Processing equipment
By using a non-planar bottom surface joint and vacuum hole design in the processing equipment, the gap problem during the bonding process of packaged components is solved, thereby improving the quality and reliability of the package structure.
Patent Information
- Application Number
- CN202423184151.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-02-01
- Filing Date
- 2024-12-23
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-23
AI Technical Summary
Existing processing equipment has not been able to fully meet the requirements of bonding processes in 3D integrated circuit manufacturing, especially in the bonding process between packaged components, where gaps or voids exist, affecting the quality and reliability of the package structure.
The connector employs a non-planar bottom surface, which is curved and has a vacuum hole. The connector can deform to adapt to the shape of the packaged element, and stable bonding of the packaged element is achieved through vacuum adsorption and planarization processes.
It effectively reduces gaps or voids between packaged components, improves the quality and reliability of the package structure, and enhances the stability and consistency of the connection.
Smart Images
Figure CN223798678U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present utility model relate to a processing equipment and a manufacturing method of a packaging structure, in particular to a processing equipment including a bonding head with a non-planar bottom surface and a manufacturing method of a packaging structure. BACKGROUND
[0002] As a new solution for integrated circuit (IC) manufacturing and system integration, three dimensional integrated circuit (3D IC) technology has emerged, which combines hybrid technology to achieve high-density integration with small size, high performance and low power consumption. In addition, three dimensional integrated circuit is a promising solution to solve the limitations of Moore's Law. Vertical interconnects usually use three-dimensional integration structures, chip to chip (C2C) bonding, chip to wafer (C2W) bonding, wafer to wafer (W2W) bonding, package to substrate bonding, etc. Although the existing processing equipment for the above bonding is generally sufficient to meet its intended purpose, these processing equipment is not fully satisfactory in all aspects. SUMMARY
[0003] The purpose of the present utility model is to provide a processing equipment to solve at least one of the above problems.
[0004] Embodiments of the present utility model provide a processing equipment, including a processing chamber for bonding a first packaging element and a second packaging element. The processing equipment includes a bonding head disposed in the processing chamber for holding the second packaging element. The processing equipment also includes a chuck table disposed in the processing chamber for holding the first packaging element. The bonding head has a bottom surface, a top surface facing the chuck table, and the bottom surface of the bonding head is a non-planar surface.
[0005] According to one embodiment of the present utility model, the bottom surface of the bonding head is curved, and a plurality of vacuum holes are formed on the bottom surface of the bonding head.
[0006] According to one embodiment of the present utility model, the bonding head has an arc-shaped profile along a long edge of the bonding head.
[0007] According to one embodiment of the present utility model, a top end of the bottom surface of the bonding head deviates from a center of the bottom surface of the bonding head.
[0008] According to one embodiment of the present utility model, the cross-sectional area of the bonding head changes along a direction parallel to a long edge of the bonding head.
[0009] Embodiments of the present application provide a processing apparatus including a processing chamber for joining a first packaging element and a second packaging element. The processing apparatus includes a chuck table disposed in the processing chamber for holding the first packaging element. The processing apparatus also includes a bonding head disposed in the processing chamber for holding the second packaging element.
[0010] According to one embodiment of the present application, the plurality of vacuum holes are distributed within an adsorption region of the bonding head, a length of the second packaging element is greater than a length of the adsorption region, and the length of the adsorption region is greater than or equal to 0.7 times the length of the second packaging element.
[0011] According to one embodiment of the present application, the bottom surface of the bonding head is arc-shaped, roof-shaped, or dome-shaped.
[0012] According to one embodiment of the present application, a top end of the bonding head is located at a center of the bottom surface of the bonding head, and the plurality of vacuum holes are symmetrically distributed about the top end and arranged along a short edge of the bonding head.
[0013] According to one embodiment of the present application, the bottom surface of the bonding head has a top end protruding toward the chuck table, and the plurality of vacuum holes are formed around the top end of the bottom surface of the bonding head. BRIEF DESCRIPTION OF DRAWINGS
[0014] The concepts of the embodiments of the present application will be better understood from the following detailed description with reference to the accompanying drawings, in which like components are identified by like numerals throughout the drawings. It should be noted that the components in the drawings are not necessarily drawn to scale. In fact, the dimensions of the various components can be arbitrarily expanded or reduced for the sake of clarity. Like reference numerals designate like elements throughout the specification and drawings.
[0015] Figure 1 FIG. 1 shows a schematic view of a processing apparatus according to some embodiments of the present application.
[0016] Figure 2 FIG. 2 shows a schematic view of a bonding head according to some embodiments of the present application.
[0017] Figure 3 FIG. 3 shows a cross-sectional view of a bonding head according to some embodiments of the present application.
[0018] Figure 4 FIG. 4 shows a plan view of a bonding head and a second packaging element according to some embodiments of the present application.
[0019] Figures 5A to 5D FIG. 5 shows cross-sectional views of various stages of manufacturing a packaging structure according to some embodiments of the present application.
[0020] Figure 6A A schematic diagram of a joint according to some embodiments of the present invention is shown.
[0021] Figure 6B and Figure 6C A cross-sectional view of a joint according to some embodiments of the present invention is shown.
[0022] Figure 7 A schematic diagram of a joint according to some embodiments of the present invention is shown.
[0023] The attached figures are labeled as follows:
[0024] 10: Processing equipment
[0025] 20: First packaged component
[0026] 30: Second packaged component
[0027] 31: Lower contact part
[0028] 100: Machining Chamber
[0029] 105: Component storage module
[0030] 110: Component Supply Module
[0031] 120: Component transfer module
[0032] 130: Connector
[0033] 130A: Part 1
[0034] 130B: Part Two
[0035] 131: Bottom surface
[0036] 131P: Top
[0037] 132: Vacuum port
[0038] 135: Adsorption region
[0039] 150: Chuck worktable
[0040] 160: Heating Module
[0041] 170: Cooling Module
[0042] 230: Connector
[0043] 230A: Part 1
[0044] 230B: Part Two
[0045] 231: Bottom surface
[0046] 231P: Top
[0047] 232: Vacuum port
[0048] 330: Connector
[0049] 330A: Part 1
[0050] 330B: Part Two
[0051] 331: Bottom surface
[0052] 331P: Top
[0053] 332: Vacuum port
[0054] BB, CC: lines
[0055] L, L1, L2: Length
[0056] TA: First thickness
[0057] TB: Second Thickness
[0058] W, W1, W2: Width Detailed Implementation
[0059] The following disclosure provides numerous different embodiments or examples to implement various features of the present invention. Reference numerals and / or letters may be repeated in the various examples described herein. These repetitions are for brevity and clarity and do not in themselves imply any relationship between the various disclosed embodiments and / or configurations. Furthermore, specific examples of components and configurations are described below to simplify the description of the embodiments of the present invention. Of course, these specific examples are merely illustrative and not intended to limit the embodiments of the present invention. For example, in the following description, reference to a first feature being formed on or above a second feature indicates that it may include embodiments where the first and second features are in direct contact, or embodiments where additional features are formed between the first and second features, so that the first and second features may not be in direct contact.
[0060] In addition, spatially related terms may be used herein. For example, terms such as “below,” “under,” “lower,” “above,” “higher,” and similar terms are used to describe the relationship between one element or feature shown in the accompanying drawings and another element(s). Besides the orientations shown in the accompanying drawings, these spatially related terms are intended to include different orientations of the device in use or operation. The device may be turned to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used herein may be interpreted in the same way.
[0061] Embodiments of this invention provide processing equipment and a method for manufacturing a package structure. The processing equipment includes a connector with a non-planar bottom surface (e.g., arcuate). Therefore, the package element attached to the connector can be deformed to conform to the bottom surface of the connector. In the bonding process, the lower contact portion (e.g., the center portion) of the package element first contacts the lower component, followed by the edge of the package element contacting the lower component. This minimizes the gap or void between the package element and the lower component, thereby improving the quality and reliability of the package structure to be formed.
[0062] Figure 1 A schematic diagram of a processing apparatus 10 according to some embodiments is shown. In some embodiments, the processing apparatus 10 is configured to form a package structure, such as performing a bonding process to bond a first package element 20 and a second package element 30 (e.g., ...). Figures 5A to 5D (As shown). In some embodiments, the processing equipment 10 can be used for a chip-to-wafer (C2W) bonding process. During the bonding process, an electrical connector at the bonding surface of a first package element 20 (e.g., a device wafer or interposer wafer) is bonded to an electrical connector at the bonding surface of a second package element 30 (e.g., a semiconductor chip). In some embodiments, the first package element 20 and the second package element 30 are bonded by dielectric-to-dielectric bonding. However, the present invention is not limited thereto. For example, the first package element 20 and the second package element 30 can be bonded by fusion bonding or hybrid bonding. In some embodiments, the first package element 20 and the second package element 30 are bonded by dielectric-to-dielectric bonding and metal-to-metal bonding.
[0063] In some embodiments, the processing apparatus 10 includes a processing chamber 100, a component supply module 110, and a component transfer module 120. The processing chamber 100 is configured to perform a bonding process therein. The component supply module 110 is configured to supply and / or store a second packaged element 30, and the component transfer module 120 is configured to transfer the second packaged element 30 from the component supply module 110 to the processing chamber 100. For example, in some embodiments, the component transfer module 120 is a robotic arm or any other suitable transfer device that can move smoothly in any of the horizontal, vertical, and / or rotational directions to transfer the second packaged element 30 between the component supply module 110 and the processing chamber 100.
[0064] In some embodiments, the processing apparatus 10 further includes a coupling head 130 configured to receive a second packaged element 30 from the component transfer module 120. The detailed structure of the coupling head 130 will be discussed in the following description. In some embodiments, the coupling head 130 introduces vacuum pressure to hold the second packaged element 30 on the coupling head 130. Similarly, the coupling head 130 can be smoothly moved in any of the horizontal, vertical, and / or rotational directions to hold and move the second packaged element 30 within the processing chamber 100.
[0065] In some embodiments, the processing apparatus 10 further includes a heating module 160 disposed in the processing chamber 100. The heating module 160 is configured to heat the second packaged element 30 during transfer. In some embodiments, the heating module 160 heats the second packaged element 30 after it has been transferred into the processing chamber 100. In some embodiments, the heating module 160 emits radiation toward the second packaged element 30. In some embodiments, the heating module 160 is an infrared (IR) lamp module emitting infrared light with wavelengths ranging from about 760 nm to about 1 mm. In some embodiments, the heating module 160 has a heating area corresponding to the surface area of a single second packaged element 30. The processing apparatus 10 also includes a cooling module 170 connected to the heating module 160 for controlling the temperature of the heating module 160 to further control the temperature of the second packaged element 30. The cooling module 170 helps reduce the possibility of the heating module 160 overheating and damaging the second packaged element 30.
[0066] In some embodiments, the processing apparatus 10 further includes a plurality of component storage modules 105 and a plurality of chuck stages 150. The component storage modules 105 are configured to supply and / or store the first packaged component 20. In some embodiments, the processing apparatus 10 further includes a carrier (not shown) for transferring the first packaged component 20 from the component storage module 105 to the chuck stage 150. The chuck stage 150 is configured to hold the first packaged component 20 for subsequent bonding processes. In some embodiments, the chuck stage 150 holding the first packaged component 20 is transferred into the processing chamber 100 for subsequent bonding processes. Although a plurality of component storage modules 105 and chuck stages 150 are shown in this embodiment, the number of component storage modules 105 and chuck stages 150 is not limited thereto and can be adjusted by those skilled in the art to which this invention pertains. In some embodiments, the chuck stage 150 is made of an insulating material (e.g., ceramic or glass) to avoid unintended induced power absorption.
[0067] Figure 2 A schematic diagram of a connector 130 according to some embodiments is shown. Figure 3A cross-sectional view of a coupling head 130 according to some embodiments is shown. In some embodiments, the coupling head 130 has a non-planar (e.g., curved) bottom surface 131 and its top surface facing the chuck table 150 (e.g., reference to...). Figures 5A to 5D In some embodiments, the bottom surface 131 is curved. In embodiments where the bottom surface 131 is curved, a top surface 131P may be formed on the bottom surface 131. The top surface 131P of the bottom surface 131 can be defined as the area closest to the chuck table 150 below. That is, the bottom surface 131 of the engagement head 130 is a non-planar surface and therefore is not parallel to the top surface of the chuck table 150. The effects of the non-planar bottom surface 131 of the engagement head 130 will be discussed below. Figures 5A to 5D To explain further.
[0068] In some embodiments, the cross-sectional area of the connector 130 varies along a direction generally parallel to the long side of the connector 130 (e.g., the X-axis), and the cross-sectional area of the connector 130 can be measured, for example, in the YZ plane. Specifically, the maximum cross-sectional area of the connector 130 may exist on a plane passing through the top end 131P, and the minimum cross-sectional area of the connector 130 may exist on the edge of the connector 130.
[0069] In some embodiments, the connector 130 includes a plurality of vacuum holes 132 formed on the bottom surface 131. More specifically, each vacuum hole 132 may communicate with a vacuum device (not shown) inherently disposed in or outside the connector 130. It should be noted that more than one vacuum device may be provided, and these vacuum devices may operate independently of each other. For example, the vacuum pressure provided by the vacuum devices may be different to provide sufficient force to hold the second encapsulation element 30. Although the detailed configuration of the vacuum devices is not described in detail in this invention, any suitable configuration of the vacuum devices should be considered within the scope of this invention.
[0070] In some embodiments, the connector 130 may be divided into a first portion 130A and a second portion 130B connected to the first portion 130A. For example, the first portion 130A may be referred to as a portion of the connector 130 with a constant length. The second portion 130B may be referred to as a portion of the connector 130 with a varying length, for example, gradually decreasing from the center of the connector 130 to the edge of the connector 130. In some embodiments, the length of the first portion 130A may be measured in a direction parallel to the X-axis and defined as length L, and the maximum width of the second portion 130B may be shorter than the length L.
[0071] Additionally, the first portion 130A of the connector 130 has a first thickness TA, and the second portion 130B of the connector 130 has a second thickness TB. It should be understood that the first thickness TA and the second thickness TB can also be measured in a direction generally parallel to the Z-axis. However, the invention is not limited thereto. For example, the second thickness TB can be measured at the top end 131P. In some embodiments, the first thickness TA is greater than the second thickness TB. In this way, the first portion 130A can provide sufficient support for the second portion 130B, which helps to flatten the second portion 130B of the connector 130, thereby enabling the second encapsulation element 30 to be bonded to the first encapsulation element 20. It should be noted that if the first thickness TA is insufficient (e.g., too thin), the second portion 130B of the connector 130 may not deform or flatten and thus cannot be positioned as needed for the second encapsulation element 30. In some embodiments, the ratio of the second thickness TB to the length L is less than about 2%. Therefore, the second encapsulation element 30 can deform to conform to the bottom surface 131 of the connector 130. However, the invention is not limited thereto.
[0072] In some embodiments, the connector 130 may include an elastic material. For example, the elastic material includes polymers, rubber, silicone resins, other suitable elastic materials, or combinations thereof. However, the invention is not limited thereto. In some embodiments, the Shore A hardness of the elastic material is in the range of about 10 to about 90. It should be noted that if the Shore A hardness of the elastic material is too high, the connector 130 will not be able to deform sufficiently to flatten the second encapsulation element 30. Conversely, if the Shore A hardness of the elastic material is too low, the connector 130 will not have sufficient structural strength to hold the second encapsulation element 30.
[0073] For example, elastic materials can be tested according to standard specifications (such as ASTM D1349-99). More specifically, elastic materials can be tested at approximately 100°C for approximately 22 hours. After testing, the percentage of compression of the elastic material (measured in a single dimension) can be less than approximately 50%. In this way, the joint 130 can withstand multiple joining processes. In some embodiments, the joint 130 can be made as a single piece. However, the present invention is not limited thereto. In some embodiments, the joint 130 can be formed by combining separately manufactured different parts.
[0074] Figure 4 A plan view of a connector 130 and a second encapsulation element 30 according to some embodiments is shown. It should be noted that the second encapsulation element 30 is shown in dashed lines to show the vacuum hole 132 on the bottom surface 131 of the connector 130. Figure 4As shown, the connector 130 includes an adsorption region 135 with distributed vacuum holes 132. For example, the vacuum holes 132 are configured along the short side of the connector 130. However, the present invention is not limited thereto. In some embodiments, the vacuum holes 132 are configured along each side of the connector 130. In some embodiments, the vacuum holes 132 may be formed parallel to the edge of the second encapsulation element 30, so that the vacuum holes 132 may be configured linearly (e.g., substantially parallel to the Y direction). It should be noted that although five vacuum holes 132 are formed on each side of the connector 130, any suitable configuration of the vacuum holes 132 (including the number, position, etc.) is included within the scope of the present invention.
[0075] In some embodiments, the connector 130 has a length L and a width W, the second encapsulation element 30 has a length L1 and a width W1, and the adsorption region 135 has a length L2 and a width W2. It should be understood that the lengths L, L1, and L2 can be measured in a direction substantially parallel to the X-axis, and the widths W, W1, and W2 can be measured in a direction substantially parallel to the Y-axis. However, the present invention is not limited thereto.
[0076] In some embodiments, the cross-sectional area of the connector 130 is larger than the cross-sectional area of the second encapsulation element 30 in a horizontal plane (e.g., the XY plane). That is, the length L of the connector 130 is greater than the length L1 of the second encapsulation element 30, and the width W of the connector 130 is greater than the width W1 of the second encapsulation element 30. Therefore, the connector 130 can completely cover the second encapsulation element 30, thereby reducing the risk of the second encapsulation element 30 accidentally separating from the connector 130.
[0077] In some embodiments, the length L1 of the second encapsulation element 30 is greater than the length L2 of the adsorption region 135 of the distributed vacuum aperture 132. The width W1 of the second encapsulation element 30 is greater than the width W2 of the adsorption region 135. In this way, the connector 130 can securely hold the second encapsulation element 30. In some embodiments, the length L2 of the adsorption region 135 is approximately 0.7 times greater than the length L1 of the second encapsulation element 30. The width W2 of the adsorption region 135 is approximately 0.7 times greater than the width W1 of the second encapsulation element 30. Therefore, the adsorption region 135 (vacuum aperture 132) can provide sufficient suction to hold the second encapsulation element 30. It should be noted that the deformation of the second encapsulation element 30 depends on the thickness of the second encapsulation element 30 and the suction force. Therefore, the adsorption force from the adsorption region 135 can be adjustable to provide sufficient adsorption force to hold various second encapsulation elements 30.
[0078] In some embodiments, the connector 130, the second encapsulation element 30, and the adsorption region 135 may be rectangular in a horizontal plane (e.g., the XY plane). However, the present invention is not limited thereto. Any suitable shape and configuration of the connector 130, the second encapsulation element 30, and the adsorption region 135 is acceptable in the present invention.
[0079] Figures 5A to 5D A cross-sectional view is shown of intermediate steps in a method for manufacturing a package structure 50 according to some embodiments. It should be noted that the package structure 50 can be formed in the processing chamber 100 by bonding a second package element 30 to a first package element 20. However, the present invention is not limited thereto. Figures 5A to 5D The steps shown can be performed in the processing chamber 100 or at any other suitable location.
[0080] like Figure 5A As shown, a first packaged element 20 is positioned on a chuck stage 150 such that the chuck stage 150 holds the first packaged element 20 for subsequent bonding processes. In some embodiments, the first packaged element 20 may be formed of a semiconductor material, such as silicon, silicon germanium, silicon carbide, gallium arsenide, or other commonly used semiconductor materials. In some embodiments, the first packaged element 20 is a device wafer and includes at least one element, which may be a passive element (e.g., a resistor, capacitor, and inductor) or an active element (e.g., a transistor and diode). However, the present invention is not limited thereto.
[0081] In some embodiments, the first package element 20 has a plurality of die regions (not shown separately) that can be monolithically formed from a device wafer to form a semiconductor chip, each similar to the second package element 30 described below. In these embodiments, the size of the first package element 20 is much larger than the size of the second package element 30. In some embodiments, the die regions may remain unmonolithically formed within the device wafer. In these embodiments, the size of the first package element 20 substantially corresponds to the size of the second package element 30.
[0082] In some embodiments, the first package element 20 is formed of a dielectric material, such as glass, alumina, aluminum nitride, or a combination thereof. The first package element 20 does not contain passive components (e.g., resistors, capacitors, and inductors) or active components (e.g., transistors and diodes). In some embodiments, the first package element 20 is an interposer wafer. In other words, the second package element 30 may be bonded to the interposer wafer, rather than to the device wafer as described above. The interposer wafer is sandwiched between package elements (e.g., the semiconductor chip and package substrate (not shown) described above) in the final package structure (which may be a chip-on-wafer-on-substrate (CoWoS) structure) and configured to interconnect these vertically separated package elements. While the first package element 20 has been described above, the present invention is not limited thereto. It should be noted that the first package element 20 can be any desired semiconductor structure.
[0083] Additionally, the second package element 30 is attached to the non-planar bottom surface 131 (i.e., curved surface) of the connector 130, such that the connector 130 holds the second package element 30. In some embodiments, the second package element 30 is a semiconductor die. For example, the semiconductor die may include a logic chip, a memory chip, a sensor chip, a digital chip, an analog chip, a wireless and radio frequency chip, a voltage regulator chip, an application-specific integrated circuit (ASIC), or any other type of semiconductor chip. In some embodiments, the second package element 30 is adsorbed onto the connector 130 by an adsorption force and is stably held by the connector 130. This can be achieved through a vacuum hole 132 on the bottom surface 131 of the connector 130 (e.g., see reference 132). Figure 4 This allows the second encapsulation element 30 to deform to conform to the contour (e.g., an arcuate contour) of the bottom surface 131 of the connector 130. Due to the deformation of the second encapsulation element 30, a lower contact portion 31 is formed corresponding to the top tip 131P of the bottom surface 131. For example, the lower contact portion 31 of the second encapsulation element 30 may be located directly below the top tip 131P of the bottom surface 131. The lower contact portion 31 of the second encapsulation element 30 may be defined as the portion closest to the lower chuck stage 150.
[0084] Next, as Figure 5BAs shown, the engagement head 130 is moved to bring the lower contact portion 31 of the second encapsulation element 30 into contact with the first encapsulation element 20. In some embodiments, the engagement head 130 moves vertically (e.g., downwards) toward the chuck stage 150. After the lower contact portion 31 of the second encapsulation element 30 contacts the first encapsulation element 20, the engagement head 130 moves continuously in a vertical direction (generally parallel to the Z-axis) until the edge of the second encapsulation element 30 also contacts the first encapsulation element 20, as shown. Figure 5C As shown. In this way, the second packaging element 30 contacts the first packaging element 20 from the center to the edge, which helps to expel air or gas from the space between the second packaging element 30 and the first packaging element 20. Therefore, the gap or void between the first packaging element 20 and the second packaging element 30 can be minimized, thereby improving the quality and reliability of the package structure 50 to be formed.
[0085] Next, as Figure 5C As shown, after the lower contact portion 31 of the second encapsulation element 30 contacts the first encapsulation element 20, the second encapsulation element 30 is planarized on the bottom surface 131 of the connector 130. More specifically, as the connector 130 moves downward, a portion of the bottom surface 131 of the connector 130 (e.g., the portion directly above the second encapsulation element 30) is planarized. Since the connector 130 is made of an elastic (deformable) material, deformation of the connector 130 will not damage the second encapsulation element 30 held on the connector 130. Furthermore, the connector 130 ensures that the second encapsulation element 30 is planarized and in complete contact with the first encapsulation element 20. Next, since the second encapsulation element 30 has been positioned above the first encapsulation element 20, the adhesive force used to hold the second encapsulation element 30 can be released, thereby releasing the second encapsulation element 30 from the connector 130.
[0086] In some embodiments, the bonding process between the first packaging element 20 and the second packaging element 30 may be performed after the adsorption force used to hold the second packaging element 30 is released. However, the present invention is not limited thereto. In some embodiments, the bonding process between the first packaging element 20 and the second packaging element 30 may be performed while the adsorption force used to hold the second packaging element 30 is still present.
[0087] For example, the bonding process between the first package element 20 and the second package element 30 includes heating the first package element 20 using a chuck stage 150 to bond the first package element 20 to the second package element 30. However, the present invention is not limited thereto. In some embodiments, the bonding process between the first package element 20 and the second package element 30 includes using an adhesive (not shown) to adhere the second package element 30 to the first package element 20.
[0088] Next, asFigure 5D As shown, after the second encapsulation element 30 is disposed above the first encapsulation element 20, the connector 130 moves away from the second encapsulation element 30. In some embodiments, after the second encapsulation element 30 is bonded to the first encapsulation element 20, the connector 130 moves away from the second encapsulation element 30. Because the connector 130 is made of an elastic (deformable) material, the connector 130 can spring back and have a curved bottom surface 131 for subsequent bonding processes.
[0089] Figure 6A A schematic diagram of a connector 230 according to some embodiments is shown. It should be noted that the connector 230 may include components that... Figures 2 to 4 The components or parts of the connector 130 shown are the same as or similar to those components or parts. These components or parts will be labeled with similar reference numerals and will not be described in detail below. Figure 6A As shown, the connector 230 includes a plurality of vacuum holes 232 formed on the bottom surface 231. The connector 230 can be divided into a first portion 230A and a second portion 230B connected to the first portion 230A. For example, the first portion 230A may be referred to as the portion of the connector 230 with a constant length. The second portion 230B may be referred to as the portion of the connector 230 whose length gradually decreases from the first portion 230A.
[0090] The difference between the connectors 130 and 230 lies in the shape of the bottom surface 231, which is dome-shaped or roof-shaped. In some embodiments, the top end 231P may be located at the center of the bottom surface 231 and protrude from each edge of the bottom surface 231. In some embodiments, the vacuum hole 232 may be configured on each side of the bottom surface 231 and closer to the edge of the bottom surface 231 than the top end 231P. However, the present invention is not limited thereto. In some embodiments, the top end 231P may be offset from the center of the bottom surface 231.
[0091] Figure 6B and Figure 6C Show Figure 6A The diagram shows a cross-sectional view of the joint 230. It should be noted that... Figure 6B You can follow Figure 6A The line BB shown is illustrated, and Figure 6C You can follow Figure 6A The line CC is shown. However, this invention is not limited thereto. Figure 6B and Figure 6C As shown, the bottom surface 231 is inclined (i.e., not parallel) relative to a horizontal plane (e.g., an XY plane) on the opposite side of the top surface 231P, therefore the bottom surface 231 is non-planar. In some embodiments, the top surface 231P may extend linearly. However, the present invention is not limited thereto.
[0092] Figure 7A schematic diagram of a coupling head 330 according to some embodiments is shown. It should be noted that the coupling head 330 may include components that... Figures 2 to 4 The components or parts of the connector 130 shown are the same as or similar to those components or parts. These components or parts will be labeled with similar reference numerals and will not be described in detail below. Figure 7 As shown, the connector 330 includes a plurality of vacuum holes 332 formed on the bottom surface 331. The connector 330 can be divided into a first portion 330A and a second portion 330B connected to the first portion 330A. For example, the first portion 330A may be referred to as the portion of the connector 330 with a constant length. The second portion 330B may be referred to as the portion of the connector 330 with a gradually decreasing length.
[0093] The difference between connectors 130 and 330 is that the tip 331P may be offset from the center of the bottom surface 331. That is, connector 330 may be asymmetrical. This feature can help hold various second package elements 30, as some areas of the second package element 30 may be more flexible or less flexible. The tip 331P may be located in the more flexible area corresponding to the second package element 30, thereby helping to hold the second package element 30 on the bottom surface 331 of connector 330.
[0094] Embodiments of processing apparatus and methods for forming package structures are provided. The processing apparatus includes a connector with a non-planar (e.g., curved) bottom surface. Therefore, the package element attached to the connector can be deformed into a curved shape. In the bonding process, the lower contact portion of the package element first contacts the underlying element, and subsequently, the edge of the package element contacts the underlying element. This minimizes the gap or void between the package element and the underlying element, thereby improving the quality and reliability of the package structure to be formed. Furthermore, the profile of the bottom surface of the connector is variable to accommodate different package elements, further improving the quality and reliability of the package structure.
[0095] In some embodiments, a processing apparatus for manufacturing a package structure is provided. The processing apparatus includes a processing chamber for engaging a first package element and a second package element. The processing apparatus includes a bonding head disposed within the processing chamber for holding the second package element. The processing apparatus also includes a chuck stage disposed within the processing chamber for holding the first package element. The bonding head has a bottom surface facing the top surface of the chuck stage, and the bottom surface of the bonding head is a non-planar surface.
[0096] In some embodiments, the bottom surface of the connector is curved, and a plurality of vacuum holes are formed on the bottom surface of the connector.
[0097] In some embodiments, the connector has an arcuate profile along its long side.
[0098] In some embodiments, the top edge of the bottom surface of the connector is offset from the center of the bottom surface of the connector.
[0099] In some embodiments, the cross-sectional area of the joint changes along a direction parallel to the long side of the joint.
[0100] In some embodiments, the joint comprises an elastic material with a Shore A hardness in the range of 10 to 90.
[0101] In some embodiments, a processing apparatus for manufacturing a package structure is provided. The processing apparatus includes a processing chamber for engaging a first package element and a second package element. The processing apparatus includes a coupling head disposed within the processing chamber for holding the second package element. The coupling head is deformable to flatten its bottom surface. The processing apparatus also includes a chuck stage disposed within the processing chamber for holding the first package element.
[0102] In some embodiments, a plurality of vacuum holes are distributed in the adsorption region of the joint, the length of the second encapsulation element is greater than the length of the adsorption region, and the length of the adsorption region is greater than or equal to 0.7 times the length of the second encapsulation element.
[0103] In some embodiments, the bottom surface of the joint is arc-shaped, roof-shaped, or dome-shaped.
[0104] In some embodiments, the tip of the connector is located at the center of the bottom surface of the connector, and a plurality of vacuum holes are distributed symmetrically with respect to the tip.
[0105] In some embodiments, vacuum holes are arranged along the short side of the joint.
[0106] In some embodiments, the tip of the connector is offset from the center of the bottom surface of the connector.
[0107] In some embodiments, the bottom surface of the connector has a top end that protrudes toward the chuck stage, and a plurality of vacuum holes are formed around the top end of the bottom surface of the connector.
[0108] In some embodiments, a method of manufacturing a package structure is provided. The method includes positioning a first package element on a chuck stage. The method includes attaching a second package element to a non-planar surface of a connector. The method includes moving the connector to bring the second package element into contact with the first package element. The method includes planarizing the second package element after it has contacted the first package element. The method further includes releasing the second package element from the connector after planarizing it over the first package element.
[0109] In some embodiments, attaching the second encapsulation element to the non-planar surface of the connector includes introducing suction through a plurality of vacuum holes on the non-planar surface of the connector.
[0110] In some embodiments, attaching the second encapsulation element to the non-planar surface of the connector includes deforming the second encapsulation element to conform to the contour of the non-planar surface of the connector.
[0111] In some embodiments, planarizing the second package element further includes: after the second package element contacts the first package element, making the edge of the second package element contact the first package element.
[0112] In some embodiments, planarizing the second package element further includes planarizing a portion of the non-planar surface of the connector above the second package element.
[0113] In some embodiments, the method further includes: after planarizing the second packaging element, joining the first packaging element and the second packaging element to form a packaging structure.
[0114] In some embodiments, the method further includes heating the first package element via a chuck stage while attaching the first package element to the second package element.
[0115] The foregoing outlines the features of numerous embodiments to enable those skilled in the art to better understand the various embodiments of this utility model. Those skilled in the art should understand that other processes and structures can be easily designed or modified based on the embodiments of this utility model to achieve the same objectives and / or advantages as the embodiments described herein. Those skilled in the art should also understand that these equivalent structures do not depart from the spirit and scope of this utility model. Various changes, substitutions, and modifications can be made to the embodiments of this utility model without departing from the spirit and scope of the appended claims.
Claims
1. A processing apparatus for manufacturing a package structure, characterized by comprising: Including: a processing chamber for joining a first packaging element and a second packaging element; a bonding head disposed in the processing chamber for holding the second packaging element; and a chuck table disposed in the processing chamber for holding the first packaging element, wherein the bonding head has a bottom surface facing a top surface of the chuck table, and the bottom surface of the bonding head is a non-planar surface.
2. The processing apparatus of claim 1, wherein The bottom surface of the bonding head is curved, and a plurality of vacuum holes are formed on the bottom surface of the bonding head.
3. The processing apparatus of claim 2, wherein The bonding head has an arc-shaped profile along a long edge of the bonding head.
4. The processing apparatus of claim 2, wherein A top end of the bottom surface of the bonding head deviates from a center of the bottom surface of the bonding head.
5. The processing apparatus of claim 1, wherein The cross-sectional area of the bonding head changes along a direction parallel to a long edge of the bonding head.
6. A processing apparatus for manufacturing a package structure, characterized by comprising: Including: a processing chamber for joining a first packaging element and a second packaging element; a bonding head disposed in the processing chamber for holding the second packaging element, wherein the bonding head is deformable to flatten a bottom surface of the bonding head; and a chuck table disposed in the processing chamber for holding the first packaging element.
7. The processing apparatus of claim 6, wherein A plurality of vacuum holes are distributed within a suction area of the bonding head, a length of the second packaging element is greater than a length of the suction area, and the length of the suction area is greater than or equal to 0.7 times the length of the second packaging element.
8. The processing apparatus of claim 6, wherein The bottom surface of the bonding head is arc-shaped, roof-shaped or dome-shaped.
9. The processing apparatus of claim 6, wherein A top end of the bonding head is located at a center of the bottom surface of the bonding head, and a plurality of vacuum holes are symmetrically distributed around the top end and arranged along a short edge of the bonding head.
10. The processing apparatus of claim 6, wherein The bottom surface of the bonding head has a top end protruding towards the chuck table, and a plurality of vacuum holes are formed around the top end of the bottom surface of the bonding head.