Semiconductor packaging epoxy molding compound injection device

Abstract

The utility model discloses a semiconductor packaging epoxy molding compound injection device, which relates to the field of semiconductor production and comprises a charging barrel, a propeller, an injection head and a heating mechanism, the propeller is arranged inside the charging barrel, the injection head is arranged at the end of the charging barrel, the heating mechanism comprises a heating sleeve, the heating sleeve is fixedly arranged on the barrel wall of the charging barrel, and the heating sleeve is arranged in the charging barrel. The heating sleeve is of a hollow structure, and a plurality of evenly-distributed heating pipes are fixedly arranged in the heating sleeve. The flow adjusting mechanism comprises a flow adjusting plate, and the flow adjusting plate is located in the injection head. According to the utility model, the packaging quality can be obviously improved, and the problems caused by poor flowability and uneven filling are avoided by effectively improving the flowability of the molding compound and ensuring the uniform filling of the molding compound, so that the semiconductor packaging performance is better; meanwhile, the extrusion amount of the molding compound can be accurately adjusted, too little or excessive injection is prevented, material waste and cost increase caused by poor packaging are reduced, and therefore the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and specifically to a semiconductor packaging epoxy molding compound injection device. Background Technology

[0002] In the semiconductor packaging process, the injection of epoxy molding compound is a critical step. Common epoxy molding compound injection devices are piston-driven structures, which use electric or pneumatic propulsion to drive the piston forward and extrude the epoxy molding compound.

[0003] Existing epoxy molding compound injection devices have some shortcomings. On the one hand, the flowability and uniformity of the molding compound are difficult to guarantee during the injection process, which can easily lead to insufficient or excessive filling in certain areas, affecting the quality and performance of semiconductor packaging. On the other hand, the extrusion amount of the molding compound cannot be precisely controlled, which can easily result in too little or too much molding compound, thereby affecting the packaging quality and increasing production and time costs.

[0004] To address this, a semiconductor packaging epoxy molding compound injection device is proposed. Utility Model Content

[0005] In view of the problems existing in the current semiconductor packaging, this utility model is proposed.

[0006] Therefore, the purpose of this invention is to provide a semiconductor packaging epoxy molding compound injection device, which solves the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A semiconductor packaging epoxy molding compound injection device includes a barrel, a pusher, and an injection head. The pusher is disposed inside the barrel, and the injection head is disposed at the end of the barrel. The device also includes:

[0009] A heating mechanism, comprising a heating sleeve fixedly disposed on the wall of the material cylinder, the heating sleeve having a hollow structure, and having multiple evenly distributed heating tubes fixedly disposed inside the heating sleeve;

[0010] A flow regulating mechanism includes a flow regulating plate located inside the injection head. A rotating shaft is fixedly provided in the middle of the flow regulating plate. The two ends of the rotating shaft are rotatably connected to the inner walls of both sides of the injection head, and one end of the rotating shaft extends to the outside of the injection head and is provided with a rotating mechanism.

[0011] Preferably, an aluminum alloy heat-conducting plate is fixedly embedded on the side of the heating jacket that contacts the material cylinder, and the aluminum alloy heat-conducting plate adopts a ring structure. The heating jacket is a rock wool insulation jacket.

[0012] Preferably, the rotating mechanism includes a protective cover fixedly disposed on the side wall of the injection head, one end of the rotating shaft extends into the interior of the protective cover and is fixedly provided with a worm gear, a worm is rotatably disposed inside the protective cover and meshes with the worm gear, and one end of the worm extends into the exterior of the protective cover and is fixedly provided with a knob.

[0013] Preferably, the flow regulating plate is a circular plate, and the size of the flow regulating plate is smaller than the inner wall size of the injection head.

[0014] Preferably, the cylinder wall is fixedly provided with mounting plates.

[0015] Preferably, the end of the propeller located outside the barrel is connected to an external drive assembly.

[0016] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0017] This invention, through the design of the heating mechanism, has a heating sleeve surrounding the barrel wall, and heating tubes evenly distributed inside can fully heat the epoxy molding compound inside the barrel. Combined with the efficient heat conduction of the aluminum alloy heat-conducting plate, the molding compound is heated more evenly, maintaining a stable temperature and ensuring good flowability during injection. This avoids problems such as poor flowability and uneven filling caused by excessively low molding compound temperature, effectively improving the quality and performance of semiconductor packaging.

[0018] This invention utilizes a flow regulation mechanism. By manually rotating a knob, a worm gear rotates, causing the worm wheel meshing with the worm gear to rotate. Ultimately, this drives a flow regulation plate to rotate around a shaft. As the flow regulation plate rotates inside the injection head, it can change the gap between itself and the inner wall of the injection head, thereby flexibly adjusting the flow rate of the molding compound. This avoids situations where there is too little or too much molding compound, effectively improving the packaging quality and reducing production and time costs. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a cross-sectional planar structural diagram of the present invention;

[0022] Figure 3 For the present utility model Figure 2Schematic diagram of the internal structure of the injection head;

[0023] Figure 4 For the present utility model Figure 2 A schematic diagram of the external structure of the injection head.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Barrel; 2. Propeller; 3. Injection head; 4. Heating jacket; 5. Heating tube; 6. Flow regulating plate; 7. Rotary shaft; 8. Aluminum alloy heat-conducting plate; 9. Protective cover; 10. Worm gear; 11. Worm; 12. Knob; 13. Mounting plate. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0027] This utility model provides, for example Figure 1-2 The semiconductor packaging epoxy molding compound injection device shown includes a barrel 1, a pusher 2, and an injection head 3. The pusher 2 is disposed inside the barrel 1, and the injection head 3 is disposed at the end of the barrel 1. One end of the pusher 2 located outside the barrel 1 is connected to an external drive assembly. The drive assembly is an electric propulsion or pneumatic propulsion device. The device also includes:

[0028] The heating mechanism includes a heating sleeve 4, which is fixedly installed on the wall of the barrel 1. The heating sleeve 4 has a hollow structure, and multiple evenly distributed heating tubes 5 are fixedly installed inside the heating sleeve 4. An aluminum alloy heat-conducting plate 8 is fixedly embedded on the side of the heating sleeve 4 that contacts the barrel 1. The aluminum alloy heat-conducting plate 8 has a ring structure. The aluminum alloy material has strong thermal conductivity, which enables the heating tubes 5 to effectively heat the epoxy molding compound inside the barrel 1. The heating sleeve 4 is made of rock wool insulation, which can reduce heat loss.

[0029] like Figure 2-4 As shown, the flow regulating mechanism includes a flow regulating plate 6 located inside the injection head 3. The flow regulating plate 6 is a circular plate, and its size is smaller than the inner wall size of the injection head 3, ensuring that the flow regulating plate 6 can rotate inside the injection head 3. A rotating shaft 7 is fixedly provided in the middle of the flow regulating plate 6. The two ends of the rotating shaft 7 are rotatably connected to the inner walls of the two sides of the injection head 3, and one end of the rotating shaft 7 extends to the outside of the injection head 3 and is provided with a rotating mechanism. The rotating mechanism includes a protective cover 9 fixedly provided on the side wall of the injection head 3. One end of the rotating shaft 7 extends to the inside of the protective cover 9 and is fixedly provided with a worm gear 10. A worm 11 is rotatably provided inside the protective cover 9, and the worm 11 meshes with the worm gear 10. One end of the worm 11 extends to the outside of the protective cover 9 and is fixedly provided with a knob 12.

[0030] like Figure 1-2 As shown, the cylinder wall of the material cylinder 1 is fixedly provided with an installation piece 13, which can be used to fix the material cylinder 1 in place.

[0031] When in use, first put the epoxy molding compound into the barrel 1, and connect the external drive component to the pusher 2. After starting, drive the pusher 2 to move inside the barrel 1.

[0032] Before the pusher pushes the molding compound, the heating mechanism starts to work. The heating sleeve 4 surrounds the wall of the cylinder 1. The heating tubes 5, which are evenly distributed inside, are energized and generate heat. The heat is quickly and evenly transferred to the molding compound in the cylinder 1 through the aluminum alloy heat conduction plate 8. The heating sleeve 4, made of rock wool insulation material, can reduce heat loss, maintain the temperature stability of the molding compound, and ensure its good fluidity.

[0033] The molding compound is pushed towards the injection head 3 by the pusher 2. At the injection head 3, the flow rate of the molding compound can be adjusted as needed. The knob 12 is manually turned, which drives the worm gear 11 to rotate. The worm wheel 10, which meshes with the worm gear 11, rotates accordingly. This causes the shaft 7 fixed on the worm wheel 10 to drive the flow regulating plate 6 to rotate around the shaft 7. Since the size of the flow regulating plate 6 is smaller than the inner wall size of the injection head 3, the gap between the flow regulating plate 6 and the inner wall of the injection head 3 changes when the flow regulating plate 6 rotates, thereby adjusting the flow rate of the molding compound through the injection head 3. Finally, after adjustment, the molding compound is extruded from the injection head 3 and injected into the semiconductor packaging mold to complete the packaging operation. During this process, because the worm wheel 10 and the worm gear 11 have a self-locking function, the flow regulating plate 6 will not rotate when not manually operated, ensuring the effectiveness of the product.

[0034] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor encapsulation epoxy potting material injection device comprising a material cylinder (1), a pusher (2) and an injection head (3), the pusher (2) is arranged inside the material cylinder (1), the injection head (3) is arranged at the end of the material cylinder (1), characterized in that, Also include: The heating mechanism includes a heating jacket (4) fixedly arranged on the barrel wall of the barrel (1), the heating jacket (4) adopts a hollow structure, and a plurality of uniformly distributed heating pipes (5) are fixedly arranged in the heating jacket (4); The flow regulating mechanism includes a flow regulating plate (6) located in the inside of the injection head (3), the middle of the flow regulating plate (6) is fixedly provided with a rotating shaft (7), the two ends of the rotating shaft (7) are rotatably connected with the two side inner walls of the injection head (3), and one end of the rotating shaft (7) extends to the outside of the injection head (3) and is provided with a rotating mechanism.

2. The apparatus of claim 1, wherein: The side of the heating jacket (4) in contact with the barrel (1) is fixedly embedded with an aluminum alloy heat conduction plate (8), the aluminum alloy heat conduction plate (8) adopts an annular structure, and the heating jacket (4) adopts a rock wool heat preservation sleeve.

3. The apparatus of claim 1, wherein: the mold is a semiconductor package epoxy mold compound injection apparatus. The rotating mechanism includes a protective cover (9) fixedly arranged on the side wall of the injection head (3), one end of the rotating shaft (7) extends to the inside of the protective cover (9) and is fixedly provided with a worm wheel (10), a worm (11) is rotatably arranged in the inside of the protective cover (9), the worm (11) is meshingly arranged with the worm wheel (10), and one end of the worm (11) extends to the outside of the protective cover (9) and is fixedly provided with a knob (12).

4. The apparatus of claim 1 wherein: the mold is a semiconductor package epoxy encapsulant injection mold. The flow regulating plate (6) adopts a circular plate, and the size of the flow regulating plate (6) is smaller than the size of the inner wall of the injection head (3).

5. The apparatus of claim 1 wherein: the mold is a semiconductor package epoxy mold. The barrel wall of the barrel (1) is fixedly provided with a mounting piece (13).

6. The apparatus of claim 1 wherein: the mold is a semiconductor package epoxy encapsulant injection mold. The end of the propeller (2) located outside the barrel (1) is connected with an external driving assembly.

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