Low-temperature-drift high-temperature-resistant pressure transmitter with anti-vibration structure

Abstract

The utility model belongs to the technical field of pressure transmitters, and particularly relates to a low-temperature-drift high-temperature-resistant pressure transmitter with an anti-vibration structure. Comprising a shell, an induction base and a signal processing board, the induction base comprises a signal guide pin, a base shell and a pressure chip, the signal guide pin and the pressure chip are arranged in the base shell, the signal processing board and the induction base are arranged in the shell, one end of the signal guide pin is connected with the pressure chip, and the other end of the signal guide pin is a free end. A sealing groove is formed between the induction base and the signal processing plate, the free end of the signal guide pin extends into the sealing groove and is fixedly connected with the signal processing plate, and the sealing groove is filled with a fixing medium which is used for carrying out vibration buffering and fixing on the free end of the signal guide pin. By arranging the sealing groove and filling the fixing medium, vibration buffering and position fixing of the free end of the signal guide pin are achieved, and the anti-vibration performance and the connection reliability of the signal guide pin are improved.

Description

Technical Field

[0001] This utility model belongs to the technical field of pressure transmitters, specifically a low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure. Background Technology

[0002] Pressure transmitters are important testing devices in the field of industrial automation, used to accurately measure the pressure of fluid media and convert the pressure signal into a standard electrical signal output.

[0003] In existing technologies, pressure transmitters generally use piezoresistive pressure sensor cores based on diffused silicon technology. These cores have an internal PN junction structure, which is greatly affected by temperature and cannot directly contact the measured medium. To achieve pressure transmission and isolation protection, traditional structures typically use an "oil-filled diaphragm" encapsulation method, transmitting external pressure to the sensor core through an oil-filled chamber.

[0004] Currently, this "oil-filled isolation" structure must rely on fine gold wires for electrical lead bonding to electrically connect the core signal points to the internal signal pins of the transmitter.

[0005] Because of the extremely small diameter and low strength of gold wires, they are prone to fatigue fracture under mechanical vibration. At the same time, the interface between gold wires and pads under high temperature conditions will exhibit "gold brittleness", which further reduces the connection strength and reliability.

[0006] Traditional signal pins, acting as conductors connecting the core to the subsequent conditioning circuit board, are typically connected to the circuit board via spot welding or soldering. This type of connection is a rigid welding, which can easily generate high-frequency vibrations under high-temperature vibration conditions. This leads to alternating stress concentration at the solder joint, which over time can cause fatigue cracking, poor soldering, or detachment, resulting in signal distortion, open circuits, or short circuits. At the same time, traditional structures lack effective pin limiting and buffering measures. When the signal pin swings slightly, the stress accumulation is amplified under high-temperature thermal cycling, ultimately leading to unstable electrical connections.

[0007] Therefore, how to improve the vibration resistance and connection reliability of the mechanical connection structure between the signal pin and the circuit board without changing the circuit structure, and thus prevent the signal pin from loosening in a high-temperature vibration environment, is a technical problem that needs to be solved by the existing technology. Utility Model Content

[0008] The purpose of this invention is to address the problem in the existing technology of how to optimize the fixing and connection of signal pins to reduce short circuits caused by loose signal pins, and to provide a low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure.

[0009] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0010] A low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure includes a housing, a sensing base, and a signal processing board;

[0011] The sensing base includes a signal pin, a base housing, and a pressure chip. The signal pin and the pressure chip are disposed inside the base housing. The signal processing board and the sensing base are disposed inside the housing. One end of the signal pin is connected to the pressure chip, and the other end is a free end.

[0012] A sealing groove is formed between the sensing base and the signal processing board. The free end of the signal pin extends into the sealing groove and is fixedly connected to the signal processing board. The sealing groove is filled with a fixing medium for vibration buffering and fixing of the free end of the signal pin.

[0013] Preferably, the signal processing board has a plurality of through holes on the side facing the signal pins, the number of through holes corresponding to the number of signal pins, and the through holes extending through the thickness of the signal processing board.

[0014] Preferably, the free end of the signal pin extends into the through-hole area and is bent toward the inner diameter of the through-hole at a position near the inner wall of the through-hole.

[0015] Preferably, the inner wall of the sealing groove and the signal pin are in a clearance fit.

[0016] Preferably, the sealing groove has a stepped structure, and the sealing groove includes a small-diameter groove located inside the base shell and a large-diameter groove located inside the shell.

[0017] Preferably, the large-diameter groove and the small-diameter groove are coaxially arranged, and their centers coincide.

[0018] Preferably, the housing includes an annular housing and a rear cover, the annular housing being used to mount the signal processing board, and the rear cover being disposed on the side of the annular housing away from the sensing base, the annular housing and the rear cover being fixedly connected.

[0019] Preferably, the housing further includes a high-temperature signal line, which is fixedly connected to the rear cover. The signal processing board has a through hole on the side facing the high-temperature signal line, and the number of through holes corresponds to the number of connectors of the high-temperature signal line.

[0020] Preferably, the rear cover and the annular housing are detachably connected.

[0021] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0022] 1. The sealing groove of this utility model is filled with a fixing medium to achieve vibration buffering and position fixation of the free end of the signal pin, thereby improving its vibration resistance and connection reliability. By setting the through hole, the connection between the signal processing board and the signal pin is more stable, further reducing the fatigue cracking of the solder joint caused by high-frequency vibration.

[0023] 2. The clearance fit of this utility model forms a flexible buffer, and the stepped sealing groove structure takes into account both sealing and support, further improving the stability and assembly accuracy of the signal pin.

[0024] 3. The annular shell and the rear cover of this utility model form an encapsulation space, and the separable connection facilitates maintenance and replacement, further improving the practicality of this utility model in actual use. Attached Figure Description

[0025] Figure 1 This is a structural diagram of a low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure.

[0026] Figure 2 This is a cross-sectional schematic diagram of a local structure of a low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure.

[0027] Figure 3 This is a cross-sectional schematic diagram of a local structure of a low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure.

[0028] Figure 4 This is a cross-sectional structural diagram of a low-temperature drift and high-temperature pressure transmitter with an anti-vibration structure.

[0029] The markings in the diagram are: 1-housing, 2-sensor base, 3-signal processing board, 4-signal pin, 5-base housing, 6-pressure chip, 7-sealing groove, 8-through hole, 9-large diameter groove, 10-small diameter groove, 11-ring housing, 12-back cover, 13-high temperature signal line. Detailed Implementation

[0030] The present invention will now be described in detail with reference to the accompanying drawings.

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0032] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0033] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] In Example 1: The present invention describes a low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure, comprising a housing 1, a sensing base 2, and a signal processing board 3. The sensing base 2 includes a signal pin 4, a base housing 5, and a pressure chip 6. The signal pin 4 and the pressure chip 6 are disposed inside the base housing 5. The signal processing board 3 and the sensing base 2 are disposed inside the housing 1. One end of the signal pin 4 is connected to the pressure chip 6, and the other end is a free end. A sealing groove 7 is formed between the sensing base 2 and the signal processing board 3. The free end of the signal pin 4 extends into the sealing groove 7 and is fixedly connected to the signal processing board 3. The sealing groove 7 is filled with a fixing medium for vibration buffering and fixing of the free end of the signal pin 4.

[0037] In this embodiment, the sealing groove 7 extends the free end of the signal pin 4 into the groove and connects it to the signal processing board 3. By forming a fixed medium filling area in the groove, it provides structural support for the free end of the signal pin 4, thereby reducing the vibration of the signal pin 4. It can effectively reduce the small displacement of the signal pin 4 when vibrating or changing temperature, and reduce the concentration of rigid welding stress.

[0038] Specifically, the fixing medium can be a high-temperature resistant potting compound, etc., and the connection between the signal pin 4 and the signal processing board 3 can be welding, etc.

[0039] As a preferred embodiment, based on the above scheme, the signal processing board 3 is further provided with a plurality of through holes 8 on the side facing the signal pin 4. The number of through holes 8 corresponds to the number of signal pins 4, and the through holes 8 penetrate along the thickness direction of the signal processing board 3. With this structural arrangement, the through holes 8 provide precise guidance when the signal pin 4 is inserted, thereby reducing the assembly deviation between the signal pin 4 and the signal processing board 3, and further maintaining the stability between the signal pin 4 and the signal processing board 3.

[0040] As a preferred embodiment, based on the above scheme, the free end of the signal pin 4 extends into the region of the through hole 8 and is bent towards the inner diameter of the through hole 8 near the inner wall of the through hole 8. With this structural arrangement, the bending of the signal pin 4 further maintains the mechanical locking effect, thereby reducing the loosening or detachment of the signal pin 4 due to vibration, and further enhancing the bonding strength between the signal pin 4 and the signal processing board 3.

[0041] Specifically, the signal processing board 3 and the signal pin 4 can be connected by filling and soldering the through hole 8 of the circuit board by bending the signal pin 4 into shape.

[0042] In Example 2: The low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure described in this utility model, based on the above scheme, further includes a clearance fit between the inner wall of the sealing groove 7 and the signal pin 4. This structural arrangement provides displacement space for the signal pin 4, thereby reducing the impact of the signal pin 4's displacement under vibration on the solder joint or electrical connection, and further reducing fatigue damage to the signal pin 4.

[0043] As a preferred embodiment, based on the above scheme, the sealing groove 7 is further configured as a stepped structure, comprising a small-diameter groove 10 located inside the base housing 5 and a large-diameter groove 9 located inside the housing 1. With this structural arrangement, the small-diameter groove 10 can effectively guide and position the signal pin 4, and the large-diameter groove 9 can effectively form a cavity for accommodating the fixed medium, thereby maintaining the stable state of the signal pin 4.

[0044] As a preferred embodiment, based on the above scheme, the large-diameter groove 9 and the small-diameter groove 10 are further arranged coaxially, with their centers coinciding. With this structural arrangement, the force on the signal pin 4 is aligned with the centerline of the sealing groove 7, thereby reducing the tilting or asymmetrical force on the signal pin 4 and further improving its service life.

[0045] In Example 3: The low-temperature drift and high-temperature resistant pressure transmitter with an anti-vibration structure described in this utility model, based on the above scheme, further includes an annular housing 11 and a rear cover 12. The annular housing 11 is used to mount the signal processing board 3, and the rear cover 12 is located on the side of the annular housing 11 away from the sensing base 2. The annular housing 11 and the rear cover 12 are fixedly connected. With this structural arrangement, the interior of the annular housing 11 is used to mount the signal processing board 3, and the rear cover 12 is located at the end of the annular housing 11. The two are fixedly connected by threads or snap-fit, forming an integral closed structure. The combination of the annular housing 11 and the rear cover 12 effectively enhances the rigidity of the structural assembly and the overall vibration resistance.

[0046] As a preferred embodiment, based on the above solution, the housing 1 further includes a high-temperature signal line 13, which is fixedly connected to the rear cover 12. The signal processing board 3 has through holes 8 on the side facing the high-temperature signal line 13, and the number of through holes 8 corresponds to the number of connectors on the high-temperature signal line 13. This structural arrangement, with the through holes 8 corresponding to the cable connectors of the high-temperature signal line 13, effectively maintains precise connection between the signal processing board 3 and the high-temperature signal line 13, thereby maintaining stability between them and further improving the stable connection of the signal processing board 3.

[0047] As a preferred embodiment, based on the above-described scheme, the rear cover 12 and the annular housing 11 are further designed to be detachably connected. This structural arrangement allows for convenient maintenance or replacement of the signal processing board 3 and signal cables, further improving the practicality of this invention in actual use.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high temperature pressure transmitter with low temperature drift and anti-vibration structure, characterized in that, The shell, the induction base and the signal processing plate are included. The induction base includes signal lead pins, a base shell and a pressure chip, the signal lead pins and the pressure chip are arranged inside the base shell, the signal processing plate and the induction base are arranged inside the shell, one end of the signal lead pins is connected with the pressure chip, and the other end is a free end. A sealing groove is formed between the induction base and the signal processing plate, the free end of the signal lead pin extends into the sealing groove and is fixedly connected with the signal processing plate, the sealing groove is filled with a fixing medium for vibration buffering and fixing of the free end of the signal lead pin.

2. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 1, wherein, The side of the signal processing plate facing the signal lead pins is provided with a plurality of through holes, the number of the through holes corresponds to the number of the signal lead pins, and the through holes penetrate along the thickness direction of the signal processing plate.

3. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 2, wherein, The free end of the signal lead pin extends into the through hole area and is bent towards the inner diameter direction of the through hole at a position close to the inner wall of the through hole.

4. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 3, wherein, The inner wall of the sealing groove and the signal lead pin are gap-fitted.

5. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 4, wherein, The sealing groove is a stepped structure, and includes a small-diameter groove inside the base shell and a large-diameter groove inside the shell.

6. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 5, wherein, The large-diameter groove and the small-diameter groove are coaxially arranged, and the centers of the two are coincident.

7. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 6, wherein, The shell includes a ring-shaped shell and a rear cover, the ring-shaped shell is used for mounting the signal processing plate, the rear cover is arranged on the side of the ring-shaped shell away from the induction base, and the ring-shaped shell and the rear cover are fixedly connected.

8. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 7, wherein, The shell further includes a high-temperature signal line, the high-temperature signal line and the rear cover are fixedly connected, the side of the signal processing plate facing the high-temperature signal line is provided with a through hole, and the number of the through hole corresponds to the joint of the high-temperature signal line.

9. The high temperature pressure transmitter with low temperature drift and anti-vibration structure according to claim 8, wherein, The rear cover and the ring-shaped shell are separable and connected.

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