Multiple stroke mechanism, transmission device and semiconductor equipment

Abstract

The utility model discloses a double-stroke mechanism, a transmission device and semiconductor equipment, and belongs to the technical field of mechanical transmission. The double-stroke mechanism comprises a driving mechanism and a connecting piece, wherein the connecting piece is in driving connection with the driving mechanism; the mounting plate is connected with the connecting piece; the bearing piece is connected with the mounting plate through a sliding rail; the transmission assembly is connected with the mounting plate and the bearing piece, and the transmission assembly is configured to be capable of driving the bearing piece to do reciprocating motion under driving of the mounting plate. The connecting piece is driven by the driving mechanism to drive the mounting plate to reciprocate, and the mounting plate drives the transmission assembly to rotate, so that the bearing piece and the mounting plate are driven to synchronously move forwards, and the movement distance is the sum of the movement distance of the mounting plate and the movement distance of the bearing piece. The double-stroke mechanism is simple in structure and small in occupied area, long-distance transportation of wafers can be achieved, the size and the weight of the mechanism are reduced, and the production cost is saved. The mounting plate is of a multi-layer structure, and the stability of the double-stroke mechanism can be enhanced.

Description

Technical Field

[0001] This utility model relates to a double-stroke mechanism, a transmission device, and a semiconductor equipment, belonging to the field of mechanical transmission technology. Background Technology

[0002] In semiconductor manufacturing, wafer transport is a crucial step, involving the transfer of wafers from one process step to the next, ensuring the stability and efficiency of the production line. Wafers need to be moved from one workstation to another, and this transport and transfer process sometimes requires long-distance transport.

[0003] Currently, most wafer transfer mechanisms on the market are modular products, such as robotic arms and precision motion platforms, used to receive wafers and transport them to different workstations. While robotic arms can achieve high-precision positioning and transfer of wafers, these modular products have complex structures, occupy a large area, are difficult to deploy, and are expensive, increasing production line costs. Furthermore, the control systems and sensor technologies of robotic arms are relatively complex, requiring specialized technicians for programming and maintenance. Especially when malfunctions occur, the diagnostic and repair processes are lengthy, further increasing production costs. In addition, the transfer distance of existing wafer transfer mechanisms is limited by the motor stroke; achieving long-distance transfer often requires larger motor power and more complex mechanisms, impacting the layout and configuration of other modules within the wafer chute. Utility Model Content

[0004] This utility model provides a double-stroke mechanism, a transmission device, and a semiconductor device to solve the problems of complex structure, difficult maintenance, large footprint, difficult layout, high price, and the need for greater motor power and mechanisms for long-distance transportation of robotic arms.

[0005] This utility model is achieved through the following technical solution:

[0006] In a first aspect, this utility model provides a double-stroke mechanism, comprising:

[0007] A drive mechanism and a connector, the connector being configured to reciprocate under the drive of the drive mechanism;

[0008] The mounting plate is connected to the connector.

[0009] A slide rail and a receiving component, wherein the receiving component is connected to the mounting plate via the slide rail;

[0010] A transmission assembly is connected to both the mounting plate and the receiving member, and the transmission assembly is configured to drive the receiving member to reciprocate under the influence of the mounting plate.

[0011] In one embodiment of this utility model, the mounting plate includes a bottom plate and a middle plate, the middle plate is connected to the bottom plate via the slide rail, and the receiving member is connected to the middle plate via the slide rail.

[0012] In one embodiment of this utility model, the transmission assembly includes a synchronous pulley and a synchronous belt;

[0013] The synchronous pulleys are located at both ends of the middle layer plate and are rotatably connected to the middle layer plate;

[0014] The timing belt is fitted over the outside of the timing pulley and abuts against the timing pulley.

[0015] In one embodiment of the present invention, the transmission assembly further includes a drive block, which is distributed on both sides of the synchronous belt and abuts against the synchronous belt. The drive block is connected to the receiving member and the bottom plate respectively.

[0016] In one embodiment of this utility model, the transmission assembly includes a rack mounting block and a rack;

[0017] The rack mounting block is mounted on the bottom plate, and the rack is connected to both the rack mounting block and the receiving member.

[0018] In one embodiment of this utility model, the transmission assembly further includes a gear and a transmission shaft; the gear meshes with the rack, the gear is mounted at both ends of the middle layer plate, and the gear is rotatably connected to the middle layer plate through the transmission shaft.

[0019] In one embodiment of this utility model, the driving mechanism is an ultrasonic piezoelectric ceramic motor, and the connecting member is a friction strip. This ultrasonic piezoelectric ceramic motor features vacuum compatibility, high precision, near-infinite stroke, a compact structure, and ease of mechanical integration. Furthermore, the motor is small in size, highly precise, and can be used in a vacuum environment. Motion can be transmitted simply by contacting the friction strip, and only one motor is needed to achieve movement in two directions, reducing the size and weight of the mechanism.

[0020] In one embodiment of this utility model, the receiving component has a fork-shaped structure with an arc-shaped recess in the middle. It is used to receive wafers.

[0021] Secondly, this utility model provides a transmission device, including the aforementioned double-stroke mechanism. This transmission device has a simple structure, occupies a small area, is easy to arrange, enables long-distance transportation, and saves production costs.

[0022] Thirdly, this utility model provides a semiconductor device, including the aforementioned transmission device. The stroke doubling mechanism further includes a mounting base, which is connected to the underlying plate. The stroke doubling mechanism or the transmission device is connected to the semiconductor device through the mounting base.

[0023] Beneficial effects

[0024] 1. The double-stroke mechanism provided by this utility model drives the connecting component through a drive mechanism to cause the mounting plate to reciprocate along the slide rail direction. The mounting plate drives the transmission component to rotate, thereby causing the receiving component to move forward synchronously with the mounting plate. This double-stroke mechanism achieves a travel distance equal to the sum of the travel distances of the mounting plate and the receiving component, thus enabling long-distance wafer transport. Furthermore, by applying different voltages to the drive mechanism, it can be made to rotate forward or backward, thereby causing the mounting plate and receiving component to move in different directions. This double-stroke structure is simple, occupies a small area, and achieves a travel distance twice that of the drive mechanism, enabling long-distance wafer transport and saving production costs.

[0025] 2. This double-stroke mechanism uses an ultrasonic piezoelectric ceramic motor. This motor is small in size, has high precision, and can be used in a vacuum environment. It can transmit motion simply by contacting the friction strip. Theoretically, it has an infinite stroke. It is arranged in the center of the base plate. Only one motor is needed to achieve movement in two directions, which reduces the size and weight of the mechanism.

[0026] 3. The double stroke mechanism forms a multi-layer structure by setting a bottom plate, a middle plate and a supporting component. Compared with the direct extension form, the multi-layer structure can enhance the stability of the double stroke mechanism. Attached Figure Description

[0027] Figure 1 A top view of a double-stroke mechanism according to an embodiment of the present invention.

[0028] Figure 2 Left view of a double-stroke mechanism according to an embodiment of the present invention.

[0029] Figure 3 A top view of the extended state of a double-stroke mechanism according to an embodiment of this utility model.

[0030] Figure 4 This is a top view of a double-stroke mechanism, which is another embodiment of the present invention.

[0031] Figure 5 The left view of a stroke-doubling mechanism, which is another embodiment of the present invention.

[0032] Figure 6 This is a top view of the extended state of the double-stroke mechanism, which is another embodiment of the present invention.

[0033] Figure 7 A top view of a double-stroke mechanism, which is another embodiment of the present invention.

[0034] In the diagram: 1. Drive mechanism; 2. Connector; 3. Transmission assembly; 31. Synchronous pulley; 32. Synchronous belt; 33. Drive block; 34. Rack mounting block; 35. Rack; 36. Gear; 37. Drive shaft; 4. Slide rail; 5. Mounting plate; 51. Bottom plate; 52. Middle plate; 6. Receiving component; 7. Mounting base; 100. Multi-stroke mechanism. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] like Figures 1 to 6As shown, this application provides a stroke doubling mechanism 100, which achieves a doubling effect of the output stroke relative to the input stroke through specific mechanical design and transmission principles. Installed in semiconductor equipment, it is used for transporting and transferring wafers, enabling long-distance transport. The stroke doubling mechanism 100 includes a drive mechanism 1, a connector 2, a transmission assembly 3, a slide rail 4, a mounting plate 5, and a receiving member 6. The drive mechanism 1 is connected to the connector 2, providing a power source for the entire stroke doubling mechanism 100. The connector 2 transmits the torque output by the drive mechanism 1. Multiple mounting plates 5 are connected to each other via slide rails 4. The transmission assembly 3 is mounted on the mounting plate 5, and the receiving member 6 is also mounted on the mounting plate 5, connected to the mounting plate 5 via slide rails 4. Simultaneously, the receiving member 6 is connected to the transmission assembly 3, which drives the receiving member 6 to move. The receiving member 6 is used to place the wafer. The drive mechanism 1 transmits torque through the connector 2, causing the mounting plate 5 to slide on the slide rail 4. The connector 2 transmits the torque output by the drive mechanism 1 to the mounting plate 5, which in turn transmits the torque to the transmission assembly 3, causing the transmission assembly 3 to move. The transmission assembly 3 then drives the receiving component 6 to slide along the slide rail 4 on the mounting plate 5, making the transport distance the sum of the distance the mounting plate 5 moves and the distance the receiving component 6 moves, thus achieving long-distance wafer transport. This double-stroke mechanism 100 has a simple structure, occupies a small area, and requires only one drive mechanism to achieve long-distance wafer transport, saving production costs.

[0039] Specifically, such as Figures 1 to 3 As shown, in this embodiment, there are at least two mounting plates 5. Each mounting plate 5 includes a bottom plate 51 and a middle plate 52. The bottom plate 51 remains fixed. A slide rail 4 is provided on one side of the bottom plate 51. The middle plate 52 is mounted on the side of the slide rail 4 away from the bottom plate 51. The middle plate 52 is connected to the bottom plate 51 via the slide rail 4 and can slide relative to the bottom plate 51. A drive mechanism 1 is mounted on the bottom plate 51. Preferably, the drive mechanism 1 is mounted in the middle position of the bottom plate 51 to facilitate control of the movement of the stroke-doubling mechanism 100, enabling movement in two directions. A connecting member 2 is connected to one side of the drive mechanism 1. The side of the connecting member 2 away from the drive mechanism 1 is connected to the middle plate 52. Specifically, in this embodiment, the connecting member 2 is a friction strip. By applying voltages in different directions to the drive mechanism 1, the drive mechanism 1 can drive the connecting member 2 to achieve linear motion in different directions, thereby driving the middle plate 52 to perform reciprocating linear motion. The support member 6 is mounted on the middle layer plate 52, and the two are connected by a slide rail 4, allowing the support member 6 and the middle layer plate 52 to slide relative to each other. This double-stroke mechanism 100 is divided into three layers: the bottom plate 51, the middle layer plate 52, and the support member 6. Compared with the direct extension form, this multi-layer structure enhances the stability of the support.

[0040] Furthermore, in this embodiment, the transmission assembly 3 is mounted on the mounting plate 5. The transmission assembly 3 includes synchronous pulleys 31, synchronous belts 32, and drive blocks 33. There are two synchronous pulleys 31, located at both ends of the middle layer plate 52. The synchronous pulleys 31 are mounted on the middle layer plate 52, and a bearing is provided between them. The synchronous pulleys 31 and the middle layer plate 52 are rotatably connected through the bearing. The synchronous belt 32 is sleeved on the outside of the synchronous pulleys 31 and abuts against them, allowing the synchronous belt 32 and the synchronous pulleys 31 to rotate simultaneously. There are two drive blocks 33, respectively mounted on the receiving member 6 and the bottom plate 51, used to drive the receiving member 6 to slide. The drive blocks 33 are located on both sides of the synchronous belt 32 and abut against it. When the synchronous belt 32 rotates, the friction force drives the drive blocks 33 to move, thereby driving the receiving member 6 to move.

[0041] In this embodiment, the drive mechanism 1 rotates, causing the connecting member 2 to move. The connecting member 2 is fixedly connected to the middle layer plate 52, thereby driving the middle layer plate 52 to move forward along the slide rail 4. Since the bottom layer plate 51 is fixed, the drive block 33 mounted on the bottom layer plate 51 generates friction with the synchronous belt 32, thereby driving the synchronous belt 32 to rotate. The synchronous belt 32 moves at the same linear speed, driving the synchronous pulley 31 to rotate. The synchronous belt 32 generates friction with the drive block 33 mounted on the receiving member 6, thereby driving the receiving member 6 to move forward at the same speed, ultimately achieving a stroke twice that of the drive mechanism.

[0042] like Figures 4 to 6 As shown, in another embodiment, this application provides a stroke doubling mechanism 100, which includes a drive mechanism 1, a connector 2, a transmission assembly 3, a slide rail 4, a mounting plate 5, and a receiving member 6. The drive mechanism 1 is connected to the connector 2. Multiple mounting plates 5 are connected to each other via the slide rail 4. The transmission assembly 3 is mounted on the mounting plate 5, and the receiving member 6 is also mounted on the mounting plate 5, connected to the mounting plate 5 via the slide rail 4. Simultaneously, the receiving member 6 is connected to the transmission assembly 3, which drives the receiving member 6 to move. The drive mechanism 1 transmits torque through the connector 2, causing the mounting plate 5 to slide on the slide rail 4. The connector 2 transmits the torque output by the drive mechanism 1 to the mounting plate 5, which in turn transmits the torque to the transmission assembly 3, causing the transmission assembly 3 to move. The transmission assembly 3 then drives the receiving member 6 to slide along the slide rail 4 on the mounting plate 5, making the transport distance the sum of the distance the mounting plate 5 moves and the distance the receiving member 6 moves, thereby achieving long-distance wafer transport.

[0043] Specifically, in this embodiment, the mounting plate 5 includes a bottom plate 51 and a middle plate 52. The bottom plate 51 remains fixed, and a slide rail 4 is provided on one side of the bottom plate 51. The middle plate 52 is mounted on the side of the slide rail 4 away from the bottom plate 51. The middle plate 52 is connected to the bottom plate 51 through the slide rail 4 and can slide relative to the bottom plate 51. The drive mechanism 1 is mounted on the bottom plate 51. Preferably, the drive mechanism 1 is mounted in the middle position of the bottom plate 51 to facilitate control of the movement of the stroke doubling mechanism 100, enabling movement in two directions. A connecting member 2 is connected to one side of the drive mechanism 1. The side of the connecting member 2 away from the drive mechanism 1 is connected to the middle plate 52. Specifically, in this embodiment, the connecting member 2 is a friction strip. The drive shaft of the drive mechanism 1 abuts against the friction strip. By applying voltages in different directions to the drive mechanism 1, the drive mechanism 1 can drive the connecting member 2 to achieve linear movement in different directions, thereby driving the middle plate 52 to perform reciprocating linear movement together. The support member 6 is mounted on the middle layer plate 52, and the two are connected by a slide rail 4, allowing the support member 6 and the middle layer plate 52 to slide relative to each other. This double-stroke mechanism 100 is divided into three layers: the bottom plate 51, the middle layer plate 52, and the support member 6. Compared with the direct extension form, this multi-layer structure enhances the stability of the support.

[0044] Furthermore, in this embodiment, the transmission assembly 3 is mounted on the mounting plate 5. The transmission assembly 3 includes a rack mounting block 34, a rack 35, a gear 36, and a transmission shaft 37. The rack mounting block 34 is mounted on the bottom plate 51. There are two racks 35, one mounted on the rack mounting block 34 and the other mounted on the side of the receiving member 6 near the middle plate 52. The middle plate 52 has bearing mounting holes, and the bearings are mounted in the bearing mounting holes. The transmission shaft 37 is located in the middle of the bearings, and the end of the transmission shaft 37 is connected to the gear 36. The gear 36 meshes with the two racks 35 respectively.

[0045] In this embodiment, the drive shaft of the drive mechanism 1 drives the connecting member 2 to move, and drives the middle plate 52 to move forward along the slide rail 4. Since the bottom plate 51 is fixed, the rack mounting block 34 and the rack mounted on the rack mounting block 34 also remain stationary. The middle plate 52 slides forward, driving the gear 36 to rotate, causing the rack 35 mounted on the receiving member 6 to move, thereby driving the receiving member 6 to move forward synchronously along the slide rail 4. The movement distance of the middle plate 52 plus the movement distance of the receiving member 6 makes the stroke of the double stroke mechanism 100 reach twice the stroke of the drive mechanism.

[0046] Optionally, if the drive mechanism 1 is connected to a reverse voltage, the middle plate 52 can move in the opposite direction, and the receiving part 6 can be extended twice the distance in the opposite direction through the transmission component 3, thus achieving the longest travel distance with the simplest and shortest structure.

[0047] Preferably, the drive mechanism 1 in this invention employs an ultrasonic piezoelectric ceramic motor. The working principle of this ultrasonic piezoelectric ceramic motor is to apply voltage to the piezoelectric ceramic material, causing it to vibrate at high frequency, thereby driving the linear motion of the mover. This ultrasonic piezoelectric ceramic motor features vacuum compatibility, high precision, near-infinite stroke, a compact structure, and convenient mechanical integration. Furthermore, the motor is small in size, highly precise, and can be used in vacuum environments. Motion can be transmitted simply by contacting the friction strip, and only one motor is needed to achieve movement in two directions, reducing the size and weight of the mechanism.

[0048] Optionally, the connector 2 is a friction strip. The drive mechanism 1 and the connector 2 drive the middle plate 52 to move through friction. The material of the connector 2 is generally aluminum alloy, which is lightweight, corrosion resistant, strong, and easy to process.

[0049] like Figure 7 As shown, in another embodiment, this application also provides a stroke doubling mechanism 100. The drive mechanism 1 of the stroke doubling mechanism 100 is an electric cylinder slide or other driver, which converts rotary motion into linear motion through a gear rack or other structure. Since the slide can only move to one side, two motors need to be installed in this embodiment. The stroke doubling mechanism 100 has two middle plate 52 and two receiving members 6, which can move to both sides under the drive of the drive mechanism 1. The transmission assembly 3 includes a rack mounting block 34, racks 35, gears 36 and a transmission shaft 37. The rack mounting block 34 is installed on the bottom plate 51. There are four racks 35. Two racks 35 are installed at both ends of the rack mounting block 34, and the other two are installed on the side of the two receiving members 6 near the middle plate 52. The middle plate 52 has bearing mounting holes. The bearings are installed in the bearing mounting holes. The transmission shaft 37 is arranged in the middle of the bearing. The end of the transmission shaft 37 is connected to the gear 36. The gear 36 meshes with the two racks 35 respectively.

[0050] In this embodiment, the two drive mechanisms 1 are electric cylinder slides, which are connected to the middle layer plate 52. The electric cylinder slides drive the two middle layer plates 52 to move to both sides respectively. Since the bottom plate 51 is fixed, the rack mounting block 34 and the racks 35 mounted on both ends of the rack mounting block 34 also remain stationary. The middle layer plate 52 slides forward, driving the gears 36 on both sides to rotate, causing the racks 35 mounted on the receiving member 6 to move, thereby driving the receiving member 6 and the middle layer plate 52 to move forward synchronously along the slide rail 4. The two receiving members 6 move towards each other or relative to each other. The distance of their movement is the distance of movement of the two middle layer plates 52 plus the distance of movement of the two receiving members 6, so that the double stroke mechanism 100 can realize long-distance transmission.

[0051] Optionally, the receiving component 6 has a fork-shaped structure with a circular arc-shaped recess in the middle for receiving the wafer, and a transmission component 3 is installed on the bottom side, which can be a synchronous belt drive block structure or a gear and rack structure.

[0052] Furthermore, this utility model also provides a transmission device, which includes the aforementioned stroke-doubling mechanism 100. In some embodiments, the transmission device further includes a drive mechanism 1 and a transmission assembly 3. A connecting member 2 is connected to the drive mechanism 1 and transmits the torque output by the drive mechanism 1 to the mounting plate 5. The transmission assembly 3 is mounted on the mounting plate 5, and a receiving member 6 is connected to the mounting plate 5 via a slide rail 4. One side of the receiving member 6 is connected to the transmission assembly 3. When the drive mechanism 1 drives the mounting plate 5 forward via the connecting member 2, the transmission assembly 3 simultaneously drives the receiving member 6 to move forward along the slide rail 4, together with the mounting plate 5. This makes the transportation distance the sum of the distance the mounting plate 5 moves and the distance the receiving member 6 moves, thereby achieving long-distance transportation of wafers. This transmission device has a simple structure, occupies a small area, is easy to arrange, and only requires one motor to achieve long-distance transportation, saving production costs.

[0053] Furthermore, this utility model also provides a semiconductor device, which includes the aforementioned stroke doubling mechanism 100 and a transport device. In some embodiments, the stroke doubling mechanism 100 further includes a mounting base 7, which is installed on the side of the bottom plate 51 opposite to the middle plate 52, providing support for the stroke doubling mechanism 100. During the use of the stroke doubling mechanism 100, the mounting base 7 and the bottom plate 51 remain stationary. The drive mechanism 1 drives the middle plate 52 to move forward along the slide rail 4 on the bottom plate 51 via the connector 2, and synchronously drives the receiving member 6 to move forward along the slide rail 4 on the middle plate 52 via the transmission assembly 3. Ultimately, the travel distance is twice the travel distance of the drive mechanism, achieving long-distance wafer transport.

[0054] Mounting base 7 is provided with multiple mounting holes. Mounting base 7 can not only connect the double stroke mechanism 100 to the semiconductor device so that the mechanism can be used in the semiconductor device, but also install the double stroke mechanism 100 on other devices through the mounting holes.

[0055] In summary, the stroke-doubling mechanism, transmission device, and semiconductor equipment provided in this application solve the problems of complex structure, difficult maintenance, large footprint, difficult layout, high price, and the need for greater motor power and mechanisms for long-distance transportation in existing technologies. Furthermore, the drive mechanism uses an ultrasonic piezoelectric ceramic motor, which is small in size, high in precision, and can be used in a vacuum environment. It only needs to contact the friction strip to transmit motion, theoretically having an infinite stroke. Arranged in the center of the base plate, only one motor is needed to achieve movement in two directions, reducing the size and weight of the mechanism. By combining the stroke-doubling mechanism with the forward and reverse rotation of the ultrasonic piezoelectric ceramic motor, the stroke is maximized within a limited space. Moreover, the stroke-doubling mechanism is divided into three layers; compared to a direct extension form, the multi-layer structure enhances the stability of the support.

[0056] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

[0058] This document uses specific embodiments to illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A double-stroke mechanism, characterized in that, include: Drive mechanism (1); Connector (2) is driven to the drive mechanism (1); Mounting plate (5) is connected to the connector (2); The receiving part (6) is connected to the mounting plate (5) via a slide rail (4); Transmission assembly (3), which is connected to the mounting plate (5) and the receiving member (6) respectively; The mounting plate (5) includes a bottom plate (51) and a middle plate (52). The middle plate (52) is connected to the bottom plate (51) via the slide rail (4). The receiving member (6) is connected to the middle plate (52) via the slide rail (4). The transmission assembly (3) includes a synchronous pulley (31) and a synchronous belt (32); the synchronous pulley (31) is located at both ends of the middle layer plate (52) and is rotatably connected to the middle layer plate (52); the synchronous belt (32) is sleeved on the outside of the synchronous pulley (31) and abuts against the synchronous pulley (31); the transmission assembly (3) also includes a drive block (33), the drive block (33) is distributed on both sides of the synchronous belt (32) and abuts against the synchronous belt (32), and the drive block (33) is connected to the receiving member (6) and the bottom plate (51) respectively; Alternatively, the transmission assembly (3) may include a rack mounting block (34) and a rack (35); the rack mounting block (34) is mounted on the bottom plate (51), and the rack (35) is connected to the rack mounting block (34) and the receiving member (6) respectively; the transmission assembly (3) may also include a gear (36) and a transmission shaft (37); the gear (36) meshes with the rack (35), the gear (36) is mounted at both ends of the middle plate (52), and the gear (36) is rotatably connected to the middle plate (52) through the transmission shaft (37).

2. The double-stroke mechanism according to claim 1, characterized in that, The driving mechanism (1) is an ultrasonic piezoelectric ceramic motor, and the connecting piece (2) is a friction strip.

3. The double-stroke mechanism according to claim 1, characterized in that, The receiving component (6) has a fork-shaped structure with an arc-shaped recess in the middle.

4. A transmission device, characterized in that, Includes a double-stroke mechanism as described in any one of claims 1-3.

5. A semiconductor device, characterized in that, The device includes a double-stroke mechanism as described in any one of claims 1-3 or a transmission device as described in claim 4. The double-stroke mechanism (100) further includes a mounting base (7), which is connected to the bottom plate (51). The double-stroke mechanism (100) or the transmission device is connected to the semiconductor device through the mounting base (7).

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