissipation substrate (4) has a welding surface and a heat dissipation surface arranged opposite to each other. The welding surface is welded to the copper-clad ceramic substrate (2) by solder (3). The side of the copper-clad ceramic substrate (2) away from the welding surface is used for welding the chip (1).

3. The power module liquid cooling structure according to claim 2, characterized in that: The plurality of heat dissipation components (7) are fixed on the heat dissipation surface and are distributed corresponding to the heat source area (5) formed by the chip (1).

4. The power module liquid cooling structure according to claim 1, characterized in that: The heat dissipation component (7) is selected from heat dissipation fins or heat dissipation columns.

5. The power module liquid cooling heat dissipation structure according to claim 1, characterized in that: The flow guide is selected from triangular fins or triangular columns.

6. The power module liquid cooling heat dissipation structure according to claim 1, characterized in that: Each of the guide holes includes a rectangular column and multiple circular through holes disposed on the rectangular column.

7. The liquid cooling heat dissipation structure for a power module according to claim 1, characterized in that: Multiple air guides are also provided on the side of the air guide hole that is close to several heat dissipation components (7).

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