Heat dissipation device, heat dissipation system and electronic device

Abstract

The utility model relates to a heat dissipation device, a heat dissipation system and an electronic device, the heat dissipation device comprises a housing, a heat pipe support block, a heat pipe, a flat plate type fin radiator with a plurality of fluid channels, a first partition plate and a second partition plate, the housing is provided with an input port and an output port, the input port is provided with a plurality of fluid channels, and the output port is provided with a plurality of fluid channels. And the heat pipe is provided with an input end pipe orifice connected with the input port. Particularly, the first partition plate, the second partition plate and the heat pipe supporting block define a buffer area in the shell, and the heat pipe is provided with an output end pipe opening communicated with the buffer area. And the buffer area is communicated with the plurality of fluid channels of the flat plate type fin radiator. Thus, after a liquid is injected into the heat pipe through the input port by an external liquid reservoir, the liquid is injected into the buffer area through the output port. Then, the liquid flows through the plurality of fluid channels and finally flows back to the reservoir through the output port.

Description

Technical Field

[0001] This utility model relates to the technical field of heat dissipation mechanisms, and more particularly to a heat dissipation device. Background Technology

[0002] It is known that a computer system, including desktop computers, notebook computers, all-in-one computers, industrial computers, server hosts, and video game consoles, must be equipped with at least one heat dissipation device to help dissipate heat from the electronic chips and / or electronic modules inside the chassis. Figure 1 This is a three-dimensional diagram of a traditional heat dissipation device. (Example:) Figure 1 As shown, the heat dissipation device 1a includes a heat-conducting block 11a, a heat sink 12a, at least one heat pipe 13a, and a fan 14a. The heat-conducting block 11a is disposed on a heat source (such as a CPU or GPU), the heat pipe 13a passes through the heat-conducting block 11a and the heat sink 12a, and the fan 14a is connected to the heat sink 12a.

[0003] It is worth noting that with the rapid development of cloud computing, video game streaming services, and 3D games, the computing speed and data processing speed of computer systems' CPUs and GPUs have correspondingly increased. In this context, Figure 1 The heat dissipation capacity of the heat dissipation device 1a shown is insufficient, at least it cannot efficiently dissipate heat from the CPU and GPU. In view of this, Taiwan Patent No. I821055 discloses a liquid cooling system.

[0004] As described in Taiwan Patent No. I821055, the liquid cooling system mainly includes a heat-conducting block, a heat sink, at least one heat pipe, a fan, and a liquid reservoir with an output port and an input port. The heat-conducting block is positioned above a heat source (e.g., CPU, GPU). The heat sink is positioned above the heat-conducting block and has multiple fins. Furthermore, the heat pipe passes through the multiple fins and connects the output port and the input port of the liquid reservoir. During normal operation, liquid (e.g., coolant) is injected into the heat pipe through the output port and flows back to the liquid reservoir through the input port. Thus, the heat carried by the liquid is transferred to the multiple fins through the heat pipe, and then dissipated by the multiple fins.

[0005] Practical experience indicates that this liquid cooling system has shortcomings in use. Specifically, because the liquid does not directly contact the fins and the contact area between the heat pipe and each fin is limited, the overall heat dissipation efficiency of this liquid cooling system has room for improvement. In view of this, the inventor of this utility model application has made great efforts to research and invent, and has finally developed a heat dissipation device of this utility model. Utility Model Content

[0006] This invention relates to a heat dissipation device for use with a liquid reservoir to form a heat dissipation system, which is integrated into an electronic device such as a server or network switch. In this heat dissipation device, a heat pipe and a flat-plate finned heat sink are housed within a housing. Thus, after a liquid reservoir injects liquid (i.e., coolant) into an inlet port of the housing, the liquid flows into the heat pipe and then into a buffer zone within the housing via the outlet port of the heat pipe. The liquid then flows through multiple fluid channels of the flat-plate finned heat sink and finally returns to the liquid reservoir through an outlet port of the housing.

[0007] To reiterate, the liquid within the buffer zone first flows through multiple fluid channels of the flat-plate finned heat sink before returning to the reservoir through the output port. In other words, the coolant is in full contact with the flat-plate finned heat sink within the casing, resulting in excellent heat dissipation performance of the heat dissipation device of this invention.

[0008] In practical applications, the heat dissipation device of this invention can be integrated into a hybrid liquid / air cooling system or an immersion cooling system.

[0009] To achieve the above objectives, the inventors of this utility model propose an embodiment of the heat dissipation device, which includes:

[0010] A housing includes an upper side plate, a first side plate, a second side plate, a third side plate, and a fourth side plate, wherein the first side plate connects the second side plate and the upper side plate, the second side plate connects the third side plate and the upper side plate, the third side plate connects the fourth side plate and the upper side plate, and the fourth side plate connects the first side plate and the upper side plate. The first side plate has a first opening, and the second side plate has a second opening.

[0011] A heat pipe is disposed within the housing and has an input section and an output section parallel to the input section; wherein the input section has an input end port connected to the first opening, the output section has an output end port facing and adjacent to the third side plate, a first side of the output section faces the fourth side plate, and a second side of the output section faces the second side plate.

[0012] A flat-plate finned heat sink is disposed inside the housing and stacked on top of the heat pipe;

[0013] A first partition plate is disposed within the housing, along the first side of the output section, and connected to the flat-plate finned heat sink; and

[0014] A second partition is disposed inside the housing and connected to a flat finned heat sink, and is located near the second side of the output section;

[0015] The flat-plate finned heat sink includes a flat plate and M plates connected to the flat plate, where M is a positive integer.

[0016] The plate is attached to the inner surface of the upper side plate, and any two of the plates and the plate form a fluid channel.

[0017] The first partition is located between the first side and the fourth side plate of the output section and is close to the output end port of the output section.

[0018] The second partition is located between the second side of the output section and the second side plate.

[0019] In one embodiment, the housing includes:

[0020] One base plate; and

[0021] A cover includes the upper side panel, the first side panel, the second side panel, the third side panel, and the fourth side panel, and the upper side panel, the first side panel, the second side panel, the third side panel, and the fourth side panel form an opening;

[0022] The bottom plate is connected to the cover to close the opening, and the first partition and the second partition are both connected between the inner surfaces of the bottom plate and the upper side plate.

[0023] In one feasible embodiment, the heat dissipation device of this utility model further includes:

[0024] A heat pipe support block is housed within the housing and disposed on the base plate; wherein the heat pipe support block comprises:

[0025] A base;

[0026] N+3 elongated protrusions are formed on the base; and

[0027] N+2 long grooves are formed on the base;

[0028] In this case, any one of the elongated grooves is located between any two of the elongated protrusions.

[0029] In one embodiment, the first partition is connected between the base plate, the third side plate, the upper side plate, the Mth plate, and the heat pipe support block, and the second partition is connected between the base plate, the first side plate, the upper side plate, the first plate, and the heat pipe support block.

[0030] In one embodiment, the base plate, the third side plate, the first partition plate, the Mth plate, the 1st plate, the heat pipe support block, the second partition plate, the second side plate, the first side plate, and the upper side plate define a buffer area within the housing.

[0031] In one embodiment, the heat pipe includes N+2 long straight sections and N+1 curved connecting sections, with one curved connecting section connecting two of the long straight sections, and the N+2 long straight sections are correspondingly embedded in the N+2 long grooves.

[0032] In one embodiment, a metal spring is provided in each of the long straight sections of the heat pipe, and a capillary structure layer is formed on the inner wall surface of each of the long straight sections.

[0033] In one embodiment, the N+2 long straight segments include:

[0034] The input segment;

[0035] The output segment; and

[0036] There are N intermediate segments, each of which is parallel to the output segment.

[0037] In one embodiment, each of the plates has a first short side, a second short side, a first long side, and a second long side, the first long side being connected to the plate, and the second long side having N+2 recesses to correspondingly embed the input segment, the N intermediate segments, and the output segment downwards.

[0038] In one feasible embodiment, the heat dissipation device of this utility model further includes:

[0039] An input port is connected to the first opening for external connection to a first conduit; and

[0040] An output port is connected to the second opening for connecting to a second conduit externally;

[0041] A reservoir injects liquid into the heat pipe through the first pipe and the input port;

[0042] The liquid is injected into the housing through the output end port of the output section, thereby being located within the buffer area;

[0043] The liquid located in the buffer area flows through M-1 fluid channels and then returns to the reservoir through the output port and the second pipeline.

[0044] The inventor of this utility model also provides a heat dissipation system, including a liquid reservoir and a heat dissipation device as described above. The liquid reservoir has a liquid output port and a liquid input port, and the liquid output port and the liquid input port are correspondingly connected to the input port and the output port of the heat dissipation device.

[0045] Furthermore, the inventors of this utility model also provide an electronic device comprising a housing and at least one electronic chip disposed within the housing, the housing housing having a heat dissipation system as described above, and the heat dissipation system being used to dissipate heat from the at least one electronic chip.

[0046] In one embodiment, the electronic device is selected from any of the group consisting of servers, network switches, gateways, embedded computers, single-board computers, industrial computers, desktop computers, all-in-one computers, vehicle computers, security monitoring hosts, gaming hosts, and game consoles. Attached Figure Description

[0047] Figure 1 A three-dimensional diagram of a traditional heat dissipation device;

[0048] Figure 2 This is a perspective view of a heat dissipation device according to the present invention;

[0049] Figure 3 This is a perspective view of a heat dissipation system according to the present invention;

[0050] Figure 4A This is a first exploded perspective view of the heat dissipation device of this utility model;

[0051] Figure 4B This is a second exploded perspective view of the heat dissipation device of this utility model; and

[0052] Figure 5 This is a perspective view of the heat dissipation device of this utility model.

[0053] [Symbol Explanation]

[0054] 1a: Heat dissipation device

[0055] 11a: Heat-conducting block

[0056] 12a: Radiator

[0057] 13a: Heat pipe

[0058] 14a: Fan

[0059] 1: Heat dissipation system

[0060] 10: Heat dissipation device

[0061] 11: Shell

[0062] 11B: Base Plate

[0063] 11C: Cover

[0064] 11SU: Upper side panel

[0065] 11S1: First side plate

[0066] 11S2: Second side plate

[0067] 11S3: Third side plate

[0068] 11S4: Fourth side plate

[0069] 11O1: First opening

[0070] 11O2: Second opening

[0071] 11P1: Input Port

[0072] 11P2: Output Port

[0073] 12: Heat pipe

[0074] 12I: Input segment

[0075] 12O: Output segment

[0076] 12M: Middle Section

[0077] 12C: Bending connection section

[0078] 121: Metal Spring

[0079] 13: Flat-plate finned heat sink

[0080] 131: Tablet

[0081] 132: Plate

[0082] 1321: Concave notch

[0083] 14: First partition

[0084] 15: Second partition

[0085] 16: Heat pipe support block

[0086] 160: Base

[0087] 161: Elongated protrusion

[0088] 162: Long groove

[0089] 17: Liquid reservoir

[0090] L1: First pipeline

[0091] L2: Second pipeline

[0092] 2: Electronic devices

[0093] 20: Chassis

[0094] 21: Electronic Chips

[0095] 22: Electronic Module Detailed Implementation

[0096] To further understand the structure, features, purpose, and advantages of this utility model, a detailed description of the preferred embodiments is provided below, accompanied by accompanying drawings.

[0097] Please see Figure 2 This is a perspective view of a heat dissipation device according to this utility model. Furthermore, Figure 3 This is a perspective view of a heat dissipation system according to this utility model. Figure 2 and Figure 3 As shown, the heat dissipation device 10 can be combined with a reservoir 17 to form a heat dissipation system 1. The heat dissipation device 10 has an input port 11P1 and an output port 11P2, and the reservoir 17 is connected to the input port 11P1 and the output port 11P2 respectively through a first pipe L1 and a second pipe L2. Furthermore, the heat dissipation system 1 is integrated into an electronic device 2, which includes a housing 20 and at least one electronic chip 21 and at least one electronic module 22 housed within the housing 20. The heat dissipation system 1 is used to dissipate heat from the at least one electronic chip 21 and / or the at least one electronic module 22. In feasible embodiments, the electronic device 2 can be, but is not limited to, a server, network switch, gateway, embedded computer, single-board computer, industrial computer, desktop computer, all-in-one computer, vehicle computer, security monitoring host, gaming host, or game console.

[0098] Figure 4A , Figure 4B These are the first and second exploded perspective views of the heat dissipation device of this utility model. (See figures below.) Figure 2 , Figure 4A and Figure 4BAs shown, the heat dissipation device 10 includes: a housing 11, a heat pipe support block 16, a heat pipe 12, a flat finned heat sink 13 with multiple fluid channels, a first partition 14, and a second partition 15. The housing 11 includes a base plate 11B and a cover 11C. More specifically, the cover 11C includes an upper side plate 11SU, a first side plate 11S1, a second side plate 11S2, a third side plate 11S3, and a fourth side plate 11S4. The first side plate 11S1 connects the second side plate 11S2 and the upper side plate 11SU; the second side plate 11S2 connects the third side plate 11S3 and the upper side plate 11SU; the third side plate 11S3 connects the fourth side plate 11S4 and the upper side plate 11SU; and the fourth side plate 11S4 connects the first side plate 11S1 and the upper side plate 11SU.

[0099] In more detail, the upper side plate 11SU, the first side plate 11S1, the second side plate 11S2, the third side plate 11S3, and the fourth side plate 11S4 form an opening, and the bottom plate 11B connects to the cover 11C to close the opening. It is worth noting that the first side plate 11S1 has a first opening 11O1, and the second side plate 11S2 has a second opening 11O2. The input port 11P1 is connected to the first opening 11O1, and the output port 11P2 is connected to the second opening 11O2.

[0100] On the other hand, the heat pipe support block 16 is disposed within the housing 11 and located above the base plate 11B. In one embodiment, the heat pipe support block 16 includes a base 160, N+3 elongated protrusions 161, and N+2 elongated grooves 162, wherein N is a positive integer, and the N+3 elongated protrusions 161 are formed on the base 160. More specifically, the N+2 elongated grooves 162 are formed on the base 160, and any one of the elongated grooves 162 is located between any two elongated protrusions 161.

[0101] like Figure 4A and Figure 4BAs shown, the heat pipe 12 is disposed within the housing 11 and supported by the heat pipe support block 16. In one embodiment, the heat pipe 12 includes N+2 long straight sections (12I, 12O, 12M) and N+1 curved connecting sections 12C, wherein a curved connecting section 12C connects two of the long straight sections, and the N+2 long straight sections are correspondingly embedded in the N+2 long grooves 162. Specifically, the N+2 long straight sections include an input section 12I, an output section 12O, and N intermediate sections 12M, wherein the output section 12O and each of the intermediate sections 12M are parallel to the input section 12I, and the input section 12I has an input end port connected to the first opening 11O1. Furthermore, the output section 12O has an output end facing and adjacent to the third side plate 11S3, a first side of the output section 12O facing the fourth side plate 11S4, and a second side of the output section 12O facing the second side plate 11S2. Additionally, each of the N+2 long straight sections (12I, 12O, 12M) contains a metal spring (e.g., a copper spring) 121, and the inner wall surface of each long straight section has a capillary structure layer.

[0102] like Figure 4A and Figure 4B As shown, the flat-plate finned heat sink 13 is disposed within the housing 11 and stacked on top of the heat pipe 12. The flat-plate finned heat sink 13 includes a flat plate 131 and M plates 132 connected to the flat plate 131, where M is a positive integer. Specifically, each plate 132 has a first short side, a second short side, a first long side, and a second long side. The first long side connects to the flat plate 131, and the second long side forms N+2 notches 1321 to correspondingly embed the input segment 12I, the N intermediate segments 12M, and the input segment 12I downwards. Furthermore, within the housing 11, the flat plate 131 is attached upwards to the upper side plate 11SU, with the flat plate 131 attached to the inner surface of the upper side plate 11SU. Any two plates 132 and the flat plate 131 form a fluid channel. In other words, the flat-plate finned heatsink 13 contains M-1 fluid channels.

[0103] Figure 5 This is a perspective view of the heat dissipation device of this utility model. It can be noted that... Figure 5 The outlines of the cover 11C, the first opening 11O1, and the second opening 11O2 are all dashed lines. Furthermore, as... Figure 2 , Figure 4A , Figure 4B ,and Figure 5As shown, the first partition 14 is disposed within the housing 11 and connected to the flat finned heat sink 13, and is located near the first side of the output section 120. Specifically, the first partition 14 is connected between the inner surfaces of the bottom plate 11B and the upper side plate 11SU, located between the first side of the output section 120 and the fourth side plate 11S4, and is located near the output end port of the output section 120. Relative to the first partition 14, the second partition 15 is disposed within the housing 11 and connected to the flat finned heat sink 13, and is located near the second side of the output section 120. Specifically, the second partition 15 is connected between the inner surfaces of the bottom plate 11B and the upper side plate 11SU, and is located between the second side of the output section 120 and the second side plate 11S2.

[0104] like Figure 2 , Figure 4A , Figure 4B ,and Figure 5 As shown, the first partition 14 is connected between the bottom plate 11B, the third side plate 11S3, the upper side plate 11SU, the Mth plate 132, and the heat pipe support block 16, and the second partition 15 is connected between the bottom plate 11B, the first side plate 11S1, the upper side plate 11SU, the first plate 132, and the heat pipe support block 16. This design, with the bottom plate 11B, the third side plate 11S3, the first partition 14, the Mth plate 132, the first plate 132, the heat pipe support block 16, the second partition 15, the second side plate 11S2, the first side plate 11S1, and the upper side plate 11SU, defines a buffer area within the housing 11.

[0105] During normal operation, the reservoir 17 injects a liquid (e.g., coolant) into the heat pipe 12 through the first pipe L1 and the input port 11P1, so that the liquid enters the housing 11 through the output end port of the output section 12O, thereby being located within the buffer area. Then, the liquid within the buffer area flows through M-1 fluid channels, and then returns to the reservoir 17 through the output port 11P2 and the second pipe L2.

[0106] It should be understood that the liquid within the buffer area first flows through the multiple fluid channels of the flat-plate finned heat sink 13 before returning to the reservoir 17 through the output port 11P2. In other words, the coolant is in full contact with the flat plate 131 and the M plates 132 of the flat-plate finned heat sink 13 within the housing 11, giving the heat dissipation device 10 of this invention excellent heat dissipation performance.

[0107] It is worth mentioning that, in practical applications, the heat dissipation device 10 of this utility model can be integrated into a hybrid liquid / air cooling system or an immersion cooling system.

[0108] In summary, the heat dissipation device, heat dissipation system, and electronic device of this utility model have been fully and clearly described. However, it must be emphasized that the embodiments disclosed above are preferred embodiments, and any partial changes or modifications that originate from the technical concept of this application and are easily deduced by those skilled in the art are not outside the scope of the patent rights of this application.

Claims

1. A heat dissipating device, characterized by, The heat pipe includes: a housing including an upper side plate, a first side plate, a second side plate, a third side plate, and a fourth side plate, wherein the first side plate connects the second side plate and the upper side plate, the second side plate connects the third side plate and the upper side plate, the third side plate connects the fourth side plate and the upper side plate, the fourth side plate connects the first side plate and the upper side plate, the first side plate has a first opening, and the second side plate has a second opening; a heat pipe disposed in the housing and having an input section and an output section parallel to the input section, wherein the input section has an input end nozzle connected to the first opening, the output section has an output end nozzle facing and adjacent to the third side plate, a first side of the output section faces the fourth side plate, and a second side of the output section faces the second side plate; a flat finned heat sink disposed in the housing and stacked on the heat pipe; a first partition plate disposed in the housing and connected to the flat finned heat sink and adjacent to the first side of the output section; and a second partition plate disposed in the housing and connected to the flat finned heat sink and adjacent to the second side of the output section; wherein the flat finned heat sink includes a flat plate and M plate members connected to the flat plate, and M is a positive integer; wherein the flat plate is attached to the upper side plate in the housing, and any two of the plate members and the flat plate enclose a fluid passage; wherein the first partition plate is between the first side of the output section and the fourth side plate and adjacent to the output end nozzle of the output section; wherein the second partition plate is between the second side of the output section and the second side plate.

2. The heat dissipating device of claim 1, wherein The housing includes: a bottom plate; and a cover including the upper side plate, the first side plate, the second side plate, the third side plate, and the fourth side plate, and the upper side plate, the first side plate, the second side plate, the third side plate, and the fourth side plate enclosing an opening; wherein the bottom plate connects the cover to close the opening, and the first partition plate and the second partition plate are both connected between the inner surfaces of the bottom plate and the upper side plate.

3. The heat dissipating device of claim 2, wherein Further includes: a heat pipe support block accommodated in the housing and disposed on the bottom plate; wherein the heat pipe support block includes: a base; N+3 elongated protrusions formed on the base; and N+2 elongated grooves formed on the base; wherein any one of the elongated grooves is located between any two of the elongated protrusions.

4. The heat dissipating device of claim 3, wherein The first partition plate is connected between the bottom plate, the third side plate, the upper side plate, the Mth plate member, and the heat pipe support block, and the second partition plate is connected between the bottom plate, the first side plate, the upper side plate, the first plate member, and the heat pipe support block.

5. The heat dissipating device of claim 4, wherein The bottom plate, the third side plate, the first partition plate, the Mth plate member, the first plate member, the heat pipe support block, the second partition plate, the second side plate, the first side plate, and the upper side plate define a buffer area in the housing.

6. The heat dissipating device of claim 5, wherein The heat pipe includes N+2 straight sections and N+1 curved connection sections, two of the straight sections are connected by one of the curved connection sections, and the N+2 straight sections are correspondingly embedded in the N+2 grooves.

7. The heat dissipating device of claim 6, wherein Each of the long straight sections of the heat pipe is provided with a metal spring, and the inner wall surface of each of the long straight sections is formed with a capillary structure layer.

8. The heat dissipating device of claim 7, wherein The N+2 long straight sections include: the input section; the output section; and N intermediate sections, wherein each of the intermediate sections is parallel to the output section.

9. The heat dissipating device of claim 8, wherein, Each of the plate members has a first short edge, a second short edge, a first long edge, and a second long edge, the first long edge is connected to the flat plate, and the second long edge is formed with N+2 recessed notches to correspondingly embed the input section, the N intermediate sections, and the output section downward.

10. The heat dissipating device of claim 8, wherein Further comprising: an input port connected to the first opening for externally connecting a first pipe; and an output port connected to the second opening for externally connecting a second pipe; wherein a liquid reservoir injects a liquid into the heat pipe through the first pipe and the input port; wherein the liquid is injected into the shell through the output end of the output section, thereby being located in the buffer area; wherein the liquid located in the buffer area flows through M-1 fluid channels, and then returns to the liquid reservoir through the output port and the second pipe.

11. A heat dissipation system, characterized by, A heat dissipation device as claimed in any one of claims 1 to 10, further comprising a liquid reservoir having a liquid output port and a liquid input port, the liquid output port and the liquid input port being in communication with the input port and the output port of the heat dissipation device, respectively.

12. An electronic device comprising a housing and at least one electronic die and at least one electronic module housed within the housing, wherein: The housing contains the heat dissipation system as claimed in claim 11, and the heat dissipation system is used to dissipate heat from the at least one electronic wafer and / or the at least one electronic module. 13.The electronic device of claim 12, wherein, The electronic device is any one selected from the group consisting of a server, a network switch, a gateway, an embedded computer, a single-board computer, an industrial computer, a desktop computer, an all-in-one computer, an in-vehicle computer, a security monitoring host, a game host, and a game console.

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