Wafer module packaging butt joint device

Abstract

The utility model discloses a wafer module packaging butt joint device. The wafer module packaging butt joint device comprises a base, a side pressing block, an adhesive placing assembly, a pressing power device and a pressing knife assembly, the adhesive placing assembly is rotatably installed on the base, and the pressing power device is installed on the base in a hinged mode. The beneficial effects of the utility model lie in that each roll is connected in the initial stage of unwinding, butt joint can be completed in the previous process, the subsequent process does not need to be interrupted again, the processing efficiency of the wafer module can be improved, and in addition, the structure of the utility model can realize preliminary compression of a to-be-processed object through the side compression block, thereby improving the processing efficiency of the wafer module. In addition, the pressing power device, the side pressing block and the viscose placing assembly are all installed on the base in a hinged mode, so that when the device is not used, only the pressing power device and the side pressing block need to be turned over to one side of the conveying device, machining is not affected, the structure is compact and reasonable, and the device is convenient to use. The use is convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer module processing technical field, concretely relates to a wafer module package butt joint ware. BACKGROUND

[0002] Wafer module processing is in the form of roll structure when discharging, and a new roll will be put after the roll is finished, but the current equipment often does not butt joint the last wafer module, so each processing procedure needs to be interrupted, which wastes time and is inconvenient to operate. UTILITY MODEL CONTENTS

[0003] The utility model discloses a purpose in order to solve above -mentioned problem and provides, see the elaboration below in detail.

[0004] In order to achieve the above object, the utility model provides the following technical scheme:

[0005] The utility model provides a wafer module package butt joint ware, including base, side pressure block, viscose placement subassembly, pressure power device and pressure cutter subassembly, viscose placement subassembly rotatable installation on base, pressure power device hinged installation on base, side pressure block is two, two side pressure block rotatable installation on base, pressure cutter subassembly rotatable installation on pressure power device.

[0006] As a priority, the viscose placement subassembly includes a connecting frame and a tape disc sleeve assembly; the connecting frame is installed on the base, and the tape disc sleeve assembly is installed on the connecting frame.

[0007] As a priority, the tape disc sleeve assembly includes a tape disc sleeve and a locking member; the tape disc sleeve is installed on the connecting frame through a fixing member; and one end of the locking member is hingedly installed on the tape disc sleeve.

[0008] As a priority, the locking member has a plug at the other end, the tape disc sleeve is provided with a socket, and the plug and the socket are matched.

[0009] As a priority, the pressure power device includes a power source and a mounting seat; and the power source is installed on the mounting seat.

[0010] As a priority, the pressure cutter subassembly includes a pressure cutter plate, a pressure cutter and a connecting member; the pressure cutter is installed on the pressure cutter plate through the connecting member; the pressure cutter plate is rotatably installed on the mounting seat; the mounting seat is provided with a notch; and the pressure cutter and the notch are matched.

[0011] As a priority, the pressure cutter has a T-shaped cross section.

[0012] As a priority, a button is also included for controlling the power source start.

[0013] As a priority, the power source is a cylinder or an electric motor.

[0014] The beneficial effect is that the utility model discloses a structure through the side pressure block, can realize to the preliminary pressure of the processing object, then through the pressure power device and press tightly, and the pressure effect is better, in addition, the pressure power device, side pressure block and viscose placement assembly are hinged and installed on the base, therefore when not needing using, only need to turn over the pressure power device and side pressure block to the side of conveying device, will not affect processing, compact structure is reasonable, convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, below will to the drawing needed to use in the embodiment or prior art description simple introduction, obviously, the drawing in the following description only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, still can obtain other drawings according to these drawings.

[0016] Figure 1 It is the three-dimensional structure schematic diagram of the utility model.

[0017] The reference signs are explained as follows:

[0018] 1, base;2, side pressure block;3, viscose placement assembly;301, connecting frame;302, adhesive tape disc sleeve assembly;3021, adhesive tape disc sleeve;3022, locking piece;4, pressure power device;401, power source;402, notch;403, mounting seat;5, pressure cutter assembly;501, pressure cutter plate;502, pressure cutter;6, operating button. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the technical scheme of the utility model will be described in detail below. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all other implementation manners obtained by those skilled in the art without making creative labor belong to the range of protection of the utility model.

[0020] Referring to Figure 1The utility model provides a kind of wafer module package docking device, including pedestal 1, side pressure block 2, adhesive placement component 3, pressure power device 4 and pressure cutter 502 component 5;The adhesive placement component 3 rotatably installed on the pedestal 1, the pressure power device 4 is hingedly installed on the pedestal 1, the side pressure block 2 is two, two the side pressure block 2 rotatably installed on the pedestal 1;The pressure cutter 502 component 5 rotatably installed on the pressure power device 4.

[0021] As priority, the adhesive placement component 3 includes connecting frame 301 and adhesive tape disc sleeve component 302;The connecting frame 301 is installed on the pedestal 1, and the adhesive tape disc sleeve component 302 is installed on the connecting frame 301.

[0022] As priority, the adhesive tape disc sleeve component 302 includes adhesive tape disc sleeve 3021 and locking member 3022;The adhesive tape disc sleeve 3021 is installed on the connecting frame 301 by fixing member;One end of the locking member 3022 is hingedly installed on the adhesive tape disc sleeve 3021.

[0023] As priority, the other end of the locking member 3022 is provided with a plug, the adhesive tape disc sleeve 3021 is provided with a socket, and the plug and the socket are matched.

[0024] As priority, the pressure power device 4 includes power source 401 and mounting seat 403;The power source 401 is installed on the mounting seat 403.

[0025] As priority, the pressure cutter component 5 includes pressure cutter plate 501, pressure cutter 502 and connecting member, the pressure cutter 502 is installed on the pressure cutter plate 501 by connecting member, the pressure cutter plate 501 is rotatably installed on the mounting seat 403, the mounting seat 403 is provided with notch 402, and the pressure cutter 502 and the notch 402 are matched.

[0026] As priority, the cross section of the pressure cutter 502 is T-shaped.

[0027] As priority, it further includes button, and the button is used to control power source 401 to start.

[0028] As priority, the power source 401 is air cylinder or motor.

[0029] The above structure is as follows:

[0030] When the unwinding structure is finished, when the two pieces of material to be processed are connected, the side pressing block 2 is turned over, and then the two pieces of material to be processed are pressed, and after being placed in position, the operation button is pressed; the power source 401 is started, and the power source 401 moves downward, so that the power source 401 presses the two pieces of material to be processed, then the pressing knife plate 501 is manually operated, the pressing plate drives the pressing knife 502 to move downward, the pressing knife 502 can pass through the gap 402, and then the two pieces of material to be processed are cut, after cutting, the driving power source 401 is moved upward, when reaching a certain position, the mounting seat 403 and the base 1 are hinged and mounted, the mounting seat 403 can be turned over, after turning over the mounting seat 403, the adhesive placing assembly 3 is rotated, the adhesive placing assembly 3 can high-temperature bond the two pieces of material to be processed, after bonding, the adhesive placing assembly 3 is turned over, and the next process is processed.

[0031] The beneficial effect is that the present application can improve the efficiency of wafer module processing, and the structure can realize preliminary pressing of the material to be processed through the side pressing block 2, and then pressing through the pressing power device 4, so that the pressing effect is better, and the pressing power device 4, the side pressing block 2 and the adhesive placing assembly 3 are hinged and mounted on the base 1, so that when not in use, the pressing power device 4 and the side pressing block 2 are turned over to one side of the conveying device, without affecting the processing, the structure is compact and reasonable, and convenient to use.

[0032] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer module packaging connector, characterized in that: The utility model relates to a side pressing block, adhesive placement assembly, pressing power device and pressing knife assembly are installed on the base, and the adhesive placement assembly can be rotatable installation on the base, and the pressing power device is hinged installation on the base, and the side pressing block is two, two side pressing blocks rotatable installation on the base, and the pressing knife assembly rotatable installation on the pressing power device.

2. The wafer module package dock of claim 1, wherein: The adhesive placement assembly includes a connecting frame and an adhesive disc sleeve assembly, the connecting frame is installed on the base, and the adhesive disc sleeve assembly is installed on the connecting frame.

3. The wafer module package dock of claim 2, wherein: The adhesive disc sleeve assembly includes an adhesive disc sleeve and a locking piece, the adhesive disc sleeve is installed on the connecting frame through a fixing piece, and one end of the locking piece is hingedly installed on the adhesive disc sleeve.

4. The wafer module package dock of claim 3, wherein: The other end of the locking piece is provided with a plug, the adhesive disc sleeve is provided with a socket, and the plug and the socket are matched.

5. The wafer module package dock of any of claims 1-4, wherein: The pressing power device includes a power source and a mounting seat, and the power source is installed on the mounting seat.

6. The wafer module package dock of claim 5, wherein: The pressing knife assembly includes a pressing knife plate, a pressing knife and a connecting piece, the pressing knife is installed on the pressing knife plate through the connecting piece, the pressing knife plate is rotatably installed on the mounting seat, the mounting seat is provided with a notch, and the pressing knife and the notch are matched.

7. The wafer module package dock of claim 6, wherein: The cross section of the pressing knife is T-shaped.

8. The wafer module package dock of claim 7, wherein: A button is further included for controlling the start of the power source.

9. The wafer module package dock of claim 8, wherein: The power source is a pneumatic cylinder or an electric motor.

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