Wafer alignment device and semiconductor equipment

Abstract

The utility model discloses a wafer alignment device and semiconductor equipment. The wafer alignment device comprises a chuck; the air blowing module at least comprises an air blowing opening located in the side portion of the chuck, the air blowing opening is located in the back face of the wafer in the state that the chuck bears the wafer, and the air blowing module is used for providing blowing gas for the back face of the wafer; and the wafer fixing module comprises a bracket which is arranged on the chuck and is used for bearing a wafer, and the bracket is provided with a suction cup. When the wafer alignment device works, the chuck and the wafer fixing module are jointly used for stabilizing the wafer, so that the process reliability of the wafer alignment device is improved; and the blowing module blows the back surface of the wafer to remove particles attached to the back surface of the wafer, so that the problem that the production efficiency of equipment is reduced is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and more particularly to a wafer alignment device and semiconductor equipment. Background Technology

[0002] In the semiconductor manufacturing industry, semiconductor equipment with wafer alignment devices is typically used to perform specific processes (such as machining processes or measurement processes). The wafer alignment device is used to align the wafer according to the notch position before performing the process.

[0003] After the wafer is transferred to the chuck of the wafer alignment device, if there are microparticles on the back of the wafer, the wafer may get stuck when it is transferred to the stage in the semiconductor equipment for the process. If there are too many microparticles on the wafer surface, the semiconductor equipment may not be able to automatically retrieve the wafer, and the chamber may have to be opened manually to remove the wafer. Improper operation may also cause accidents such as equipment downtime, wafer contamination, and wafer damage.

[0004] Therefore, how to clean the particles on the wafer surface while performing wafer alignment has become an urgent problem to be solved. Utility Model Content

[0005] The problem solved by this invention is to provide a wafer alignment device and semiconductor equipment for reducing particles adhering to the back of a wafer and improving wafer stability.

[0006] To address the aforementioned problems, this utility model provides a wafer alignment device, comprising: a chuck; an air blowing module, including at least an air blowing port located on the side of the chuck, wherein the air blowing port is located on the back side of the wafer when the chuck is carrying the wafer, and the air blowing module is used to provide purge gas to the back side of the wafer; and a wafer fixing module, including a support disposed on the chuck and used to carry the wafer, wherein a suction cup is disposed on the support.

[0007] Optionally, the wafer alignment device further includes a base; the chuck is disposed on the base; the air blowing module includes: an air blowing port located on the top surface of the base; and an air blowing pipe located inside the base, one end of the air blowing pipe being connected to the air blowing port.

[0008] Optionally, a pressure regulating valve is provided on the air blowing pipe.

[0009] Optionally, the wafer alignment device further includes a purge gas supply device connected to the other end of the purge pipe.

[0010] Optionally, the wafer alignment device further includes: an air intake module, which includes at least an air intake port located on the side of the chuck and facing the side wall of the chuck, wherein the air pressure of the air intake module is greater than the air pressure of the air blowing module.

[0011] Optionally, the chuck includes a wafer support surface, and the chuck is also used to drive the wafer to move up and down in a direction perpendicular to the wafer support surface, and the chuck has a preset lifting height area in the direction perpendicular to the wafer support surface; in the direction perpendicular to the wafer support surface, the air intake of the air intake module at least covers the preset lifting height area.

[0012] Optionally, the wafer alignment device further includes a base; the chuck is disposed on the base; the suction module includes: a suction body structure disposed on the base, the suction body structure having a suction port; and a first suction pipe located inside the base, the first suction pipe being connected to the suction port.

[0013] Optionally, the wafer alignment device further includes: a first vacuum generator; the end of the first suction pipe not connected to the suction port is connected to the first vacuum generator.

[0014] Optionally, the wafer alignment device further includes a detection module located on the side of the chuck for identifying notches on the wafer, wherein the detection module and the suction module are staggered.

[0015] Optionally, the suction cup surface on the bracket has a first vacuum adsorption port; the wafer fixing module further includes: a first air extraction pipe located inside the bracket, the first air extraction pipe being connected to the first vacuum adsorption port.

[0016] Optionally, the chuck includes: a chuck body structure, the surface of which has a second vacuum suction port; and a pipeline device located at the bottom of the chuck body structure and connected to it, the pipeline device including a second suction pipe connected to the second vacuum suction port and a bypass suction pipe connected to the first suction pipe, the bypass suction pipe being independent of the second suction pipe.

[0017] Optionally, a gas connection port is provided on the side wall of the chuck body structure; the bracket is provided on the side wall of the chuck body structure, and the first suction pipe and the bypass suction pipe are connected through the gas connection port; or, a gas connection port is provided on the side wall of the pipeline device; the bracket is provided at the bottom of the chuck body structure, and the first suction pipe and the bypass suction pipe are connected through the gas connection port.

[0018] Optionally, the wafer alignment device further includes: a second vacuum generator; the end of the bypass evacuation pipe not connected to the gas communication port is connected to the second vacuum generator.

[0019] Optionally, the plurality of the supports are distributed at equal angular intervals along the circumference of the chuck.

[0020] Optionally, the number of supports is at least three.

[0021] Optionally, the chuck includes a wafer support surface; on a projection surface parallel to the wafer support surface, the air inlets of the air blowing module are uniformly distributed along the circumference of the chuck.

[0022] Optionally, the chuck includes a wafer-carrying surface; the suction surface of the chuck is at the same horizontal plane as the wafer-carrying surface of the chuck.

[0023] Optionally, the blowing module includes an inert gas purging module or a compressed air purging module.

[0024] Accordingly, this utility model embodiment also provides a semiconductor device, including the wafer alignment device described in any embodiment of this utility model.

[0025] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0026] The wafer alignment device provided in this embodiment includes: a chuck; a blowing module, including at least an air outlet located on the side of the chuck, and with the chuck carrying the wafer, the air outlet located on the back side of the wafer, the blowing module being used to provide purge gas to the back side of the wafer; and a wafer fixing module, including a support disposed on the chuck and used to carry the wafer, the support being provided with a suction cup. In the wafer alignment device provided in this embodiment, the blowing module is used to provide purge gas to the back side of the wafer, which helps to remove particles attached to the back side of the wafer, thereby effectively reducing the probability of wafer jamming after being transferred to subsequent processes due to excessive particles, and correspondingly improving the problem of reduced equipment production efficiency. Moreover, the chuck and the wafer fixing module work together to stabilize the wafer. By adding the wafer fixing module, the impact of the presence of the blowing module on the stability of the wafer is reduced, thereby improving the process reliability of the wafer alignment device.

[0027] In an optional embodiment, the wafer alignment device further includes: an air suction module located on the side of the chuck and facing the side wall of the chuck; the air pressure of the air suction module is greater than that of the air blowing module; the air suction module can collect particles falling off from the back of the wafer; and the greater air pressure of the air suction module than that of the air blowing module is beneficial for timely collection of particles on the wafer surface, thereby effectively suppressing the problem of particle accumulation inside the machine.

[0028] In an optional configuration, multiple supports in the wafer fixing module are distributed at equal angular intervals along the circumference of the chuck, and the suction cups on the supports uniformly adsorb the wafer. This can effectively suppress the occurrence of problems such as accidental displacement and warping of the wafer during the alignment process, increase the stability of the wafer, and thus improve the accuracy of wafer alignment.

[0029] In an optional embodiment, the chuck includes a wafer support surface. The chuck is used to drive the wafer to move up and down in a direction perpendicular to the wafer support surface. The chuck has a preset lifting height area in the direction perpendicular to the wafer support surface. In the direction perpendicular to the wafer support surface, the air intake of the air intake module at least covers the preset lifting height area. This is beneficial to improving the collection of particles on the wafer surface and can also improve the effectiveness of suppressing the accumulation of particles inside the machine.

[0030] Accordingly, this utility model embodiment provides a semiconductor device, which includes the wafer alignment device described in this utility model embodiment. Since the wafer alignment device integrates alignment function and particle cleaning function, it is beneficial to remove particles attached to the back of the wafer, thereby reducing the probability of wafer jamming accidents in the semiconductor device and thus improving the production efficiency of the semiconductor device. Attached Figure Description

[0031] Figure 1 This is a bottom view of the chuck and support in the wafer alignment device of the first embodiment of this utility model;

[0032] Figure 2 yes Figure 1 A schematic diagram of a wafer alignment device at position AB in one embodiment;

[0033] Figure 3 This is a bottom view of the chuck and support in the wafer alignment device according to the second embodiment of this utility model;

[0034] Figure 4 yes Figure 3 A schematic diagram of the structure of a wafer alignment device at position AB in one embodiment. Detailed Implementation

[0035] As the background technology shows, how to clean the particles on the wafer surface while performing wafer alignment has become an urgent problem to be solved.

[0036] To address the aforementioned technical problems, this utility model provides a wafer alignment device, comprising: a chuck; an air blowing module, including at least an air blowing port located on the side of the chuck, wherein the air blowing port is located on the back side of the wafer when the chuck is carrying the wafer, and the air blowing module is used to provide purge gas to the back side of the wafer; and a wafer fixing module, including a support disposed on the chuck and used to carry the wafer, wherein a suction cup is disposed on the support.

[0037] In the wafer alignment device provided in this embodiment of the present invention, the air blowing module is used to provide purge gas to the back of the wafer, which helps to remove particles attached to the back of the wafer. This effectively reduces the probability of wafer jamming after being transferred to subsequent processes due to excessive particles, and can improve the problem of reduced equipment production efficiency. Moreover, the chuck and the wafer fixing module work together to stabilize the wafer. By adding the wafer fixing module, the influence of the air blowing module on the stability of the wafer is reduced, thereby improving the process reliability of the wafer alignment device.

[0038] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] Figure 1 This is a bottom view of the chuck and support in the wafer alignment device according to the first embodiment of this utility model. Figure 2 yes Figure 1 A schematic diagram of the structure of a wafer alignment device at position AB in one embodiment.

[0040] It should be noted that, Figure 1 The outline of the wafer is represented by a dashed line.

[0041] Reference Figure 1 and Figure 2 A wafer alignment device includes: a chuck 100; a blowing module 200, including at least an air outlet 201 located on the side of the chuck 100, and the air outlet 201 located on the back side of the wafer when the chuck 100 carries the wafer, the blowing module 200 being used to provide purge gas to the back side of the wafer; and a wafer fixing module 300, including a support 301 disposed on the chuck 100 and used to carry the wafer, the support 301 being provided with a suction cup 302.

[0042] In the wafer alignment device provided by this utility model, the air blowing module 200 is used to provide purge gas to the back of the wafer, which helps to remove particles attached to the back of the wafer. This effectively reduces the probability of the wafer getting stuck after being transferred to subsequent processes due to excessive particles, and can improve the problem of reduced equipment production efficiency. Moreover, the chuck and the wafer fixing module 300 work together to stabilize the wafer. By adding the wafer fixing module 300, the influence of the air blowing module 200 on the stability of the wafer is reduced, which helps to improve the stability of the wafer. Even during high-speed rotation and lifting, the wafer is less likely to experience accidental displacement, warping, or other problems, thereby improving the process reliability of the wafer alignment device and improving the accuracy of wafer alignment.

[0043] The chuck 100 is used to carry and hold the wafer.

[0044] In this embodiment, the chuck 100 is also used to rotate the wafer during the wafer alignment process. Specifically, the chuck 100 is used to carry the wafer and drive the wafer to rotate in a direction parallel to the wafer support surface 101.

[0045] In this embodiment, the chuck 100 is also used to drive the wafer to move up and down in a direction perpendicular to the wafer support surface 101, and the chuck 100 has a preset lifting height area in the direction perpendicular to the wafer support surface 101.

[0046] In this embodiment, the chuck 100 includes a wafer carrier surface 101, and the chuck 100 carries and adsorbs wafers through the wafer carrier surface 101.

[0047] In this embodiment, the chuck 100 is a vacuum chuck. In other embodiments, the chuck can also adsorb wafers by other means.

[0048] In this embodiment, the wafer alignment device further includes a base 20; a chuck 100 is disposed on the base 20.

[0049] The base 20 serves as a support platform for the wafer alignment device and is also used to install structures such as the chuck 100 and pipes.

[0050] In this embodiment, the air blowing module 200 includes: an air blowing port 201 located on the top surface of the base 20; and an air blowing pipe 202 located inside the base 20, with one end of the air blowing pipe 202 connected to the air blowing port 201 and the other end used to connect to the purging gas supply device 30.

[0051] By providing an air inlet 201 on the top surface of the base 20 and placing the air pipe 202 inside the base 20, the internal space of the base 20 can be utilized, thereby reducing the impact of the air blowing module 200 on other components outside the base 20.

[0052] In other embodiments, a portion of the blowing module may also be located outside the base, as long as it can provide purge gas to the back side of the wafer.

[0053] The blowing module 200 is used to provide purge gas to the back side of the wafer, thereby removing particles attached to the back side of the wafer.

[0054] In this embodiment, the wafer alignment device further includes a purge gas supply device 30, which is connected to the other end of the purge pipe 202.

[0055] The purge gas supply device 30 provides purge gas, which is blown to the back side of the wafer through the purge pipe 202 and the purge port 201 to remove particles attached to the back side of the wafer.

[0056] In this embodiment, a pressure regulating valve (not shown in the figure) is provided on the blowing pipe 202 to control the gas supply pressure of the blowing gas supply device 30. This helps to reduce the probability of wafer damage caused by excessive blowing gas pressure and also helps to reduce the probability of poor particle removal effect caused by insufficient blowing gas pressure.

[0057] Specifically, the blowing module 200 includes an inert gas purging module or a compressed air purging module, wherein the purging gas is either an inert gas or compressed air, thereby effectively suppressing the reaction between the purging gas and the wafer surface material.

[0058] Taking an inert gas purging module as an example, the purging module 200 is a nitrogen purging module. Correspondingly, the purging gas supply device 30 can be a nitrogen supply device, and the purging gas is nitrogen.

[0059] In other embodiments, the blowing module 200 is an air purging module. Accordingly, the purging gas supply device is a compressed air supply device, and the purging gas is compressed air.

[0060] In other embodiments, the purging module 200 is an inert gas purging module, such as helium. Accordingly, the purging gas supply device is a helium supply device, and the purging gas is helium.

[0061] In this embodiment, the wafer alignment device further includes an air intake module 400, which includes at least an air intake port 402 located on the side of the chuck 100 and facing the side wall of the chuck 100, and the air pressure of the air intake module 400 is greater than the air pressure of the air blowing module 200.

[0062] The blowing module 200 is used to remove particles attached to the back of the wafer by providing purge gas to the back of the wafer, while the suction module 400 can collect particles that fall off from the back of the wafer. Moreover, the air pressure of the suction module 400 is greater than that of the blowing module 200, which is beneficial for timely collection of particles on the wafer surface, thereby effectively suppressing the problem of particle accumulation inside the machine.

[0063] In this embodiment, the air intake module 400 includes: an air intake body structure 401 disposed on the base 20, the air intake body structure 401 having an air intake port 402; and a first air intake pipe 403 located inside the base 20, the first air intake pipe 403 being connected to the air intake port 402.

[0064] The suction module 400 includes a first suction pipe 403, which allows particles falling off from the back of the wafer to be discharged in a timely manner through the first suction pipe 403.

[0065] In this embodiment, the wafer alignment device further includes: a first vacuum generator 40; the end of the first suction pipe 403 that is not connected to the suction port 402 is connected to the first vacuum generator 40.

[0066] In this embodiment, the air pressure of the suction module 400 is greater than that of the blowing module 200. The first vacuum generator 40 extracts air from the chamber where the wafer alignment device is located, thereby creating a negative pressure in the area of ​​the suction port 402 and a pressure difference in the area near the wafer surface. The particles blown off by the blowing module 200 are collected into the first suction pipe 403 by the pressure.

[0067] As an example, the first vacuum generator 40 can be a first vacuum pump.

[0068] In this embodiment, the chuck 100 has a preset lifting height area (not shown) in a direction perpendicular to the wafer support surface 101. Correspondingly, in a direction perpendicular to the wafer support surface 101, the air intake 402 of the air intake module 400 at least covers the preset lifting height area.

[0069] The air intake 402 at least covers the preset lifting height area of ​​the chuck 100, reducing the possibility that particles may exceed the negative pressure influence area formed by the air intake 402 after being blown by the air blowing module 200, thereby improving the effect of collecting particles on the wafer surface and enhancing the effectiveness of suppressing the accumulation of particles inside the machine.

[0070] In this embodiment, the wafer alignment device further includes a detection module 50 located on the side of the chuck 100 for identifying notches on the wafer. The detection module 50 and the suction module 400 are staggered.

[0071] The detection module 50 is used to identify the notch in the wafer, thereby aligning the wafer through the notch. For example, the chuck 100 picks up the wafer and rotates it. When the detection module 50 receives a signal generated by the notch in the wafer, the chuck 100 stops moving, thus aligning the wafer.

[0072] The detection module 50 is located on the side of the chuck 100. Therefore, the detection module 50 and the suction module 400 are staggered to avoid the suction module 400 blocking the wafer during the detection module 50's detection of the wafer's notch.

[0073] It should be noted that, in other embodiments, the detection module and the suction module may also satisfy other positional relationships depending on the positional relationship between the detection module and the chuck.

[0074] It should be noted that, as Figure 1 As shown, the area of ​​the wafer is usually larger than the area of ​​the chuck 100. Therefore, in this embodiment, the wafer fixing module 300 includes a support 301, and the portion of the wafer exposed in the chuck 100 is fixed by a suction cup 302 on the support 301.

[0075] In this embodiment, the suction cup 302 of the support 301 is a vacuum suction cup. Therefore, the surface of the suction cup 302 on the support 301 has a first vacuum adsorption port 303. The wafer fixing module 300 further includes a first air extraction pipe 304, which is located inside the support 301 and is connected to the first vacuum adsorption port 303.

[0076] In this embodiment, the chuck 100 includes: a chuck body structure 102, the surface of which has a second vacuum suction port 103; and a pipeline device 104, located at the bottom of the chuck body structure 102 and connected to it. The pipeline device 104 includes a second suction pipe 105 connected to the second vacuum suction port 103 and a bypass suction pipe 106 connected to the first suction pipe 304. The bypass suction pipe 106 and the second suction pipe 105 are independent of each other.

[0077] The chuck 100 has a bypass evacuation pipe 106 in its piping device 104, which reduces the space occupied by the pipes connected to the wafer fixing module 300 on the wafer alignment device, thereby reducing the impact on the layout of other components of the wafer alignment device.

[0078] Furthermore, the bypass venting pipe 106 is independent of the second venting pipe 105, thereby reducing or avoiding the impact of the bypass venting pipe 106 on the working performance of the chuck body structure 102.

[0079] In this embodiment, a gas communication port 110 is provided on the side wall of the chuck body structure 102; correspondingly, the bracket 301 is provided on the side wall of the chuck body structure 102, and the first air extraction pipe 304 and the bypass air extraction pipe 106 are connected through the gas communication port 110.

[0080] The bracket 301 is disposed on the side wall of the chuck body structure 102, which makes it easy to reduce the height difference between the adsorption surface of the suction cup and the wafer bearing surface of the chuck 100.

[0081] In other embodiments, the bracket may also be disposed at the bottom of the chuck body structure.

[0082] In this embodiment, the wafer alignment device includes: a second vacuum generator 60; one end of the bypass evacuation pipe 106 that is not connected to the gas communication port 110 is connected to the second vacuum generator 60.

[0083] In this embodiment, the second vacuum generator 60 draws air through the first air extraction pipe 304 and the bypass air extraction pipe 106 to draw air near the first vacuum adsorption port 303, forming a negative pressure at the first vacuum adsorption port 303 to provide suction to the wafer.

[0084] In this embodiment, the second vacuum generator 60 is also connected to the end of the second air extraction pipe 105 that is not connected to the second vacuum adsorption port 103.

[0085] The second vacuum generator 60 draws air from the vicinity of the second vacuum adsorption port 103 through the second air extraction pipe 105, forming a negative pressure at the second vacuum adsorption port 103, and providing suction to the wafer located on the wafer support surface 101.

[0086] As an example, the second vacuum generator 60 can be a second vacuum pump.

[0087] In this embodiment, a plurality of the brackets 301 are distributed at equal angular intervals along the circumference of the chuck 100.

[0088] The multiple supports 301 are distributed at equal angular intervals along the circumference of the chuck 100, which helps to ensure that the suction cups 302 on the supports 301 can uniformly adsorb the wafer. This can effectively suppress the occurrence of problems such as accidental displacement and warping of the wafer during the alignment process, increase the stability of the wafer, and thus improve the accuracy of wafer alignment.

[0089] like Figure 1 As shown, as an example, the number of supports 301 is at least three. Three supports 301 can improve the stability of the wafer and also facilitate the blowing module 200 to provide purge gas to the back of the wafer.

[0090] In this embodiment, on a projection surface parallel to the wafer support surface 101, the air blowing ports 201 of the air blowing module 200 are uniformly distributed along the circumference of the chuck 100.

[0091] The air inlets 201 are evenly distributed along the circumference of the chuck 100, which helps to evenly blow the purging gas onto the back side of the wafer. This increases the purging range of the purging gas on the back side of the wafer when the wafer rotates, effectively improving the removal efficiency of particles on the wafer surface.

[0092] In this embodiment, the adsorption surface 311 of the suction cup 302 and the wafer bearing surface 101 of the chuck 100 are on the same horizontal plane. Therefore, when the wafer is carried by the adsorption surface 311 and the wafer bearing surface 101, it is beneficial to improve the stability of the wafer and reduce the possibility of unexpected displacement or warping of the wafer.

[0093] Figure 3 This is a bottom view of the chuck and support in the wafer alignment device according to the second embodiment of this utility model. Figure 4 yes Figure 3 A schematic diagram of the structure of a wafer alignment device at position AB in one embodiment.

[0094] The similarities between this embodiment and the previous embodiment will not be repeated here. The difference between this embodiment and the previous embodiment is that: a gas connection port 511 is provided on the side wall of the pipeline device 514; the bracket 711 is provided at the bottom of the chuck body structure, and the first air extraction pipe 714 and the bypass air extraction pipe 516 are connected through the gas connection port 511.

[0095] A gas connection port 511 is provided on the side wall of the pipeline device 514. The first gas extraction pipe 714 and the bypass gas extraction pipe 516 are connected through the gas connection port 511, thereby reducing the impact of the bypass gas extraction pipe 516 on the chuck body structure.

[0096] Accordingly, this utility model embodiment also provides a semiconductor device, which includes the wafer alignment device described in any of the foregoing embodiments.

[0097] Because this wafer alignment device integrates alignment and particle cleaning functions, it is beneficial to remove particles attached to the back of the wafer, thereby reducing the probability of wafer jamming accidents in the semiconductor equipment and thus improving the production efficiency of the semiconductor equipment.

[0098] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer alignment apparatus, characterized in that, include: Chuck; The blowing module includes at least an air inlet located on the side of the chuck, and the air inlet is located on the back side of the wafer when the chuck is carrying the wafer, and the blowing module is used to provide purge gas to the back side of the wafer; A wafer holding module includes a support mounted on the chuck for supporting the wafer, and a suction cup is provided on the support.

2. The wafer alignment apparatus as described in claim 1, characterized in that, The wafer alignment device further includes a base; the chuck is disposed on the base; The air blowing module includes: an air blowing port located on the top surface of the base; and an air blowing pipe located inside the base, with one end of the air blowing pipe connected to the air blowing port.

3. The wafer alignment apparatus as described in claim 2, characterized in that, A pressure regulating valve is installed on the air blowing pipe.

4. The wafer alignment apparatus as described in claim 2, characterized in that, The wafer alignment device further includes a purge gas supply device, which is connected to the other end of the purge pipe.

5. The wafer alignment apparatus as described in claim 1, characterized in that, The wafer alignment device further includes: an air intake module, which includes at least an air intake port located on the side of the chuck and facing the side wall of the chuck, wherein the air pressure of the air intake module is greater than the air pressure of the air blowing module.

6. The wafer alignment apparatus as described in claim 5, characterized in that, The chuck includes a wafer support surface, and the chuck is used to drive the wafer to move up and down in a direction perpendicular to the wafer support surface. The chuck also has a preset lifting height area in the direction perpendicular to the wafer support surface. In a direction perpendicular to the wafer support surface, the air intake of the air intake module at least covers the preset lifting height area.

7. The wafer alignment apparatus as described in claim 5, characterized in that, The wafer alignment device further includes a base; the chuck is disposed on the base; The air intake module includes: an air intake body structure disposed on the base, the air intake body structure having an air intake port; and a first air intake pipe located inside the base, the first air intake pipe being connected to the air intake port.

8. The wafer alignment apparatus as described in claim 7, characterized in that, The wafer alignment device further includes: a first vacuum generator; The end of the first suction pipe that is not connected to the suction port is connected to the first vacuum generator.

9. The wafer alignment apparatus as described in claim 5, characterized in that, The wafer alignment device further includes a detection module located on the side of the chuck for identifying notches on the wafer, wherein the detection module and the suction module are staggered.

10. The wafer alignment apparatus as claimed in claim 1, characterized in that, The suction cup surface on the bracket has a first vacuum adsorption port; The wafer fixing module further includes: a first air extraction pipe located inside the bracket, the first air extraction pipe being connected to the first vacuum adsorption port.

11. The wafer alignment apparatus as claimed in claim 10, characterized in that, The chuck includes: a chuck body structure, the surface of which has a second vacuum adsorption port; The piping device is located at the bottom of the chuck body structure and connected to the chuck body structure. The piping device includes a second air extraction pipe connected to the second vacuum suction port and a bypass air extraction pipe connected to the first air extraction pipe. The bypass air extraction pipe and the second air extraction pipe are independent of each other.

12. The wafer alignment apparatus as claimed in claim 11, characterized in that, A gas communication port is provided on the side wall of the chuck body structure; the bracket is provided on the side wall of the chuck body structure, and the first air extraction pipe and the bypass air extraction pipe are connected through the gas communication port; or, A gas connection port is provided on the side wall of the pipeline device; the bracket is located at the bottom of the chuck body structure, and the first air extraction pipe and the bypass air extraction pipe are connected through the gas connection port.

13. The wafer alignment apparatus according to any one of claims 11 to 12, characterized in that, The wafer alignment device further includes: a second vacuum generator; The bypass extraction pipe is connected to the vacuum generator at one end, which is not connected to the gas inlet.

14. The wafer alignment apparatus as claimed in claim 1, characterized in that, The multiple supports are distributed at equal angular intervals along the circumference of the chuck.

15. The wafer alignment apparatus as described in claim 1 or 14, characterized in that, The number of supports is at least three.

16. The wafer alignment apparatus as claimed in claim 1, characterized in that, The chuck includes a wafer support surface; on a projection surface parallel to the wafer support surface, the air inlets of the air blowing module are uniformly distributed along the circumference of the chuck.

17. The wafer alignment apparatus as claimed in claim 1, characterized in that, The chuck includes a wafer-carrying surface; the suction surface of the suction cup is at the same horizontal plane as the wafer-carrying surface of the chuck.

18. The wafer alignment apparatus as claimed in claim 1, characterized in that, The blowing module includes an inert gas blowing module or a compressed air blowing module.

19. A semiconductor device, characterized in that, Includes the wafer alignment apparatus as described in any one of claims 1 to 18.

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