Electrostatic chuck carrying table

Abstract

The utility model discloses an electrostatic chuck carrying platform, which is used for detecting the flatness of an electrostatic chuck and comprises a base, a pressure sensing layer arranged at the top of the base and an electrostatic adsorption layer arranged at the top of the pressure sensing layer, the top of the electrostatic adsorption layer is used for placing a product to be detected, and the electrostatic adsorption layer comprises an electrostatic adsorption electrode. The pressure sensing layer comprises a pressure sensing upper electrode; the electrostatic adsorption electrode and the pressure sensing upper electrode are arranged on a substrate in an integral forming manner so as to realize integration of the pressure sensing layer and the electrostatic adsorption layer; the electrostatic adsorption electrode is arranged on the upper side surface of the substrate, and the pressure sensing upper electrode is arranged on the lower side surface of the substrate; the electrostatic adsorption electrode and the pressure sensing upper electrode are arranged on the same substrate in an integrated forming mode, and tight integration of the pressure sensing layer and the electrostatic adsorption layer is achieved. The structure of the carrying platform is simplified, connection and assembly errors among parts are reduced, and the overall stability and reliability are improved.

Description

Technical Field

[0001] This utility model relates to the field of display screen manufacturing technology, and in particular to an electrostatic chuck stage. Background Technology

[0002] In semiconductor manufacturing, precision machining, and optical component assembly, electrostatic adsorption technology is widely used for fixing and handling various small or thin workpieces. As the core component of electrostatic adsorption technology, the flatness of the electrostatic chuck is crucial for ensuring processing accuracy and product quality. Traditional electrostatic adsorption stages lack pressure sensing capabilities; currently, pressure-sensitive paper is used to detect the flatness of electrostatic chucks. However, pressure-sensitive paper can only perform pre- and post-processing checks, not real-time checks. With the rapid development of industries such as semiconductor manufacturing and precision machining, the performance requirements for electrostatic chuck stages are becoming increasingly stringent. In particular, a stage capable of real-time, accurate, and low-cost flatness detection is needed for electrostatic chuck flatness testing.

[0003] In existing electrostatic chuck platforms with electrostatic adsorption and pressure sensing functions, the insulating layers located at the bottom of the electrostatic adsorption layer and the top of the pressure sensing layer are mostly etched separately using etching processes. After the circuits on these two layers are fabricated, they are then combined into a whole by pressing or coating and bonded with adhesive. The platform structure formed by this method is complex, has poor flatness, and has low integration. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an electrostatic chuck stage. This application integrates the electrostatic adsorption electrode and the pressure sensing upper electrode on the same substrate in a one-piece molding manner to achieve the integration of the pressure sensing layer and the electrostatic adsorption layer. This integrated design not only simplifies the structure and improves the integration degree, but also enables real-time and accurate flatness detection.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A stage for an electrostatic chuck, used to detect the flatness of the electrostatic chuck, includes a base, a pressure sensing layer disposed on top of the base, and an electrostatic adsorption layer disposed on top of the pressure sensing layer. The top of the electrostatic adsorption layer is used to place the product to be tested. The electrostatic adsorption layer includes an electrostatic adsorption electrode, and the pressure sensing layer includes a pressure sensing upper electrode.

[0007] The electrostatic adsorption electrode and the pressure sensing upper electrode are integrally formed on a substrate to achieve the integration of the pressure sensing layer and the electrostatic adsorption layer.

[0008] The electrostatic adsorption electrode is disposed on the upper side of the substrate, and the pressure sensing upper electrode is disposed on the lower side of the substrate.

[0009] Furthermore, the substrate is a flexible copper-clad laminate with copper foil on both sides.

[0010] Furthermore, both the upper and lower sides of the substrate are provided with etching grooves.

[0011] Furthermore, sputtering electrodes are disposed on both the upper and lower sides of the substrate.

[0012] Furthermore, an insulating film is provided inside the substrate.

[0013] Furthermore, the pressure sensing layer also includes a pressure sensing lower electrode disposed at the bottom of the pressure sensing upper electrode, and a pressure-sensitive material plate is disposed between the pressure sensing upper electrode and the pressure sensing lower electrode. The pressure-sensitive material plate is used to monitor the change in surface pressure of the electrostatic chuck during the bonding process within the product adsorption plane.

[0014] Furthermore, a dielectric layer is disposed on the upper side of the electrostatic adsorption electrode.

[0015] Furthermore, the pressure-sensing layer and the electrostatic adsorption layer are pressed together to form a whole.

[0016] Furthermore, the pressure-sensing layer and the electrostatic adsorption layer are integrally cut and formed.

[0017] Furthermore, the overall thickness of the pressure sensing layer and the electrostatic adsorption layer is 155μm-260μm.

[0018] Furthermore, the electrostatic adsorption layer is bonded to the base.

[0019] Due to the adoption of the above technical solutions, this utility model has the following beneficial effects:

[0020] 1. This invention achieves tight integration of the pressure-sensing layer and the electrostatic adsorption layer by integrally molding the electrostatic adsorption electrode and the pressure-sensing upper electrode onto the same substrate. This design not only simplifies the structure of the stage and reduces connection and assembly errors between components, but also improves overall stability and reliability. Furthermore, the integrated pressure-sensing layer can monitor pressure changes on the surface of the electrostatic chuck in real time, thereby indirectly reflecting the flatness of the electrostatic chuck. This real-time monitoring function allows users to promptly detect and adjust any unevenness in the electrostatic chuck during the adsorption process, effectively avoiding processing errors and product quality problems caused by flatness issues.

[0021] 2. This invention uses a flexible copper-clad laminate with double-sided copper foil as the substrate, and incorporates structures such as etched grooves and sputtering electrodes, further improving the accuracy and stability of the electrostatic adsorption electrode and the pressure-sensing upper electrode. These designs enable the stage to more accurately sense minute changes on the surface of the electrostatic chuck, improving the accuracy and reliability of flatness detection.

[0022] 3. This invention incorporates an insulating film inside the substrate, effectively isolating electrical interference between the electrostatic adsorption electrode and the pressure-sensing upper electrode, ensuring the normal operation of the stage under harsh environments such as high pressure and high humidity. Simultaneously, the insulating film also enhances the stage's safety performance, preventing accidents caused by electrical faults. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below only involve some embodiments of this utility model, and are not intended to limit this utility model.

[0024] Figure 1 This is a structural diagram of the present invention.

[0025] Figure 2 This is a structural diagram of the pressure sensing layer of this utility model.

[0026] Figure 3 This is a structural diagram of the electrostatic adsorption layer of this utility model.

[0027] Figure label:

[0028] In the figure, 100 is the base; 200 is the pressure-sensing layer; 210 is the upper pressure-sensing electrode; 220 is the lower pressure-sensing electrode; 230 is the pressure-sensitive material plate; 240 is the lower insulating plate; 300 is the electrostatic adsorption layer; 310 is the electrostatic adsorption electrode; 320 is the dielectric layer; 400 is the substrate; 410 is the upper side surface; and 420 is the lower side surface. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. The components of the embodiments of this utility model described and shown in the accompanying drawings can be arranged and designed in various different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0031] Unless otherwise defined, the technical or scientific terms used in this patent document shall have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model patent specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" indicate that the element or object preceding "comprising" encompasses the element or object listed following "comprising" or its equivalents, and do not exclude other elements or objects. Terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" are used only to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the features in the following embodiments can be combined with each other.

[0034] Example 1:

[0035] Please see Figures 1-3This utility model discloses an electrostatic chuck stage for detecting the flatness of electrostatic chucks. Specifically, the electrostatic chuck stage includes a base 100, a pressure-sensing layer 200 disposed on top of the base 100, and an electrostatic adsorption layer 300 disposed on top of the pressure-sensing layer 200. The top of the electrostatic adsorption layer 300 is used to place the product to be tested. The electrostatic adsorption layer 300 includes an electrostatic adsorption electrode 310, and the pressure-sensing layer 200 includes a pressure-sensing upper electrode 210. The electrostatic adsorption electrode 310 and the pressure-sensing upper electrode 210 are integrally formed on a substrate 400 to achieve integration of the pressure-sensing layer 200 and the electrostatic adsorption layer 300. In this embodiment, the electrostatic adsorption electrode 310 is disposed on the upper side of the substrate 400, and the pressure-sensing upper electrode 210 is disposed on the lower side of the substrate 400. It should be noted that the electrostatic adsorption layer 300 uses electrostatic effect to adsorb objects. Static electricity refers to the unbalanced distribution of electric charge on the surface of an object. When two objects come into contact and separate, an electrostatic attraction may occur between them. Since the electrostatic adsorption layer 300 must be in contact with the product to adhere, it must be placed on the top layer, the one closest to the product being adsorbed. Real-time monitoring of the pressure state is crucial during the bonding process. The pressure state reflects the tightness and uniformity of the bond. Real-time monitoring allows for the timely detection and adjustment of any factors that may affect the bonding quality, such as insufficient pressure or uneven pressure distribution. This monitoring helps ensure a high-quality bonding process, thereby meeting the product's requirements for bonding precision.

[0036] It is important to note that the electrostatic chuck stage of this invention has a specific application scenario of use under vacuum, where the electrostatic adsorption layer 300 is used for product bonding in a vacuum environment. A vacuum environment means the absence of interference from air or other gas molecules, which helps ensure the accuracy and stability of the bonding process. The electrostatic chuck stage of this application integrates the electrostatic adsorption electrode 310 and the pressure sensing upper electrode 210 onto the substrate 400 through an integral molding process, achieving the integration of electrostatic adsorption and pressure sensing. Furthermore, the stage of this application has the advantages of distinct layers, good flatness, and high integration, enabling accurate and real-time detection of the flatness of the electrostatic chuck.

[0037] In this embodiment, the substrate 400 is a flexible copper-clad laminate with double-sided copper foil. The substrate 400 has an upper side 410 and a lower side 420, both of which are covered with copper foil. According to the design pattern of the electrostatic adsorption electrode 310, both the upper side 410 and the lower side 420 of the substrate 400 are provided with etching grooves. Specifically, etching is performed on the upper side 410 to form the electrostatic adsorption electrode 310. Then, according to the design pattern of the pressure-sensing upper electrode 210, etching is performed on the lower side 420 to form the pressure-sensing upper electrode 210. During the etching process, a chemical etching solution is used to corrode the copper foil, removing unwanted portions and retaining the desired electrode shape. After etching, a cleaning and drying process is performed to obtain the substrate 400 with the electrostatic adsorption electrode 310 and the pressure-sensing upper electrode 210. An insulating film is provided inside the substrate 400 to ensure electrical isolation between the electrostatic adsorption electrode 310 and the pressure-sensing upper electrode 210. The insulating film can be made of insulating materials such as polyimide or polyester, and can be fixed inside the substrate 400 by coating, bonding or lamination, which will not be elaborated on here.

[0038] In this embodiment, the pressure-sensing layer 200 further includes a pressure-sensing lower electrode 220 disposed at the bottom of the pressure-sensing upper electrode 210. A pressure-sensitive material plate 230 is disposed between the pressure-sensing upper electrode 210 and the pressure-sensing lower electrode 220. The pressure-sensitive material plate 230 is used to monitor the change in surface pressure of the electrostatic chuck during the product adsorption process. Furthermore, the material of the pressure-sensitive material plate 230 can be a piezoresistive material, a capacitive material, etc., which will change resistance or capacitance when subjected to pressure, thereby detecting the pressure change. The lower side of the pressure-sensing lower electrode 220 has a lower insulating plate 240 that is bonded to the base 100. A dielectric layer 320 is disposed on the upper side of the electrostatic adsorption electrode 310. This dielectric layer 320 is used to provide the electric field required for electrostatic adsorption, while protecting the electrostatic adsorption electrode 310 from the influence of the external environment.

[0039] In this embodiment, the pressure sensing layer 200 and the electrostatic adsorption layer 300 are pressed together to form a whole, and the pressure sensing layer 200 and the electrostatic adsorption layer 300 are integrally cut and shaped. The overall thickness of the pressure sensing layer 200 and the electrostatic adsorption layer 300 is 155μm-260μm. Specifically, in this embodiment, the overall thickness of the electrostatic adsorption electrode 310 and the pressure sensing upper electrode 210 is 55-90μm.

[0040] Example 2:

[0041] The difference between this embodiment and Embodiment 1 is that, in this embodiment, a flexible copper-clad laminate with double-sided copper foil is used as the substrate 400, and sputtering is performed on both sides of the substrate 400. First, a layer of metal is sputtered on the copper foil on the upper side to form an electrostatic adsorption electrode 310. Then, a layer of metal is sputtered on the copper foil on the lower side to form a pressure-sensing upper electrode 210. During the sputtering process, high-energy particles are used to bombard the metal target, causing metal atoms to deposit on the substrate 400 to form electrodes. After sputtering is completed, a cleaning and drying process is performed to obtain the substrate 400 with the electrostatic adsorption electrode 310 and the pressure-sensing upper electrode 210.

[0042] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An electrostatic chuck stage for detecting the flatness of an electrostatic chuck, comprising a base, a pressure-sensing layer disposed on top of the base, and an electrostatic adsorption layer disposed on top of the pressure-sensing layer, wherein the top of the electrostatic adsorption layer is used to place the product to be tested, characterized in that: The electrostatic adsorption layer includes an electrostatic adsorption electrode, and the pressure sensing layer includes a pressure sensing upper electrode. The electrostatic adsorption electrode and the pressure sensing upper electrode are integrally formed on a substrate to achieve the integration of the pressure sensing layer and the electrostatic adsorption layer. The electrostatic adsorption electrode is disposed on the upper side of the substrate, and the pressure sensing upper electrode is disposed on the lower side of the substrate.

2. The electrostatic chuck stage according to claim 1, characterized in that, The substrate is a flexible copper-clad laminate with copper foil on both sides.

3. The electrostatic chuck stage according to claim 1 or 2, characterized in that, The upper and lower sides of the substrate are provided with etching grooves.

4. The electrostatic chuck stage according to claim 3, characterized in that, Sputtering electrodes are disposed on both the upper and lower sides of the substrate.

5. The electrostatic chuck stage according to claim 4, characterized in that, The substrate has an insulating film inside.

6. The electrostatic chuck stage according to claim 1, characterized in that, The pressure sensing layer also includes a pressure sensing lower electrode disposed at the bottom of the pressure sensing upper electrode. A pressure-sensitive material plate is disposed between the pressure sensing upper electrode and the pressure sensing lower electrode. The pressure-sensitive material plate is used to monitor the change in surface pressure of the electrostatic chuck during the bonding process within the product adsorption plane.

7. The electrostatic chuck stage according to claim 1, characterized in that, A dielectric layer is disposed on the upper side of the electrostatic adsorption electrode.

8. The electrostatic chuck stage according to claim 1, characterized in that, The pressure sensing layer and the electrostatic adsorption layer are pressed together to form a whole, and the pressure sensing layer and the electrostatic adsorption layer are cut into a whole.

9. The electrostatic chuck stage according to claim 8, characterized in that, The overall thickness of the pressure sensing layer and the electrostatic adsorption layer is 155μm-260μm.

10. The electrostatic chuck stage according to claim 1, characterized in that, The electrostatic adsorption layer is bonded to the base.

Images