Taitao film tearing workbench and Taitao film tearing device
By introducing a flow monitoring element into the taigu film tearing workbench, the high fragmentation rate caused by wafer breakage can be monitored in real time, thus solving the problem and enabling timely detection and elimination of the cause of breakage, thereby reducing the fragmentation rate.
Patent Information
- Application Number
- CN202423250729.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In the existing TIDDOS film removal process, the fragmentation rate caused by wafer breakage is high. Existing equipment cannot detect and eliminate the cause of breakage in time, resulting in continuous fragmentation.
Design a taiko film tearing worktable, including an annular adsorption component, a stage body, an air inlet channel, an air outlet channel, a valve, and a flow monitoring element. By monitoring the change in the flow rate of the detection gas, it can determine whether the wafer is cracked and promptly detect and eliminate the cause of the crack.
This technology enables timely detection of wafer breakage during the tako decoction process, reducing the breakage rate and preventing the equipment from continuing to operate under broken conditions.
Smart Images
Figure CN223798681U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor production equipment, specifically relates to a drum tear film workstation and device. BACKGROUND
[0002] The drum wafer tear film is an important process in the semiconductor process. With the improvement of the requirement of chip performance, the thickness of power semiconductor device products is getting thinner and thinner, which leads to the higher and higher fragment rate in the process of drum tear film. Through monitoring the fragments, the causes leading to the fragments are analyzed and excluded in time, which is an effective measure to reduce the fragment rate. UTILITY MODEL CONTENTS
[0003] The utility model discloses a drum tear film workstation and device, which aims at monitoring the fragments in the process of drum tear film, and then the causes of the fragments can be found and excluded in time to reduce the fragment rate.
[0004] To achieve the above object, the utility model provides a drum tear film workstation, which comprises:
[0005] Annular suction accessory;
[0006] The table body carries the annular suction accessory;The table body and the inner side surface of the annular suction accessory jointly define an inflation space;The table body is provided with an air inlet channel and an air outlet channel;The air inlet channel communicates the inflation space with the external space;
[0007] Valve, set at the air outlet channel, and be configured to open under the preset condition, so that the inflation space is communicated with the external space through the air outlet channel;And,
[0008] Flow monitoring element, set at the valve.
[0009] Optionally, the air inlet channel comprises an air inlet end and a plurality of air outlet ends, and the plurality of air outlet ends are dispersedly arranged on the surface of the table body facing the inflation space.
[0010] Optionally, the number of air inlet channels is two.
[0011] Optionally, the drum tear film workstation further comprises a controller, an alarm and the controller is respectively in communication connection with the alarm, the flow monitoring element, and the controller is configured to control the alarm to generate a first alarm when the flow value monitored by the flow monitoring element is greater than zero and less than a preset flow.
[0012] Optionally, the valve is an overflow valve, and the preset condition is that the air pressure in the inflation space reaches a preset pressure.
[0013] Optionally, the controller is further configured to control the alarm to generate a second alarm when the flow value monitored by the flow monitoring element is always zero.
[0014] Optionally, the taiko film tearing workbench further comprises a timer configured to monitor a time length of the wafer being adsorbed by the annular adsorption member; and the preset condition is that the time length monitored by the timer reaches a preset time length.
[0015] The controller is in communication connection with the timer and the valve respectively, and the controller is configured to control the valve to open when the time length monitored by the timer reaches the preset time length.
[0016] To achieve the above object, the utility model further provides a taiko film tearing device, including film tearing mechanism and thousand any one of the taiko film tearing workbench, film tearing mechanism sets up in the annular adsorption member is away from the one side of the table body.
[0017] Optionally, the taiko film tearing device further comprises a gas source connected to the air inlet channel through a pipeline.
[0018] Optionally, the taiko film tearing device further comprises a pressure stabilizing mechanism arranged between the gas source and the air inlet channel and configured to stabilize the pressure of the detection gas supplied to the air inlet channel; and / or,
[0019] The taiko film tearing device further comprises a pressure detecting element arranged between the gas source and the air inlet channel and configured to monitor the pressure of the detection gas supplied to the air inlet channel.
[0020] Compared with the prior art, the taiko film tearing workbench and device have the following advantages:
[0021] The aforementioned taiko film tearing workbench includes a table body, an annular suction component, a valve, and a flow monitoring element; the annular suction component is arranged on the table body, and the inner side surface of the annular suction component and the table body jointly define an inflation space; an air inlet channel is arranged on the table body, and the air inlet channel connects the inflation space with the external space; an air outlet channel is further arranged on the table body, a valve is arranged at the air outlet channel, and the valve is configured to be opened under preset conditions so that the inflation space is connected with the external space through the air outlet channel; the flow monitoring element is arranged at the valve. When performing the taiko film tearing process, the annular suction component adsorbs the wafer, the air inlet channel is connected with an air source so that the detection gas provided by the air source enters the inflation space through the air inlet channel. When the valve is opened, if the wafer is not broken, the flow rate of the detection gas flowing out from the valve is not lower than a preset value, and if the wafer is broken, since part of the detection gas leaks from the crack of the wafer, the flow rate of the detection gas flowing out from the valve is lower than the preset value. In other words, by monitoring the flow rate of the detection gas flowing out from the valve through the flow monitoring element, it can be judged whether the wafer is broken. Furthermore, the operator can timely analyze and eliminate the reasons causing the wafer to break, and avoid the continuous operation of the taiko film tearing device including the taiko film tearing workbench when the reasons for causing the wafer to break exist, thereby reducing the fragmentation rate. Description of the Drawings
[0022] The drawings are used to better understand the present invention and do not constitute an improper limitation to the present invention. Among them:
[0023] Figure 1 is a schematic diagram of the working scenario of a taiko film tearing device in the prior art;
[0024] Figure 2 is a schematic diagram when the taiko ring of the wafer is separated from the annular adsorption mechanism during the working process of a taiko film tearing device in the prior art;
[0025] Figure 3 is a schematic diagram of a broken wafer during the taiko film tearing process, and the break in the figure is a "one" - shaped crack;
[0026] Figure 4 is a schematic diagram of a broken wafer during the taiko film tearing process, and the break in the figure is a "square" - shaped crack
[0027] Figure 5 is a schematic diagram of the structure of the taiko film tearing workbench provided by the present invention according to an embodiment;
[0028] Figure 6 is a schematic diagram of the structure of the taiko film tearing workbench provided by the present invention according to an embodiment, Figure 2 andFigure 1 The observation directions are different;
[0029] Figure 7 This is a partial structural schematic diagram of the taiko tearing film device provided in this embodiment of the utility model;
[0030] Figure 8 This is a schematic diagram of the working scene of the taiko film tearing device provided in this embodiment of the utility model.
[0031] [The annotations in the attached figures are explained below]:
[0032] 1. 100 - Taiko tearing worktable; 11. 110 - Worktable body; 111 - Air inlet channel; 111a - Air inlet end; 111b - Air outlet end; 112 - Air outlet channel; 101 - Inflation space; 12. 120 - Ring-shaped adsorption element; 121. 1210 - Vacuum adsorption hole; 13 - Vacuum detection element; 14. 160 - Alarm; 130 - Valve; 140 - Flow monitoring element; 150 - Controller; 2. 200 - Tearing mechanism; 300 - Air source; 400 - Pressure stabilizing mechanism; 500 - Pressure monitoring element; 1000 - Taiko tearing device; 3 - Wafer; 31 - Wafer body; 32 - Taiko ring; 301 - Crack; 4 - Protective film. Detailed Implementation
[0033] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.
[0034] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.
[0035] As used in the specification, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used in the specification, the term "or" is generally used in the sense that it is used in the patent or patent application context in the United States, i.e., in the sense of "and / or," unless the context clearly dictates otherwise. The term "and / or" as used in the specification means "and" or "or," i.e., it means "and" in some instances and "or" in other instances. The terms "mounting," "connected," "connecting," or "connection" should be interpreted broadly from the context in which they are used, e.g., fixed connections, detachable connections, or integral connections. They can be mechanical or electrical connections. They can be direct connections or indirect connections through an intermediate medium. They can be internal connections of two elements or interaction relationship between two elements. The terms "first," "second," and the like are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between the entities or operations, nor indicate or imply relative importance or imply a specific number of the indicated technical features. The specific meaning of the above terms in the present application can be understood according to the specific circumstances by those skilled in the art.
[0036] The partial structure of the prior art drum film tearing device is shown in Figure 1 The drum film tearing device includes a drum film tearing workbench 1 and a film tearing mechanism 2. The drum film tearing workbench 1 includes a bench body 11, an annular suction member 12, a vacuum detection element 13, and an alarm 14. The annular suction member 12 is arranged on the bench body 11, and the annular suction member 12 is provided with vacuum suction holes 121 arranged at intervals in the circumferential direction thereof. The vacuum detection element 13 is configured to detect the negative pressure of the annular suction member 12, and the alarm 14 is in communication connection with the vacuum detection element 13.
[0037] When the drum film tearing process is performed by using the drum film tearing device, the drum ring 32 of the wafer 3 to be torn is in contact with the annular suction member 12, so that the annular suction member 12 adsorbs the wafer 3 through the vacuum suction holes 121 thereon, and then the protective film 4 located on the front surface of the wafer 3 is torn off through the relative movement of the film tearing mechanism 3 and the bench body 11.
[0038] During the film tearing process, the vacuum detection element 13 detects in real time whether the negative pressure of the annular suction member 12 is normal. When the drum ring 32 is partially separated from the annular suction member 12, or the drum ring 21 is broken, at least part of the vacuum suction holes 121 are in communication with the outside, thereby causing the negative pressure of the annular suction member 12 to be abnormal, and the abnormality is monitored by the vacuum detection element 13, which causes the alarm 14 to generate an alarm to alert the operator. However, if a rupture occurs in other parts of the wafer 3, for example, a rupture is formed on the wafer body 31 of the wafer 3 as shown in Figure 3The crack 301 in the shape of "one" shown by the dashed line in the figure or when the crack 301 in the shape of "square" shown by the dashed line in the figure is formed, since this kind of rupture will not cause abnormal negative pressure of the annular suction attachment 12, it will not be detected by the vacuum detection element 13, nor will it cause the alarm 14 to alarm, and the operator cannot timely discover the occurrence of debris, and thus cannot analyze and process the cause of the debris. Therefore, the drum film tearing device continues to operate when the cause of the rupture of the wafer body 31 exists, resulting in more debris situations. Figure 4 When the crack 301 in the shape of "square" shown by the dashed line in the figure is formed, since this kind of rupture will not cause abnormal negative pressure of the annular suction attachment 12, it will not be detected by the vacuum detection element 13, nor will it cause the alarm 14 to alarm, and the operator cannot timely discover the occurrence of debris, and thus cannot analyze and process the cause of the debris. Therefore, the drum film tearing device continues to operate when the cause of the rupture of the wafer body 31 exists, resulting in more debris situations.
[0039] In view of this, the embodiment of the present invention provides a drum film tearing workbench and a drum film tearing device including the drum film tearing workbench. The application of the drum film tearing workbench enables the operator to timely discover and eliminate the cause of the rupture of the wafer body 31, and avoid the drum film tearing device from continuing to operate when the cause of the fragmentation exists, thereby reducing the fragmentation rate.
[0040] To make the purpose, advantages and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for the purpose of conveniently and clearly assisting in explaining the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.
[0041] <Example 1>
[0042] Figure 5 and Figure 6 show a schematic structural diagram of the drum film tearing workbench 100 provided in this embodiment. As Figure 5 and Figure 6 shown, the drum film tearing workbench 100 includes a table body 110, an annular suction attachment 120, a valve 130 and a flow monitoring element 140.
[0043] The annular suction attachment 120 is disposed on the table body 110, and the inner side surface of the annular suction attachment 120 and the table body 110 together define an inflation space 101. It can be understood that when the drum film tearing workbench 100 does not carry the wafer 3, the end of the inflation space 101 away from the table body 110 is an open end.
[0044] The table body 110 is provided with an air inlet channel 111 and an air outlet channel 112. The air-filled space 101 communicates with the external space through the air inlet channel 111. The valve 130 is arranged at the air outlet channel 112, and the valve 130 is opened under a preset condition. The flow monitoring element 140 is arranged at the valve 130. When the valve 130 is opened, the air-filled space 101 also communicates with the external space through the air outlet channel 112. When the valve 130 is closed, the air-filled space 101 cannot communicate with the external space through the air outlet channel 112.
[0045] Figure 7 A partial structural schematic diagram of a drum film tearing device 1000 including the drum film tearing table 100 is shown. As shown, the drum film tearing device 1000 also includes a film tearing mechanism 200, which is located on the side of the annular suction member 120 away from the table body 110. Figure 7
[0046] Figure 8 A working scene schematic diagram of the drum film tearing device 1000 is shown. When the drum film tearing process is performed by using the drum film tearing device 1000, a wafer 3 is located on the side of the film tearing mechanism 200 facing the annular suction member 120. The annular suction member 120 contacts the drum ring 32 of the wafer 3, and then adsorbs the wafer 3, so that the opening end of the air-filled space 101 is closed by the wafer 3. Then, through the relative movement of the film tearing mechanism 200 and the table body 110, the protective film 4 on the front side of the wafer 3 can be torn off. It should be understood that the structure of the annular suction member 120 is similar to that of the annular suction member 12 in the prior art, and a plurality of vacuum suction holes 1210 are arranged on the annular suction member 120 in a circumferential direction. By forming a negative pressure on the annular suction member 120, a negative pressure is formed on the vacuum suction holes 1210 to adsorb the wafer 3.
[0047] During the film tearing process, an air source 300 communicates with the air inlet channel 112 through a pipeline (not labeled in the figure) and provides detection gas to the air-filled space 101. The detection gas includes but is not limited to any one of nitrogen and helium.
[0048] In this embodiment, the valve 130 is an overflow valve, and correspondingly, the preset condition is that the air pressure in the air-filled space 101 reaches a preset pressure, which can be referred to as a first preset pressure. That is, when the air pressure in the air-filled space 101 reaches the preset pressure, the valve 130 is opened, so that the air-filled space 101 communicates with the external space through the air outlet channel 112, and then the detection gas can flow out of the air-filled space 101 from the air outlet channel 112.
[0049] After the valve 130 is opened, if the wafer body 31 is not broken, the detection gas can only flow out of the inflation space 101 from the gas outlet channel 112, and if the wafer body 31 is broken, the detection gas can flow out of the inflation space 101 not only from the gas outlet channel 112 but also from the cracks on the wafer body 31, which results in a decrease in the flow rate of the detection gas flowing out of the gas outlet channel 112. In practice, when the wafer body 31 is not broken, the flow rate of the detection gas flowing out of the valve 130 is not less than a preset flow rate, which is referred to as a first preset flow rate; when the wafer body 31 is broken, the flow rate of the detection gas flowing out of the valve 130 is less than the first preset flow rate. Thus, by monitoring the flow rate of the detection gas flowing through the valve 130 by the flow monitoring element 140, it can be known whether the wafer body 31 is broken, thereby achieving the effect of monitoring in real time whether the wafer 3 is broken during the execution of the drum film tearing process.
[0050] In a specific example, the pressure of the detection gas supplied by the gas source 300 to the inflation space 101 is 0.007 mpa. It has been tested that when the first preset pressure is 0.005 mpa, when the wafer body 31 is not broken and the valve 130 is opened, the flow rate of the detection gas flowing out of the gas outlet channel 112 is about 300 ml / min, and when the wafer body 31 is broken and the valve 130 is opened, the flow rate of the detection gas flowing out of the gas outlet channel 112 varies according to the size of the cracks on the wafer body 31, but is not greater than 110 ml / min. In this example, the first preset flow rate can be set to a value between 110 ml / min and 300 ml / min, such as 200 ml / min or 180 ml / min or 150 ml / min, etc. Of course, the first preset flow rate can also be other suitable values.
[0051] In other examples, the pressure of the detection gas supplied by the gas source 300 to the inflation space 101 can also be other values, such as 0.004 mpa, 0.005 mpa, 0.006 mpa, 0.008 mpa, 0.009 mpa, etc., which are selected according to actual needs. The specific value of the first preset pressure and the specific value of the first preset flow rate are set according to actual conditions. It can be understood that the specific value of the first preset pressure should be such that the drum film tearing device 1000 itself can be normally operated when the wafer body 31 is broken or not broken.
[0052] In the embodiment, the number of the air inlet channels 111 can be one, or more than two, for example, two, three, four or more. However, considering the size of the table body 110 and the daily maintenance, the number of the air inlet channels 111 is preferably two. Further preferably, each of the air inlet channels 111 includes an air inlet end 111a for connecting with the air source and a plurality of air outlet ends 111b distributed on the surface of the table body 110 facing the air filling space 101 (as shown in the figure). That is, the detection gas from the air inlet channel 111 can enter the air filling space 101 from the plurality of air outlet ends 111b, which is beneficial to the uniform distribution of the detection gas in the air filling space 101, and improves the uniformity of the air pressure in the air filling space 101. It should be noted that the number of the air outlet ends 111b of different air inlet channels 111 can be the same or different. Figure 2
[0053] Further, the taiko tear film workbench 100 further includes a controller 150 and an alarm 160. The controller 150 is in communication connection with the flow monitoring element 140 and the alarm 160, respectively. The controller 150 is configured to receive the actual flow value monitored by the flow monitoring element 140, and to determine the relationship between the actual flow value and the first preset flow value, and to control the alarm 160 to generate a first alarm when the actual flow value is less than the first preset flow value, so as to prompt the operator that the wafer body 31 is broken.
[0054] The taiko tear film device 1000 can further include the air source 300.
[0055] Optionally, the taiko tear film device 1000 further includes a pressure stabilizing mechanism 400 arranged on the pipeline between the air source 200 and the air inlet channel 111. The pressure stabilizing mechanism 400 is configured to maintain the pressure of the detection gas supplied by the air source 200 to the air inlet channel 111 stable.
[0056] Optionally, the taiko tear film device 1000 further includes a pressure monitoring element 500 arranged on the pipeline between the air source 200 and the air inlet channel 111. The pressure monitoring element 500 is configured to monitor the pressure of the detection gas supplied to the air inlet channel 111.
[0057] It should be noted that when some abnormal conditions occur in the drum film tearing device 1000 itself, the pressure in the air-filled space 101 cannot reach the first preset pressure, so that the valve 130 cannot be opened and the flow monitoring element 140 cannot monitor the flow of the detection gas from the air outlet channel 112. In this case, the controller 150 is further configured to control the alarm to generate a second alarm when the actual flow value monitored by the flow monitoring element 140 during the operation of the drum film tearing device 1000 is always zero, so as to remind the operator to check the drum film tearing device 1000. The abnormal conditions that may occur in the drum film tearing device 1000 include, for example, that the air inlet channel 111 is blocked or the air source 300 cannot supply air normally.
[0058] <Embodiment Two>
[0059] The drum film tearing workbench 100 provided in the present embodiment is different from the drum film tearing workbench 100 of Embodiment One in that the valve 130 is not an overflow valve but any suitable electromagnetic valve. Meanwhile, the drum film tearing workbench 100 provided in the present embodiment can further include a timer (not shown in the figure) for monitoring the length of time during which the annular suction member 120 sucks the wafer 3, and the controller 150 is in communication connection with the valve 130 and the timer, and is configured to receive the length of time monitored by the timer and control the valve 130 to be opened when the length of time reaches a preset length of time. That is, in the present embodiment, the preset condition is that the length of time during which the annular suction member 120 sucks the wafer 3 reaches the preset length of time.
[0060] It can be understood that when the wafer body 31 of the wafer 3 sucked by the annular suction member 120 is not broken, the air pressure in the air-filled space 101 reaches a second preset pressure within the preset length of time, and if the valve 130 is opened at this time, the flow of the detection gas from the air outlet channel 112 is not less than a second preset flow; when the wafer body 31 of the wafer 3 sucked by the annular suction member 120 is broken, the air pressure in the air-filled space 101 cannot reach the second preset pressure within the preset length of time, and if the valve 130 is opened at this time, the flow of the detection gas from the air outlet channel 112 is less than the second preset flow. Therefore, in the present embodiment, the flow of the detection gas flowing through the valve 140 monitored by the flow monitoring element 140 can also be used to determine whether the wafer body 31 is broken.
[0061] It should be understood that the preset time length is set according to the second preset pressure and the parameters such as the gas pressure and flow rate of the detection gas provided by the gas source 300. In addition, the second preset pressure can be the same as the first preset pressure, or different from the first preset pressure; similarly, the second preset flow rate can be the same as the first preset flow rate, or different from the first preset flow rate.
[0062] Although the present application has been disclosed with reference to the above embodiments, it is not limited thereto. It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit and scope of the application. Thus, it is intended that the present application cover modifications and variations of this application provided they come within the scope of the appended claims and their equivalents.
Claims
1. A taiko film tearing table, characterized by, The drum film tearing workbench comprises: a ring-shaped suction member; a table body carrying the ring-shaped suction member; the table body and an inner side surface of the ring-shaped suction member jointly defining an inflation space; the table body is provided with an air inlet channel and an air outlet channel; the air inlet channel is in communication with the inflation space and an external space; a valve is arranged at the air outlet channel and is configured to be opened under a preset condition to enable the inflation space to be in communication with the external space through the air outlet channel; and a flow monitoring element is arranged at the valve.
2. The taiko tear film station of claim 1, wherein, The air inlet channel comprises an air inlet end and a plurality of air outlet ends, and the plurality of air outlet ends are dispersedly arranged on a surface of the table body facing the inflation space.
3. The taiko tear film station according to claim 1 or 2, characterized in that, The number of the air inlet channels is two.
4. The taiko tear film station of claim 1, wherein, The drum film tearing workbench further comprises a controller, an alarm, and the controller is in communication connection with the alarm and the flow monitoring element, respectively; the controller is configured to control the alarm to generate a first alarm when the flow value monitored by the flow monitoring element is greater than zero and less than a preset flow value.
5. The taiko tear film station of claim 4, wherein, The valve is an overflow valve, and the preset condition is that the air pressure in the inflation space reaches a preset pressure.
6. The taiko tear film station of claim 5, wherein, The controller is further configured to control the alarm to generate a second alarm when the flow value monitored by the flow monitoring element is always zero.
7. The taiko tear film station of claim 4, wherein, The drum film tearing workbench further comprises a timer for monitoring the time length of the ring-shaped suction member adsorbing a wafer; the preset condition is that the time length monitored by the timer reaches a preset time length. The controller is further in communication connection with the timer and the valve, respectively; the controller is configured to control the valve to be opened when the time length monitored by the timer reaches the preset time length.
8. A taiko film tearing device characterized by The drum film tearing device comprises a film tearing mechanism and the drum film tearing workbench according to any one of claims 1-7; the film tearing mechanism is arranged on a side of the ring-shaped suction member away from the table body.
9. The too!less film tear device of claim 8, wherein, The drum film tearing device further comprises an air source, and the air source is connected with the air inlet channel through a pipeline.
10. The taiko peeling film device according to claim 9, characterized by The drum film tearing device further comprises a pressure stabilizing mechanism arranged between the air source and the air inlet channel and configured to stabilize the pressure of the detection gas supplied to the air inlet channel. And / or, The drum film tearing device further comprises a pressure detection element arranged between the air source and the air inlet channel and configured to monitor the pressure of the detection gas supplied to the air inlet channel.