Loading device and semiconductor device

Abstract

A loading device and a semiconductor device, the loading device is used for loading a wafer cartridge, the loading device comprises: a bearing module comprising a bearing table and limiting guardrails arranged at two sides of the bearing table and arranged in parallel, the bearing table being used for bearing the wafer cartridge; and the locking module is used for locking the top of the wafer cartridge, the locking module comprises a locking part, and the locking part is arranged at the top of at least one limiting guardrail. According to the utility model, the locking module is arranged at the top of the limiting guardrail, so that when the wafer cartridge is placed on the bearing platform, the top of the wafer cartridge can be locked through the locking component, and the probability that the wafer cartridge is taken away accidentally is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a loading device and semiconductor equipment. Background Technology

[0002] A load port is used to carry wafer cassettes during semiconductor manufacturing. The load port can transfer wafers from the wafer cassette to the inside of the semiconductor equipment, or transfer wafers from the inside of the semiconductor equipment to the wafer cassette.

[0003] To ensure the wafers are protected during loading, the loading device must not only guarantee the stability of the wafer cassette, but also ensure that the wafers are successfully transferred into the wafer cassette during the transfer process.

[0004] Therefore, there is an urgent need for a more secure wafer loading device. Utility Model Content

[0005] The problem solved by this utility model embodiment is to provide a loading device and a semiconductor device for improving the safety of the loading device.

[0006] To address the aforementioned problems, this utility model provides a loading device for loading wafer cassettes. The loading device includes: a support module comprising a support platform and limiting guardrails arranged side-by-side on both sides of the support platform, the support platform being used to support the wafer cassette; and a locking module for locking the top of the wafer cassette, the locking module including a locking component disposed on the top of at least one of the limiting guardrails.

[0007] Optionally, the locking module further includes: a driving component for driving the locking component to lock the top of the wafer cassette, and for driving the locking component to release the wafer cassette.

[0008] Optionally, the locking component may include a rotatable locking component or a foldable locking component.

[0009] Optionally, the driving component is located on top of the limiting guardrail where the locking component is located.

[0010] Optionally, the drive component includes a cylinder.

[0011] Optionally, the locking component is configured such that it abuts against the top of the wafer cassette when the top of the wafer cassette is locked.

[0012] Optionally, the locking components are respectively disposed on the top of each of the limiting guardrails on both sides of the support platform, and the locking components on different limiting guardrails are symmetrically arranged along the arrangement direction of the limiting guardrails.

[0013] Optionally, the loading device further includes: a sensor for sensing whether the wafer cassette has reached a preset position on the carrier stage; and a locking module for locking the top of the wafer cassette when the sensor detects that the wafer cassette has reached the preset position on the carrier stage.

[0014] Optionally, the loading device further includes a control module for receiving signals from the sensor and controlling the locking module to lock the top of the wafer cassette when the sensor detects that the wafer cassette has reached a preset position on the carrier stage.

[0015] Optionally, the control module is also used to control the locking module to release the wafer cassette after the wafer manufacturing process is completed.

[0016] Optionally, the sensor is mounted on the limit guardrail.

[0017] This utility model embodiment also provides a semiconductor device, including the loading device of any of the foregoing embodiments.

[0018] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0019] The loading device provided in this embodiment of the present invention includes a carrying module and a locking module. The carrying module includes a carrying platform and limiting guardrails arranged side by side on both sides of the carrying platform. The carrying platform is used to carry the wafer cassette. The locking module is used to lock the top of the wafer cassette. The locking module includes a locking component, which is disposed on the top of at least one of the limiting guardrails. In the loading device provided in this embodiment of the present invention, the locking module is used to lock the top of the wafer cassette, reducing the probability of the wafer cassette being accidentally removed, thereby effectively suppressing the occurrence of accidents where wafers fall and break due to the absence of a wafer cassette during loading, and thus improving the safety of the loading device.

[0020] In an optional embodiment, the locking module further includes a driving component, which is used to drive the locking component to lock the top of the wafer cassette and to drive the locking component to release the wafer cassette. The driving component enables automatic locking of the wafer cassette, thereby saving manpower.

[0021] In an optional configuration, the locking components are respectively disposed on the top of each of the limiting guardrails, and the locking components on different limiting guardrails are symmetrically arranged along the arrangement direction of the limiting guardrails, so that the position of the locking components locking the cartridge is evenly distributed, which is beneficial to improving the stability of the locking process.

[0022] In an optional embodiment, the loading device further includes: a sensor for sensing whether the wafer cassette has reached a preset position on the carrier stage; and a locking module for locking the top of the wafer cassette when the sensor detects that the wafer cassette has reached the preset position on the carrier stage. By setting the sensor and cooperating with the locking module, the wafer cassette can be locked in a timely manner when it reaches the preset position on the carrier stage, thereby improving the response speed for locking the wafer cassette.

[0023] Accordingly, this utility model provides a semiconductor device, which includes the loading device described in any embodiment of this utility model. Since the loading device is equipped with a locking module, the locking module is used to lock the top of the wafer cassette, reducing the probability of the wafer cassette being accidentally removed, thereby effectively suppressing the occurrence of accidents where wafers fall and break due to the absence of a wafer cassette during loading, thus improving the operational safety of the semiconductor device. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the loading device according to an embodiment of the present invention with the locking module in a locked state;

[0025] Figure 2 This is a schematic diagram of the loading device according to an embodiment of the present invention, with the locking module in the released state. Detailed Implementation

[0026] As can be seen from the background technology, the safety of current wafer loading devices still needs to be improved.

[0027] Research has revealed that current loading devices lack locking mechanisms, allowing wafer cassettes to be removed from the loading platform at any time. Consequently, during the transport of wafers that have completed manufacturing processes to the wafer cassettes, wafers are prone to falling due to the lack of a cassette to support them, leading to wafer breakage and other accidents. This, in turn, reduces production efficiency and increases production costs.

[0028] To address the aforementioned technical problems, this utility model provides a loading device for loading wafer cassettes. The loading device includes: a support module comprising a support platform and limiting guardrails arranged side-by-side on both sides of the support platform, the support platform being used to support the wafer cassette; and a locking module for locking the top of the wafer cassette, the locking module including a locking component disposed on the top of at least one of the limiting guardrails.

[0029] In the loading device provided by this utility model, the locking module is used to lock the top of the wafer cassette, reducing the probability of the wafer cassette being accidentally removed, thereby effectively suppressing the occurrence of accidents where wafers fall and break due to the absence of a wafer cassette during loading, and thus improving the safety of the loading device.

[0030] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] refer to Figure 1 and Figure 2 , Figure 1 This diagram shows a structural schematic of the loading device according to an embodiment of the present invention with the locking module in a locked state. Figure 1 A schematic diagram of the loading device according to an embodiment of the present invention is shown in the state where the locking module is released.

[0032] In this embodiment, the loading device is used to load wafer cassettes.

[0033] The loading device includes: a carrying module 200, including a carrying platform 50 and limiting guardrails 20 arranged side by side on both sides of the carrying platform 50, the carrying platform 50 being used to carry the wafer cassette 40; and a locking module 100, used to lock the top of the wafer cassette 40, the locking module 100 including a locking component 102, the locking component 102 being disposed on the top of at least one of the limiting guardrails 20.

[0034] The guardrails 20 are provided on both sides of the support platform 50 to laterally limit the side walls of the wafer cassette 40, thereby effectively preventing the wafer cassette 40 from accidentally displacing on the support platform 50.

[0035] In addition, the limiting guardrail 20 is also used to provide an installation position for the locking component 102.

[0036] The locking component 102 of the locking module 100 is disposed on the top of the limiting guardrail 20. The locking module 100 is used to lock the wafer cassette 40 when it is loaded onto the carrier platform 50, thereby increasing the stability of the wafer cassette 40 and effectively reducing the probability that the wafer cassette 40 is accidentally removed during the wafer manufacturing process. This effectively suppresses the occurrence of accidents where wafers fall and break due to the absence of the wafer cassette 40 during loading, thereby improving the safety of the loading device.

[0037] In this embodiment, the locking component 102 is disposed on the top of the limiting guardrail 20, thereby utilizing the space at the top of the limiting guardrail 20, which helps to reduce the structural complexity of the loading device; moreover, it also facilitates locking the top of the wafer cassette 40.

[0038] Specifically, the locking component 102 includes a rotatable locking component or a foldable locking component.

[0039] Taking a rotatable locking component as an example, the locking component 102 is rotated to the top position of the wafer cassette 40, thereby locking the wafer cassette 40. When the locking component 102 is rotated to the position where it is disengaged from the top of the wafer cassette 40, the locking component 102 can release the wafer cassette 40.

[0040] Taking the foldable locking component as an example, when the locking component 102 is in the folded state, the locking component 102 can lock the wafer cassette 40. When the locking component 102 is in the unfolded state, the locking component 102 can release the wafer cassette 40.

[0041] like Figure 1 and Figure 2 As shown, in this embodiment, the locking component 102 is a rotatable locking component.

[0042] In this embodiment, the locking module 100 further includes a driving component 101, which is used to drive the locking component 102 to lock the top of the wafer cassette 40 and to drive the locking component 102 to release the wafer cassette 40.

[0043] The drive component 101 enables automatic locking of the wafer cassette 40, thereby saving manpower.

[0044] In this embodiment, the driving component 101 includes a cylinder. By using a cylinder, it is beneficial to reduce the structural complexity and manufacturing cost of the locking module 100.

[0045] As an example, the locking component 102 is a rotatable locking component, and correspondingly, the cylinder is a rotary cylinder.

[0046] As an example, the bottom of the rotatable locking component is connected to the cylinder, which is connected to an air supply device (not shown in the figure). The air supply device supplies gas (e.g., compressed air) to the cylinder, and the gas drives the push structure inside the cylinder, thereby driving the connection between the rotatable locking component and the cylinder to rotate, and thus driving the rotatable locking component to rotate in the horizontal direction.

[0047] In other embodiments, the driving component may be other types of components, as long as they can drive the locking component to lock and release the wafer cassette. For example, the driving component may be a motor driving component, etc.

[0048] In this embodiment, the locking component 102 is configured such that the locking component 102 is in contact with the top of the wafer cassette 40 when the top of the wafer cassette 40 is locked.

[0049] With the top of the wafer cassette 40 locked, the locking component 102 fits against the top of the wafer cassette 40, thereby increasing the stability of locking the wafer cassette 40, effectively suppressing accidental displacement of the wafer cassette 40, and thus reducing the probability of the wafer falling and breaking due to positional deviation during the transfer of the processed wafer to the wafer cassette 40.

[0050] In other embodiments, the locking member may also have a gap with the top of the wafer cassette while the top of the wafer cassette is locked in place.

[0051] In this embodiment, the driving component 101 is also located on the top of the limiting guardrail 20 where the locking component 102 is located, thereby utilizing the space at the top of the limiting guardrail 20, which helps to reduce the structural complexity of the loading device.

[0052] Specifically, the locking component 102 is disposed on the driving component 101, which helps to reduce the structural complexity of the loading device. In addition, it also facilitates the locking component 102 to fit against the top of the wafer cassette 40 when the top of the wafer cassette 40 is locked.

[0053] like Figure 1 As an example, the rotatable locking component is disposed on the cylinder.

[0054] In other embodiments, the driving component may also be located in other positions, only needing to be able to drive the locking component to lock and release the wafer cassette.

[0055] In this embodiment, the locking components 102 are respectively disposed on the top of each of the limiting guardrails 20 on both sides of the support platform 50, and the locking components 102 on different limiting guardrails 20 are symmetrically arranged along the arrangement direction of the limiting guardrails 20.

[0056] The locking components 102 on the different limiting guardrails 20 are symmetrically arranged along the arrangement direction of the limiting guardrails 20, which helps to make the position of the locking components 102 locking the cartridge 40 evenly distributed, thereby improving the stability of the locking process.

[0057] like Figure 1 As shown, as an example, each limit guardrail 20 is provided with two locking parts 102, and the locking parts 102 on one limit guardrail 20 are symmetrically arranged with the locking parts 102 on the other limit guardrail 20.

[0058] It is understood that the number of locking components 102 on each limit barrier 20 is not limited to two. In other embodiments, the number of locking components on each limit barrier may be other values, or the layout of the locking components may be other types, depending on the actual situation.

[0059] In this embodiment, the loading device further includes a sensor 30 for sensing whether the wafer cassette 40 has reached a preset position on the carrier platform 50. Correspondingly, the locking module 100 is used to lock the top of the wafer cassette 40 when the sensor 30 senses that the wafer cassette 40 has reached the preset position on the carrier platform 50.

[0060] By setting up the sensor 30 and cooperating with the locking module 100, the wafer cassette 40 can be locked in time when it reaches the preset position of the carrier stage 50, thereby improving the response speed of locking the wafer cassette 40.

[0061] As an example, the sensor 30 can be a photodetector, which can detect the obstruction of an object and thus sense that the wafer cassette 40 has reached a preset position on the carrier stage 50.

[0062] In other embodiments, the sensor may be other types of devices, as long as they are capable of sensing whether the wafer cassette has reached the preset position of the carrier stage.

[0063] In this embodiment, the sensor 30 is disposed on the limiting guardrail 20.

[0064] The limiting guardrail 20 is disposed on both sides of the support platform 50, and the support platform 50 is used to support the wafer cassette 40. Therefore, by placing the sensor 30 on the limiting guardrail 20, it is easy to detect the position of the wafer cassette 40.

[0065] like Figure 1 As shown, as an example, the limiting guardrail 20 may include a top guardrail (not shown) and a bottom guardrail (not shown), the top of the top guardrail is the top of the limiting guardrail 20, the bottom guardrail is fixed on the support platform 50, and the sensor 30 is disposed on the bottom guardrail.

[0066] In other embodiments, the sensor can also be located in other positions, as long as it can sense whether the wafer cassette has reached the preset position of the carrier stage. For example, the sensor can be located inside the carrier stage.

[0067] In this embodiment, the loading device further includes a control module 10, which receives the signal from the sensor 30 and controls the locking module 100 to lock the top of the wafer cassette 40 when the sensor 30 senses that the wafer cassette 40 has reached a preset position on the carrier platform 50.

[0068] By controlling the module 10, the status of the wafer cassette 40 can be easily monitored. Once the wafer cassette 40 reaches the preset position of the carrier platform 50, the locking module 100 can be automatically controlled to lock the top of the wafer cassette 40, achieving rapid response and reducing the delay of manual operation.

[0069] Taking the locking component 102 as a rotatable locking component and the driving component 101 as a cylinder as an example, when the wafer cassette 40 reaches the loading position of the loading stage 50, the sensor 30 sends a signal to the control module 10. In response to the signal sent by the sensor 30, the control module 10 controls the air supply device (not shown in the figure) corresponding to the cylinder to supply gas (e.g., compressed air) to the cylinder. The gas drives the cylinder to control the rotatable locking component to rotate and lock the wafer cassette 40.

[0070] In this embodiment, the control module 10 is also used to control the locking module 100 to release the wafer cassette 40 after the wafer manufacturing process is completed.

[0071] Reference Figure 2Taking the locking component 102 as a rotatable locking component and the driving component 101 as a cylinder as an example, after the wafer completes the manufacturing process, the control module 10 responds to the signal indicating that the wafer has completed the manufacturing process and controls the cylinder to reset the rotatable locking component and release the wafer cassette 40, which is beneficial for timely subsequent transfer of the wafer that has completed the manufacturing process.

[0072] Therefore, in this embodiment, by setting the control module 10, the loading device can become a loading device with a self-locking function, which makes the loading device safer, more reliable and faster in response.

[0073] As an example, the control module 10 may include a programmable logic controller (PLC).

[0074] In other embodiments, the control module may also employ other types of controllers, such as a central processing unit (CPU).

[0075] Accordingly, this utility model embodiment also provides a semiconductor device, which includes the loading device described in the foregoing embodiment.

[0076] Because the loading device is equipped with a locking module, which is used to lock the top of the wafer loading cassette, the probability of the wafer cassette being accidentally removed is reduced, thereby effectively suppressing the occurrence of accidents where wafers fall and break due to the absence of a wafer cassette during loading, thus improving the operational safety of the semiconductor equipment.

[0077] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A loading device, characterized in that, For loading wafer cassettes, the loading device includes: The support module includes a support platform and limiting guardrails arranged side by side on both sides of the support platform. The support platform is used to support the wafer cassette. A locking module for securing the top of the wafer cassette, the locking module including a locking component disposed on the top of at least one of the limiting guardrails for securing the top of the wafer cassette.

2. The loading device according to claim 1, characterized in that, The locking module further includes a driving component, which is used to drive the locking component to lock the top of the wafer cassette and to drive the locking component to release the wafer cassette.

3. The loading device according to claim 1, characterized in that, The locking component includes a rotatable locking component or a foldable locking component.

4. The loading device according to claim 2, characterized in that, The driving component is located on top of the limiting guardrail where the locking component is located.

5. The loading device according to claim 2, characterized in that, The drive component includes a cylinder.

6. The loading device according to claim 1, characterized in that, The locking component is configured such that it abuts against the top of the wafer cassette when the top of the wafer cassette is locked.

7. The loading device according to claim 1, characterized in that, The locking components are respectively disposed on the top of each of the limiting guardrails on both sides of the support platform, and the locking components on different limiting guardrails are symmetrically arranged along the arrangement direction of the limiting guardrails.

8. The loading device according to any one of claims 1 to 7, characterized in that, The loading device further includes a sensor for sensing whether the wafer cassette has reached a preset position on the carrier stage; The locking module is used to lock the top of the wafer cassette when the sensor detects that the wafer cassette has reached a preset position on the carrier stage.

9. The loading device according to claim 8, characterized in that, The loading device further includes a control module for receiving signals from the sensor and controlling the locking module to lock the top of the wafer cassette when the sensor detects that the wafer cassette has reached a preset position on the carrier stage.

10. The loading device according to claim 9, characterized in that, The control module is also used to control the locking module to release the wafer cassette after the wafer manufacturing process is completed.

11. The loading device according to claim 8, characterized in that, The sensor is installed on the limit guardrail.

12. A semiconductor device, characterized in that, Includes the loading device as described in any one of claims 1 to 11.

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