Chip sorting equipment

Abstract

The utility model relates to the technical field of chip manufacturing, and provides chip sorting equipment. The chip sorting equipment comprises a rotating disc feeding module, a transferring material shuttle module, a feeding manipulator module, a pressure measuring material shuttle module, a pressure measuring module, a material receiving manipulator module and a material receiving module which are sequentially arranged in the chip flowing direction. The chip sorting equipment further comprises an assembly machine table, and the above six parts are all integrated on the assembly machine table. The receiving module comprises a receiving box, a first receiving tray and an expansion module or any combination of the receiving box, the first receiving tray and the expansion module, the expansion module and the assembly machine table are arranged at intervals or adjacently, and the receiving box and / or the first receiving tray are / is arranged on the assembly machine table; and the material receiving manipulator module can carry the chip to circulate between the pressure measuring module and the material receiving box, or circulate between the pressure measuring module and the expansion module, or circulate between the pressure measuring module and the material receiving tray. The chip sorting equipment can be suitable for different receiving modes, and use flexibility and applicability are improved.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing technology, and in particular to a chip sorting device. Background Technology

[0002] During chip manufacturing, a three-temperature test is required, which involves placing the chip at high, room, and low temperatures for functional testing. The purpose of this test is to ensure the chip functions correctly under different conditions, improving its reliability and stability. Following the three-temperature test results, chips of different performance levels are sorted to group chips with similar performance into the same group, ensuring consistency in performance and characteristics during subsequent testing and production.

[0003] However, the current chip sorting and receiving section is relatively simple and cannot meet the needs of more diverse receiving situations. Utility Model Content

[0004] Therefore, it is necessary to provide a chip sorting device that can be applied to different receiving methods, thereby improving its flexibility and applicability.

[0005] A chip sorting device includes a turntable loading module, a transfer shuttle module, an infeed robot module, a pressure testing shuttle module, a pressure testing module, a receiving robot module, and a receiving module arranged sequentially along the chip flow direction. The chip sorting device also includes an assembly machine. The turntable loading module, the transfer shuttle module, the infeed robot module, the pressure testing shuttle module, the pressure testing module, and the receiving robot module are all integrated into the assembly machine. The receiving module includes a receiving box, a first receiving tray, an expansion module, or any combination of the three. The expansion module is arranged at an interval or adjacent to the assembly machine. The receiving box and / or the first receiving tray are located on the assembly machine. The receiving robot module is capable of transporting chips between the pressure testing module and the receiving box, or between the pressure testing module and the expansion module, or between the pressure testing module and the first receiving tray.

[0006] Understandably, the rotary feeding module uses rotation to feed chips to be tested to the intermediate shuttle module. The intermediate shuttle module receives the chips, and once full, it conveys them to the infeed robot module, which then transports them to the pressure testing shuttle module. The pressure testing shuttle module then delivers the chips to the pressure testing module for performance testing. After testing, the chips are transported to the receiving module via the receiving robot module. In this process, because the receiving module includes a receiving box, a first receiving tray, an expansion module, or any combination of these three, the chip sorting equipment has different receiving positions and methods, thus improving its flexibility and applicability. Furthermore, the entire operation minimizes manual intervention, increasing the automation of chip testing and sorting.

[0007] In some embodiments, the expansion module includes an expansion machine and an expansion shuttle, the expansion machine being arranged at an interval or adjacent to the assembly machine, a portion of the expansion shuttle being detachably connected to the expansion machine and another portion being detachably connected to the assembly machine; the expansion module also includes a tape feeding mechanism, a second take-up tray or a combination of both, the tape feeding mechanism and / or the second take-up tray being disposed on the expansion machine.

[0008] In some embodiments, the turntable loading module includes a turntable and a plurality of pickup components connected to the turntable, the plurality of pickup components being arranged at circumferential intervals along the turntable, the turntable being rotatable about its own axis; the turntable loading module further includes a feeding component, a positioning component, a detection component, a vision component, and an angle compensation component arranged at circumferential intervals along the turntable and located below each of the pickup components, the angle compensation component being configured to drive the chip picked up by the pickup component to rotate by a target angle in response to the detection information of the vision component.

[0009] In some embodiments, the angle compensation component includes a positioning group and a support shaft. The positioning group surrounds a material-carrying space for accommodating the chip and for clamping and positioning the chip. The positioning group is connected to the support shaft, and the support shaft is rotatable about its own axis to drive the positioning group to rotate synchronously.

[0010] In some embodiments, the detection component includes a polarity testing structure, a visual inspection structure, and a rotating support stage. The polarity testing structure and the rotating support stage are arranged circumferentially around the turntable and are both located below a plurality of the pickup components. The rotating support stage includes at least a support portion, which is inclined downward toward the side opposite to the pickup components. The support portion has a receiving position and a detection position. The visual inspection structure is located above the rotating support stage and is adapted to the detection position. The support portion is capable of rotating around its own axis to drive the chip to flow between the receiving position and the detection position.

[0011] In some embodiments, the transfer shuttle module includes a first conveying mechanism and a second conveying mechanism; both the first conveying mechanism and the second conveying mechanism include a Y-direction conveying group and an X-direction conveying group connected to the Y-direction conveying group, the two Y-direction conveying groups are arranged at intervals along the X-direction, and the X-direction and Y-direction are set at an angle; at least one of the two Y-direction conveying groups is provided with a loading area, a unloading area and an interference area arranged along the Y-direction, the interference area is located between the loading area and the unloading area, and at least one of the two X-direction conveying groups can move along the X-direction in the interference area in a direction away from the other.

[0012] In some embodiments, the Y-axis conveying group includes at least a Y-axis support base, and the X-axis conveying group is connected to the Y-axis support base; the transfer shuttle module further includes a Y-axis detection component; the Y-axis detection component includes a detection guide rail and a Y-axis sensor, the length of the detection guide rail is along the Y-axis, the Y-axis sensor is mounted on the Y-axis support base or the corresponding X-axis conveying group, and the Y-axis sensor can move along the Y-axis to cooperate with the detection guide rail to provide different detection signals.

[0013] In some embodiments, the pressure testing shuttle module includes a conveying track, a support carrier slidably connected to the conveying track, and a preheating structure disposed on the support carrier. The support carrier has a plurality of spaced-apart pits, and the preheating structure is used to preheat the chips in each of the pits.

[0014] In some embodiments, the chip sorting device further includes an infeed vision module disposed between the transfer shuttle module and the pressure measuring shuttle module; and / or, the chip sorting device further includes a receiving vision module disposed between the receiving robot module and the receiving module.

[0015] In some embodiments, the turntable loading module, the transfer shuttle module, and the pressure measuring shuttle module are arranged at intervals along a first direction, and the pressure measuring shuttle module, the pressure measuring module, and the receiving module are arranged at intervals along a second direction; the transfer shuttle module is used to convey chips along the first direction, and the pressure measuring shuttle module is used to convey chips along the second direction, with the first direction, the second direction, and the vertical direction arranged at angles to each other; the feeding robot module and the receiving robot module are respectively located on both sides of the pressure measuring module along the second direction. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a first schematic diagram of a chip sorting device provided in an embodiment of this application;

[0018] Figure 2 A top view of a chip sorting device provided in an embodiment of this application;

[0019] Figure 3 A partial top view of a chip sorting device provided in another embodiment of this application;

[0020] Figure 4 This is a first schematic diagram of a turntable feeding module in a chip sorting device provided in an embodiment of this application;

[0021] Figure 5 This is a second schematic diagram of a turntable loading module in a chip sorting device provided in an embodiment of this application;

[0022] Figure 6 This is a top view of a turntable loading module in a chip sorting device provided in an embodiment of this application;

[0023] Figure 7 for Figure 6 A schematic diagram of the angle compensation component in the provided turntable feeding module;

[0024] Figure 8 for Figure 7 A cross-sectional view of the angle compensation component in the provided turntable feeding module;

[0025] Figure 9 This is a schematic diagram of a transfer shuttle module in a chip sorting device provided in an embodiment of this application;

[0026] Figure 10 for Figure 9 A partial schematic diagram of the provided transfer shuttle module;

[0027] Figure 11 for Figure 9 A side view of the provided transfer shuttle module.

[0028] Reference numerals: 10. Turntable feeding module; 11. Turntable; 12. Pick-up component; 13. Incoming component; 14. Positioning component; 15. Detection component; 16. Vision component; 17. Angle compensation component; 18. Pressing component; 19. Support plate; 20. Transfer shuttle module; 21. First conveying mechanism; 22. Second conveying mechanism; 23. Y-axis detection component; 30. Feeding robot module; 40. Pressure measuring shuttle module; 50. Pressure measuring module; 60. Receiving robot module; 70. Receiving module; 71. Receiving box; 72. Expansion module; 80. Assembly table; 91. Feeding vision module; 92. Receiving vision module; 131. Hopper; 132. Vibratory feeder; 133. Vibrating rail; 134. Particle separating component; 151. Polarity testing structure; 152. Vibration. Detection structure; 153. Rotary support table; 171. Positioning group; 172. Support shaft; 173. Lifting shaft; 174. Drive shaft; 175. Assembly support; 176. Rotary motor; 177. Lifting motor; 201. Y-axis conveyor group; 202. X-axis conveyor group; 203. Loading area; 204. Unloading area; 205. Interference area; 231. Detection guide rail; 232. Y-axis sensor; 721. Extending platform; 722. Extending shuttle; 723. Tapeing mechanism; 1701. Material carrying space; 1711. Gripper seat; 1712. Gripper; 1731. Assembly slot; 1732. Top contact part; 1741. Connecting part; 1742. Mating part; 2011. Y-axis support seat; 2021. X-axis support seat; 2321. Shielding plate; 2322. Notch area. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0034] Please see Figures 1 to 3 One embodiment of this application provides a chip sorting device, including a turntable loading module 10, a transfer shuttle module 20, an infeed robot module 30, a pressure testing shuttle module 40, a pressure testing module 50, a receiving robot module 60, and a receiving module 70 arranged sequentially along the chip flow direction. In actual use, the turntable loading module 10 loads chips by rotation to transfer the chips to be tested to the transfer shuttle module 20. The transfer shuttle module 20 receives chips through a fixture or tray, and when full, it can convey them to the infeed robot module 30, which then transports them to the pressure testing shuttle module 40. The pressure testing shuttle module 40 can then convey the chips to the pressure testing module 50 for performance testing, such as high and low temperature testing. After testing, the chips are transported to the receiving module 70 via the receiving robot module 60.

[0035] The chip sorting equipment also includes an assembly station 80, on which all the aforementioned modules are integrated and assembled to form a unified structure. The receiving module 70 includes a receiving box 71, a first receiving tray, an expansion module 72, or any combination thereof. The expansion module 72 is arranged spaced apart from or adjacent to the assembly station 80, and the receiving box 71 and / or the first receiving tray are located on the assembly station 80. The receiving robot module 60 can transport chips between the pressure testing module 50 and the receiving box 71, or between the pressure testing module 50 and the expansion module 72, or between the pressure testing module 50 and the first receiving tray.

[0036] In other words, chips tested by the pressure testing module 50 can be transported to different receiving positions by the receiving robot module 60. These positions include receiving at the receiving box 71, receiving on the first receiving tray, or being transported to the expansion module 72 for receiving or other operations. Therefore, the chip sorting equipment provided in this embodiment, by utilizing combinations of different receiving modes, can be applied to different receiving methods, improving its flexibility and applicability. Furthermore, throughout the entire operation, manual intervention can be minimized, increasing the automation of chip testing and sorting.

[0037] Furthermore, the expansion module 72 includes an expansion machine 721 and an expansion shuttle 722, with the expansion machine 721 and assembly machine 80 arranged at intervals. Part of the expansion shuttle 722 is detachably connected to the expansion machine 721, and another part is detachably connected to the assembly machine 80. Thus, when the expansion module needs to receive materials or perform other operations, the receiving robot module 60 can transport the tested chips from the pressure testing module 50 to the expansion shuttle 722, and then transport them to a position away from the pressure testing module 50. For example, the expansion module 72 also includes a tape and reel mechanism 723, which is located on the expansion machine 721. Therefore, the expansion shuttle 722 can transport the tested chips to the tape and reel mechanism 723 for tape and reel packaging operations.

[0038] For example, if the expansion module 72 also includes a second receiving tray, the expansion shuttle 722 can transport the tested chips to the second receiving tray. In this case, the expansion module 72 also includes an expansion robot, which is used to pick up the chips on the expansion shuttle 722 and transport them to the second receiving tray to achieve chip collection.

[0039] Understandably, because chips require performance testing of multiple parameters during manufacturing, it's necessary to set up receiving positions for different parameters, and to distinguish between good and defective chips even within the same parameter. Furthermore, to improve testing or production efficiency, it's often necessary to process more chips at a time. Therefore, when the receiving box 71 and the first receiving tray on the assembly machine 80 are insufficient to handle more parameters or more chips, the second receiving tray on the expansion module 72 can be used for receiving, thereby accommodating a larger batch of chip tests and improving testing efficiency.

[0040] Of course, the extension machine 721 can be integrated with the tape and reel mechanism 723 and the second take-up tray. The second take-up tray can be used for take-up of the tape and reel mechanism 723; of course, it can also be used for take-up of chips after they have been tested by the pressure testing module 50.

[0041] The specific structure of the tape feeding mechanism 723 is a mature existing technology and is not an improvement point of this application, so it will not be described in detail here.

[0042] Please see Figure 1 , Figure 4 , Figure 5 and Figure 6 As one example, the rotary loading module 10 includes a rotary disk 11 and a plurality of pickup components 12 connected to the rotary disk 11. The pickup components 12 are arranged circumferentially spaced along the rotary disk 11, and the rotary disk 11 is rotatable about its own axis. The rotary loading module also includes a feeding component 13, a positioning component 14, a detection component 15, a vision component 16, and an angle compensation component 17, which are arranged circumferentially spaced along the rotary disk 11 and located below each pickup component 12. The angle compensation component 17 is configured to drive the chip picked up by the pickup component 12 to rotate by a target angle in response to the detection information of the vision component 16.

[0043] Specifically, each pickup component uses vacuum adsorption to pick up the chip. The receiving component 13 provides the chip to be tested. The pickup component 12 picks up the chip from the receiving component 13 and moves it to the detection component 15 under the action of the turntable 11, where relevant parameters are tested. After testing, the chip is moved by the pickup component 12 and the turntable 11 to the vision component 16 for photographing, and then moved to the angle compensation component 17 for deflection angle adjustment. After the chip is aligned relative to the pickup component 12, the pickup component 12 and the turntable 11 move the chip to the intermediate shuttle module 20, where it is transferred to the infeed robot module 30 for subsequent processes. That is, the receiving component 13, positioning component 14, detection component 15, vision component 16, angle compensation component 17, and intermediate shuttle module 20 are arranged at intervals along the feeding direction of the turntable 11.

[0044] In this process, because the pickup component uses vacuum adsorption to pick up the chip, when the pickup component 12 picks up the chip at the receiving position, the instantaneous large negative pressure directly acts on the chip, which may cause the chip to deflect at a certain angle. At this time, due to the setting of the angle compensation component 17 and the detection component 15, after the pickup component 12 picks up the chip, it can first rotate to above the detection component 15 under the action of the turntable 11. The detection component 15 takes a picture to obtain the positional image information of the chip relative to the pickup component 12, that is, the deflection angle. Then, the turntable 11 drives the pickup component 12 to rotate to above the angle compensation component 17, so that the chip positioned by the pickup component 12 can be driven to rotate at a certain angle relative to the pickup component 12, thereby compensating for the aforementioned deflection angle. In this way, the deflection angle of the chip during adsorption can be adjusted and compensated, which is beneficial for the chip to be aligned, thereby reducing the angular deviation between the chip and the corresponding position of the subsequent process and mitigating the risk of chip falling or damage.

[0045] The detection component 15 uses a camera to take pictures to determine the deflection angle. Alternatively, the detection component 15 can also use laser detection to obtain the position coordinates of multiple points on the chip, and then calculate the corresponding deflection angle, which is convenient for the angle compensation component 17 to adjust.

[0046] like Figures 4 to 8 As shown, the angle compensation component 17 further includes a positioning group 171 and a support shaft 172. The positioning group 171 surrounds a material-carrying space 1701 for accommodating the chip and is used for clamping and positioning the chip. The positioning group 171 is connected to the support shaft 172, and the support shaft 172 can rotate around its own axis to drive the positioning group 171 to rotate synchronously.

[0047] In other words, when the chip deflection angle is compensated by the angle compensation component 17, the positioning group 171 can rotate accordingly under the action of the support shaft 172 based on the deflection angle obtained from the image information captured by the detection component 15, so as to align the loading space 1701 with the chip, and then cause the chip to move into the loading space 1701 of the positioning group 171, and the positioning group 171 clamps the chip. During this process, the pick-up component 12 is always in a vacuum adsorption state for the chip and the vacuum is not released. Then, the positioning group 171 rotates in the opposite direction under the action of the support shaft 172, and drives the chip to rotate synchronously to change the angle of the chip relative to the pick-up component 12; at the same time, since the pick-up component 12 has a vacuum adsorption effect on the chip, it does not affect the mechanical positioning and rotation of the chip by the positioning group 171.

[0048] The positioning assembly 171 includes a gripper base 1711 and multiple grippers 1712 arranged circumferentially around and rotatably connected to the gripper base 1711. The multiple grippers 1712 cooperate to form a material-carrying space 1701, thereby clamping the chip. The positioning assembly 171 also includes a support boss located in the center of the gripper base 1711. The support boss protrudes upward along the Z-axis to substantially match the size of the chip, reducing interference during clamping by the individual grippers 1712. In some specific embodiments, four grippers 1712 are provided, each with a straight end to match the four sides of the chip for clamping.

[0049] The angle compensation component 17 also includes a lifting shaft 173 slidably connected to the support shaft 172. The lifting shaft 173 can move along the axial direction of the support shaft 172 to drive the grippers 1712 to rotate. In actual use, the support shaft 172 is connected to a rotary motor 176 to drive the support shaft 172 to rotate. The axial direction of the support shaft 172 is along the Z-axis. The lifting shaft 173 is connected to a lifting motor 177 to drive the lifting shaft 173 to move along the Z-axis, thereby driving the grippers 1712 to rotate relative to the gripper seat 1711 to achieve chip clamping and positioning. The lifting shaft 173 is sleeved on the outside of the support shaft 172, and a linear bearing is provided between the lifting shaft 173 and the support shaft 172 to guide the axial movement of the lifting shaft 173 relative to the support shaft 172. The gripper seat 1711 is provided with multiple clearance slots, and a gripper 1712 is installed in each clearance slot. The lifting shaft 173 moves upward along the Z-axis to drive each gripper 1712 to rotate outward relative to the gripper seat 1711 to open, facilitating the placement of the chip within the material carrying space 1701 and its support on the bearing protrusion. Simultaneously, each gripper 1712 is provided with a corresponding elastic element, which is pre-pressed between the corresponding gripper 1712 and the gripper seat 1711 and accommodated within a corresponding clearance groove. Each gripper 1712, under the action of its corresponding elastic element, has a tendency to rotate inward for clamping. The gripper seat 1711 has multiple lifting channels spaced apart along its circumference, and the lifting shaft 173 has multiple top contacts 1732 spaced apart around its own axis. Each top contact 1732 passes through a lifting channel and corresponds to one gripper 1712. When the lifting shaft 173 moves along the Z-axis under the action of external force, each top contact 1732 moves within its corresponding lifting channel to act on the corresponding gripper 1712, thereby driving the gripper 1712 to rotate. This arrangement helps to reduce the diameter of the lifting shaft 173, thereby reducing the planar dimensions of the entire angle compensation component 17 and reducing assembly interference with other structures in the turntable loading module 10.

[0050] Each of the top contacts 1732 has a conical surface on the side opposite to the positioning axis. Each gripper 1712 is equipped with a corresponding roller to engage with the corresponding conical surface and reduce wear.

[0051] Optionally, the angle compensation component 17 further includes a drive shaft 174, which is movably connected to the lifting shaft 173 and is used to drive the lifting shaft 173 to move axially along the support shaft 172. The drive shaft 174 is connected between the lifting shaft 173 and the lifting motor 177. Of course, a cylinder can also be used to drive the lifting shaft 173 to move along the Z-axis via the drive shaft 174 to achieve rotational drive of the gripper 1712.

[0052] Furthermore, the drive shaft 174 includes a connecting portion 1741 and a mating portion 1742. The mating portion 1742 is connected to the connecting portion 1741 and is eccentrically positioned. The mating portion 1742 is movably connected to the lifting shaft 173. The connecting portion 1741 can rotate around its own axis, thereby driving the lifting shaft 173 to move axially along the support shaft 172 via the mating portion 1742. The axis of the connecting portion 1741 is angled to the axis of the support shaft 172. That is, the connecting portion 1741 and the mating portion 1742 together form an eccentric wheel structure. When the connecting portion 1741 rotates around its own axis, it causes the position of the mating portion 1742 to change along the Z-axis, thereby driving the lifting shaft 173 to move up and down along the Z-axis.

[0053] Furthermore, the outer circumferential surface of the lifting shaft 173 is recessed with an assembly groove 1731, which surrounds the lifting shaft 173. The mating part 1742 of the drive shaft 174 is inserted into the assembly groove 1731 and can move within it. In other words, the assembly groove 1731 enables the movable engagement and power transmission between the lifting shaft 173 and the drive shaft 174. This arrangement ensures the freedom of movement between the lifting shaft 173 and the drive shaft 174, preventing jamming. It also ensures full contact between the mating part 1742 and the drive shaft 174, providing force application positions on both the upper and lower sides along the Z-axis, facilitating the lifting of the lifting shaft 173. The mating part 1742 includes a shaft body and a first roller. The shaft body is connected to the connecting part 1741, and the first roller is rotatably connected to the shaft body, rolling in engagement with the wall of the assembly groove 1731. In other words, by utilizing the rolling contact of the first roller, the wear between the lifting shaft 173 and the mating part 1742 is reduced, and the degree of freedom at the mating point is further increased.

[0054] In practical use, the angle compensation component 17 also includes a mounting support 175. The gripper seat 1711 is rotatably mounted on the mounting support 175, and the aforementioned lifting motor 177, drive shaft 174, rotary motor 176, etc., are all mounted on the mounting support 175. The mounting support 175 integrates the various structures of the angle compensation component 17 into a single unit, facilitating assembly and disassembly as a whole. The angle compensation component 17 is mounted on the aforementioned assembly machine 80 via the mounting support 175.

[0055] The structure of the positioning component 14 is basically similar to that of the angle compensation component 17 that enables the gripper 1712 to rotate. The difference is that the support shaft 172 in the positioning component 14 does not need to rotate, so the positioning group 171 also does not need to rotate. At this time, the end of the support shaft 172 facing away from the positioning group 171 can be installed on the corresponding assembly support 175 to guide the movement of the lifting shaft 173 along the Z-axis. By using the positioning component 14, the chip provided by the incoming material component 13 can be positionally corrected, which facilitates the alignment and detection of the subsequent detection component 15 and ensures a certain level of detection accuracy.

[0056] Please see Figures 4 to 6 In an optional embodiment, the detection component 15 includes a polarity testing structure 151, a vision detection structure 152, and a rotating support stage 153. The polarity testing structure 151 and the rotating support stage 153 are arranged circumferentially around the turntable 11 and are both located below a plurality of pickup components 12. The rotating support stage 153 includes at least a support portion, which is inclined downward toward the side opposite to the pickup component 12. The support portion is located at the receiving position and the detection position. The vision detection structure 152 is located above the rotating support stage 153 and is adapted to the detection position. The support portion can rotate around its own axis to drive the chip to flow between the receiving position and the detection position.

[0057] The polarity test structure 151 is used to detect the electrical properties of the chip pins to determine whether the circuit placement is reversed or misaligned. The vision inspection structure 152 detects defects in the chip pins by taking pictures. In actual operation, the pick-up component 12 transports the chip to the polarity test structure 151 for polarity testing. After the polarity test, the chip is transported to the rotating support stage 153 and placed in the receiving position of the carrier. After the carrier identifies the chip in the receiving position, it rotates around its own axis, causing the chip to be rotated to the detection position, i.e., the position directly opposite the vision inspection structure 152, where it is photographed. After the vision inspection structure 152 completes the photographing and detection, the carrier rotates the chip to the receiving position, i.e., the position directly opposite the pick-up component 12, so that the pick-up component 12 can pick up the chip again and transport it to the vision component 16 for deflection angle detection. The receiving position and detection position on the carrier can be arranged circumferentially along the carrier to reduce interference between the vision inspection structure 152 and each pick-up component 12.

[0058] like Figures 4 to 6 As shown, in some other embodiments, the feeding component 13 includes a hopper 131, a vibratory feeder 132, a vibratory rail 133, and a particle separating component 134. The outlet of the hopper 131 is connected to the inlet of the vibratory feeder 132, the outlet of the vibratory feeder 132 is connected to the input end of the vibratory rail 133, and the particle separating component 134 is located at the output end of the vibratory rail 133. The output end of the vibratory rail 133 is located near the turntable 11 and below the picking component 12, which facilitates the picking component 12 to pick up the chips from the output end of the vibratory rail 133 for feeding.

[0059] In practical use, the chips are loaded into the hopper 131 and fed into the vibratory feeder 132 via vibration. The vibratory feeder 132 drives the chips one by one into the vibratory rail 133 through vibration, and the chips are then conveyed one by one toward the output end by the vibration of the vibratory rail 133. The vibratory rail 133 has a receiving position and a picking position, with the picking position located downstream of the receiving position. The picking position is used by the picking component 12 to pick up the chips. The vibratory rail 133 has vacuum suction holes for positioning the chips. When feeding using the vibratory rail 133, the vacuum suction at the bottom of the first chip on the vibratory rail 133 is released, and the following three chips are vacuum-adsorbed and fixed. The chip-separating component 134 moves the first chip to the picking position. After the picking component 12 picks up the chip at the picking position, the chip-separating component 134 moves to the receiving position and moves the first chip at that moment to the picking position; this process is repeated to achieve uninterrupted feeding of single chips.

[0060] The specific structures of the hopper 131, vibratory plate 132, vibratory rail 133 and pelletizing assembly 134 are existing mature technologies and are not improvements in this application, so they will not be described in detail here.

[0061] Please see Figures 4 to 6 Optionally, each pickup component 12 includes a mounting base and a pickup element movably connected to the mounting base. The mounting base is connected to the turntable 11 to achieve assembly of each pickup component 12 relative to the turntable 11. The turntable 11 may have multiple support arms protruding radially. The multiple support arms are arranged radially and spaced apart circumferentially along the turntable 11, with at least some of the support arms connected to a pickup component 12 at their ends. The turntable loading module 10 also includes several pressing components 18. Each pressing component 18 is connected to the turntable 11 and arranged circumferentially and spaced apart. Each pressing component 18 corresponds to a pickup component 12 and is used to drive the corresponding pickup element to move in the vertical direction (i.e., the Z-axis direction). That is, the pickup element can be slidably connected to the mounting base, facilitating reciprocating motion along the Z-axis direction. The pressing component 18 can be driven by an electric push rod or a cylinder, as long as it can achieve linear drive of the pickup element. The turntable loading module 10 also includes a support plate 19 disposed on the turntable 11. The support plate 19 is located above the turntable 11 and is arranged at intervals along the vertical direction. The pressing component 18 includes a pressing base, a drive source connected to the pressing base, and a pressing head connected to the drive source. The pressing base is connected to the support plate 19 so that the pressing component 18 is located above the picking component 12. The drive source drives the pressing head to move vertically to act on the picking component, thereby driving the picking component vertically. Each picking component is also provided with a guide rod between itself and its corresponding mounting base to guide the movement of the picking component. When picking up and unloading materials, the pressing component 18 is required to drive the picking component to move vertically.

[0062] The turntable 11 component also includes a rotary power source connected to the turntable 11 to drive its rotation. The rotary power source is mounted on the assembly machine 80. In this embodiment, the rotary power source only drives the turntable 11 to rotate, and then the pressing component 18 is used to move the pick-up piece in the individual pick-up component 12 vertically, facilitating chip placement and removal. Compared to directly using a cam to drive the turntable 11, this arrangement improves chip protection and reduces indentations on the chip surface.

[0063] In actual use, the turntable feeding module 10 also includes a rotating air passage on the turntable 11, which facilitates rotational air supply for vacuum adsorption of each pickup component 12. It is more suitable for each pickup component 12 to rotate with the turntable 11, avoiding air pipe tangling, entanglement, or even pulling and damage, thus improving safety and reliability.

[0064] Please see Figure 1 , Figure 9 , Figure 10 and Figure 11In another embodiment, the transfer shuttle module 20 includes a first conveying mechanism 21 and a second conveying mechanism 22, both of which include a Y-direction conveying group 201 and an X-direction conveying group 202 connected to the Y-direction conveying group 201. The conveying directions of the two Y-direction conveying groups 201 are along the Y-direction and are arranged at intervals along the X-direction. The conveying directions of the two X-direction conveying groups 202 are along the X-direction. The X-direction (i.e., the X-axis direction, hereinafter referred to as X-direction) and the Y-direction (i.e., the Y-axis direction, hereinafter referred to as Y-direction) are set at an angle, for example, the X-direction and the Y-direction are perpendicular. At least one of the two Y-direction conveying groups 201 is provided with a loading area 203, a unloading area 204 and an interference area 205 arranged along the Y-direction, and the interference area 205 is located between the loading area 203 and the unloading area 204. The loading area 203 is used for loading materials from the turntable loading module 10 into the transfer shuttle module 20, and the unloading area 204 is used for unloading materials from the transfer shuttle module 20, so that the chip can be transferred to the pressure measuring shuttle module 40 using the feeding robot module 30. The interference area 205 is the region where positional interference occurs when the two X-direction conveying groups 202 move along the Y-direction. In this embodiment, at least one of the two X-direction conveying groups 202 can move along the X-direction away from the other in the interference area 205. The aforementioned loading area 203 is the end of the transfer shuttle module 20 along the Y-direction near the turntable loading module 10, and the unloading area 204 is the end of the transfer shuttle module 20 along the Y-direction near the pressure measuring shuttle module 40.

[0065] In practical use, each X-axis conveying group 202 includes an X-axis drive unit (not shown in the figure) and an X-axis support 2021 connected to the X-axis drive unit. The X-axis support 2021 moves along the X-axis under the action of the X-axis drive unit and is used to load the material tray. Therefore, at least one of the two X-axis conveying groups 202 can move along the X-axis away from the other in the interference zone 205, meaning that the X-axis support 2021 corresponding to at least one of the two X-axis conveying groups 202 can move along the X-axis away from the other in the interference zone 205. Both Y-axis conveying groups 201 include a Y-axis track and a Y-axis support 2011 slidably connected to the Y-axis track. Both Y-axis conveying groups 201 also include a Y-axis drive unit (not shown in the figure), and the Y-axis support 2011 is connected to the Y-axis drive unit and moves along the length direction of the Y-axis track under the action of its corresponding Y-axis drive unit. The length direction of the Y-axis track is the Y-axis direction (abbreviated as Y-axis). The two X-axis conveying groups 202 mentioned above are respectively installed on their corresponding Y-axis support groups, thereby realizing the Y-axis movement of the X-axis conveying group 202. Both the Y-axis conveying group 201 and the X-axis conveying group 202 adopt screw drive.

[0066] like Figure 10 and Figure 11As shown, the transfer shuttle module 20 further includes a Y-axis detection component 23, which includes a detection guide rail 231 and a Y-axis sensor 232. The detection guide rail 231 extends along the Y-axis, and the Y-axis sensor 232 is mounted on the Y-axis support 2011. Alternatively, the Y-axis sensor 232 can also be mounted on the X-axis conveyor group 202 corresponding to the Y-axis support 2011; or, part of the Y-axis sensor 232 can be mounted on the Y-axis support 2011, and the other part can be connected to the X-axis conveyor group 202. The key is to ensure that the Y-axis sensor 232 can move along the Y-axis with the X-axis conveyor group 202. When the Y-axis sensor 232 moves with the Y-axis support 2011, it can cooperate with the detection guide rail 231 to provide different detection signals in the Y-axis direction. Specifically, it indicates that the X-axis conveyor group 202 is located in one of the loading area 203, unloading area 204 and interference area 205, which facilitates timely movement feedback and avoidance in the interference area 205, improves response timeliness, and further enhances the loading cycle time.

[0067] The detection guide rail 231 includes at least two shielding plates 2321 arranged at intervals along the X-direction, each shielding plate 2321 corresponding to a Y-direction sensor 232. The length L1 of the two shielding plates 2321 along the Y-direction is less than the length L2 of the Y-direction track, and one of the shielding plates 2321 has a notch area 2322. That is to say, different detection signals can be fed back through the structural arrangement of the detection guide rail 231, thereby determining the position area of ​​the X-direction conveying group 202 in the Y-direction.

[0068] Taking two Y-axis sensors 232 as an example, both Y-axis sensors 232 are mounted on the Y-axis support 2011 and arranged along the X-axis, with each Y-axis sensor 232 corresponding to a blocking plate 2321. Both Y-axis sensors 232 can be through-beam sensors. Therefore, when a Y-axis sensor 232 is blocked by the blocking plate 2321, it feeds back a "1" signal; when it is not blocked, it feeds back a "0" signal.

[0069] Based on this, since the lengths of both blocking plates 2321 along the Y direction are less than the length of the Y-direction track, the portion of the Y-direction track protruding from the blocking plates 2321 in the Y direction can be defined as a blank area. Therefore, when the two Y-direction sensors 232 move to the blank area with the Y-direction support 2011, neither Y-direction sensor 232 is blocked, and a "00" signal is fed back. Simultaneously, taking the portion of the blocking plate 2321 used to block the Y-direction sensor 232 as the blocking area, the two Y-direction sensors 232 will feed back a "11" signal when they move to the blocking area. Moreover, since one of the blocking plates 2321 has a notch 2322, the corresponding Y-direction sensor 232 will not be blocked when it moves to the notch 2322, while the other blocking plate 2321 does not have a notch 2322, thus blocking the corresponding Y-direction sensor 232. At this time, both Y-direction sensors 232 will feed back a "10" signal. In this way, the Y-axis track can be divided into a loading area 203, an interference area 205, and a unloading area 204 by different feedback signals.

[0070] Specifically, the area corresponding to the blank area is designated as the unloading area 204, the area corresponding to the two obscured areas is designated as the interference area 205, and the area corresponding to one obscured area and one gap area 2322 is designated as the loading area 203. Alternatively, the area corresponding to the blank area is designated as the loading area 203, the area corresponding to the two obscured areas is designated as the unloading area 204, and the area corresponding to one obscured area and one gap area 2322 is designated as the interference area 205. Yet another option is to designate the area corresponding to the blank area as the unloading area 204, the area corresponding to the two obscured areas as the loading area 203, and the area corresponding to one obscured area and one gap area 2322 as the interference area 205. These are merely illustrative examples.

[0071] As another example, the pressure testing shuttle module 40 includes a conveying track, a support carrier slidably connected to the conveying track, and a preheating structure disposed on the support carrier. The support carrier has multiple spaced-apart pits, and the preheating structure is used to preheat the chips in each pit. That is, after the feeding robot module 30 picks up the chip from the transfer shuttle module 20, it places it in a pit on the support carrier. During the movement of the chip along the conveying track from one end to the other via the support carrier, the preheating structure can be used to preheat the chip. This arrangement is equivalent to combining the preheating process before chip testing and the loading process before testing into one, omitting the arrangement of the preheating tray, and thus simplifying the structure.

[0072] like Figures 1 to 3As shown, in actual use, the chip sorting equipment also includes an infeed vision module, which is located between the transfer shuttle module 20 and the pressure measuring shuttle module 40. Simultaneously, the chip sorting equipment also includes a receiving vision module, with a receiving vision module 92 located between the receiving robot module 60 and the receiving module 70. Both the infeed robot module 30 and the discharge robot module can employ variable-pitch robots. Therefore, the infeed vision module can be used to calibrate the positions of the infeed robot module 30, the transfer shuttle module 20, and the pressure measuring shuttle module 40, thereby improving the material handling accuracy of the infeed robot module 30. Simultaneously, the receiving vision module 92 can also calibrate the positions of the receiving module 70 and the receiving robot module 60, improving the material handling accuracy of the receiving robot module 60; furthermore, the receiving vision module 92 can also perform chip pin detection and scratch detection, reducing the risk of pin bending and scratching in batch chip production.

[0073] Both the infeed vision module 91 and the receiving vision module 92 use cameras for photography and are located below the infeed robot module 30 and the receiving robot module 60 to reduce interference.

[0074] It should be noted that the specific structure of the variable pitch manipulator is a mature existing technology and is not an improvement point of this application, so it will not be described in detail here.

[0075] Please see Figures 1 to 3 Furthermore, the infeed robot module 30 and the take-up robot module 60 are respectively positioned on both sides of the pressure measuring module 50 along a second direction, namely the X-axis direction. Both the infeed robot module 30 and the take-up robot module 60 include a guide rail, a crossbeam slidably connected to the guide rail, and a robot arm slidably connected to the crossbeam. The guide rail extends along the Y-axis direction, and the crossbeam extends along the X-axis direction. The crossbeam moves along the length of the guide rail to drive the robot arm to move along the Y-axis direction, and the robot arm can also move along the length of the crossbeam (i.e., along the X-axis direction). The robot arm can also move along the Z-axis direction to pick up and place chips.

[0076] Both the feeding robot module 30 and the receiving robot module 60 are equipped with a dual vision positioning system to ensure that the position of each suction nozzle in each robot and its position relative to each material shuttle are detected, thereby correcting deviations and improving the accuracy of the robot's picking and placing of materials.

[0077] The rotary feeding module 10, the intermediate shuttle module 20, and the pressure measuring shuttle module 40 are arranged at intervals along the first direction (i.e., the Y-axis direction), while the pressure measuring shuttle module 40, the pressure measuring module 50, and the receiving module 70 are arranged at intervals along the second direction (i.e., the X-axis direction). The intermediate shuttle module 20 is used to convey chips along the first direction, and the pressure measuring shuttle module 40 is used to convey chips along the second direction. The first direction, the second direction, and the vertical direction (i.e., the Z-axis direction) are arranged at angles to each other, i.e., perpendicularly. Compared to a unidirectional arrangement, this arrangement is equivalent to having corresponding structures in both the X-axis and Y-axis directions of the chip sorting equipment, alleviating the problem of large space occupation in a unidirectional arrangement, and thus ensuring that the chip sorting equipment has sufficient space in both the Y-axis and X-axis directions for connecting the expansion module 72.

[0078] The receiving boxes 71 are provided in multiple locations and arranged at intervals along the Y-axis. At least one of the receiving boxes 71 is a good product receiving box, while the remaining receiving boxes 71 are undetermined boxes. These undetermined boxes can be used for receiving good products or for receiving defective products. If all undetermined boxes are used as good product receiving boxes, then an expansion module 72 or a first receiving tray can be connected to perform defective product receiving with different parameters.

[0079] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip sorting apparatus, characterized by comprising: The chip sorting device comprises, in sequence along a chip flow direction, a rotary table feeding module, a transfer shuttle module, a feeding manipulator module, a pressure testing shuttle module, a pressure testing module, a receiving manipulator module and a receiving module; The chip sorting device further comprises an assembly machine table, and the rotary table feeding module, the transfer shuttle module, the feeding manipulator module, the pressure testing shuttle module, the pressure testing module and the receiving manipulator module are all integrated on the assembly machine table; The receiving module comprises a receiving box, a first receiving tray, an expansion module or any combination of the three, the expansion module is arranged separately or adjacently from the assembly machine table, and the receiving box and / or the first receiving tray are arranged on the assembly machine table; The receiving manipulator module can carry the chips to flow between the pressure testing module and the receiving box, or between the pressure testing module and the expansion module, or between the pressure testing module and the first receiving tray.

2. The chip sorting apparatus according to claim 1, wherein The expansion module comprises an expansion machine table and an expansion shuttle, the expansion machine table is arranged separately or adjacently from the assembly machine table, and a part of the expansion shuttle is detachably connected to the expansion machine table and the other part is detachably connected to the assembly machine table; The expansion module further comprises a belt coding mechanism, a second receiving tray or a combination of the two, and the belt coding mechanism and / or the second receiving tray are arranged on the expansion machine table.

3. The chip sorting apparatus according to claim 1, wherein The rotary table feeding module comprises a rotary table and a plurality of pickup components connected to the rotary table, the plurality of pickup components are arranged separately along the circumference of the rotary table, and the rotary table can rotate around its own axis; The rotary table feeding module further comprises a feeding component, a positioning component, a detection component, a vision component and an angle compensation component arranged separately along the circumference of the rotary table and below each pickup component, and the angle compensation component is configured to drive the pickup component to rotate a target angle of the picked chip in response to the detection information of the vision component.

4. The chip sorting apparatus according to claim 3, wherein The angle compensation component comprises a positioning group and a support shaft, the positioning group surrounds a loading space for accommodating the chip and is used for clamping and positioning the chip, the positioning group is connected to the support shaft, and the support shaft can rotate around its own axis to drive the positioning group to rotate synchronously.

5. The chip sorting apparatus according to claim 3, wherein The detection component comprises a polarity testing structure, a visual detection structure and a rotary support table, the polarity testing structure and the rotary support table are arranged separately along the circumference of the rotary table and below the plurality of pickup components; The rotary support table at least comprises a bearing part, the bearing part is inclined downward toward a side away from the pickup component, the bearing part is provided with a receiving position and a detection position, the visual detection structure is arranged above the rotary support table and is adapted to the detection position, and the bearing part can rotate around its own axis to drive the chip to flow between the receiving position and the detection position.

6. The chip sorting apparatus according to claim 1, wherein The transfer shuttle module comprises a first conveying mechanism and a second conveying mechanism; The first conveying mechanism and the second conveying mechanism each comprise a Y-direction conveying group and an X-direction conveying group connected to the Y-direction conveying group, two Y-direction conveying groups are arranged separately along the X-direction, and the X-direction and the Y-direction are arranged at an angle; At least one of the two Y-direction conveying groups is provided with an upper feeding area, a lower feeding area and an interference area arranged along the Y-direction, the interference area is arranged between the upper feeding area and the lower feeding area, and at least one of the two X-direction conveying groups is capable of moving in the X-direction towards a direction away from the other one in the interference area.

7. The chip sorting apparatus according to claim 6, wherein The Y-direction conveying group at least comprises a Y-direction support base, and the X-direction conveying group is connected to the Y-direction support base; the transfer shuttle module further comprises a Y-direction detection assembly; The Y-direction detection assembly comprises a detection guide rail and a Y-direction sensor, the length of the detection guide rail is along the Y-direction, the Y-direction sensor is installed on the Y-direction support base or the corresponding X-direction conveying group, and the Y-direction sensor is capable of moving along the Y-direction to cooperate with the detection guide rail to feedback different detection signals.

8. The chip sorting apparatus according to claim 1, wherein The pressure testing shuttle module comprises a conveying track, a support carrier slidably connected to the conveying track, and a preheating structure arranged on the support carrier, the support carrier is provided with a plurality of spaced-apart material pits, and the preheating structure is used for preheating chips in each material pit.

9. The chip sorting apparatus according to claim 1, wherein The chip sorting device further comprises an incoming visual module, the incoming visual module is arranged between the transfer shuttle module and the pressure testing shuttle module; and / or, The chip sorting device further comprises a receiving visual module, the receiving visual module is arranged between the receiving manipulator module and the receiving module.

10. The chip sorting apparatus according to any one of claims 1 to 8, characterized by, The turntable feeding module, the transfer shuttle module and the pressure testing shuttle module are arranged along a first direction, and the pressure testing shuttle module, the pressure testing module and the receiving module are arranged along a second direction; The transfer shuttle module is used for conveying chips along a first direction, the pressure testing shuttle module is used for conveying chips along a second direction, and the first direction, the second direction and a vertical direction are arranged at an angle with each other; The incoming manipulator module and the receiving manipulator module are separately arranged on two sides of the pressure testing module along the second direction.

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