Conductive shielding flexible film

Abstract

The utility model relates to the field of electromagnetic shielding, and discloses a conductive shielding flexible film, which comprises a protective layer, a conductive layer and a gum layer, and is characterized in that the protective layer is provided with a first surface and is a polyethylene terephthalate protective layer, a polyimide protective layer or a thermoplastic polyurethane elastomer protective layer; the conductive layer is arranged on the first surface and is a copper conductive layer, a nickel conductive layer, a gold conductive layer, an aluminum conductive layer or a silver conductive layer; the back adhesive layer is arranged on the side, away from the first surface, of the conductive layer, and the back adhesive layer is a hot melt adhesive back adhesive layer, a thermosetting adhesive back adhesive layer, an organic silica gel back adhesive layer, a pressure-sensitive adhesive back adhesive layer and a polyurethane conductive hot melt adhesive back adhesive layer. According to the utility model, the conductive layer is protected by the protective layer and is prevented from being scratched and oxidized, the conductive layer plays a role in electromagnetic shielding, the device is bonded on a product by the back adhesive layer, and the protective layer, the conductive layer and the back adhesive layer which are made of special materials are adopted, so that the flexible electronic component packaging device has flexibility and meets the wrapping and packaging requirements of electronic components with complex shapes.

Description

TECHNICAL FIELD

[0001] The utility model relates to shielding film technical field especially relates to a kind of conductive shielding flexible film. BACKGROUND

[0002] In the current market environment, electromagnetic shielding products are various, wherein metal shielding cover is a more common type, and its material covers white copper, stainless steel and various alloys etc.This kind of metal shielding cover is usually processed into shape by means of stamping, bending and welding process.

[0003] In actual use, due to the difference of shape and surface profile of different electronic components, it is often necessary to specially customize the metal shielding cover adapted thereto, and the signals of various electronic components are shielded by the metal shielding cover to avoid signal interference between each electronic component, but such customized production not only lengthens production cycle, but also produces additional cost in mold design and manufacturing, material customization and procurement and processing technology, resulting in substantial increase in cost.

[0004] Therefore, the prior art still needs to be improved and developed. UTILITY MODEL CONTENT

[0005] The utility model solves the technical problems, in view of the above defects of prior art, provide a kind of conductive shielding flexible film, to solve the problem that the metal shielding cover of prior art needs to be customized when signal shielding for various electronic components, but customized production not only lengthens production cycle, but also produces additional cost in mold design and manufacturing, material customization and procurement and processing technology, resulting in substantial increase in cost.

[0006] The technical scheme adopted by the utility model to solve technical problems is as follows:

[0007] A kind of conductive shielding flexible film, comprising:

[0008] protective layer, with first surface, the protective layer is phthalic acid glycol protective layer, polyimide protective layer or thermoplastic polyurethane elastomer protective layer;

[0009] Conductive layer is set to the first surface, the conductive layer is copper conductive layer, nickel conductive layer, gold conductive layer, aluminum conductive layer or silver conductive layer;

[0010] Back adhesive layer is set to the side of the conductive layer away from the first surface, the back adhesive layer is hot melt adhesive back adhesive layer, thermosetting adhesive back adhesive layer, silicone adhesive back adhesive layer, pressure sensitive adhesive back adhesive or polyurethane conductive hot melt adhesive back adhesive layer.

[0011] The conductive shielding flexible film, wherein, the back adhesive layer is provided with a plurality of conductive metal particles.

[0012] The conductive shielding flexible film, wherein the conductive metal particles are silver conductive metal particles, copper conductive metal particles, gold conductive metal particles or nickel conductive metal particles.

[0013] The conductive shielding flexible film, wherein the thickness of the protective layer is 0.002-0.03mm.

[0014] The conductive shielding flexible film, wherein the thickness of the conductive layer is 0.01-0.05mm.

[0015] The conductive shielding flexible film, wherein the thickness of the adhesive layer is 0.01-0.05mm.

[0016] The conductive shielding flexible film, wherein the protective layer, the conductive layer and the adhesive layer are combined from top to bottom.

[0017] Advantages:

[0018] The conductive shielding flexible film of the utility model discloses a protective layer, a conductive layer and an adhesive layer, the protective layer can protect the conductive layer, prevent the conductive layer from being scratched and oxidized, the conductive layer can play the role of electromagnetic shielding, the adhesive layer can bond the device on the corresponding product, because the protective layer, the conductive layer and the adhesive layer are made of special material, the device has good flexibility, can stretch and deform, also has good shielding and conductivity, can tightly wrap multiple electronic components of different shapes at the same time, meets the wrapping and packaging requirements of the electronic components of complex shape, has simple structure, convenient production and manufacture, effectively reduces the cost. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structure diagram of the conductive shielding flexible film in the utility model.

[0020] In the drawing:

[0021] 1, protective layer, 2, conductive layer, 3, adhesive layer. DETAILED DESCRIPTION

[0022] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the present application, and cannot be understood as limiting the present application.

[0023] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can be explicitly or implicitly included one or more. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0024] In the description of the present application, it needs to be understood that unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] The content of the utility model is further illustrated by the description of the embodiments in combination with the drawings.

[0026] The embodiment provides a conductive shielding flexible film, as shown in Figure 1 In order to solve the above technical problems, the technical scheme adopted by the utility model is as follows: comprising: a protective layer 1, a conductive layer 2 and a back adhesive layer 3, the protective layer 1 has a first surface, the protective layer 1 is an ethylene glycol phthalate protective layer, a polyimide protective layer or a thermoplastic polyurethane elastomer protective layer;The conductive layer 2 is arranged on the first surface, and the conductive layer 2 is a copper conductive layer, a nickel conductive layer, a gold conductive layer, an aluminum conductive layer or a silver conductive layer;The back adhesive layer 3 is arranged on the side of the conductive layer 2 away from the first surface, and the back adhesive layer 3 is a hot melt adhesive back adhesive layer, a thermosetting adhesive back adhesive layer, a silicone adhesive back adhesive layer, a pressure sensitive adhesive back adhesive layer or a polyurethane conductive hot melt adhesive back adhesive layer.

[0027] Specifically, the existing metal shielding cover needs to be specially customized to adapt to the shape and surface profile of different electronic components in actual use, and the signals of various electronic components are shielded by the metal shielding cover to avoid signal interference between the electronic components. However, such customized production not only prolongs the production cycle, but also produces additional costs in mold design and manufacturing, material customization and procurement, and processing technology, resulting in a substantial increase in cost. For example, the metal shielding cover provided on the mobile phone shell needs to be customized to adapt to the shape of the metal shielding cover for each electronic component, so that the metal shielding cover on the mobile phone shell closely fits the electronic component. However, the number of metal shielding covers is large, and the shape and size are different, making production and manufacturing difficult and increasing cost.

[0028] In actual use, the conductive layer 2 is processed on the protective layer 1 by silk printing, and after drying in an oven, the adhesive layer 3 is attached to the conductive layer 2 to form a shape. The protective layer 1 protects the conductive layer 2, which can prevent the conductive layer 2 from being scratched and oxidized. The conductive layer 2 plays a role in electromagnetic shielding, and the adhesive layer 3 plays a role in sticking, so that the device can closely fit each electronic component.

[0029] In this embodiment, the protective layer 1 is an ethylene glycol phthalate protective layer, a polyimide protective layer or a thermoplastic polyurethane elastomer protective layer. The ethylene glycol phthalate protective layer refers to a protective layer 1 made of ethylene glycol phthalate material, which has high strength, hardness and toughness, good friction resistance, poor thermal stability and slightly poor flexibility, but it has good electrical insulation performance and can effectively prevent short circuit of the circuit board. The polyimide protective layer refers to a protective layer 1 made of polyimide material, which has excellent heat resistance, low thermal expansion coefficient, good dimensional stability in environments with large temperature changes, high strength, good flexibility and strong chemical stability. The thermoplastic polyurethane elastomer protective layer refers to a protective layer 1 made of thermoplastic polyurethane elastomer material, which has high strength, flexibility and friction resistance, can withstand pressure or impact while maintaining its original shape and structure, has good tensile strength and is not easy to break even in tension, has good flexibility and can withstand a certain degree of deformation.

[0030] The conductive layer 2 is made of copper, nickel, gold, aluminum or silver. The copper conductive layer refers to a conductive layer 2 made of copper material. Copper has excellent conductivity, which can significantly reduce circuit resistance and reduce power loss, thereby providing strong support for performance improvement and efficiency optimization of electronic components and devices. However, copper has poor chemical stability and is easily oxidized in air, especially in humid environments. The nickel conductive layer refers to a conductive layer 2 made of nickel material. Nickel has poorer conductivity than silver, copper and gold, with a resistivity of about 6.93 x 10 -8 Ω at room temperature, but it has good corrosion resistance and electromagnetic shielding performance. The gold conductive layer refers to a conductive layer 2 made of gold material. Gold has excellent chemical stability, strong oxidation resistance and corrosion resistance, excellent conductivity and good ductility. However, gold is a precious metal with high price, which greatly limits its wide application in mass production and consumer electronics. The aluminum conductive layer refers to a conductive layer 2 made of aluminum material. Aluminum has a small density and light weight. Although the conductivity of aluminum is slightly inferior to that of copper and gold, it can still meet the basic requirements of many electronic devices for conductivity. Aluminum is a relatively active metal that easily reacts with oxygen in air to form a dense aluminum oxide film on its surface, making it resistant to corrosion in air. Aluminum has relatively low cost, so it can be used as a cost-effective alternative material in applications where conductivity requirements are not very strict. The silver conductive layer refers to a conductive layer 2 made of silver material. Silver has extremely high conductivity, with a resistivity of about 1.59 x 10 -8 Ω at room temperature, much better than copper, aluminum and nickel. Silver can efficiently and quickly transmit current, reduce energy loss and signal attenuation, and greatly improve the performance and efficiency of electronic devices.

[0031] Preferably, silver is used as the material of the conductive layer 2, which has excellent ductility and flexibility. This property allows silver to have various forms of silver nanoparticles, such as silver nanowires, silver nanotubes and silver nanospheres, which can be processed onto the protective layer 1 by silk printing. After drying in an oven, a silver conductive layer is formed. The silver conductive layer still exhibits excellent conductivity after stretching.

[0032] The back adhesive layer 3 is a hot melt adhesive back adhesive layer, a thermosetting adhesive back adhesive layer, a silicone adhesive back adhesive layer, a pressure sensitive adhesive back adhesive layer or a polyurethane conductive hot melt adhesive back adhesive layer. The hot melt adhesive back adhesive layer is made of hot melt adhesive material. The hot melt adhesive has good plasticity, high stability and high efficiency, and is suitable for high-speed automatic production. The thermosetting adhesive back adhesive layer is made of thermosetting adhesive material. The thermosetting adhesive is used as an epoxy adhesive. The curing method is heating curing. The thermosetting adhesive is widely used in structural bonding due to its high bonding strength, excellent aging resistance and other advantages. The silicone adhesive back adhesive layer is made of silicone adhesive material. The silicone adhesive naturally has excellent properties of organic materials, such as low viscosity-temperature coefficient, high compressibility, high and low temperature resistance, oxidation resistance and the like. The pressure sensitive adhesive back adhesive layer is made of pressure sensitive adhesive material. The pressure sensitive adhesive has excellent bonding performance and firm bonding during use. The polyurethane conductive hot melt adhesive back adhesive layer is made of polyurethane and conductive hot melt adhesive materials. The polyurethane conductive hot melt adhesive back adhesive layer has good conductivity, excellent bonding performance, good flexibility, and the characteristics of repeated heating and melting and re-bonding. The polyurethane conductive hot melt adhesive back adhesive layer can avoid the residue phenomenon during machine rework and facilitate machine disassembly and rework.

[0033] Preferably, the back adhesive layer 3 is a polyurethane conductive hot melt adhesive back adhesive layer.

[0034] In the above embodiment, the protective layer 1, the conductive layer 2 and the back adhesive layer 3 are made of specific materials, so that the device has good flexibility, can be stretched and deformed, has good shielding and conductivity, can tightly wrap multiple electronic components of different shapes at the same time, meets the wrapping and packaging requirements of electronic components of complex shapes, has a simple structure, is convenient to produce and manufacture, and effectively reduces the cost.

[0035] In another embodiment of the present application, the back adhesive layer 3 is provided with a plurality of conductive metal particles.

[0036] Specifically, the back adhesive layer 3 is added with a plurality of conductive metal particles. The conductive metal particles have good conductivity. By embedding the conductive metal particles in the back adhesive layer 3, the back adhesive layer 3 forms a conductive path, plays a role of electromagnetic shielding, and can also be grounded to reduce the risk of static electricity accumulation and discharge.

[0037] In another embodiment of the present application, the conductive metal particles are silver conductive metal particles, copper conductive metal particles, gold conductive metal particles or nickel conductive metal particles.

[0038] Specifically, the conductive metal particles in the embodiment are silver conductive metal particles, copper conductive metal particles, gold conductive metal particles or nickel conductive metal particles. The silver conductive metal particles refer to conductive metal particles made of silver. Silver has the best conductivity and relatively stable chemical properties and is not easy to oxidize in air. The copper conductive metal particles refer to conductive metal particles made of copper. Copper has a conductivity only inferior to silver and a lower cost than silver, but a poorer chemical stability than silver. The gold conductive metal particles refer to conductive metal particles made of gold. Gold has good conductivity and stable chemical properties, but is relatively expensive. The nickel conductive metal particles refer to conductive metal particles made of nickel. Nickel has a conductivity poorer than silver, copper and gold, and good corrosion resistance.

[0039] In another embodiment of the present application, the color of the protective layer 1 is black or white.

[0040] Specifically, the color of the protective layer 1 can be selected and set by the user according to actual needs, for example, black or white. The black protective layer 1 has good light-shielding and heat-absorbing properties and can effectively transfer the heat generated by electronic components. The white protective layer 1 has a simple and beautiful effect and high strength and can withstand a large external force without being easily damaged.

[0041] In another embodiment of the present application, the thickness of the protective layer 1 is 0.002-0.03 mm.

[0042] Specifically, the thickness of the protective layer 1 is 0.002-0.03 mm. In the embodiment, the thickness of the protective layer 1 is preferably 0.01 mm. The protective layer 1 with this thickness has good flexibility and adhesion and is not easy to produce bubbles and wrinkles. It can tightly wrap multiple electronic components with different shapes and different surface profiles and meet the wrapping and packaging requirements of complex-shaped electronic components. That is, it can avoid the phenomenon that the protective layer is too thin, the tensile strength is not enough, the electronic components are easily damaged when wrapped, and cracks, bubbles and wrinkles are easily produced. In addition, it can avoid the phenomenon that the protective layer 1 is too thick, the product has poor flexibility, and the electronic components are easily arched and broken when wrapped.

[0043] In another embodiment of the present application, the thickness of the conductive layer 2 is 0.01-0.05 mm.

[0044] Specifically, the thickness of the conductive layer 2 can be selected as 0.01-0.05 mm, and in the embodiment, the thickness of the conductive layer 2 is preferably 0.02 mm. In the operation of silk printing the conductive layer 2, the cracking of the material and the generation of poor resistance and other problems can be effectively avoided, and the conductive layer 2 has good conductivity and strong adhesion, thereby ensuring the reliability and stability of the electronic component in the long-term use process. The thickness of the conductive layer 2 is neither too thin to cause insufficient shielding effect of the product, nor too thick to cause cracking phenomenon.

[0045] In another embodiment of the present application, the thickness of the back adhesive layer 3 is 0.01-0.05 mm.

[0046] Specifically, the thickness of the back adhesive layer 3 is 0.01-0.05 mm, and in the embodiment, the thickness of the back adhesive layer 3 is preferably 0.02 mm. The back adhesive layer 3 has good processing performance, can achieve high bonding strength and conductivity in a short time, thereby improving production efficiency, and has good flexibility and plasticity, can wrap multiple electronic components of different shapes, can meet the wrapping and packaging requirements of electronic components of complex shapes, and the back adhesive layer 3 of the thickness can maintain its performance stability under different environmental conditions, and is not prone to problems such as conductivity decline and bonding failure. That is, the back adhesive layer 3 is neither too thin to cause poor adhesion and fail to tightly wrap the electronic component, nor too thick to cause poor flexibility, long drying and curing time, and be not conducive to rework, and generate internal stress when wrapping the electronic component, which may cause cracks or gaps between the bonding interface of the electronic component and the back adhesive layer 3, thereby causing the decline of grounding performance and electrical connection effect.

[0047] In another embodiment of the present application, the protective layer 1, the conductive layer 2 and the back adhesive layer 3 are combined from top to bottom.

[0048] Specifically, after the protective layer 1, the conductive layer 2 and the back adhesive layer 3 are combined from top to bottom, the user can set the shape of the device according to the use scenario, so that the device can match the shape of the corresponding product, and the adaptability of the device is stronger and the applicability range is larger.

[0049] In conclusion, the utility model provides a kind of conductive shielding flexible film, by setting protective layer, conductive layer and back adhesive layer, protective layer can protect conductive layer, prevent conductive layer from being scratched and oxidized, and conductive layer can play the role of electromagnetic shielding, back adhesive layer can bond the device on corresponding product, since the protective layer, conductive layer and back adhesive layer made of special material, so that the device has good flexibility, can be stretched and deformed, also has good shielding and conductivity, can simultaneously tightly wrap multiple electronic components of different shapes, meet the wrapping requirements and packaging requirements of complex shape electronic components, simple structure, easy to produce and manufacture, effectively reduce cost;By setting a plurality of conductive metal particles on the back adhesive layer, the conductivity of the back adhesive layer can be effectively improved, so that the back adhesive layer forms a conductive path, thereby effectively blocking electromagnetic waves and playing the role of electromagnetic shielding, and the back adhesive layer can also be grounded to reduce the risk of static accumulation and discharge.

[0050] It should be understood that the application of the utility model is not limited to the above examples, and those skilled in the art can improve or change according to the above description, and all these improvements and changes shall belong to the protection scope of the claims attached to the utility model.

Claims

1. An electrically conductive shielding flexible film characterized by, The protective layer has a first surface, and is a phthalic acid glycol protective layer, a polyimide protective layer or a thermoplastic polyurethane elastomer protective layer. The conductive layer is disposed on the first surface, and is a copper conductive layer, a nickel conductive layer, a gold conductive layer, an aluminum conductive layer or a silver conductive layer. The adhesive layer is disposed on the side of the conductive layer away from the first surface, and is a hot melt adhesive layer, a thermosetting adhesive layer, a silicone adhesive layer, a pressure sensitive adhesive layer or a polyurethane conductive hot melt adhesive layer. The adhesive layer is provided with a plurality of conductive metal particles.

2. The conductive shielding flexible film of claim 1, wherein, The conductive metal particles are silver conductive metal particles, copper conductive metal particles, gold conductive metal particles or nickel conductive metal particles.

3. The conductive shielding flexible film of claim 2, wherein, The thickness of the protective layer is 0.002-0.03 mm.

4. The conductive shielding flexible film of claim 1, wherein, The thickness of the conductive layer is 0.01-0.05 mm.

5. The conductive shielding flexible film of claim 1, wherein, The thickness of the adhesive layer is 0.01-0.05 mm.

6. The conductive shielding flexible film of claim 1, wherein, The protective layer, the conductive layer and the adhesive layer are combined from top to bottom in order.

7. The conductive shielding flexible film of claim 1, wherein, ​

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