Heat dissipation device and vehicle

Abstract

The utility model provides a heat dissipation device and a vehicle, and relates to the technical field of automobile parts. The heat dissipation device comprises a base, a refrigeration part, a heat dissipation assembly and at least one fan. The refrigerating part is arranged on the base, and the cold end face of the refrigerating part is used for dissipating heat of the part to be cooled. The heat dissipation assembly is arranged on the base, the heat dissipation assembly abuts against the refrigeration part, and the heat dissipation assembly is provided with at least one containing groove. At least part of the fans are correspondingly arranged in the containing grooves. The fan is contained in the containing groove of the heat dissipation assembly, so that the stacked arrangement that the fan and the heat dissipation assembly are sequentially stacked in the related technology can be avoided, the overall structure of the heat dissipation device is more compact, and the size of the heat dissipation device is reduced.

Description

Technical Field

[0001] This application relates to the field of automotive parts technology, and more particularly to a heat dissipation device and a vehicle. Background Technology

[0002] Vehicle lights are an essential lighting tool for vehicles, primarily used in low-light conditions to ensure safe driving. Vehicle lights generate a significant amount of heat during use; therefore, heat dissipation measures are necessary to extend their lifespan and defog them.

[0003] In related technologies, heat dissipation devices utilize the cooling principle of semiconductor refrigeration chips to dissipate heat from vehicle headlights. The heat dissipation device has a housing, within which a semiconductor refrigeration chip, a heat sink assembly, and a fan are housed. The semiconductor refrigeration chip is connected to the heat sink assembly, which improves the heat exchange efficiency between the semiconductor refrigeration chip and the vehicle headlight. The fan promotes airflow to further enhance the heat dissipation efficiency of the heat sink assembly.

[0004] However, existing heat dissipation devices are generally large in size, making subsequent installation inconvenient. Utility Model Content

[0005] This application provides a heat dissipation device and a vehicle to solve the problem that existing heat dissipation devices are large in size and inconvenient to install.

[0006] In a first aspect, an embodiment of this application provides a heat dissipation device, comprising:

[0007] Base;

[0008] The cooling component is mounted on the base, and its cold end face is used to dissipate heat from the component to be cooled.

[0009] A heat dissipation component is disposed on a base and abuts against a cooling component. The heat dissipation component has at least one receiving groove.

[0010] At least one fan, and at least some of the fans are respectively disposed in the receiving slot.

[0011] In one possible implementation, the heat dissipation device provided in this application embodiment includes a first heat dissipation component and a second heat dissipation component, both of which have receiving grooves.

[0012] The first heat sink abuts against the cold end face of the cooling component, and the second heat sink abuts against the hot end face of the cooling component.

[0013] In one possible implementation, the heat dissipation device provided in this application embodiment includes at least one of the first heat dissipation component and the second heat dissipation component:

[0014] The support is located on the base and abuts against the refrigeration component.

[0015] Multiple heat sinks are spaced apart on the support, and the heat sinks and the support form a receiving groove.

[0016] In one possible implementation, the heat dissipation device provided in this application embodiment has a mounting through hole on the base, and the cooling component is disposed in the mounting through hole;

[0017] An mounting platform is provided circumferentially inside the mounting through hole. The mounting platform, the first heat sink, the cooling component, and the second heat sink are sequentially abutted together. The second heat sink is detachably connected to the base.

[0018] In one possible implementation, the heat dissipation device provided in this application embodiment further includes a first connector;

[0019] The second heat sink has a first connecting part, and the base has a second connecting part. The first connecting part connects the first connecting part and the second connecting part.

[0020] In one possible implementation, the heat dissipation device provided in this application embodiment has a positioning part on the side of the first heat dissipation component facing the cooling component, and the cooling component is installed on the positioning part.

[0021] In one possible implementation, the heat dissipation device provided in this application embodiment has wiring holes on both the first heat dissipation component and the second heat dissipation component. The wiring holes are connected to the mounting through holes and are used for wiring harnesses.

[0022] In one possible implementation, the heat dissipation device provided in this application embodiment has a water collection part on the base, which is correspondingly arranged with the first heat dissipation component, and the water collection part is used to collect water droplets dripping from the first heat dissipation component.

[0023] The base is also provided with a drainage channel, the first heat sink is provided with a first drainage hole, and the second heat sink is provided with a second drainage hole. The water collection part, the first drainage hole, the drainage channel and the second drainage hole are connected in sequence. The second drainage hole is used to connect with an external liquid collection device.

[0024] In one possible implementation, the heat dissipation device provided in this application embodiment further includes at least one end cover, on which a plurality of air outlet holes are provided;

[0025] The end cap is connected to the heat dissipation assembly, and the end cap is placed on the receiving groove.

[0026] Secondly, an embodiment of this application provides a vehicle including a vehicle body and any of the above-mentioned heat dissipation devices disposed on the vehicle body.

[0027] This utility model provides a heat dissipation device and a vehicle. The heat dissipation device includes a base, a cooling component, a heat dissipation assembly, and at least one fan. The cooling component is disposed on the base, and its cold end face is used to dissipate heat from the component to be cooled. The heat dissipation assembly is disposed on the base, abutting against the cooling component, and has at least one receiving groove. At least a portion of the fan is correspondingly disposed within the receiving groove. By housing the fan within the receiving groove of the heat dissipation assembly, the stacked arrangement of the fan and heat dissipation assembly in related technologies can be avoided, making the overall structure of the heat dissipation device more compact and reducing its volume. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0029] Figure 1 This is a schematic diagram of the structure of the heat dissipation device provided in the embodiments of this application;

[0030] Figure 2 for Figure 1 Exploded view of the heat dissipation device in the middle;

[0031] Figure 3 for Figure 2 A partial structural diagram;

[0032] Figure 4 for Figure 2 A schematic diagram of the base structure;

[0033] Figure 5 for Figure 2 A schematic diagram of the structure of the second heat sink in the middle;

[0034] Figure 6 for Figure 2 A schematic diagram of the structure of the first heat sink component.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Base; 110. Mounting through hole; 111. Mounting platform; 120. Second connection part; 130. Water collection part; 140. Drainage channel; 150. One-way valve; 160. Thermal insulation component; 170. Sealing component;

[0037] 200. Refrigeration components;

[0038] 300. Heat dissipation assembly; 310. First heat sink; 311. First support portion; 312. First heat sink fin; 313. First wiring hole; 314. First drainage hole; 315. Positioning portion; 320. Second heat sink; 321. Second support portion; 322. Second heat sink fin; 323. First connecting portion; 324. Second wiring hole; 325. Second drainage hole; 326. Extension portion; 327. Clearance notch; 330. Receiving groove; 331. First receiving groove; 332. Second receiving groove;

[0039] 400. Fan;

[0040] 500. End cap; 510. First end cap; 520. Second end cap;

[0041] 600. Electrical control unit.

[0042] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0043] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0044] The terms “first,” “second,” “third,” and “fourth,” etc. (if present), in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0045] In related technologies, heat dissipation devices utilize the cooling principle of semiconductor refrigeration chips to dissipate heat from vehicle lights. The heat dissipation device has a housing, within which a semiconductor refrigeration chip, a heat sink assembly, and a fan are housed. The semiconductor refrigeration chip is connected to the heat sink assembly, which improves the heat exchange efficiency between the semiconductor refrigeration chip and the vehicle light. The fan is connected to the heat sink assembly, promoting airflow to further enhance the heat dissipation efficiency of the heat sink assembly.

[0046] However, among the aforementioned heat dissipation devices, the overall size is relatively large, making subsequent installation inconvenient.

[0047] To address the aforementioned problems in the prior art, this utility model provides a heat dissipation device and a vehicle. The heat dissipation device includes a base, a cooling component, a heat dissipation assembly, and at least one fan. The cooling component is disposed on the base, and its cold end face is used to dissipate heat from the component to be cooled. The heat dissipation assembly is disposed on the base, abutting against the cooling component, and has at least one receiving groove. At least a portion of the fan is correspondingly disposed within the receiving groove. By housing the fan within the receiving groove of the heat dissipation assembly, the stacked arrangement of the fan and heat dissipation assembly in related technologies is avoided, resulting in a more compact overall structure and reduced volume of the heat dissipation device.

[0048] The following describes exemplary application scenarios of this utility model.

[0049] The heat dissipation device provided by this utility model can be used to dissipate heat and cool vehicle lights, such as car lights and truck lights. Specifically, the heat dissipation device provided by this utility model makes the overall structure of the heat dissipation device more compact and reduces its size by housing the fan in the receiving slot of the heat dissipation component.

[0050] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0051] Reference Figures 1 to 6 As shown, the heat dissipation device provided in this application embodiment includes a base 100, a cooling component 200, a heat dissipation assembly 300, and at least one fan 400.

[0052] A cooling component 200 is disposed on a base 100, and the cold end face of the cooling component 200 is used to dissipate heat from the component to be scaldredged. A heat dissipation assembly 300 is disposed on the base 100, and at least a portion of the heat dissipation assembly 300 abuts against the hot end face of the cooling component 200. The heat dissipation assembly 300 has at least one receiving groove 330. At least a portion of the fan 400 is correspondingly disposed within the receiving groove 330.

[0053] Understandably, the cooling component 200 can be a conventional semiconductor cooling chip. The cooling component 200 has a cold end face and a hot end face, and the cold end face can be used to connect to the component to be cooled. The cooling component 200 has a unidirectional heat dissipation function. After the cooling component 200 is connected to an external power source, it can transfer heat from the cold end face to the hot end face under the action of electrical energy, thereby dissipating heat from the component to be cooled.

[0054] The heat dissipation component 300 abuts against the cooling component 200, and under the action of the fan 400, the heat exchange efficiency between the cooling component 200 and the component to be cooled is improved, ensuring the normal operation and effective cooling of the cooling component 200. The fan 400 can promote airflow to further improve heat dissipation efficiency.

[0055] Furthermore, refer to Figure 1 and Figure 2 As shown, the fan 400 is housed in the receiving slot 330 of the heat dissipation component 300. This avoids the stacked arrangement of the fan 400 and the heat dissipation component 300 in the related art, so as to make the overall structure of the heat dissipation device more compact and reduce the volume of the heat dissipation device.

[0056] It is understood that at least a portion of the fan 400 is disposed within the receiving groove 330. This can be either a partial embedding of the fan 400 within the receiving groove 330 or the entire fan 400 being installed within the receiving groove 330. Preferably, the entire fan 400 is installed within the receiving groove 330.

[0057] The heat dissipation component 300 can abut against either the hot end face or the cold end face of the cooling component 200. Alternatively, the cold and hot ends of the cooling component 200 can each abut against a portion of the heat dissipation component 300 to improve heat exchange efficiency. This application does not impose further limitations in this regard.

[0058] For example, the shape of the cooling component 200 can be circular, square, elliptical, etc., and the embodiments of this application do not impose too many restrictions on it.

[0059] Reference Figures 1 to 3 As shown, in some embodiments, the heat dissipation assembly 300 includes a first heat dissipation component 310 and a second heat dissipation component 320, both of which have receiving grooves 330.

[0060] The first heat sink 310 abuts against the cold end face of the cooling component 200, and the second heat sink 320 abuts against the hot end face of the cooling component 200.

[0061] The first heat sink 310 and the second heat sink 320 are both disposed on the base 100. The receiving groove 330 on the first heat sink 310 is the first receiving groove 331, and the receiving groove 330 on the second heat sink 320 is the second receiving groove 332. A fan 400 is disposed in both the first receiving groove 331 and the second receiving groove 332. The first heat sink 310 is used to connect with the component to be cooled.

[0062] In the above embodiments, the cold end face of the cooling component 200 is connected to the component to be cooled via the first heat dissipation component 310. The first heat dissipation component 310 can expand the contact area between the cold end face of the cooling component 200 and the component to be cooled, thereby improving the heat exchange efficiency between the component to be cooled and the cold end face of the cooling component 200.

[0063] The hot end face of the cooling component 200 abuts against the second heat sink 320. The second heat sink 320 can increase the contact area between the hot end face of the cooling component 200 and the air, thereby improving the heat dissipation efficiency on the hot end face and keeping the temperature of the hot end face within a reasonable range, thus avoiding equipment failure or performance degradation of the cooling component 200 due to overheating.

[0064] The fan 400 can promote airflow to improve the heat exchange efficiency of the first heat sink 310 and the second heat sink 320.

[0065] Reference Figure 2 and Figure 3 As shown, in some embodiments, at least one of the first heat sink 310 and the second heat sink 320 includes a support portion and a plurality of heat sink fins.

[0066] The support is mounted on the base 100 and abuts against the cooling component 200. Multiple heat sinks are spaced apart on the support, and the heat sinks and the support form a receiving groove 330.

[0067] Specifically, refer to Figure 2 and Figure 3 As shown, the first heat sink 310 may include a first support portion 311 disposed on the base 100. The first support portion 311 abuts against the cold end face of the cooling component 200. A plurality of first heat sinks 312 are disposed on the first support portion 311 at intervals. The first heat sinks 312 and the first support portion 311 form a first receiving groove 331.

[0068] The second heat sink 320 includes a second support portion 321 disposed on the base 100. The second support portion 321 abuts against the hot end face of the cooling component 200. A plurality of second heat sinks 322 are disposed on the second support portion 321 at intervals. The second heat sinks 322 and the second support portion 321 form a second receiving groove 332.

[0069] In the above embodiment, for the first heat sink 310, a plurality of first heat sink fins 312 are spaced apart on the first support portion 311, and together with the first support portion 311, they form a first receiving groove 331. The fan 400 is housed in the first receiving groove 331 and fixed on the first support portion 311. This avoids the fan 400 and the first heat sink fins 312 being stacked sequentially, making the overall structure more compact and thus reducing the size of the heat dissipation device. The second heat sink 320 is similar, and will not be described further here.

[0070] The first support portion 311, on the side away from the first heat sink 312, abuts against the cold end face of the cooling component 200, and the second support portion 321, on the side away from the second heat sink 322, abuts against the hot end face of the cooling component 200. The first heat sink 312 and the second heat sink 322 are located on opposite sides of the base 100.

[0071] Reference Figure 2 As shown, in some embodiments, the two fans 400 can be detachably connected to the first support portion 311 and the second support portion 321 respectively via at least one second connector. This allows the fan 400 to be easily removed from the first support portion 311 or the second support portion 321 for replacement or repair when it is damaged.

[0072] The second connecting member can be a bolt, a locking buckle, a locking pin, or other structures, and this application does not impose too many restrictions on this embodiment.

[0073] It is understood that there is at least one second connector, and the number of second connectors can be one or more. This application embodiment does not impose too many restrictions on this.

[0074] Reference Figure 2 and Figure 3 As shown, in some embodiments, the base 100 has a mounting through hole 110, and the cooling component 200 is disposed in the mounting through hole 110.

[0075] An mounting platform 111 is provided circumferentially inside the mounting through hole 110. The mounting platform 111, the first heat sink 310, the cooling component 200, and the second heat sink 320 abut against each other in sequence. The second support part 321 is detachably connected to the base 100.

[0076] In the above embodiment, during assembly, the first heat sink 310 is first inserted into the mounting through hole 110 so that it abuts against the mounting platform 111. Next, the cooling component 200 is placed into the mounting through hole 110, with the cold end face of the cooling component 200 abutting against the first heat sink 310. Then, the second heat sink 320 is inserted into the mounting through hole 110 and abuts against the hot end face of the cooling component 200. Finally, the second heat sink 320 is locked and fixed to the base 100.

[0077] In this way, the overall structure is simple and compact, which makes it easy to install and disassemble, so as to maintain the refrigeration components 200 in a timely manner.

[0078] Specifically, refer to Figure 2 and Figure 3 As shown, the first support portion 311 of the first heat sink 310 is inserted into the mounting through hole 110 and abuts against the mounting platform 111. The second support portion 321 of the second heat sink 320 is partially inserted into the mounting through hole 110, and the cooling component 200 is located between the first support portion 311 and the second support portion 321. The second support portion 321 is detachably connected to the base 100.

[0079] A heat insulation component 160 may be provided between the cooling component 200 and the mounting through hole 110. The heat insulation component 160 abuts against the first support part 311 and the second support part 321 respectively to reduce heat loss.

[0080] For example, the insulation component 160 can be insulation foam.

[0081] Reference Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, the heat dissipation device provided in this application further includes a first connector.

[0082] The second heat sink 320 has a first connecting part 323, and the base 100 has a second connecting part 120. The first connecting part connects the first connecting part 323 and the second connecting part 120.

[0083] In the above embodiment, the first connecting part 323 and the second connecting part 120 can be connected by the first connecting member, thereby realizing the detachable connection between the second support part 321 of the second heat sink 320 and the base 100, so as to fix the second heat sink 320 on the base 100.

[0084] The number of the first connector, the first connecting part 323, and the second connecting part 120 can both be multiple. The first connecting part 323 is arranged circumferentially around the second support part 321, and the second connecting part 120 is arranged circumferentially around the base 100 to improve the connection stability.

[0085] Specifically, the first connector can be a bolt. The first connecting part 323 is provided with a through hole, and the second connecting part 120 is provided with a threaded hole. The bolt passes through the through hole on the first connecting part 323 and connects with the threaded hole on the second connecting part 120 to connect the first connecting part 323 and the second connecting part 120.

[0086] Reference Figure 2 and Figure 6As shown, in some embodiments, the first heat sink 310 is provided with a positioning part 315 on the side facing the cooling part 200, and the cooling part 200 is mounted on the positioning part 315.

[0087] In the above embodiment, the shape of the positioning part 315 is adapted to the shape of the cooling component 200 so as to position the cooling component 200 onto the first heat sink 310 and prevent the cooling component 200 from shaking in the mounting through hole 110.

[0088] Among them, reference Figure 2 and Figure 6 As shown, the positioning part 315 is disposed on the side of the first support part 311 away from the first heat sink 312.

[0089] Furthermore, the second support 321 has an extension 326 on the side opposite to its heat sink. The shape of the extension 326 is adapted to the shape of the mounting through hole 110. The extension 326 is used to insert into the mounting through hole 110 and abut against the cooling component 200, thus ensuring the stability of the overall installation.

[0090] Reference Figure 2 , Figure 5 and Figure 6 As shown, in some embodiments, both the first heat sink 310 and the second heat sink 320 are provided with wiring holes, which are connected to the mounting through hole 110 and are used for wiring harness routing.

[0091] In the above embodiment, the wiring harness of the cooling component 200 and the wiring harnesses of the two fans 400 can be arranged between the wiring hole and the mounting through hole 110 to make the wiring harness arrangement neater and avoid tangling.

[0092] Specifically, refer to Figure 2 , Figure 5 and Figure 6 As shown, the first support part 311 is provided with a first wiring hole 313, and the second support part 321 is provided with a second wiring hole 324. The first wiring hole 313 and the second wiring hole 324 are respectively connected to the mounting through hole 110.

[0093] Reference Figures 2 to 4 As shown, in some embodiments, a water collection part 130 is provided on the base 100, and the water collection part 130 is correspondingly provided with the first heat sink 310. The water collection part 130 is used to collect water droplets dripping from the first heat sink 310.

[0094] In the above embodiment, the cold end face of the first heat sink 310 corresponds to that of the cooling component 200. The temperature of the first heat sink 310 is relatively low. When water vapor in the air comes into contact with the first heat sink 310, it will condense and form water droplets. The water collection part 130 on the base 100 is correspondingly arranged with the first heat sink 310. In this way, the water collection part 130 collects the water droplets dripping from the first heat sink 310 to prevent water leakage. This ensures that other electronic components, conductive parts or other sensitive parts are not affected by moisture, reducing the occurrence of short circuits, corrosion and other problems.

[0095] For example, the shape of the water collection part 130 can be adapted to the shape of the first heat sink 310, and the outline of the water collection part 130 is larger than the outline of the first heat sink 310, so as to ensure that the water droplets dripping from the first heat sink 310 can enter the water collection part 130 and avoid leakage.

[0096] Reference Figure 1 and Figure 2 As shown, in some embodiments, the heat dissipation device provided in this application further includes an electronic control unit 600, which is disposed close to the first heat sink 310.

[0097] The wiring harnesses of the cooling component 200 and the fan 400 can be electrically connected to the electronic control unit 600 through the first wiring hole 313 and the second wiring hole 324. The electronic control unit 600 can be electrically connected to an external control system, so that the operation and shutdown of the cooling component 200 and the fan 400 can be controlled by the electronic control unit 600.

[0098] The electronic control unit 600 has a temperature sensor that can collect the temperature of the cold end face of the cooling component 200 and the first heat sink 310, and send the collected temperature signal to an external control system. The control system controls the cold end temperature of the cooling component 200 through the electronic control unit 600.

[0099] Furthermore, the electronic control unit 600 also has a humidity sensor, which can collect the air humidity on the cold end face of the cooling component 200. The control system controls the temperature within the freezing point range of water based on the temperature and humidity signals, so that the cold air condenses into water droplets on the surface of the first heat sink 310.

[0100] Specifically, the heat dissipation component can be the headlight. The electronic control unit 600 can control the temperature inside the headlight within the freezing point range of water to prevent fogging from forming on the headlight and affecting its illumination.

[0101] For example, the electronic control unit 600 can be a circuit board.

[0102] Furthermore, refer to Figures 3 to 6As shown, a drainage channel 140 is also provided on the base 100, a first drainage hole 314 is provided on the first heat sink 310, and a second drainage hole 325 is provided on the second heat sink 320. The water collection part 130, the first drainage hole 314, the drainage channel 140 and the second drainage hole 325 are connected in sequence, and the second drainage hole 325 is used to connect with an external liquid collection device.

[0103] The first drain hole 314 is disposed on the first support portion 311 of the first heat sink 310, and the second drain hole 325 is disposed on the second support portion 321 of the second heat sink 320.

[0104] In the above embodiment, the second drain hole 325 can be connected to an external liquid collection device so that the water in the water collection section 130 can be discharged sequentially through the first drain hole 314, the drain channel 140 and the second drain hole 325.

[0105] Reference Figure 2 As shown, a sealing element 170 may be provided between the first support part 311 and the base 100, and between the second support part 321 and the base 100, to prevent water leakage.

[0106] For example, the seal 170 may be a silicone gasket, a rubber gasket, or other materials with a certain degree of elasticity, and this application embodiment does not impose too many restrictions on this.

[0107] Reference Figures 3 to 5 As shown, the drainage channel 140 can be disposed inside the mounting through hole 110. The extension 326 of the second support 321 has a clearance notch 327, which is disposed corresponding to the drainage channel 140. This can play a role in positioning and installation, so that the second drainage hole 325 is connected to the drainage channel 140 for easy installation.

[0108] Reference Figure 2 and Figure 3 As shown, in some embodiments, a one-way valve 150 is provided between the drainage channel 140 and the second drainage hole 325.

[0109] In the above embodiment, the drainage channel 140 and the second drainage hole 325 are provided with a one-way valve 150. The opening direction of the one-way valve 150 is towards the second drainage hole 325, so as to prevent water from backflowing back into the water collection part 130.

[0110] Reference Figure 1 and Figure 2 As shown, in some embodiments, the heat dissipation device provided in this application further includes at least one end cover 500, on which a plurality of air vents are provided. The end cover 500 is connected to the heat dissipation assembly 300 and is disposed on the receiving groove 330.

[0111] The vent on the end cap 500 is connected to the receiving groove 330. The end cap 500 may include a first end cap 510 and a second end cap 520. The first end cap 510 is disposed on the first heat sink 310, and the second end cap 520 is disposed on the second heat sink 320.

[0112] In the above implementation, the end cover 500 can protect the fan 400 to prevent the blades of the fan 400 from colliding with other external devices and causing damage.

[0113] In some embodiments, the first end cap 510 can be detachably connected to the first support portion 311 via at least one third connector, and the second end cap 520 can be detachably connected to the second support portion 321 via at least one third connector. This allows the fan 400 to be easily removed for replacement or repair when it is damaged.

[0114] The third connecting member can be a bolt, a locking buckle, a locking pin, or other structures, and this application does not impose too many restrictions on this embodiment.

[0115] Furthermore, referring to Figure 1 and Figure 2 As shown, the electronic control unit 600 can be disposed between the first end cover 510 and the first heat sink 312.

[0116] The vehicle provided in this application includes a vehicle body and a heat dissipation device disposed on the vehicle body according to any of the above embodiments.

[0117] The cooling system can be connected to the vehicle's headlights.

[0118] In the above structural configuration, since the vehicle adopts the heat dissipation device in the above embodiment, it also has the advantages and benefits brought by the heat dissipation device, which will not be elaborated further here.

[0119] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0120] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A heat dissipation device, characterized in that, include: Base (100); A cooling component (200) is disposed on the base (100), and the cold end face of the cooling component (200) is used to dissipate heat from the heat dissipation component. A heat dissipation assembly (300) is disposed on the base (100), the heat dissipation assembly (300) abuts against the cooling component (200), and the heat dissipation assembly (300) has at least one receiving groove (330). At least one fan (400), at least a portion of the fan (400) is disposed within the receiving slot (330).

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation assembly (300) includes a first heat dissipation component (310) and a second heat dissipation component (320), both of which have receiving grooves (330). The first heat sink (310) abuts against the cold end face of the cooling component (200), and the second heat sink (320) abuts against the hot end face of the cooling component (200).

3. The heat dissipation device according to claim 2, characterized in that, At least one of the first heat sink (310) and the second heat sink (320) includes: A support portion is disposed on the base (100) and abuts against the cooling component (200); Multiple heat sinks are spaced apart on the support portion, and the heat sinks and the support portion form the receiving groove (330).

4. The heat dissipation device according to claim 2 or 3, characterized in that, The base (100) has a mounting through hole (110), and the cooling component (200) is disposed in the mounting through hole (110); An mounting platform (111) is provided circumferentially inside the mounting through hole (110). The mounting platform (111), the first heat sink (310), the cooling component (200) and the second heat sink (320) abut against each other in sequence. The second heat sink (320) is detachably connected to the base (100).

5. The heat dissipation device according to claim 4, characterized in that, It also includes a first connector; The second heat sink (320) has a first connecting part (323), and the base (100) is provided with a second connecting part (120). The first connecting part connects the first connecting part (323) and the second connecting part (120).

6. The heat dissipation device according to claim 4, characterized in that, The first heat sink (310) has a positioning part (315) on the side facing the cooling part (200), and the cooling part (200) is installed on the positioning part (315).

7. The heat dissipation device according to claim 4, characterized in that, Both the first heat sink (310) and the second heat sink (320) are provided with wiring holes, which are connected to the mounting through hole (110) and are used for wiring harness routing.

8. The heat dissipation device according to claim 2 or 3, characterized in that, A water collection part (130) is provided on the base (100), and the water collection part (130) is correspondingly provided with the first heat sink (310). The water collection part (130) is used to collect water droplets dripping from the first heat sink (310). The base (100) is also provided with a drainage channel (140), the first heat sink (310) is provided with a first drainage hole (314), and the second heat sink (320) is provided with a second drainage hole (325). The water collection part (130), the first drainage hole (314), the drainage channel (140) and the second drainage hole (325) are connected in sequence. The second drainage hole (325) is used to connect with an external liquid collection device.

9. The heat dissipation device according to any one of claims 1 to 3, characterized in that, It also includes at least one end cap (500), on which a plurality of vent holes are provided; The end cap (500) is connected to the heat dissipation assembly (300), and the end cap (500) covers the receiving groove (330).

10. A vehicle, characterized in that, It includes a vehicle body and a heat dissipation device as described in any one of claims 1 to 9 disposed on the vehicle body.

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