Silicon wafer box and blanking system

Abstract

The utility model provides a silicon wafer box and a blanking system. The silicon wafer material box comprises a material box body, and the material box body is provided with a containing groove. And at least one part of the air knife assembly is arranged on the circumferential side wall of the material box body and blows air towards the side wall opposite to the side wall where the air knife assembly is located. According to the utility model, the problems in the prior art that the silicon wafers are stacked irregularly and are easy to scratch in the blanking process are solved.

Description

Technical Field

[0001] This utility model relates to the field of battery production equipment, and more specifically, to a silicon wafer cassette and feeding system. Background Technology

[0002] In existing technologies, a tilted tray method is typically used when unloading silicon wafers. A suction cup picks up the wafer and lowers it above the tray, allowing the wafer to fall into the tray on its own and then slide down to the bottom, achieving wafer stacking. However, due to the friction between the wafer's grid lines, existing technologies cannot guarantee that every wafer will slide to the bottom of the tray, and the friction between the grid lines during the sliding process can easily cause scratches on the wafers. Furthermore, during on-site production, each tray holds 120-150 wafers, resulting in a high degree of unevenness. After unloading, the wafers cannot be properly collected and need to be manually rearranged, further increasing the risk of scratches and breakage.

[0003] Therefore, existing technologies suffer from problems such as uneven stacking and easy scratching during silicon wafer cutting. Utility Model Content

[0004] The main purpose of this utility model is to provide a silicon wafer cassette and feeding system to solve the problems of uneven stacking and easy scratching during the silicon wafer feeding process in the prior art.

[0005] To achieve the above objectives, according to one aspect of the present invention, a silicon wafer cassette is provided, comprising: a cassette body having a receiving groove; and an air knife assembly, at least a portion of which is disposed on a circumferential sidewall of the cassette body and blows air toward a sidewall opposite to the sidewall where the air knife assembly is located.

[0006] Furthermore, the air knife assembly includes: an air knife body, which is disposed on the circumferential side wall of the material box body; and a CDA air supply structure, which is connected to the air knife body.

[0007] Furthermore, the air knife assembly also includes a regulating valve, and the CDA air supply structure is connected to the air knife body through the regulating valve.

[0008] Furthermore, the circumferential sidewall of the material box body is provided with an avoidance notch corresponding to the air knife body, and at least a part of the air knife body is provided at the avoidance notch.

[0009] Furthermore, the air outlet of the wind blade body is higher than the bottom edge of the clearance notch.

[0010] Furthermore, the opening width of the clearance notch is greater than the width of the air outlet of the air blade body.

[0011] Furthermore, the air outlet of the air knife body is located below the top of the material box body.

[0012] Furthermore, there are one or more air knife assemblies. When there are multiple air knife assemblies, the multiple air knife assemblies are spaced apart along the same side wall of the material box body.

[0013] Furthermore, the bottom of the material box body has an opening that communicates with the receiving groove.

[0014] According to another aspect of the present invention, a feeding system is provided, including the aforementioned silicon wafer cassette.

[0015] Applying the technical solution of this utility model, the silicon wafer cassette in this application includes a cassette body and an air knife assembly. The cassette body has a receiving groove. At least a portion of the air knife assembly is disposed on the circumferential sidewall of the cassette body and blows air toward the sidewall opposite to the sidewall where the air knife assembly is located.

[0016] When using the silicon wafer cassette of this application, because the cassette body is equipped with an air knife assembly, during the process of placing the silicon wafer into the receiving slot of the cassette body, the air knife assembly can continuously blow air into the receiving slot, thereby forming an air layer between the silicon wafer already placed in the cassette body and the silicon wafer being placed in the cassette body. This avoids excessive contact between the two silicon wafers and allows the silicon wafer to slide more easily to the lower position of the cassette body, ensuring neat alignment between adjacent silicon wafers within the cassette body. Furthermore, this design also improves the process of the silicon wafer sliding to the lower position, simultaneously reducing the tilt angle of the cassette body and minimizing edge chipping and crystal detachment caused by the silicon wafer colliding with the high corner of the silicon wafer in the cassette body when falling due to excessive tilt angle. Therefore, the silicon wafer cassette of this application effectively solves the problems of uneven stacking and easy scratching during the silicon wafer unloading process in the prior art. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic diagram of the structure of a silicon wafer cassette according to a specific embodiment of the present invention is shown.

[0019] The above figures include the following reference numerals:

[0020] 10. Material box body; 11. Receiving groove; 12. Avoidance notch; 20. Air knife assembly. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0023] In this utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0024] To address the issues of uneven stacking and easy scratching during silicon wafer feeding in existing technologies, this application provides a silicon wafer cassette and feeding system.

[0025] Furthermore, the feeding system in this application has the following silicon wafer cassette.

[0026] like Figure 1 As shown, the silicon wafer cassette in this application includes a cassette body 10 and an air knife assembly 20. The cassette body 10 has a receiving groove 11. At least a portion of the air knife assembly 20 is disposed on the circumferential sidewall of the cassette body 10 and blows air toward the sidewall opposite to the sidewall where the air knife assembly 20 is located.

[0027] When using the silicon wafer cassette of this application, since the cassette body 10 is equipped with an air knife assembly 20, during the process of placing the silicon wafer into the receiving groove 11 of the cassette body 10, the air knife assembly 20 can continuously blow air into the receiving groove 11, thereby forming an air layer between the silicon wafer already placed in the cassette body 10 and the silicon wafer being placed in the cassette body 10. This avoids excessive contact between the two silicon wafers and allows the silicon wafer to slide more easily to the lower position of the cassette body 10, ensuring neat alignment between adjacent silicon wafers within the cassette body 10. Furthermore, this arrangement also improves the process of the silicon wafer sliding to the lower position, simultaneously reducing the tilt angle of the cassette body 10 and minimizing edge chipping and crystal detachment caused by the silicon wafer colliding with the high corner of the silicon wafer in the cassette body 10 when falling due to excessive tilt angle. Therefore, the silicon wafer cassette of this application effectively solves the problems of uneven stacking and easy scratching during the silicon wafer unloading process in the prior art.

[0028] In one specific embodiment of this application, the air knife assembly 20 includes an air knife body and a CDA air supply structure. The air knife body is disposed on the circumferential side wall of the material box body 10; the CDA air supply structure is connected to the air knife body. In this embodiment, the CDA air supply structure is a compressed air supply structure, which provides a gas source for the air knife body, thereby ensuring that the air knife body can continuously blow air into the material box body 10. Simultaneously, this arrangement also avoids the influence of moisture on the silicon wafers, further improving the processing quality of the silicon wafers.

[0029] Preferably, the air knife assembly 20 further includes a regulating valve, and the CDA air supply structure is connected to the air knife body through the regulating valve. In this application, the regulating valve allows the airflow from the air knife body to be adjusted to accommodate silicon wafers of different thicknesses or sizes, ensuring the stability and effectiveness of the airflow. This flexibility provides more precise control when handling silicon wafers of different specifications, making it suitable for the production of multiple product models in semiconductor manufacturing.

[0030] Optionally, the circumferential sidewall of the material box body 10 is provided with a clearance notch 12 corresponding to the air knife body, and at least a portion of the air knife body is located at the clearance notch 12. This arrangement ensures that the air knife body can more easily blow air into the material box body 10. Simultaneously, this arrangement not only allows the air knife body to be closer to the silicon wafer, forming a more effective and concentrated airflow, but also optimizes the structural design of the material box body 10, avoiding the air knife assembly 20 occupying internal space of the material box body 10 and improving space utilization. In production environments requiring efficient space utilization, such as semiconductor manufacturing and solar panel manufacturing, this design provides more possibilities for production line layout and optimization, while reducing the complexity of equipment maintenance and adjustment.

[0031] Optionally, the air outlet of the air knife body is higher than the bottom edge of the clearance notch 12. This design ensures that the airflow directly acts on the falling path of the silicon wafer, avoiding ineffective airflow diffusion and improving airflow utilization efficiency.

[0032] Optionally, the opening width of the clearance notch 12 is larger than the width of the air outlet of the air knife body. This design ensures uniform airflow distribution, preventing excessively concentrated airflow from causing excessive local pressure on the silicon wafer, which could lead to wafer deformation or damage. In fields such as semiconductor manufacturing and solar panel manufacturing, where the integrity of silicon wafers must be guaranteed, this design provides a safer feeding environment, reduces wafer breakage due to improper equipment design, further reduces the scrap rate in the production process, and improves the controllability of production costs.

[0033] Optionally, the air outlet of the air knife body is located below the top of the wafer cassette body 10. This arrangement ensures that the air knife body can blow air only into the interior of the wafer cassette body 10, thereby guaranteeing the performance of the silicon wafer cassette.

[0034] Optionally, there may be one or more air knife assemblies 20. When there are multiple air knife assemblies 20, they are spaced apart along the same side wall of the material box body 10. In a specific embodiment of this application, there is one air knife assembly 20, and the air knife body of the air knife assembly 20 is positioned at the midpoint of the side of the material box body 10 to which it is located.

[0035] Optionally, the bottom of the material box body 10 has an opening communicating with the receiving groove 11. This design allows the silicon wafer to be removed directly from the bottom, avoiding potential damage to the silicon wafer when removed from the top, while also facilitating the operation of automated equipment and improving production efficiency.

[0036] From the above description, it can be seen that the above embodiments of this utility model achieve the following technical effects: The silicon wafer cassette of this application includes a cassette body 10 and an air knife assembly 20. The cassette body 10 has a receiving groove 11. At least a portion of the air knife assembly 20 is disposed on the circumferential side wall of the cassette body 10 and blows air toward the side wall opposite to the side wall where the air knife assembly 20 is located. When using the silicon wafer cassette of this application, since the air knife assembly 20 is provided on the cassette body 10, during the process of placing the silicon wafer into the receiving groove 11 of the cassette body 10, air can be continuously blown into the receiving groove 11 by the air knife assembly 20. This can form an air layer between the silicon wafer already placed in the cassette body 10 and the silicon wafer being placed in the cassette body 10, thereby avoiding excessive contact between the two silicon wafers and making it easier for the silicon wafer to slide to the lower position of the cassette body 10, so that the two adjacent silicon wafers in the cassette body 10 are neatly aligned. Furthermore, this design also improves the process of silicon wafers sliding down to a lower position, simultaneously reducing the tilt angle of the wafer cassette body 10. This minimizes the problem of edge chipping and crystal detachment caused by the silicon wafers colliding with the high corners of the wafers in the cassette body 10 during their descent due to excessive tilt. Therefore, the silicon wafer cassette in this application effectively solves the problems of uneven stacking and easy scratching during the silicon wafer unloading process in the prior art.

[0037] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0038] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0039] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0040] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A silicon wafer cassette, characterized in that, include: The material box body (10) has a receiving groove (11). Air knife assembly (20), at least a portion of which is disposed on the circumferential sidewall of the material box body (10) and blows air toward the sidewall opposite to the sidewall where the air knife assembly (20) is located; The air knife assembly (20) is one or more. When there are multiple air knife assemblies (20), the multiple air knife assemblies (20) are spaced apart along the same side wall of the material box body (10). The air knife assembly (20) includes an air knife body, which is disposed on the circumferential sidewall of the material box body (10); When there is one air knife assembly (20), the air knife body of the air knife assembly (20) is set at the midpoint of the side of the material box body (10) where it is located; The circumferential sidewall of the material box body (10) is provided with an avoidance notch (12) corresponding to the air knife body, and at least a part of the air knife body is provided at the avoidance notch (12); The air outlet of the air knife body is higher than the bottom edge of the clearance notch (12); The bottom of the material box body (10) has an opening that communicates with the receiving groove (11). The opening is used to remove the silicon wafer so that the silicon wafer can be directly removed from the bottom of the material box body (10) and the silicon wafer can be avoided from being damaged when it is removed from the top of the material box body (10).

2. The silicon wafer cassette according to claim 1, characterized in that, The air knife assembly (20) further includes a CDA air supply structure, which is connected to the air knife body.

3. The silicon wafer cassette according to claim 2, characterized in that, The air knife assembly (20) also includes a regulating valve, and the CDA air supply structure is connected to the air knife body through the regulating valve.

4. The silicon wafer cassette according to claim 2, characterized in that, The opening width of the clearance notch (12) is greater than the width of the air outlet of the air knife body.

5. The silicon wafer cassette according to claim 2, characterized in that, The air outlet of the air knife body is located below the top of the material box body (10).

6. A feeding system, characterized in that, The silicon wafer cassette includes any one of claims 1 to 5.

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