Semiconductor device processing device

Abstract

The utility model discloses a semiconductor device processing device, and relates to the technical field of semiconductor processing. The semiconductor polishing device comprises a bottom plate, a limiting mechanism is fixedly arranged on the upper surface of the bottom plate, the limiting mechanism is used for limiting a semiconductor device and facilitating machining, two polishing mechanisms are arranged in the limiting mechanism, the polishing mechanisms are used for polishing the periphery of the semiconductor device, and the limiting mechanism comprises a sliding frame. The lower surface of the sliding frame is fixedly connected with the upper surface of the bottom plate, a sliding air cylinder is fixedly arranged at the upper end of the sliding frame, stable limiting and accurate positioning of the semiconductor device in the machining process are achieved through the limiting mechanism, meanwhile, the sliding fit between the sliding frame and the sliding block enhances the stability of movement, and the machining precision is improved. And the rotating matching of the rotating cylinder and the rotating rod ensures the flexible rotation of the limiting chassis, so that the processing efficiency and precision are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a semiconductor device processing apparatus. Background Technology

[0002] Semiconductor device processing equipment is suitable for efficient and precise processing of semiconductor devices in precision manufacturing environments, especially in scenarios that require stable positioning of devices, fine polishing, and precise control of the processing process, such as semiconductor chip production lines and precision machining workshops for microelectronic components.

[0003] However, existing technologies still have the following problems:

[0004] In traditional semiconductor device manufacturing processes, due to vibrations in the processing equipment and interference from the external environment, semiconductor devices may be accidentally displaced during processing. This can not only lead to inaccurate processing positions but also damage the devices, affecting product quality and yield.

[0005] To address the aforementioned problems, the inventors propose a semiconductor device processing apparatus. Utility Model Content

[0006] In order to solve the problem of accidental displacement during processing, the purpose of this utility model is to provide a semiconductor device processing apparatus.

[0007] To solve the above technical problems, the present invention adopts the following technical solution: a semiconductor device processing apparatus, including a base plate, a limiting mechanism fixedly provided on the upper surface of the base plate, the limiting mechanism being used to limit the semiconductor device for processing, two grinding mechanisms provided inside the limiting mechanism being used to grind the periphery of the semiconductor, the limiting mechanism including a sliding frame, the lower surface of the sliding frame being fixedly connected to the upper surface of the base plate, a sliding cylinder fixedly provided at the upper end of the sliding frame, a sliding plate fixedly provided at the output end of the sliding cylinder, a limiting frame fixedly provided at the upper end of the base plate, a limiting cylinder fixedly provided on the upper surface of the limiting frame, a limiting pressure plate rotatably provided at the output end of the limiting cylinder, a limiting motor provided on the lower surface of the base plate, a rotating rod fixedly provided at the output end of the limiting motor, a limiting base plate fixedly provided at the end of the rotating rod near the limiting pressure plate, and a limiting stop fixedly provided in the middle of the upper surface of the base plate for use with the limiting base plate.

[0008] Preferably, the grinding mechanism includes a mounting frame located above the sliding plate. A grinding motor is provided on the upper surface of the mounting frame, and a housing is fixedly provided on the upper surface of the mounting frame. Drive gears are rotatably provided on the inner walls of both sides of the housing. A driven gear is meshed with the outer surface of the drive gear, and a grinding wheel is fixedly provided at the end of the driven gear away from the grinding motor.

[0009] Preferably, the lower surface of the sliding plate is fixedly provided with a plurality of sliders arranged in a rectangular array, and the upper surface of the sliding frame is fixedly provided with two symmetrical slide rails, with the sliders slidingly engaging with the slide rails.

[0010] Preferably, the upper surface of the mounting bracket is movably permeated with a plurality of adjusting screws arranged in a rectangular array, and the outer surface of the adjusting screws is threaded with three adjusting nuts, one end of the three adjusting nuts being respectively attached to the lower surface of the mounting bracket and the upper and lower surfaces of the sliding plate.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. This utility model achieves stable limiting and precise positioning of semiconductor devices during processing through a limiting mechanism. At the same time, the sliding cooperation between the sliding frame and the slider enhances the smoothness of the movement, and the rotational cooperation between the rotating cylinder and the rotating rod ensures the flexible rotation of the limiting chassis, thereby improving processing efficiency and accuracy. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the limiting mechanism of this utility model.

[0016] Figure 3 This is a schematic diagram of the grinding mechanism of this utility model.

[0017] In the diagram: 1. Base plate; 2. Limiting mechanism; 3. Grinding mechanism; 20. Limiting cylinder; 21. Limiting frame; 22. Limiting pressure plate; 23. Anti-slip pad; 24. Limiting chassis; 25. Rotating rod; 26. Rotating cylinder; 27. Limiting support frame; 28. Limiting motor; 29. ​​Sliding plate; 201. Slider; 202. Slide rail; 203. Sliding frame; 204. Sliding cylinder; 205. Limiting stop; 30. Mounting frame; 31. Adjusting nut; 32. Grinding support frame; 33. Grinding motor; 35. Drive gear; 36. Grinding wheel; 37. Driven gear; 38. Housing; 301. Adjusting screw. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example: Figure 1-3 As shown, this utility model provides a semiconductor device processing apparatus, mainly consisting of a base plate 1 as a supporting foundation. A limiting mechanism 2 is fixedly installed on the upper surface of the base plate 1. Two grinding mechanisms 3 are embedded inside the limiting mechanism 2. The limiting mechanism 2 specifically includes a sliding frame 203, which is fixedly connected to the base plate 1. A sliding cylinder 204 is mounted on the top of the sliding frame 203, and the output end of the cylinder is connected to a sliding plate 29. A limiting frame 21 is fixed on the base plate 1, and a limiting cylinder 20 is installed on the top of the limiting frame 21. The output end of the cylinder is rotatably connected to a limiting pressure plate 22. A limiting motor 28 is installed below the base plate 1. The output shaft of the motor is connected to a limiting base 24 through a rotating rod 25. A limiting stop 205 is provided in the middle of the base plate 1 to cooperate with the limiting base 24.

[0020] The sliding cooperation between slider 201 and slide rail 202 enhances the smoothness and accuracy of the movement of sliding plate 29. Anti-slip pad 23 effectively prevents the limiting pressure plate 22 from sliding when pressing semiconductor devices, improving the stability of processing. The rotational cooperation between rotating cylinder 26 and rotating rod 25 ensures the flexible rotation of limiting chassis 24, meeting the needs of different processing angles. Limiting support frame 27 provides stable support for limiting motor 28, improving the overall stability of the equipment.

[0021] The grinding mechanism 3 is located above the sliding plate 29 and is supported by the mounting bracket 30. The top of the mounting bracket 30 is equipped with a grinding motor 33 and a housing 38 is fixed thereon. The housing 38 contains a drive gear 35 and a driven gear 37, which are connected by meshing. One end of the driven gear 37 is connected to the grinding wheel 36.

[0022] The combination of adjusting screw 301 and adjusting nut 31 allows for fine-tuning of the grinding mechanism 3 to accommodate semiconductor devices of different sizes and shapes. The grinding support frame 32 provides a stable mounting platform for the grinding motor 33, ensuring the stability and durability of the grinding process.

[0023] Working principle: The semiconductor device is placed on the limiting base 24 through the limiting mechanism 2 and limited by the limiting stop 205. Then, the limiting cylinder 20 drives the limiting pressure plate 22 to descend and press the semiconductor device to prevent it from shifting during processing. After the limiting motor 28 is started, it drives the limiting base 24 to rotate through the rotating rod 25. It works with the limiting stop 205 and the limiting pressure plate 22 to limit and rotate the semiconductor device. Then, the sliding cylinder 204 is started to drive the sliding plate 29 to slide on the sliding frame 203. This allows the grinding mechanism 3 to grind the periphery of the semiconductor device, achieving precise positioning and fixation of the semiconductor device and providing stable support for subsequent grinding processing.

[0024] The grinding mechanism 3 drives the drive gear 35 to rotate via the grinding motor 33, which in turn drives the driven gear 37 and the grinding wheel 36 to rotate. The grinding wheel 36 contacts the periphery of the semiconductor device and performs grinding processing in conjunction with the rotation of the limiting mechanism 2. The combination of the adjusting screw 301 and adjusting nut 31 on the mounting bracket 30 allows for fine adjustment of the height and angle of the grinding mechanism 3 to adapt to different processing requirements. The grinding support bracket 32 ​​provides stable support for the grinding motor 33, ensuring the smoothness and accuracy of the grinding process.

[0025] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A semiconductor device processing apparatus comprising a base plate (1), characterized in that: The upper surface of the bottom plate (1) is fixedly provided with a limiting mechanism (2), and the inside of the limiting mechanism (2) is provided with two polishing mechanisms (3); The limiting mechanism (2) comprises a sliding frame (203), and the lower surface of the sliding frame (203) is fixedly connected with the upper surface of the bottom plate (1); the upper end of the sliding frame (203) is fixedly provided with a sliding cylinder (204); the output end of the sliding cylinder (204) is fixedly provided with a sliding plate (29); the upper end of the bottom plate (1) is fixedly provided with a limiting frame (21); the upper surface of the limiting frame (21) is fixedly provided with a limiting cylinder (20); the output end of the limiting cylinder (20) is rotatably provided with a limiting pressure plate (22); the lower surface of the bottom plate (1) is provided with a limiting motor (28); the output end of the limiting motor (28) is fixedly provided with a rotating rod (25); the end of the rotating rod (25) close to the limiting pressure plate (22) is fixedly provided with a limiting base plate (24); and the middle of the upper surface of the bottom plate (1) is fixedly provided with a limiting baffle (205) used in cooperation with the limiting base plate (24).

2. A semiconductor device processing apparatus as claimed in claim 1, characterized in that The polishing mechanism (3) comprises a mounting frame (30), and the mounting frame (30) is located above the sliding plate (29); the upper surface of the mounting frame (30) is provided with a polishing motor (33); the upper surface of the mounting frame (30) is fixedly provided with a shell (38); the two side inner walls of the shell (38) are rotatably provided with drive gears (35); the outer surface of the drive gears (35) is meshedly connected with driven gears (37); and the end, away from the polishing motor (33), of the driven gears (37) is fixedly provided with a polishing wheel (36).

3. A semiconductor device processing apparatus as claimed in claim 1, characterized in that The lower surface of the sliding plate (29) is fixedly provided with a plurality of sliding blocks (201) arranged in a rectangular array; and the upper surface of the sliding frame (203) is fixedly provided with two symmetrical sliding rails (202), and the sliding blocks (201) are in sliding fit with the sliding rails (202).

4. A semiconductor device processing apparatus as claimed in claim 1, characterized in that The lower surface of the limiting pressure plate (22) is fixedly provided with an antiskid pad (23).

5. A semiconductor device processing apparatus as claimed in claim 1, characterized in that The upper end of the bottom plate (1) is fixedly provided with a rotating cylinder (26), and the inner surface of the rotating cylinder (26) is in rotational fit with the outer surface of the rotating rod (25).

6. A semiconductor device processing apparatus as claimed in claim 1, characterized in that The lower surface of the bottom plate (1) is fixedly provided with a limiting support frame (27), and the lower surface of the limiting support frame (27) is fixedly connected with the upper end of the limiting motor (28).

7. A semiconductor device processing apparatus as claimed in claim 2, characterized in that The upper surface of the mounting frame (30) is movably penetrated through a plurality of adjusting screws (301) arranged in a rectangular array; the outer surface of the adjusting screws (301) is threadedly sleeved with three adjusting nuts (31), and one end of each of the three adjusting nuts (31) is in abutment with the lower surface of the mounting frame (30) and the upper and lower surfaces of the sliding plate (29) respectively.

8. A semiconductor device processing apparatus as claimed in claim 2, characterized in that The upper surface of the mounting frame (30) is fixedly provided with a polishing support frame (32), and the upper surface of the polishing support frame (32) is fixedly connected with the outer surface of the polishing motor (33).

Images