Cooling disc assembly and cooling device
By using support pillars and heat-absorbing coatings in the cooling pad assembly, the problem of uneven heat dissipation during wafer cooling is solved, achieving uniform heat dissipation and temperature balance of the wafer, thereby improving wafer quality and yield.
Patent Information
- Application Number
- CN202423183538.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-20
AI Technical Summary
During the wafer cooling process, existing technologies result in uneven heat dissipation in different parts of the wafer, leading to problems such as cracks and fragments, which affect wafer quality and yield.
A cooling plate assembly is used, including a support column and a heat-conducting plate body. The surface of the plate body is covered with a heat-absorbing coating, and a medium flow channel is arranged inside. The support column supports the part to be cooled. The medium flow channel and the heat-absorbing coating are evenly distributed to achieve heat exchange and avoid interference from the robot arm.
This achieves uniform heat dissipation and temperature balance in wafers, avoiding wafer cracks and fragmentation, and improving wafer quality and yield.
Smart Images
Figure CN223798626U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of cooling technology, and in particular to a cooling plate assembly and a cooling device. Background Technology
[0002] In the wafer processing, some processes require cooling of the wafer after high-temperature treatment, such as resist removal. However, due to limitations in the design of the cooling equipment, uneven heat dissipation occurs throughout the wafer during cooling, leading to excessive internal thermal stress. This results in problems such as cracks and fragmentation, severely impacting wafer quality and yield. Utility Model Content
[0003] This invention provides a cooling plate assembly and a cooling device to improve the problem of uneven heat dissipation during the cooling process of wafers.
[0004] To achieve the above objectives, this utility model provides the following technical solution:
[0005] A cooling plate assembly includes a support column and a heat-conducting plate body, wherein the plate body has a first surface and a second surface opposite to each other in the thickness direction of the plate body, the first surface is planar and has a continuous heat-absorbing coating; the interior of the plate body is uniformly provided with medium flow channels, the extension direction of the medium flow channels being parallel to the first surface.
[0006] There are multiple support columns, all of which are fixed to the disc body and exposed above the heat-absorbing coating. The multiple support columns are used to support the components to be cooled.
[0007] Optionally, the heat-absorbing coating has a thermal radiation absorptivity of 0.7 to 0.99.
[0008] Optionally, the heat-absorbing coating is a black coating.
[0009] Optionally, the height at which the heat-absorbing coating is exposed is the same for each support column.
[0010] Optionally, the height of each support column exposed above the heat-absorbing coating is 5 to 15 mm.
[0011] Optionally, the top of the support column is spherical.
[0012] Optionally, the disc body is provided with mounting slots that correspond one-to-one with the support columns, and the support columns are inserted into the corresponding mounting slots;
[0013] The support column is provided with an operating hole, the axis of which is parallel to the axis of the support column and extends through the top of the support column. The depth of the operating hole is greater than the height of the operating hole exposed above the surface of the heat-absorbing coating.
[0014] The inner diameter of the operating hole is greater than or equal to 1 mm.
[0015] Optionally, the cooling plate assembly includes at least three support columns, which are arranged in a triangle on the plate body, and the center of the plate body is located within the area enclosed by the triangle.
[0016] Alternatively, the cooling plate assembly includes at least six support pillars, wherein at least three support pillars are distributed in a first triangle on the plate body, and at least three support pillars are distributed in a second triangle on the plate body; the center of the plate body is located within the area enclosed by the first triangle, the second triangle is located outside the first triangle, and the three sides of the first triangle and the three sides of the second triangle do not coincide.
[0017] Optionally, the material of the disc body is at least one of alumina ceramic and silicon nitride ceramic.
[0018] Optionally, the cross-section of the disk perpendicular to the thickness direction is circular, and the medium flow channel includes multiple arc segments, the center of which coincides with the center of the disk.
[0019] This utility model also provides a cooling device, which includes any of the cooling plate assemblies provided in the above-described technical solutions.
[0020] In this design, the component to be cooled (e.g., a wafer) is positioned above the heat-absorbing coating, supported by various support pillars. The heat-absorbing coating absorbs the thermal radiation from the component and exchanges heat with the cooling medium in the medium channels, thereby achieving heat dissipation and cooling of the component. On one hand, this design allows for heat exchange between the component to be cooled and the disk body over a large area, resulting in more uniform heat dissipation and a more balanced temperature across the component. On the other hand, the first surface with the heat-absorbing coating is planar, and the extension direction of the medium channels is parallel to the first surface. This means that the distance between the medium channels and the heat-absorbing coating is equidistant. Furthermore, the medium channels are evenly distributed within the disk body, ensuring that the cooling medium in the medium channels exchanges heat with the heat-absorbing coating as uniformly as possible, resulting in a more balanced temperature across the heat-absorbing coating. This also contributes to uniform heat dissipation and temperature balance across the component.
[0021] In addition, the solution uses support columns to support the parts to be cooled, which can minimize interference with the robotic arm that transports the parts to be cooled. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a cooling plate in related technologies;
[0023] Figure 2 A schematic diagram of a cooling plate assembly provided in an embodiment of this utility model;
[0024] Figure 3 for Figure 2AA section view;
[0025] Figure 4 This is a schematic diagram of the structure of a support column in a cooling plate assembly provided by an embodiment of the present utility model;
[0026] Figure 5 A schematic cross-sectional view of the cooling plate assembly in the direction perpendicular to the thickness direction, provided for an embodiment of this utility model;
[0027] Figure 6 for Figure 5 The diagram shown illustrates the structure of the disk body when it is equipped with a connector.
[0028] Figure 7 This is a schematic diagram illustrating an application scenario of a cooling device provided in an embodiment of the present utility model.
[0029] Icons: 1-Disk body; 110'-Recess; 101-Media inlet; 102-Media outlet; 11-Media flow channel; 121-First arc-shaped protrusion; 122-Second arc-shaped protrusion; 123-Third arc-shaped protrusion; 124-Fourth arc-shaped protrusion; 125-Columnar protrusion; 2-Support column; 3-Connector; 100-Cooling device; 200-Robot arm; 300-Circular storage platform; 310-Clip; 400-Wafer; 500-Removal cavity. Detailed Implementation
[0030] A cooling tray is a component in a cooling system used to support and dissipate heat from the wafer, thereby cooling it. Typically, after a robotic arm arrives at the wafer cooling station, it lifts or removes the wafer from the cooling tray. For example, after the robotic arm arrives at the wafer cooling station, it lowers the wafer to place it on the cooling tray; once the wafer is in place, the robotic arm retracts and exits. Figure 1 This is a schematic diagram of a cooling plate in related technologies. For example... Figure 1 As shown, in this design, a recess 110' needs to be provided on the upper surface of the cooling pad to avoid obstructing the robotic arm. The portion of the wafer directly above the recess 110' is suspended and has no contact with the cooling pad. In other words, the portion of the wafer directly above the recess 110' cannot directly dissipate heat through the cooling pad. Furthermore, in some embodiments, the actual contact area between the wafer and the cooling pad accounts for only about 52% of the wafer area. This can cause uneven heat dissipation across different parts of the wafer, leading to problems such as cracks and fragmentation.
[0031] Based on this, this embodiment provides a cooling plate assembly and a cooling device to improve the problem of uneven heat dissipation of wafers during the cooling process.
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0033] Figure 2 This is a schematic diagram of a cooling plate assembly provided in an embodiment of this application. Figure 3 for Figure 2 AA sectional view, such as Figure 2 and Figure 3 As shown in the illustration, a cooling plate assembly provided in this application includes support columns 2 and a heat-conducting plate body 1. Specifically, the plate body 1 has a first surface a and a second surface b opposite to each other in the thickness direction of the plate body 1. The first surface a is planar and has a continuous heat-absorbing coating. Medium flow channels 11 are uniformly distributed inside the plate body 1, and the extension direction of the medium flow channels 11 is parallel to the first surface a. Multiple support columns 2 are fixed to the plate body 1 and exposed above the heat-absorbing coating. The multiple support columns 2 are used to jointly support the component to be cooled.
[0034] In this design, the component to be cooled (e.g., a wafer) is positioned above the heat-absorbing coating under the combined support of the support pillars 2. The heat-absorbing coating absorbs the thermal radiation from the component and exchanges heat with the cooling medium in the medium channels, thereby achieving heat dissipation and cooling of the component. On one hand, this design allows the component to exchange heat with the disk 1 over the largest possible area, resulting in more uniform heat dissipation and a more balanced temperature across the component. On the other hand, the first surface a with the heat-absorbing coating is planar, and the extension direction of the medium channels 11 is parallel to the first surface a. This means that the distance between the medium channels 11 and the heat-absorbing coating is equal at all points. Furthermore, the medium channels 11 are evenly distributed inside the disk 1, ensuring that the cooling medium in the medium channels 11 exchanges heat with the heat-absorbing coating as evenly as possible, resulting in a more balanced temperature across the heat-absorbing coating. This also contributes to uniform heat dissipation and temperature balance across the component.
[0035] In addition, the solution uses support columns 2 to support the parts to be cooled, which can minimize interference with the robotic arm that transports the parts to be cooled.
[0036] In some embodiments, the heat-absorbing coating has a thermal radiation absorptivity of 0.7 to 0.99, thereby dissipating heat more efficiently from the component to be cooled. Exemplarily, the heat-absorbing coating has a thermal radiation absorptivity of 0.7, 0.8, or 0.99, etc.; the heat-absorbing coating is a black coating, such as a black paint layer. Of course, in other embodiments, the heat-absorbing coating may also employ other layered structures, such as a black coating formed by a surface blackening process, as long as the thermal radiation absorptivity is within the range of 0.7 to 0.99.
[0037] In practice, the height of each support column 2 exposed above the heat-absorbing coating is the same, so that the part to be cooled is parallel to the heat-absorbing coating, and the parts of the part to be cooled can dissipate heat more evenly. For example, the height H0 of each support column 2 exposed above the heat-absorbing coating is 5 to 15 mm, such as 5 mm, 10 mm or 15 mm.
[0038] In practical implementation, the top of support column 2 is spherical to reduce the contact area between support column 2 and the component to be cooled, allowing more of the component to be exposed above the heat-absorbing coating for better heat dissipation. It is worth noting that the term "spherical top of support column 2" should be interpreted broadly; that is, the top of support column 2 can be approximately spherical, not just geometrically spherical. Of course, the shape of the top of support column 2 is not limited to spherical; for example, the top surface of support column 2 can also be flat.
[0039] In some embodiments, the disk body 1 is provided with mounting slots corresponding to the support columns 2, and the support columns 2 are inserted into the corresponding mounting slots. Figure 4 As shown, the support column 2 is provided with an operating hole. The axis of the operating hole is parallel to the axis of the support column 2, and the operating hole extends through the top of the support column 2. The depth of the operating hole is greater than the height of the operating hole exposed above the surface of the heat-absorbing coating. The inner diameter of the operating hole is greater than or equal to 1 mm. This design allows for several advantages. First, if the support column 2 breaks accidentally, tools such as wires can be inserted into the operating hole to remove the broken support column 2 for replacement. This makes installation and removal of the support column 2 more convenient, saving equipment maintenance time. Second, the operating hole further reduces the contact area between the support column 2 and the component to be cooled (e.g., a wafer), allowing more of the component to be exposed above the heat-absorbing coating for better heat dissipation.
[0040] In practice, the axis of the support column 2 can be perpendicular to the first surface a of the disk body 1, and the operating hole can also penetrate the support column 2.
[0041] For example, the support column 2 includes a spherical part and a cylindrical part, wherein the height h2 of the spherical part is 4 mm, the height h3 of the cylindrical part is 6 mm, the diameter of the support column 2 is 5 mm, the height of the support column 2 exposing the heat-absorbing coating is 5 mm, and the depth h1 of the operating hole is 7 mm.
[0042] In one specific implementation, the cooling pad assembly includes at least three support pillars 2, which are arranged in a triangle on the pad body 1, with the center of the pad body 1 located within the area enclosed by the triangle, to provide stable support for the component to be cooled. Exemplarily, the at least three support pillars are evenly distributed on a circle whose center coincides with the center of the pad body 1. For example, the cooling pad assembly includes three support pillars 2, which are evenly distributed on a circle whose center coincides with the center of the pad body 1.
[0043] In another specific implementation method, you can refer to Figure 5 As shown, the cooling pad assembly includes at least six support pillars 2, of which at least three support pillars 2 are distributed in a first triangle on the pad body 1, and at least three support pillars 2 are distributed in a second triangle on the pad body 1. The center of the pad body 1 is located within the area enclosed by the first triangle, and the second triangle is located outside the first triangle, with the three sides of the first triangle and the three sides of the second triangle not coinciding. In this design, even if one or two support pillars 2 break accidentally, the components to be cooled can still be stably supported, and the wafer will not tilt and fall, thus avoiding the situation where the robotic arm hits the wafer and causes fragmentation. Exemplarily, the support pillars distributed on the first triangle are evenly distributed on a circle whose center coincides with the center of the pad body 1, and the support pillars distributed on the second triangle are evenly distributed on a circle whose center coincides with the center of the pad body 1.
[0044] It should be understood that the number and distribution of support columns 2 are not limited to the two situations mentioned above. For example, in addition to the two situations mentioned above, support columns 2 can also be provided at the center of the disk body 1. Other situations regarding the number and distribution of support columns 2 will not be listed here.
[0045] When specifically setting up the disk body 1, the material of the disk body 1 can be at least one of alumina ceramic and silicon nitride ceramic. Similarly, the material of the support column 2 can also be at least one of alumina ceramic and silicon nitride ceramic. Of course, the materials of both the disk body 1 and the support column 2 can also be other ceramic materials. In specific implementation, the heat-absorbing coating can be prepared on the first surface a by chemical deposition or electroplating process.
[0046] like Figure 5As shown, in some embodiments, the cross-section of the disk 1 perpendicular to the thickness direction is circular. In this case, the diameter of the disk 1 can be set according to specific needs. For example, when the component to be cooled is a wafer, the diameter of the disk 1 can be set according to the size of the wafer, so that the orthographic projection of the wafer on the disk 1 is completely located on the disk 1. For example, the diameter of the disk 1 is 240 mm to accommodate 6-inch and 8-inch wafers. Furthermore, the dielectric channel 11 includes multiple arc-shaped segments, the centers of which coincide with the center of the disk 1, so that the temperature of the cooling disk is uniform, thereby achieving a uniform cooling effect when the wafer undergoes thermal radiation.
[0047] The disk body 1 includes a substrate (not shown) and a cover plate (not shown) facing each other in the thickness direction of the disk body 1. A heat-absorbing coating is disposed on the surface of the cover plate facing away from the substrate. The surface of the substrate facing the cover plate is provided with a first arc-shaped protrusion 121, a second arc-shaped protrusion 122, a third arc-shaped protrusion 123 and a fourth arc-shaped protrusion 124, which are arranged at intervals along the direction from the center of the substrate to the edge of the substrate. A columnar protrusion 125 is provided at the center of the surface of the substrate facing the cover plate, and the columnar protrusion 125 is located in the area surrounded by the first arc-shaped protrusion 121.
[0048] Each arc-shaped protrusion has a first end located to the right of the centerline of its notch and a second end located to the left of the centerline of its notch. Specifically, the fourth arc-shaped protrusion 124 has a medium inlet 101 and a medium outlet 102. The first end T1 of the third arc-shaped protrusion 123 is connected to the portion of the fourth arc-shaped protrusion 124 located between the medium inlet 101 and the medium outlet 102, and the second end T2 of the third arc-shaped protrusion 123 is connected to the first end F1 of the first arc-shaped protrusion 121. The first end S1 of the second arc-shaped protrusion 122 is connected to the portion of the fourth arc-shaped protrusion 124 located at the medium outlet 102 away from the medium inlet 101, and the second end S2 of the second arc-shaped protrusion 122 is connected to the columnar protrusion 125. In this way, a medium flow channel 11 is formed. An arc-shaped section for medium flow is formed between two adjacent arc-shaped protrusions.
[0049] In specific implementation, the substrate, cover plate and each arc-shaped protrusion can be an integrally formed structure, or the substrate and each arc-shaped protrusion can be an integrally formed structure, or the substrate and cover plate can be a symmetrical structure, that is, both the substrate and the cover plate are provided with the above-mentioned arc-shaped protrusions. After the substrate and the cover plate are fastened and sealed, they together define the medium flow channel.
[0050] For example, the cooling medium is process cooling water with a pressure of 0.1 MPa to 0.3 MPa and a water temperature of 10°C to 18°C. Both the medium inlet 101 and the medium outlet 102 can be equipped with connectors 3 (e.g., ...). Figure 6 (As shown), to connect to the external process cooling water system.
[0051] It should be understood that the components to be cooled mentioned in this embodiment include, but are not limited to, wafers.
[0052] The cooling device provided in this embodiment includes the above-mentioned cooling plate assembly. Therefore, it can at least achieve the technical effects that the above-mentioned cooling plate assembly can achieve, namely, to make the heat dissipation of the component to be cooled (e.g., a wafer) more even and to make the temperature of the component to be cooled more uniform.
[0053] For example, the cooling device includes a frame, and the plate 1 is mounted on the frame by screws.
[0054] The cooling devices mentioned in this embodiment include, but are not limited to, wafer cooling devices.
[0055] The following describes the application scenario when the cooling device provided in this embodiment is a wafer cooling device. Please refer to [link / reference]. Figure 7 .
[0056] The robotic arm 200 removes the wafer 400 from the cassette 310 of the wafer storage stage 300, and transports the wafer 400 to the de-adhesive chamber 500 for high-temperature de-adhesive removal. After de-adhesive removal, the robotic arm removes the wafer 400 from the de-adhesive chamber 500 and places it on the cooling plate assembly in the cavity of the cooling device 100 for cooling. After cooling, the wafer 400 is transported by the robotic arm 200 to the cassette 310 of the wafer storage stage 300.
[0057] Specifically, after the adhesive is removed from the wafer 400, it is delivered by the robotic arm 200 to directly above the cooling pad assembly. The robotic arm then lowers the wafer 400 and places it on each support column 2. The robotic arm 200 then retracts. The cooling pad assembly absorbs the heat radiation from the wafer 400, thereby cooling the wafer 400.
[0058] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A cooling disc assembly, characterized in that The cooling disc assembly comprises a support column and a disc capable of conducting heat, wherein the disc has a first surface and a second surface opposite in the thickness direction of the disc, the first surface is a plane, and the first surface is provided with a continuous heat absorption coating; the inside of the disc is uniformly provided with a medium flow channel, and the extension direction of the medium flow channel is parallel to the first surface; The support column is a plurality of support columns, and the plurality of support columns are fixed to the disc and exposed to the heat absorption coating, and the plurality of support columns are used to jointly support a component to be cooled.
2. The cooling pan assembly of claim 1, wherein, The heat radiation absorption rate of the heat absorption coating is 0.7-0.
99.
3. The cooling pan assembly of claim 1, wherein, The heat absorption coating is a black coating.
4. The cooling pan assembly of claim 1, wherein, The height of each support column exposed to the heat absorption coating is the same.
5. The cooling pan assembly of claim 4, wherein, The height of each support column exposed to the heat absorption coating is 5-15 mm.
6. The cooling pan assembly of claim 4, wherein, The top end of the support column is spherical.
7. The cooling pan assembly of claim 6, wherein, The disc is provided with a mounting groove corresponding to the support column, and the support column is inserted into the corresponding mounting groove; The support column is provided with an operation hole, the axis of the operation hole is parallel to the axis of the support column, the operation hole penetrates the top end of the support column, and the depth of the operation hole is greater than the height of the operation hole exposed to the surface of the heat absorption coating; The inner diameter of the operation hole is greater than or equal to 1 mm.
8. The cooling pan assembly of any one of claims 1-6, wherein, The cooling disc assembly comprises at least three support columns, and the at least three support columns are distributed in a triangular shape on the disc, and the center of the disc is located in the area surrounded by the triangle. Alternatively, the cooling disc assembly comprises at least six support columns, wherein at least three support columns are distributed in a first triangular shape on the disc, and at least three support columns are distributed in a second triangular shape on the disc; the center of the disc is located in the area surrounded by the first triangle, the second triangle is surrounded outside the first triangle, and the three sides of the first triangle and the three sides of the second triangle do not coincide.
9. The cooling pan assembly of any one of claims 1-6, wherein, The material of the disc is one of alumina ceramic and silicon nitride ceramic.
10. The cooling pan assembly of any one of claims 1-6, wherein, The cross section of the disc perpendicular to the thickness direction is circular, and the medium flow channel comprises a plurality of arc segments, and the centers of the arc segments coincide with the center of the disc.
11. Cooling device, characterized in that The cooling disc assembly comprises the cooling disc assembly according to any one of claims 1-10.