Back inspection carrying platform compatible with wafers of multiple sizes

Abstract

The utility model provides a back inspection platform deck compatible with wafers of multiple sizes. The back inspection platform deck comprises a disc-shaped platform deck body, a supporting assembly used for supporting a product film, a suction cup assembly used for adsorbing the product film and a top PIN assembly used for positioning and bearing a fixing ring. The supporting assembly comprises a first supporting table and a second supporting table which are arranged on the top face of the carrying table body, the first supporting table and the second supporting table are both annular bosses with the center of the top face of the carrying table body as the circle center, and the first supporting table is located on the inner side of the second supporting table. An annular gap between the first supporting table and the second supporting table is a first matching area, an annular second matching area is further arranged on the outer side of the second supporting table, and suction cup assemblies and top PIN assemblies are circumferentially distributed in the first matching area and the second matching area. The back detection carrying platform can be compatible with wafers of 8 and 12 inches, has high flatness during detection, and can ensure that the detection effect is not affected by sagging of a product film.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a back inspection stage compatible with multi-size wafers. Background Technology

[0002] Due to the high difficulty of wafer production, wafer defect detection must be carried out at multiple stages to ensure the final yield of the wafer. This process requires not only inspection of the front side of the wafer, but also inspection of the back side of the wafer. When inspecting the back side of the wafer after it has been cut, the front side of the product cannot come into contact with anything, which greatly limits the inspection method and the design of the stage.

[0003] Currently, the most common wafer sizes are 8-inch and 12-inch. The back inspection stage of general testing equipment cannot be compatible with both 8-inch and 12-inch wafers at the same time. When switching between wafers of different sizes for testing, it is necessary to manually switch the stage or the mechanism on the stage, which may result in the risk of the front side of the wafer coming into contact with foreign objects.

[0004] Chinese utility model patent CN208570572U discloses a stage suitable for multi-size wafers. The stage is used to support wafers of various sizes, which are placed on a plastic film. The plastic film has iron rings around its perimeter. One side of the plastic film is adhesive, and the other is smooth; the adhesive side can adhere the wafers and iron rings. The stage includes a suction cup 1 for adsorbing the wafers, with grooves of various sizes. Wafers of different sizes are placed in corresponding grooves. This stage uses the suction cup to adsorb the plastic film of the wafers and uses different nozzles of the adsorption assembly to adsorb the iron rings of different sized wafers, thus achieving compatibility with wafers of different sizes. However, it cannot tension the plastic film, resulting in insufficient guarantee of the flatness of the wafers during inspection.

[0005] Therefore, this application aims to provide a back inspection stage that is compatible with wafers of multiple sizes and can guarantee flatness during inspection. Utility Model Content

[0006] To address the problems of existing wafer stages not being well compatible with multi-size wafers and not being able to guarantee sufficient flatness, this invention proposes a back inspection stage compatible with multi-size wafers to solve the above problems.

[0007] This invention proposes a back inspection stage compatible with multi-size wafers. The wafer is placed at the center of a product film, and a fixing ring is attached to the edge of the product film. The stage also includes a disc-shaped main body, a support assembly for supporting the product film, a suction cup assembly for adsorbing the product film, and a top pin assembly for positioning and receiving the fixing ring. The support assembly includes a first support platform and a second support platform placed on the top surface of the main body. Both the first and second support platforms are annular bosses centered on the top surface of the main body, with the first support platform located inside the second support platform. The annular gap between the first and second support platforms is a first mating area, and an annular second mating area is also provided on the outer side of the second support platform. The suction cup assembly and the top pin assembly are circumferentially distributed in both the first and second mating areas.

[0008] By adopting the above technical solution, during wafer inspection, the top PIN assembly positions and supports the fixing rings of wafers of different sizes. The first support platform and the second support platform are used to support the product films of wafers of different sizes, and the suction cup assembly adsorbs the product films to make them taut, preventing the product films from sagging in their natural state. During use, the adsorption force of the suction cup assembly can be adjusted. After the product film is taut, a product with high flatness can be obtained for inspection. This enables the function of inspecting wafers of different sizes without changing the platform, reducing work order time and improving the automation level of wafer back defect inspection.

[0009] Preferably, the suction cup assembly includes multiple first suction cups and multiple second suction cups, with the first suction cups and second suction cups located in the first mating area and the second mating area, respectively, and the first suction cups and second suction cups are equidistantly distributed in a circular pattern based on the center of the top surface of the platform body.

[0010] By adopting the above technical solution, the first suction cup and the second suction cup in the first mating area and the second mating area are used to adsorb product films of wafers of different sizes. The equidistant circumferential distribution can ensure that the first suction cup and the second suction cup apply adsorption force to the product film from different directions, ensuring that the product film is stably placed on the stage and avoiding the displacement of the wafer during the detection process due to uneven adsorption, thereby improving the accuracy and stability of the detection.

[0011] In a further preferred embodiment, a suction cup groove is provided on the top surface of the platform body corresponding to the position of the first suction cup, and the lower half of the first suction cup is embedded in the suction cup groove.

[0012] By adopting the above technical solution, the first suction cup is partially embedded in the suction cup groove, creating a height difference between the first and second suction cups. This ensures that the first / second suction cups are not affected by the second / first suction cups when adsorbing product films of the corresponding size, thus improving the working coordination of the suction cup assembly.

[0013] More preferably, the outer edge of the second support platform is flush with the edge of the platform body, and the outer periphery of the platform body is provided with a protruding connecting block corresponding to the position of the second suction cup. The connecting block extends into the second mating area and connects with the bottom of the second suction cup.

[0014] By adopting the above technical solution, when designing a stage for only two sizes of wafers, the edge structure of the stage body is made more regular, avoiding local stress concentration and saving more space occupied by the stage body. The design of the connecting block utilizes the space of the second mating area outside the stage body, making the installation of the second suction cup more convenient. During the assembly process, it can be quickly positioned and accurately connected, and the overall space utilization rate is improved.

[0015] Preferably, the top pin assembly includes a plurality of first top pins and a plurality of second top pins disposed perpendicular to the stage body. The first top pins and the second top pins are located in the first mating area and the second mating area, respectively. The length of the first top pin is shorter than the length of the second top pin, and the first top pin penetrates upward through the stage body.

[0016] By adopting the above technical solution, multiple first and second top pins are respectively set in the first and second mating areas, enabling precise positioning and support of fixing rings for wafers of different sizes. The layout of multiple top pins can provide support for the fixing ring from multiple directions, ensuring stable placement of the fixing ring, thereby guaranteeing the positional accuracy of the wafer during the inspection process and improving the reliability of the inspection results. At the same time, the first and second top pins are not affected by the second and first top pins when supporting fixing rings of corresponding sizes.

[0017] A further preferred embodiment includes a mounting ring and multiple mounting brackets. The mounting ring is arranged parallel to the bottom surface of the platform body, and the bottom surface of the mounting brackets is connected to the top surface of the mounting ring, and they are evenly distributed along the circumference of the mounting ring.

[0018] By adopting the above technical solution, the mounting ring and mounting bracket are designed to install the top PIN assembly, and can be further used with an additional driving device to drive the first top PIN and the second top PIN to move up and down synchronously, simplifying the driving structure of the top PIN assembly.

[0019] More preferably, the mounting bracket has a U-shaped structure, and the top and bottom surfaces of the mounting bracket are both U-shaped surfaces parallel to the bottom surface of the platform body. The turning part of the mounting bracket is located below the first mating area, and the two ends of the mounting bracket extend to the bottom of the second mating area.

[0020] By adopting the above technical solution, the U-shaped mounting bracket can provide full support for the top PIN assembly in both the first and second mating areas, effectively distributing the weight of the top PIN assembly. The U-shaped mounting bracket, together with the mounting ring, can cleverly utilize the space under the main body of the platform, avoiding interference with the operation of other components, and making it easier to install and maintain the top PIN assembly in the first and second mating areas. The overall structure is more compact.

[0021] More preferably, a single mounting bracket has two first top pins and two second top pins installed, with the bottom of the first top pin perpendicularly connected to the turning part of the mounting bracket, and the bottom of the second top pin perpendicularly connected to both ends of the mounting bracket.

[0022] By adopting the above technical solution, the first and second top pins are connected to different positions on the mounting bracket, forming a stable mechanical support structure. When the top pin assembly is subjected to pressure from the retaining ring, the mounting bracket can evenly distribute the force, avoiding deformation or damage due to excessive local stress, thus ensuring the stability of the entire top pin assembly.

[0023] Preferably, the top surface height of the second support platform is greater than the top surface height of the first support platform, and the height difference is 4mm.

[0024] By adopting the above technical solution, the 4mm height difference between the first support platform and the second support platform is more compatible with the size difference of conventional 8-inch and 12-inch wafers, further ensuring that when using the second support platform to inspect 12-inch wafers, the first support platform, the first suction cup, and the first top pin will not be touched.

[0025] Preferably, a first air inlet and a second air inlet are respectively provided at the center of the top surface of the platform body and at a position near the inner side of the first support platform. The platform body is provided with a first air channel and a second air channel that communicate with the first air inlet and the second air inlet, and the first air channel and the second air channel are independent of each other.

[0026] By adopting the above technical solution, when inspecting small-sized wafers, only the first air blowing port can be used to blow air onto the product film, thereby controlling the sagging of the product film center. When inspecting large-sized wafers, considering that the first air blowing port alone cannot blow air onto a large area of ​​product film, the first air blowing port and the second air blowing port are used simultaneously to provide sufficient airflow, thereby controlling the sagging of the product film on large-sized wafers.

[0027] Compared with the prior art, the beneficial effects of this application are as follows:

[0028] This application proposes a back inspection stage compatible with multiple wafer sizes. The top pin assembly precisely positions and supports wafers of different sizes using a fixing ring. The support assembly and suction cup assembly work together to taut the product film, allowing for the inspection of wafers of different sizes without changing the stage, thus improving the automation and efficiency of the inspection process. Furthermore, the first and second suction cups are equidistantly distributed circumferentially to uniformly adsorb the product film, ensuring stable and accurate inspection, and the height difference design avoids mutual interference. The different lengths of the first and second top pins, combined with the U-shaped mounting bracket and specific connection method, distribute the force, enhance stability, and facilitate installation and maintenance. The height difference between the first and second support stages is more adaptable to conventional wafer sizes. Independent air inlets and air channels allow for flexible control of the product film sag on wafers of different sizes. These structures work together to make wafer back defect inspection more efficient. Attached Figure Description

[0029] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the present invention. Other embodiments and many anticipated advantages of the embodiments will be readily recognized as they become better understood through reference to the following detailed description. Elements in the drawings are not necessarily to scale. The same reference numerals refer to corresponding similar parts.

[0030] Figure 1 This is a schematic diagram of the back inspection platform structure according to an embodiment of this application;

[0031] Figure 2 This is a three-dimensional structural schematic diagram of the back inspection platform according to an embodiment of this application;

[0032] Figure 3 This is an installation diagram of the top PIN assembly according to an embodiment of this application;

[0033] Figure 4 This is a structural perspective view of the back inspection platform according to an embodiment of this application;

[0034] Figure 5 This is a schematic diagram of 8-inch wafer inspection according to an embodiment of this application.

[0035] The meaning of each number in the diagram:

[0036] The components are as follows: platform body 01, support assembly 02, suction cup assembly 03, top pin assembly 04, first support platform 05, second support platform 06, first mating area 07, second mating area 08, first suction cup 09, second suction cup 10, suction cup groove 11, connecting block 12, first top pin 13, second top pin 14, mounting ring 15, mounting bracket 16, first air outlet 17, second air outlet 18, first air channel 19, second air channel 20, wafer 21, product film 22, and fixing ring 23. Detailed Implementation

[0037] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description and illustrate illustrative specific embodiments in which the present invention may be practiced. In this regard, directional terms such as “top,” “bottom,” “left,” “right,” “up,” “down,” etc., are used with reference to the orientation of the described figures. Because components of the embodiments can be positioned in several different orientations, directional terms are used for illustrative purposes and are by no means limiting. It should be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present invention. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0038] This invention proposes a back inspection stage compatible with multiple wafer sizes, in which wafer 21 is placed at the center of product film 22, and fixing rings 23 are attached to the edge of product film 22. Figure 1 A schematic diagram of the back inspection platform structure according to an embodiment of this application is shown. Figure 5 A schematic diagram of 8-inch wafer inspection according to an embodiment of this application is shown, as follows. Figure 1 , Figure 5 As shown, the back inspection platform includes a disc-shaped platform body 01, a support assembly 02 for supporting the product film 22, a suction cup assembly 03 for adsorbing the product film 22, and a top pin assembly 04 for positioning and receiving the fixing ring 23. The support assembly 02 includes a first support platform 05 and a second support platform 06 placed on the top surface of the platform body 01. Both the first support platform 05 and the second support platform 06 are annular bosses with the center of the top surface of the platform body 01 as the center, and the first support platform 05 is located inside the second support platform 06. The annular gap between the first support platform 05 and the second support platform 06 is a first mating area 07. An annular second mating area 08 is also provided on the outside of the second support platform 06. The suction cup assembly 03 and the top pin assembly 04 are circumferentially distributed in both the first mating area 07 and the second mating area 08.

[0039] Specifically, the edge of the platform body 01 is located in the inner circle of the second mating area 08, as shown in the figure. For ease of understanding, the outer circle of the second mating area 08 is shown with a dashed line (non-solid area) to indicate that the edge of the platform body 01 does not extend into the second mating area 08. However, in actual applications, the edge of the platform body 01 can also extend to the outer circle of the second mating area 08. The following embodiments are mainly described in the case where the edge of the platform body 01 coincides with the inner circle of the second mating area 08.

[0040] By adopting the above technical solution, when inspecting wafer 21, the top PIN assembly 04 positions and supports the fixing ring 23 of wafers 21 of different sizes. The first support platform 05 and the second support platform 06 are used to support the product film 22 of wafers 21 of different sizes, and the suction cup assembly 03 adsorbs the product film 22 to make it taut, so as to prevent the product film 22 from falling in its natural state. During use, the adsorption force of the suction cup assembly 03 can be adjusted. After the product film 22 is taut, a product to be inspected with high flatness can be obtained. Thus, the function of not needing to change the platform when inspecting wafers 21 of different sizes is realized, reducing the time of work orders and realizing the automation of wafer 21 back defect inspection.

[0041] Figure 2 A three-dimensional structural schematic diagram of a back inspection stage according to an embodiment of this application is shown, as follows: Figure 1 , 2 As shown in Figure 5, the suction cup assembly 03 includes multiple first suction cups 09 and multiple second suction cups 10. The first suction cups 09 and the second suction cups 10 are located in the first mating area 07 and the second mating area 08, respectively, and the first suction cups 09 and the second suction cups 10 are equidistantly distributed in a circular pattern based on the center of the top surface of the platform body 01.

[0042] In a specific embodiment, both the first suction cup 09 and the second suction cup 10 are vacuum suction cups, and the number of the first suction cup 09 and the second suction cup 10 distributed in the first mating area 07 and the second mating area 08 are four each. The angle between the line connecting the adjacent first suction cup 09 / second suction cup 10 and the center of the top surface of the platform body 01 is 90°. Therefore, the line connecting the two first suction cups 09 and the two second suction cups 10 on the diagonal will pass through the center of the top surface of the platform body 01.

[0043] In practical applications, the number of the first suction cup 09 and the second suction cup 10 distributed in their respective areas can be adjusted according to the size of the wafer 21 to be inspected, so as to provide sufficient and uniform adsorption force to the product film 22 of the wafer 21 to be inspected.

[0044] By adopting the above technical solution, the first suction cup 09 and the second suction cup 10 in the first mating area 07 and the second mating area 08 are used to adsorb the product film 22 of wafers 21 of different sizes. The equidistant circumferential distribution can ensure that the first suction cup 09 and the second suction cup 10 apply adsorption force to the product film 22 uniformly from different directions, ensuring that the product film 22 is stably placed on the stage and avoiding displacement of the wafer 21 during the detection process due to uneven adsorption, thereby improving the accuracy and stability of the detection.

[0045] In a further preferred embodiment, a suction cup groove 11 is provided on the top surface of the platform body 01 corresponding to the position of the first suction cup 09, and the lower half of the first suction cup 09 is embedded in the suction cup groove 11.

[0046] By adopting the above technical solution, by partially embedding the first suction cup 09 in the suction cup groove 11, a height difference is created between the first suction cup 09 and the second suction cup 10, thereby ensuring that the first suction cup 09 / second suction cup 10 will not be affected by the second suction cup 10 / first suction cup 09 when adsorbing the product film 22 of the corresponding size, thus improving the working coordination of the suction cup assembly 03.

[0047] More preferably, the outer edge of the second support platform 06 is flush with the edge of the platform body 01, and the outer periphery of the platform body 01 is provided with a protruding connecting block 12 corresponding to the position of the second suction cup 10. The connecting block 12 extends into the second mating area 08 and is connected to the bottom of the second suction cup 10.

[0048] In this embodiment, the top surface of the connecting block 12 is at the same height as the top surface of the platform body 01. Therefore, the lower part of the first suction cup 09 is embedded in the suction cup groove 11. When the top surfaces of the first suction cup 09 and the second suction cup 10 are at the same height, they can have a certain height difference. Of course, the suction cup groove 11 can be omitted, and a shorter first suction cup 09 can be used instead, which can also create a height difference between the two. However, in order to ensure the uniformity of parts installation and replacement, it is better to use the same length of first suction cup 09 and second suction cup 10.

[0049] In this embodiment, the edge of the platform body 01 coincides with the inner ring of the second mating area 08. Therefore, an independent connecting block 12 is set to install the second suction cup 10 in order to save space occupied by the platform body 01. In another embodiment, the edge of the platform body 01 can coincide with the outer ring of the second mating area 08, and the second support platform 06 is still located in the inner ring of the second mating area 08. In this case, the second suction cup 10 is directly set on the top surface of the platform body 01.

[0050] By adopting the above technical solution, when designing the stage for only two sizes of wafers 21, the edge structure of the stage body 01 is made more regular, avoiding local stress concentration, and saving more space occupied by the stage body 01. The design of the connecting block 12 utilizes the space of the second mating area 08 outside the stage body 01, making the installation of the second suction cup 10 more convenient. During the assembly process, it can be quickly positioned and accurately connected, and the overall space utilization rate is improved.

[0051] Figure 3 An installation diagram of the top PIN assembly according to an embodiment of this application is shown, such as... Figure 1 , 2 As shown in Figures 3 and 5, the top PIN assembly 04 includes a plurality of first top PINs 13 and a plurality of second top PINs 14 disposed perpendicular to the platform body 01. The first top PINs 13 and the second top PINs 14 are located in the first mating area 07 and the second mating area 08, respectively. The length of the first top PINs 13 is shorter than the length of the second top PINs 14, and the first top PINs 13 penetrate upward through the platform body 01.

[0052] In this embodiment, there are four first top PIN13 and four second top PIN14, and adjacent first top PIN13 / second top PIN14 are equally spaced between adjacent first suction cup 09 / second suction cup 10.

[0053] By adopting the above technical solution, multiple first top pins 13 and second top pins 14 are respectively set in the first mating area 07 and the second mating area 08, which can accurately position and support the fixing ring 23 of wafers 21 of different sizes. The layout of multiple top pins can provide support for the fixing ring 23 from multiple directions, ensuring the stable placement of the fixing ring 23, thereby ensuring the positional accuracy of the wafer 21 during the inspection process and improving the reliability of the inspection results. At the same time, the first top pin 13 / second top pin 14 will not be affected by the second top pin 14 / first top pin 13 when supporting the fixing ring 23 of the corresponding size.

[0054] Further preferably, it also includes a mounting ring 15 and a plurality of mounting brackets 16. The mounting ring 15 is arranged parallel to the bottom surface of the platform body 01, and the bottom surface of the mounting brackets 16 is connected to the top surface of the mounting ring 15 and is evenly distributed along the circumference of the mounting ring 15.

[0055] Specifically, depending on the application scenario, there are two mounting brackets 16, which are symmetrically arranged on the left and right sides of the stage body 01. When the wafer 21 that needs to be compatible is 8-inch and 12-inch, the symmetrically arranged mounting brackets 16 can effectively disperse the force generated when the top PIN assembly 04 carries the fixing ring 23.

[0056] By adopting the above technical solution, the mounting ring 15 and mounting bracket 16 are designed to install the top PIN assembly 04, and can further cooperate with an additional driving device to drive the first top PIN 13 and the second top PIN 14 to perform synchronous lifting and lowering actions, thus simplifying the driving structure of the top PIN assembly 04.

[0057] More preferably, the mounting bracket 16 has a U-shaped structure and is fixed to the top surface of the mounting ring 15 by bolts. The top and bottom surfaces of the mounting bracket 16 are both U-shaped surfaces parallel to the bottom surface of the platform body 01. The turning part of the mounting bracket 16 is located below the first mating area 07, and both ends of the mounting bracket 16 extend to the bottom of the second mating area 08.

[0058] The U-shaped mounting bracket 16 has a simpler structure and allows the force borne by the top PIN assembly 04 to be evenly distributed on the mounting bracket 16, while also saving the space required for the installation of the top PIN assembly 04.

[0059] By adopting the above technical solution, the U-shaped mounting bracket 16 can provide full support for the top PIN assembly 04 in the first mating area 07 and the second mating area 08 at the same time, effectively distributing the weight of the top PIN assembly 04. The U-shaped mounting bracket 16, together with the mounting ring 15, can cleverly utilize the space under the platform body 01, avoid interfering with the work of other components, and make it easier to install and maintain the top PIN assembly 04 in the first mating area 07 and the second mating area 08. The overall structure is more compact.

[0060] More preferably, each mounting bracket 16 is equipped with two first top pins 13 and two second top pins 14, with the bottom of the first top pin 13 perpendicularly connected to the turning part of the mounting bracket 16, and the bottom of the second top pin 14 perpendicularly connected to both ends of the mounting bracket 16.

[0061] In this embodiment, the edge of the platform body 01 coincides with the inner ring of the second mating area 08, so the second top PIN 14 does not need to penetrate the platform body 01 and can receive the fixing ring 23 on the outside of the platform body 01. In another embodiment, the edge of the platform body 01 coincides with the outer ring of the second mating area 08, in which case the second top PIN 14 also needs to penetrate the platform body 01 from bottom to top.

[0062] Furthermore, the mounting ring 15 can be connected to an automated drive mechanism (not shown in the figure). The drive mechanism can be in the form of a motor and a lead screw, or in the form of a pneumatic component (such as a cylinder). Under the drive of the drive mechanism, the mounting ring 15 can drive the mounting bracket 16 together with the first top PIN 13 and the second top PIN 14 to move vertically upward and support the mounting ring 15 of the wafer 21.

[0063] By adopting the above technical solution, the first top PIN 13 and the second top PIN 14 are respectively connected to different positions of the mounting bracket 16, forming a stable mechanical support structure. When the top PIN assembly 04 is subjected to pressure from the fixing ring 23, the mounting bracket 16 can evenly distribute the force, avoiding deformation or damage due to excessive local force, thus ensuring the stability of the entire top PIN assembly 04.

[0064] Preferably, the top surface height of the second support platform 06 is greater than the top surface height of the first support platform 05, and the height difference is 4mm.

[0065] Specifically, the diameter of the 8-inch wafer is approximately 200mm, and the size of the 12-inch wafer 21 is approximately 300mm. In order to ensure that the product film 22 of the wafer 21 can be stretched and to ensure the flatness during testing, a height difference of 4mm is a reasonable one, and it can effectively prevent the product film 22 of the 12-inch wafer 21 from contacting the top surface of the first support stage 05.

[0066] By adopting the above technical solution, the 4mm height difference between the first support platform 05 and the second support platform 06 is more compatible with the size difference of conventional 8-inch and 12-inch wafers 21, further ensuring that when the second support platform 06 is used to test the 12-inch wafer 21, it will not touch the first support platform 05, the first suction cup 09 and the first top PIN 13.

[0067] Figure 4 A structural perspective view of the back inspection stage according to an embodiment of this application is shown, as follows. Figure 1-5 As shown, a first air inlet 17 and a second air inlet 18 are respectively provided at the center of the top surface of the platform body 01 and at the position near the inner side of the first support platform 05. The platform body 01 is provided with a first air channel 19 and a second air channel 20 that are connected to the first air inlet 17 and the second air inlet 18, and the first air channel 19 and the second air channel 20 are independent of each other.

[0068] Specifically, the entrances of the first air blowing channel 19 and the second air blowing channel 20 are both located on the outer side of the platform body 01, and extend from the outer side all the way to the bottom of the first air blowing port 17 and the second air blowing port 18.

[0069] By adopting the above technical solution, when inspecting a small-sized wafer 21, only the first air blowing port 17 can be used to blow air onto the product film 22, thereby controlling the sag at the center of the product film 22. When inspecting a large-sized wafer 21, considering that the first air blowing port 17 alone cannot blow air onto the large-area product film 22, the first air blowing port 17 and the second air blowing port 18 are used simultaneously to provide sufficient airflow, thereby controlling the sag of the product film 22 on the large-sized wafer 21.

[0070] Specifically, taking an 8-inch wafer as an example, the method of using the back inspection stage in this application is as follows:

[0071] Using a robotic fork (not shown in the figure), the fixing ring 23 is carried to the top of the back inspection stage. The drive mechanism drives the top PIN assembly 04 to rise and support the fixing ring 23 before lowering it (the fixing ring 23 of the 8-inch wafer corresponds to the first top PIN 13, and the fixing ring 23 of the 12-inch wafer corresponds to the second top PIN 14). The product film 22 comes into contact with the support assembly 02 (the product film 22 of the 8-inch wafer corresponds to the first support stage 05, and the product film 22 of the 12-inch wafer corresponds to the second support stage 06). At this time, the suction cup assembly 03 adsorbs the product film 22 (the first suction cup 09 corresponds to the 8-inch wafer, and the second suction cup 10 corresponds to the 12-inch wafer). The adsorption force of the suction cup assembly 03 can be adjusted by the pressure regulating valve to adjust the vacuum pressure. The product film 22 is tightened under the combined action of the support assembly 02 and the suction cup assembly 03, resulting in a film-coated product with high horizontality. After the product film 22 is tightened, the back defect inspection of the wafer 21 can be performed.

[0072] This application proposes a back inspection stage compatible with multiple wafer sizes. The top pin assembly 04 precisely positions and supports the fixing ring 23 for wafers 21 of different sizes. The support assembly 02 and suction cup assembly 03 work together to tighten the product film 22, allowing for the inspection of wafers 21 of different sizes without changing the stage, thus improving the automation and efficiency of the inspection. Furthermore, the first suction cup 09 and the second suction cup 10 are equidistantly distributed circumferentially to uniformly adsorb the product film 22, ensuring stable and accurate inspection, and the height difference design avoids mutual interference. The first top pin 13 and the second top pin 14 of different lengths, combined with the U-shaped mounting bracket 16 and a specific connection method, distribute the force, enhance stability, and facilitate installation and maintenance. The height difference between the first support stage 05 and the second support stage 06 is more adaptable to the size of conventional wafers 21. Independent air outlets and air channels can flexibly control the sag of the product film 22 on wafers 21 of different sizes. The above structures work together to make the inspection of defects on the back of wafers 21 more efficient.

[0073] Obviously, those skilled in the art can make various modifications and changes to the embodiments of this utility model without departing from the spirit and scope of this utility model. In this way, this utility model is also intended to cover such modifications and changes if they fall within the scope of the claims of this utility model and their equivalents. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not indicate that a combination of these measures cannot be used for profit. Any reference numerals in the claims should not be considered as limiting the scope.

Claims

1. A back inspection stage compatible with multi-size wafers, wherein the wafer is placed at the center of a product film, and a fixing ring is attached to the edge of the product film, characterized in that, The device includes a disc-shaped platform body, a support assembly for supporting the product film, a suction cup assembly for adsorbing the product film, and a top pin assembly for positioning and receiving the fixing ring. The support assembly includes a first support platform and a second support platform placed on the top surface of the platform body. Both the first and second support platforms are annular protrusions centered on the center of the top surface of the platform body, with the first support platform located inside the second support platform. The annular gap between the first and second support platforms is a first mating area, and an annular second mating area is also provided on the outer side of the second support platform. The suction cup assembly and the top pin assembly are circumferentially distributed within both the first and second mating areas.

2. The back inspection platform according to claim 1, characterized in that, The suction cup assembly includes multiple first suction cups and multiple second suction cups. The first suction cups and second suction cups are located in the first mating area and the second mating area, respectively, and the first suction cups and second suction cups are equidistantly distributed in a circle based on the center of the top surface of the platform body.

3. The back inspection platform according to claim 2, characterized in that, The top surface of the platform body is provided with a suction cup groove corresponding to the position of the first suction cup, and the lower half of the first suction cup is embedded in the suction cup groove.

4. The back inspection platform according to claim 2, characterized in that, The outer edge of the second support platform is flush with the edge of the platform body, and the outer periphery of the platform body is provided with a protruding connecting block corresponding to the position of the second suction cup. The connecting block extends into the second mating area and connects to the bottom of the second suction cup.

5. The back inspection platform according to claim 1, characterized in that, The top PIN assembly includes a plurality of first top PINs and a plurality of second top PINs disposed perpendicular to the platform body. The first top PINs and the second top PINs are respectively located in the first mating area and the second mating area. The length of the first top PIN is shorter than the length of the second top PIN, and the first top PIN penetrates upward through the platform body.

6. The back inspection platform according to claim 5, characterized in that, It also includes a mounting ring and multiple mounting brackets. The mounting ring is arranged parallel to the bottom surface of the platform body. The bottom surface of the mounting bracket is connected to the top surface of the mounting ring and is evenly distributed along the circumference of the mounting ring.

7. The back inspection platform according to claim 6, characterized in that, The mounting bracket has a U-shaped structure, and both the top and bottom surfaces of the mounting bracket are U-shaped surfaces parallel to the bottom surface of the platform body. The turning part of the mounting bracket is located below the first mating area, and both ends of the mounting bracket extend to the bottom of the second mating area.

8. The back inspection platform according to claim 7, characterized in that, Each mounting bracket has two first top pins and two second top pins installed, with the bottom of the first top pin perpendicularly connected to the turning portion of the mounting bracket, and the bottom of the second top pin perpendicularly connected to both ends of the mounting bracket.

9. The back inspection platform according to claim 1, characterized in that, The top surface height of the second support platform is greater than the top surface height of the first support platform, and the height difference is 4mm.

10. The back inspection platform according to claim 1, characterized in that, The top center of the platform body and the position near the inner side of the first support platform are respectively provided with a first air inlet and a second air inlet. The interior of the platform body is provided with a first air channel and a second air channel that communicate with the first air inlet and the second air inlet, and the first air channel and the second air channel are independent of each other.

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