Display structure, nixie tube and electronic equipment

Abstract

The utility model provides a display structure, nixie tube and electronic equipment, wherein the display structure of the embodiment of the utility model comprises a circuit board and a luminous chip, the luminous chip is arranged on the circuit board, the luminous chip is connected with the circuit board through a metal wire, the surface of the metal wire is sequentially packaged with a first adhesive layer and a second adhesive layer, and the first adhesive layer and the second adhesive layer are arranged on the circuit board. The curing shrinkage rate of the first adhesive layer is smaller than that of the second adhesive layer. According to the display structure provided by the embodiment of the utility model, the first adhesive layer and the second adhesive layer are sequentially packaged on the surface of the metal wire, and the curing shrinkage rate of the first adhesive layer is set to be smaller than that of the second adhesive layer, so that the internal stress generated by the first adhesive layer in the packaging and curing process of the metal wire is smaller; therefore, the problem that a metal wire used for connecting the light-emitting chip and the circuit board is snapped by the first adhesive layer can be avoided.

Description

Technical Field

[0001] This utility model belongs to the field of digital tube technology, specifically relating to a display structure, a digital tube, and an electronic device. Background Technology

[0002] Display structures in related technologies typically include a circuit board, a light-emitting chip, and metal wires connecting the circuit board and the light-emitting chip. Epoxy resin is used to encapsulate the light-emitting chip and the metal wires, such as in a digital tube display.

[0003] Because epoxy resin has a large curing shrinkage rate, it will generate significant internal stress during the curing process or in environments with high or low temperature changes. This stress can easily break the metal wires, causing the light-emitting chip to malfunction. Utility Model Content

[0004] This utility model aims to at least partially solve one of the technical problems in the related art.

[0005] Therefore, an embodiment of this utility model proposes a display structure.

[0006] The display structure of this utility model embodiment includes:

[0007] circuit board,

[0008] A light-emitting chip is disposed on the circuit board, and the light-emitting chip is connected to the circuit board by a metal wire.

[0009] The surface of each metal wire is sequentially encapsulated with a first adhesive layer and a second adhesive layer, wherein the curing shrinkage rate of the first adhesive layer is less than that of the second adhesive layer.

[0010] The display structure of this utility model embodiment encapsulates a first adhesive layer and a second adhesive layer sequentially on the surface of the metal wires. At the same time, the curing shrinkage rate of the first adhesive layer is set to be less than that of the second adhesive layer. The internal stress generated by the first adhesive layer during the encapsulation and curing process of the metal wires is small, thereby avoiding the problem of the first adhesive layer pulling off the metal wires used to connect the light-emitting chip and the circuit board.

[0011] In some embodiments, the coefficient of thermal expansion of the first adhesive layer is less than that of the second adhesive layer.

[0012] The display structure of this utility model embodiment encapsulates a first adhesive layer and a second adhesive layer sequentially on the surface of the metal wires. At the same time, the curing shrinkage rate of the first adhesive layer is set to be less than that of the second adhesive layer. The internal stress generated by the first adhesive layer during the encapsulation and curing process of the metal wires is small, thereby avoiding the problem of the first adhesive layer pulling off the metal wires used to connect the light-emitting chip and the circuit board.

[0013] In some embodiments, the hardness of the first adhesive layer is less than that of the second adhesive layer.

[0014] In some embodiments, the first adhesive layer is a silicone layer and the second adhesive layer is an epoxy adhesive layer.

[0015] In some embodiments, the light-emitting chip and the metal wire are encapsulated in the first adhesive layer, and the second adhesive layer covers the outer surface of the first adhesive layer.

[0016] In some embodiments, the metal wire is any one of an aluminum wire, a copper wire, and a gold wire; and / or

[0017] the diameter of the metal wire is 1.25 mil - 2 mil; and / or

[0018] The light-emitting chip is a light-emitting semiconductor die.

[0019] In some embodiments, a metal pole piece is provided on the circuit board. One end of the metal wire is connected to the metal pole piece, and the other end of the metal wire is connected to the light-emitting chip.

[0020] In some embodiments, the display structure of the embodiment of the present invention further includes a reflection cover. The reflection cover covers the circuit board. The reflection cover has a mounting groove and a receiving cavity. The mounting groove is communicated with the receiving cavity. The circuit board is disposed in the receiving cavity, and the light-emitting chip is disposed corresponding to the mounting groove.

[0021] The present invention also provides a digital tube.

[0022] The digital tube of the embodiment of the present invention includes the display structure described in the above embodiment. Among them, the number of the light-emitting chips is multiple, and the multiple light-emitting chips are arranged in a "day" shape.

[0023] The present invention also provides an electronic device.

[0024] The electronic device of the embodiment of the present invention includes the digital tube described in the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a schematic structural diagram of a digital tube including a display structure according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the internal structure of a digital tube including a display structure according to an embodiment of the present invention;

[0028] Figure 3 yes Figure 2 A cross-sectional view along the AA direction.

[0029] In the picture:

[0030] 1. Circuit board;

[0031] 2. Reflective cover; 201. Mounting groove; 202. Receiving cavity;

[0032] 3. Light-emitting chip;

[0033] 4. First adhesive layer;

[0034] 5. Second adhesive layer;

[0035] 6. Metal wire;

[0036] 7. Metal electrode sheet. Detailed Implementation

[0037] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0038] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0039] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal encapsulation of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] The following is in conjunction with the appendix Figure 1-3 The display structure of an embodiment of this utility model is described.

[0041] The display structure of this utility model embodiment includes a circuit board 1 and a light-emitting chip 3.

[0042] The light-emitting chip 3 is disposed on the circuit board 1, and the light-emitting chip 3 is connected to the circuit board 1 by a metal wire 6.

[0043] The surface of the metal wire 6 is sequentially encapsulated with a first adhesive layer 4 and a second adhesive layer 5. The curing shrinkage rate of the first adhesive layer 4 is less than that of the second adhesive layer 5.

[0044] The display structure of this utility model embodiment has a first adhesive layer 4 and a second adhesive layer 5 sequentially encapsulated on the surface of the metal line 6. At the same time, the curing shrinkage rate of the first adhesive layer 4 is set to be less than that of the second adhesive layer 5. The internal stress generated by the first adhesive layer 4 during the encapsulation and curing process of the metal line 6 is small, thereby avoiding the problem that the first adhesive layer 4 will pull the metal line 6 used to connect the light-emitting chip 3 and the circuit board 1 off.

[0045] In some embodiments, the light-emitting chip 3 and the metal wire 6 are encapsulated in a first adhesive layer 4, and a second adhesive layer 5 covers the outer surface of the first adhesive layer 4.

[0046] It is understood that the first adhesive layer 4 should completely cover the light-emitting chip 3 and the metal line 6, and the specific size parameters can be determined according to the actual size of the light-emitting chip 3 and the metal line 6.

[0047] The display structure of this utility model encapsulates the light-emitting chip 3 and the metal wire 6 together in the first adhesive layer 4. On the one hand, the first adhesive layer 4 can protect both the light-emitting chip 3 and the metal wire 6 at the same time. On the other hand, the curing shrinkage rate of the first adhesive layer 4 is small, which can avoid the problem of damaging the light-emitting chip 3 during the curing process of the first adhesive layer 4.

[0048] In some embodiments, the coefficient of thermal expansion of the first adhesive layer 4 is less than that of the second adhesive layer 5.

[0049] The display structure of this utility model embodiment sets the coefficient of thermal expansion of the first adhesive layer 4 to be less than that of the second adhesive layer 5, so that the deformation of the first adhesive layer 4 under the influence of temperature is smaller. Compared with the related technology that directly uses the second adhesive layer (epoxy resin) for encapsulation, the use of the first adhesive layer 4 with a lower coefficient of thermal expansion can further reduce the impact of the first adhesive layer 4 on the light-emitting chip 3 and the metal line 6, and at the same time reduce the impact of the second adhesive layer 5 on the light-emitting chip and the metal line 6, thereby further extending the service life of the LED encapsulation structure of this utility model embodiment.

[0050] In some embodiments, the hardness of the first adhesive layer 4 is less than the hardness of the second adhesive layer 5.

[0051] The display structure of this utility model embodiment sets the hardness of the first adhesive layer 4 to be less than that of the second adhesive layer 5. The first adhesive layer 4 with lower hardness can effectively protect the light-emitting chip 3 and the metal line 6, better adapt to the deformation of the light-emitting chip 3 and the metal line 6 caused by temperature, avoid damage to the light-emitting chip 3 and the metal line 6, and extend the service life of the digital tube.

[0052] In some embodiments, the first adhesive layer 4 is a silicone layer, and the second adhesive layer 5 is an epoxy adhesive layer.

[0053] The display structure of this utility model embodiment uses a first adhesive layer 4 as a silicone layer and a second adhesive layer 5 as an epoxy layer. On the one hand, the silicone layer with lower hardness can better adapt to the deformation of the light-emitting chip 3 and the metal line 6 caused by temperature, avoiding damage to the light-emitting chip 3 and the metal line 6. On the other hand, the second adhesive layer 5 with higher hardness can improve the mechanical strength of the display structure and avoid damage to the display structure of this utility model embodiment by external force.

[0054] In some embodiments, the metal wire 6 is any one of aluminum wire, copper wire, and gold wire. It is understood that any one of aluminum wire, copper wire, and gold wire can be selected as the metal wire 6 according to actual needs.

[0055] In some embodiments, the diameter of the metal wire 6 is 1.25mil-2mil.

[0056] Furthermore, the diameter of the metal wire 6 can be any one of 1.25mil, 1.30mil, 1.35mil, 1.40mil, 1.45mil, 1.50mil, 1.55mil, 1.60mil, 1.65mil, 1.70mil, 1.75mil, 1.80mil, 1.85mil, 1.90mil, 1.95mil, or 2.00mil. Similarly, the diameter of the metal wire 6 can be selected according to actual needs.

[0057] In some embodiments, the light-emitting chip 3 is a light-emitting semiconductor die.

[0058] In some embodiments, the circuit board 1 is provided with a metal electrode 7, one end of the metal wire 6 is connected to the metal electrode 7, and the other end of the metal wire 6 is connected to the light-emitting chip 3.

[0059] The display structure of this utility model embodiment provides a metal electrode 7 on the circuit board 1, which can be connected to the light-emitting chip 3 via a metal wire 6, thereby facilitating the power supply to the light-emitting chip 3 and also facilitating the connection of the digital tube with other electronic devices.

[0060] In some embodiments, the display structure of the present utility model further includes a reflective cover 2. The reflective cover 2 covers the circuit board 1. The reflective cover 2 has a mounting groove 201 and a receiving cavity 202. The mounting groove 201 is communicated with the receiving cavity 202. The circuit board 1 is disposed in the receiving cavity 202. The light-emitting chip 3 is correspondingly disposed opposite to the mounting groove 201. At the same time, the metal wire 6, the first adhesive layer 4 and the second adhesive layer 5 are all disposed corresponding to the mounting groove 201.

[0061] It can be understood that the dimensional parameters of the first adhesive layer 4 can be determined according to the size of the mounting groove 201 of the reflective cover 2.

[0062] The present utility model further provides a digital tube, including the display structure as described in the above embodiments;

[0063] Among them, the number of the light-emitting chips 3 is multiple, and the multiple light-emitting chips 3 are arranged in a "day" shape. Correspondingly, the number of the mounting grooves 201 of the reflective cover 2 is also multiple, and the number of the mounting grooves 201 is the same as the number of the light-emitting chips 3. The multiple mounting grooves 201 are arranged in a "day" shape.

[0064] The present utility model further provides an electronic device.

[0065] The electronic device of the embodiment of the present utility model includes the digital tube as described in the above embodiments.

[0066] By providing the digital tube of the above embodiment, the service life of the electronic device of the embodiment of the present utility model can be greatly extended.

[0067] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model, and should all be included in the protection scope of the present utility model.

Claims

1. A display structure, characterized in that, Comprising: A circuit board (1), A light-emitting chip (3), the light-emitting chip (3) is disposed on the circuit board (1), and the light-emitting chip (3) is connected to the circuit board (1) by arranging metal wires (6). The surfaces of the metal wires (6) are sequentially encapsulated with a first adhesive layer (4) and a second adhesive layer (5), and the curing shrinkage rate of the first adhesive layer (4) is less than that of the second adhesive layer (5).

2. The display structure according to claim 1, characterized in that, The coefficient of thermal expansion of the first adhesive layer (4) is less than that of the second adhesive layer (5).

3. The display structure according to claim 1, characterized in that, The hardness of the first adhesive layer (4) is less than that of the second adhesive layer (5).

4. The display structure according to claim 1, characterized in that, The first adhesive layer (4) is a silica gel layer, and the second adhesive layer (5) is an epoxy adhesive layer.

5. The display structure according to claim 1, characterized in that, The light-emitting chip (3) and the metal wires (6) are encapsulated in the first adhesive layer (4), and the second adhesive layer (5) covers the outer surface of the first adhesive layer (4).

6. The display structure according to claim 1, characterized in that, The metal wire (6) is any one of an aluminum wire, a copper wire, and a gold wire; and / or The diameter of the metal wire (6) is 1.25 mil - 2 mil; and / or The light-emitting chip (3) is a light-emitting semiconductor grain.

7. The display structure according to claim 1, characterized in that, A metal pole piece (7) is provided on the circuit board (1), one end of the metal wire (6) is connected to the metal pole piece (7), and the other end of the metal wire (6) is connected to the light-emitting chip (3).

8. The display structure according to claim 1, characterized in that, Further comprising a reflective cover (2), the reflective cover (2) covers the circuit board (1), the reflective cover (2) has a mounting groove (201) and a receiving cavity (202), the mounting groove (201) is connected to the receiving cavity (202), the circuit board (1) is disposed in the receiving cavity (202), and the light-emitting chip (3) is arranged corresponding to the mounting groove (201).

9. A digital tube, characterized in that, Comprising the display structure according to any one of claims 1 to 8; the number of the light-emitting chips (3) is multiple, and the multiple light-emitting chips (3) are arranged in a shape like the Chinese character 'Ri'.

10. An electronic device, characterized in that, Comprising the digital tube according to claim 9.

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