Injection mold with double cooling structures

Abstract

The utility model relates to the technical field of injection molds, in particular to an injection mold with a double-cooling structure, which comprises an upper mold component, a lower mold component is mounted on the inner wall of the upper mold component, the upper mold component comprises a bottom plate, support rods are mounted at four corners of the top of the bottom plate, mounting plates are mounted at the tops of the support rods, and the mounting plates are mounted on the lower mold component. An electric push rod is mounted in the middle of the top of the mounting plate in a penetrating manner, an upper mold main body is mounted at the bottom of the electric push rod, a sliding rod is mounted at the top of the upper mold main body, and an inserting rod is mounted at the bottom of the upper mold main body. According to the improved injection mold, the upper mold assembly is adopted, when the injection mold is used, the upper mold body and the lower mold body can be rapidly installed and separated, and the using convenience of the injection mold is improved; the lower mold assembly is adopted, when the injection mold is used, double heat dissipation can be conducted on the lower mold body, materials in the mold can be rapidly cooled and formed, and the machining efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of injection mold technology, specifically to an injection mold with a dual cooling structure. Background Technology

[0002] Injection molds are the core tools used in the injection molding process and are widely used in the production of plastic products. Injection molding is a production process in which plastic raw materials are heated and melted, and then injected into the mold cavity through an injection molding machine. After cooling, the desired shape is obtained. The design and manufacturing quality of injection molds directly affect the quality of products, production efficiency, and cost.

[0003] In the process of realizing this utility model, the inventors discovered the following problems with the existing technology: 1. In the process of using existing ordinary injection molds, it is usually necessary to manually install and separate the upper mold and the lower mold, which is time-consuming and labor-intensive, increasing the workload of operators; 2. In the process of using existing ordinary injection molds, natural cooling is generally adopted. However, the time required for natural cooling is long, which leads to a longer production cycle and thus affects the overall processing efficiency. Utility Model Content

[0004] The purpose of this invention is to provide an injection mold with a dual cooling structure to solve the problems mentioned in the background art. To achieve the above objective, this invention provides the following technical solution: an injection mold with a dual cooling structure, comprising an upper mold assembly, wherein a lower mold assembly is mounted on the inner wall of the upper mold assembly.

[0005] The upper mold assembly includes a base plate, with support rods installed at the four top corners of the base plate. An mounting plate is installed on the top of the support rods, and an electric push rod is installed through the top center of the mounting plate. The upper mold body is installed at the bottom of the electric push rod, a sliding rod is installed on the top of the upper mold body, and an insert rod is installed at the bottom of the upper mold body.

[0006] The lower mold assembly includes a lower mold body mounted on the top of the base plate, a liquid pump, and a liquid storage tank. The inner wall of the lower mold body is equipped with a cooling pipe, a semiconductor cooling device is mounted on one side of the liquid storage tank, and a cooling fan is mounted on the front end of the lower mold body.

[0007] More preferably, the upper mold body and the electric push rod constitute a lifting mechanism.

[0008] More preferably, the top of the mounting plate has two circular holes, and the slide rods are slidably installed in the circular holes, and the slide rods are symmetrically distributed about the vertical center line of the upper mold body.

[0009] More preferably, there are four insertion rods in total, and the four insertion rods are distributed at the bottom of the upper mold body and near the four corners, and the top of the lower mold body has four circular insertion holes with internal dimensions consistent with the external dimensions of the insertion rods.

[0010] More preferably, the lower mold body has a U-shaped cavity inside, and two circular holes symmetrically distributed with the vertical center line of the lower mold body as the origin are opened at both the front and rear ends of the lower mold body. A cooling fan is installed in each of the two circular holes at the front end of the lower mold body, and a dustproof net is installed in each of the two circular holes at the rear end of the lower mold body.

[0011] More preferably, the cooling pipe is S-shaped, and the inlet end of the cooling pipe is connected to the outlet end of the pump through a pipe, and the outlet end of the cooling pipe is connected to the storage tank through a pipe, while the pump is connected to the storage tank through a pipe.

[0012] More preferably, the semiconductor cooling device consists of a semiconductor cooling chip, a heat sink, and a fan. The heat-absorbing end of the semiconductor cooling chip is connected to a liquid storage tank, the heat-releasing end of the semiconductor cooling chip is connected to the heat sink, and the fan is connected to the heat sink.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] In this invention, the upper mold assembly allows for quick installation and removal of the upper mold body from the lower mold body during injection molding. When the upper mold body needs to be installed with the lower mold body, the electric push rod is activated, moving the upper mold body, two sliding rods, and insert rods downwards. The four insert rods then insert into the corresponding circular holes at the top of the lower mold body, thus installing the upper mold body with the lower mold body. When the upper mold body needs to be separated from the lower mold body, the electric push rod is activated, moving the upper mold body, two sliding rods, and insert rods upwards, thus separating the upper mold body from the lower mold body. This allows for rapid installation and separation of the upper and lower mold bodies, improving the convenience of using the injection mold.

[0015] In this invention, the lower mold assembly, when using the injection mold, activates the liquid pump, cooling fan, and semiconductor cooling device (semiconductor cooling chip and fan) when the raw material is injected through the injection port of the upper mold body. The semiconductor cooling device cools the coolant in the storage tank, and the liquid pump draws the coolant from the storage tank. The coolant passes through the S-shaped cooling pipe, absorbs heat from the lower mold body, and returns to the storage tank. The cooling fan sends outside air into the cavity of the lower mold body, and then the air is discharged through two circular holes at the rear end of the lower mold body. During the injection molding process, the lower mold body receives dual heat dissipation, which allows the material inside the mold to cool and solidify quickly, improving processing efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the upper mold assembly structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the lower mold assembly structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the full cross-sectional structure of the lower mold assembly of this utility model.

[0020] In the diagram: 1. Upper mold assembly; 101. Base plate; 102. Support rod; 103. Mounting plate; 104. Electric push rod; 105. Upper mold body; 106. Slide rod; 107. Insert rod; 2. Lower mold assembly; 201. Lower mold body; 202. Liquid pump; 203. Liquid storage tank; 204. Cooling pipe; 205. Semiconductor cooling device; 206. Cooling fan. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1 to 4 The present invention provides a technical solution: an injection mold with a dual cooling structure, including an upper mold assembly 1, and a lower mold assembly 2 installed on the inner wall of the upper mold assembly 1.

[0023] The upper mold assembly 1 includes a base plate 101. Support rods 102 are installed at the four corners of the top of the base plate 101. An mounting plate 103 is installed on the top of the support rods 102. An electric push rod 104 is installed through the middle of the top of the mounting plate 103. An upper mold body 105 is installed at the bottom of the electric push rod 104. A sliding rod 106 is installed on the top of the upper mold body 105. An insert rod 107 is installed at the bottom of the upper mold body 105.

[0024] The lower mold assembly 2 includes a lower mold body 201, a liquid pump 202, and a liquid storage tank 203 installed on the top of the base plate 101. A cooling pipe 204 is installed on the inner wall of the lower mold body 201, a semiconductor cooling device 205 is installed on one side of the liquid storage tank 203, and a cooling fan 206 is installed at the front end of the lower mold body 201.

[0025] In this embodiment, as Figure 2As shown, the upper mold body 105 and the electric push rod 104 constitute a lifting mechanism; when the electric push rod 104 is started, it can drive the upper mold body 105 to move up and down, so that the upper mold body 105 can be automatically installed or separated from the lower mold assembly 2, improving the convenience of using the device.

[0026] In this embodiment, as Figure 2 As shown, the top of the mounting plate 103 has two circular holes, and the slide rods 106 are slidably installed in the circular holes. The slide rods 106 are symmetrically distributed about the vertical center line of the upper mold body 105. When the electric push rod 104 is started and drives the upper mold body 105 to move up and down, the two slide rods 106 slide in the circular holes on the mounting plate 103 at the same time, which can improve the stability of the upper mold body 105 when it moves up and down, thereby improving the stability of the device during use.

[0027] In this embodiment, as Figure 2 , Figure 3 and Figure 4 As shown, there are four insertion rods 107, which are distributed at the bottom of the upper mold body 105 and near the four corners. The top of the lower mold body 201 has four circular insertion holes with internal dimensions that match the external dimensions of the insertion rods 107. When the electric push rod 104 is activated and moves the upper mold body 105 downward, the four insertion rods 107 on the upper mold body 105 are inserted into the corresponding circular holes on the top of the lower mold body 201. This can improve the stability of the upper mold body 105 and the lower mold body 201 during installation, thereby improving the stability of the device during use.

[0028] In this embodiment, as Figure 3 and Figure 4 As shown, the lower mold body 201 has a U-shaped cavity inside, and two circular holes symmetrically distributed with the vertical center line of the lower mold body 201 as the origin are opened at both the front and rear ends of the lower mold body 201. A cooling fan 206 is installed in each of the two circular holes at the front end of the lower mold body 201, and a dustproof screen is installed in each of the two circular holes at the rear end of the lower mold body 201. When the two cooling fans 206 are activated, they can draw in outside air and send it into the cavity of the lower mold body 201. Then, the air is discharged through the two circular holes at the rear end of the lower mold body 201, which can dissipate heat from the lower mold body 201, allowing the material inside the mold to cool and solidify quickly. The cooling fans 206 and the dustproof screens in the two circular holes at the rear end of the lower mold body 201 can prevent external dust from entering the cavity of the lower mold body 201, causing cavity blockage and affecting the heat dissipation effect.

[0029] In this embodiment, as Figure 3 and Figure 4As shown, the cooling pipe 204 is S-shaped, and the inlet end of the cooling pipe 204 is connected to the outlet end of the pump 202 through a pipe. The outlet end of the cooling pipe 204 is connected to the storage tank 203 through a pipe. At the same time, the pump 202 is connected to the storage tank 203 through a pipe. The cooling pipe 204 is installed on the top of the cavity wall of the lower mold body 201. When the pump 202 is started, it draws the coolant in the storage tank 203. The coolant passes through the S-shaped cooling pipe 204 and then returns to the storage tank 203. The coolant can absorb the heat on the lower mold body 201, so that the material in the mold can be cooled and formed quickly.

[0030] In this embodiment, as Figure 1 , Figure 3 and Figure 4 As shown, the semiconductor cooling device 205 consists of a semiconductor cooling chip, a heat sink, and a fan. The heat-absorbing end of the semiconductor cooling chip is connected to the liquid storage tank 203, the heat-releasing end of the semiconductor cooling chip is connected to the heat sink, and the fan is connected to the heat sink. When the semiconductor cooling chip and the fan are started, the semiconductor cooling chip absorbs the heat of the coolant in the liquid storage tank 203 through the liquid storage tank 203 to cool the coolant, which can improve the cooling effect of the coolant on the lower mold body 201. The fan and the heat sink dissipate heat from the heat-releasing end of the semiconductor cooling chip.

[0031] The usage method and advantages of this utility model: The injection mold with a dual cooling structure operates as follows:

[0032] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, firstly, the electric push rod 104 is activated, causing the upper mold body 105, two sliding rods 106, and insert rods 107 to move downwards. Then, the four insert rods 107 are inserted into the corresponding circular holes at the top of the lower mold body 201, completing the installation of the upper mold body 105 and the lower mold body 201. Next, raw materials are injected through the injection port on the upper mold body 105. Then, the liquid pump 202, the cooling fan 206, and the semiconductor cooling device 205 (including the thermoelectric cooler and fan) are activated, and the semiconductor cooling device 205 cools the liquid storage tank 203. Cooling is achieved by pumping coolant from the storage tank 203 using a pump 202. The coolant passes through the S-shaped cooling pipe 204 and then returns to the storage tank 203. Two cooling fans 206 draw in outside air and send it into the cavity of the lower mold body 201. The air then exits through two circular holes at the rear end of the lower mold body 201, allowing the material inside the mold to cool and solidify rapidly. Then, the electric push rod 104 is activated, which moves the upper mold body 105, the two sliding rods 106, and the insert rod 107 upwards. Finally, the solidified material is removed.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. Injection mold with double cooling structure, comprising an upper mold assembly (1), characterized in that: The inner wall of the upper mold assembly (1) is provided with a lower mold assembly (2); The upper mold assembly (1) comprises a bottom plate (101), four support rods (102) are installed at the top corners of the bottom plate (101), an installation plate (103) is installed at the top of the support rods (102), an electric push rod (104) is installed through the top middle part of the installation plate (103), an upper mold body (105) is installed at the bottom of the electric push rod (104), a sliding rod (106) is installed at the top of the upper mold body (105), and a plug rod (107) is installed at the bottom of the upper mold body (105). The lower mold assembly (2) comprises a lower mold body (201) installed on the top of the bottom plate (101), a liquid pumping device (202) and a liquid storage tank (203), a cooling pipe (204) is installed on the inner wall of the lower mold body (201), a semiconductor cooling device (205) is installed on one side of the liquid storage tank (203), and a heat dissipation fan (206) is installed at the front end of the lower mold body (201).

2. The injection mold having a dual cooling structure according to claim 1, characterized by: The upper mold body (105) and the electric push rod (104) constitute a lifting mechanism.

3. The injection mold having a dual cooling structure according to claim 1, characterized by: Two circular holes are formed in the top of the installation plate (103), the sliding rod (106) is slidingly installed in the circular holes, and the sliding rods (106) are symmetrically distributed about the vertical center line of the upper mold body (105).

4. The injection mold having a dual cooling structure according to claim 1, characterized by: The four plug rods (107) are distributed at the bottom of the upper mold body (105) and close to the four corners, and four circular insertion holes are formed in the top of the lower mold body (201), the internal dimensions of which are consistent with the external dimensions of the plug rods (107).

5. The injection mold having a dual cooling structure according to claim 1, characterized by: A U-shaped cavity is formed in the lower mold body (201), two circular holes are formed in the front and rear ends of the lower mold body (201) and symmetrically distributed about the vertical center line of the lower mold body (201), the heat dissipation fan (206) is installed in the two circular holes at the front end of the lower mold body (201), and a dust screen is arranged in the two circular holes at the rear end of the lower mold body (201).

6. The injection mold having a dual cooling structure according to claim 1, characterized by: The cooling pipe (204) is in an S shape, the liquid inlet end of the cooling pipe (204) is connected with the liquid outlet end of the liquid pumping device (202) through a pipeline, the liquid outlet end of the cooling pipe (204) is connected with the liquid storage tank (203) through a pipeline, and the liquid pumping device (202) is connected with the liquid storage tank (203) through a pipeline.

7. The injection mold having a dual cooling structure according to claim 1, characterized by: The semiconductor cooling device (205) is composed of a semiconductor refrigeration sheet, a heat dissipation fin and a fan, the heat absorption end of the semiconductor refrigeration sheet is connected with the liquid storage tank (203), the heat release end of the semiconductor refrigeration sheet is connected with the heat dissipation fin, and the fan is connected with the heat dissipation fin.

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