Semiconductor device processing platform

Abstract

The utility model relates to the field of semiconductors, and discloses a semiconductor device processing platform which comprises a bottom plate, vertical plates are symmetrically and fixedly connected to the top of the bottom plate, a rotating seat is arranged between the vertical plates, rotating rods are fixedly connected to the two sides of the rotating seat, a stepping motor is fixedly connected to one side of each vertical plate, and the stepping motor is fixedly connected to the other side of each vertical plate. According to the semiconductor device processing platform, after bolts are screwed off and matched with limiting grooves and L-shaped limiting strips, the empty containing bases are detached, a semiconductor to be dried is installed on the containing bases and then reset, and after drying treatment of the bottom containing base is completed, the semiconductor to be dried is placed on the containing bases to be dried. And the top placing seat is rotated to the bottom by using the stepping motor for continuous drying, the processed semiconductor is taken down for subsequent processing, a new semiconductor is continuously loaded, and continuous drying processing is performed in such a way, so that the problem of low semiconductor drying processing efficiency caused by difficulty in continuous processing of an existing processing platform is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technology field, concretely is a kind of semiconductor device processing platform. BACKGROUND

[0002] Semiconductor refers to the conductivity performance between conductor and insulator at room temperature. Semiconductor has application in integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion and other fields, such as diode is the device made of semiconductor. From the angle of science and technology or economic development, the importance of semiconductor is very huge.

[0003] The patent with publication number CN219693742U discloses a kind of semiconductor component processing device, it includes bottom plate, in the top of bottom plate one side fixed installation has a support plate, another side fixed installation has a baking oven, the one side of support plate is installed with a motor, another side rotationally connects with a has the pad of rotating rod, rotating rod is fixedly connected with the output shaft of motor, the device can realize the individual placement of semiconductor component, effectively avoid the damage caused by the mutual extrusion and collision of semiconductor component, improve the yield of product;

[0004] But the device exists just only on the face of pad is set base plate, placement plate and other structures, this leads to when semiconductor component is turned over by pin location on placement plate, and is dried using baking oven, must wait after all semiconductor component on placement plate is dried, reset placement plate and take down semiconductor component, replace new semiconductor component to be dried to continue drying, operation is tedious, greatly reduce semiconductor component drying efficiency, for this, a kind of semiconductor device processing platform is presented, to solve the problem that the existing processing platform is difficult to continuous processing and leads to low semiconductor device drying processing efficiency. Utility model content

[0005] (One) the technical problem solved

[0006] In view of the deficiencies of prior art, the utility model provides a kind of semiconductor device processing platform, solves the above-mentioned problem.

[0007] (Two) technical scheme

[0008] In order to achieve the above object, the utility model provides the following technical scheme: A kind of semiconductor device processing platform, including bottom plate, the top of the bottom plate is symmetrical and is fixedly connected with vertical plate, rotating seat is arranged between the vertical plate, the both sides of the rotating seat are fixedly connected with rotating lever, the one side of the vertical plate is fixedly connected with step motor, the top and bottom of the rotating seat are rotatably provided with placing table, the top of the placing table is provided with placing seat, pin slot is opened in the top of the placing seat, limit slot is opened in the both sides of the placing seat, L-shaped limit strip is arranged in the inner cavity of the limit slot, the top of the placing seat is penetrated and is screwed with bolt, the top of the placing table is fixedly connected with baffle, the top of the bottom plate is provided with dryer, the one side of the vertical plate is provided with driving mechanism, receiving mechanism is arranged between the vertical plate.

[0009] Preferably, the rotating seat is rotatably connected between the vertical plate by rotating lever, and the output shaft of the step motor penetrates the vertical plate and is fixedly connected with the rotating lever.

[0010] Preferably, the L-shaped limit strip is fixedly connected with the placing table, the baffle is attached to the placing seat, the bolt penetrates the inner wall of the placing seat to the placing table, and the bolt and the placing table are screw-connected.

[0011] Preferably, the driving mechanism comprises a groove opened in the one side of the right vertical plate, the inner cavity of the groove is fixedly connected with a motor, the output shaft of the motor is fixedly connected with a rubber wheel, and the outer circle of the placing table is fixedly connected with a rubber strip.

[0012] Preferably, the rubber wheel is in interference extrusion contact with the rubber strip, a rotating groove is opened in the top of the placing table, a rotating column is rotatably connected in the inner cavity of the rotating groove, and the rotating column is fixedly connected with the rotating seat.

[0013] Preferably, the receiving mechanism comprises a moving groove opened in the one side of the vertical plate, a U-shaped receiving plate is slidably arranged in the inner cavity of the moving groove, and the U-shaped receiving plate is made of ordinary glass.

[0014] Preferably, a collection box is slidably arranged on the left side of the right vertical plate, a support is fixedly connected to the bottom of the U-shaped receiving plate, and a ball bearing is rotatably connected to the bottom of the support.

[0015] (Three) beneficial effects

[0016] 1. The semiconductor device processing platform, unscrew the bolts, cooperate with the limiting groove and the L-shaped limiting strip to disassemble the empty placing seat, install the semiconductor to be dried on the placing seat after resetting, continue to dry when the bottom placing seat is dried, take down the processed semiconductor for subsequent processing, continue to load new semiconductor, and the like, so as to solve the problem of low semiconductor drying processing efficiency caused by the difficulty of continuous processing of the existing processing platform.

[0017] 2. The semiconductor device processing platform, when the semiconductor on the bottom placing seat is dried, the motor in the groove is started, the rubber wheel on the output shaft is driven to rotate, and the placing table is driven to rotate under the action of the rubber strip extruded by the rubber wheel and the rotating column in the rotating groove, so as to drive the semiconductor on the placing seat to rotate and dry as much as possible to ensure that the semiconductor can be heated uniformly and improve the drying processing effect of the semiconductor device processing platform. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The utility model structural drawing is shown in the figure;

[0019] Figure 2 The utility model structural section view is shown in the figure;

[0020] Figure 3 The utility model structure is shown in the figure Figure 2 The utility model structure is shown in the figure

[0021] Figure 4 The utility model structure is shown in the figure

[0022] Figure 5 The utility model structure is shown in the figure.

[0023] In the figure: 1, bottom plate; 2, vertical plate; 3, rotating seat; 4, rotating rod; 5, stepping motor; 6, placing table; 7, placing seat; 8, pin groove; 9, limiting groove; 10, L-shaped limiting strip; 11, bolt; 12, blocking strip; 13, dryer; 14, driving mechanism; 141, recess; 142, motor; 143, rubber wheel; 144, rubber strip; 145, rotating groove; 146, rotating column; 15, receiving mechanism; 151, moving groove; 152, U-shaped receiving plate; 153, collection box; 154, support; 155, ball. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0025] EMBODIMENT: Please refer to Figures 1-5 A semiconductor device processing platform, including a bottom plate 1, the top of the bottom plate 1 is symmetrical and fixedly connected with the vertical plate 2, the vertical plate 2 is provided with a rotating seat 3, the rotating seat 3 is fixedly connected with the rotating rod 4 on both sides, the vertical plate 2 is fixedly connected with the step motor 5 on one side, the top of the rotating seat 3 is rotatably provided with a placing table 6, the top of the top placing table 6 is provided with a placing seat 7, the top of the placing seat 7 is provided with a pin slot 8, the both sides of the placing seat 7 are provided with a limiting slot 9, the inner cavity of the limiting slot 9 is provided with an L-shaped limiting strip 10, the top of the placing seat 7 penetrates and is screwed with a bolt 11, the top of the placing table 6 is fixedly connected with a blocking strip 12, the top of the bottom plate 1 is provided with a dryer 13, one side of the vertical plate 2 is provided with a driving mechanism 14, and the vertical plate 2 is provided with a receiving mechanism 15.

[0026] Further, the rotating seat 3 is rotatably connected between the vertical plate 2 by the rotating rod 4, and the output shaft of the step motor 5 penetrates the vertical plate 2 and is fixedly connected with the rotating rod 4.

[0027] Further, the L-shaped limiting strip 10 is fixedly connected with the placing table 6, the blocking strip 12 is attached to the placing seat 7, the bolt 11 penetrates the inner wall of the placing seat 7 to the placing table 6, and the bolt 11 is threadedly connected with the placing table 6.

[0028] Further, the driving mechanism 14 comprises a groove 141 provided on one side of the right vertical plate 2, the inner cavity of the groove 141 is fixedly connected with a motor 142, the output shaft of the motor 142 is fixedly connected with a rubber wheel 143, and the outer circle of the placing table 6 is fixedly connected with a rubber strip 144.

[0029] Further, the rubber wheel 143 is in interference extrusion contact with the rubber strip 144, the top of the placing table 6 penetrates to be provided with a rotating groove 145, the inner cavity of the rotating groove 145 is rotatably connected with a rotating column 146, the rotating column 146 is fixedly connected with the rotating seat 3, when the semiconductor on the bottom placing seat 7 is dried, the motor 142 in the groove 141 is started, the rubber wheel 143 on the output shaft is driven to rotate, and then under the action of the rubber strip 144 in interference extrusion with the rubber wheel 143 and the rotating column 146 in the rotating groove 145, the placing table 6 is driven to rotate, so as to drive the semiconductor on the placing seat 7 to rotate and dry, so as to ensure that the semiconductor can be heated uniformly as much as possible, and improve the drying treatment effect of the semiconductor device processing platform.

[0030] Further, the receiving mechanism 15 comprises a moving groove 151 provided through one side of the vertical plate 2, and the inner cavity of the moving groove 151 is slidably provided with a U-shaped receiving plate 152, the U-shaped receiving plate 152 is made of ordinary glass.

[0031] Further, the left side of the right side stand 2 is slidably provided with a collection box 153, the bottom of the U-shaped receiving plate 152 is fixedly connected with a support 154, the bottom of the support 154 is rotatably connected with a ball 155, when the rotary seat 3 replaces the placing seat 7, the U-shaped receiving plate 152 in the moving groove 151 is pulled out between the stand 2, avoiding interference with the rotation of the rotary seat 3, and when drying, the U-shaped receiving plate 152 is reset, and the semiconductor falling during drying can be received, and when the U-shaped receiving plate 152 is moved out between the stand 2, the semiconductor also falls into the collection box 153 and is collected, thereby improving the functionality of the semiconductor device processing platform.

[0032] Working principle: when the semiconductor device processing platform is used, the semiconductor is installed on the placing seat 7 by limiting the pin groove 8, the rotary seat 3 is rotated by 180 degrees by the stepping motor 5 and the rotating rod 4, so that the semiconductor on the placing seat 7 faces the dryer 13, and the semiconductor can be dried; during the drying process of the semiconductor on the bottom placing seat 7, the bolt 11 is unscrewed, the empty placing seat 7 is disassembled by cooperating with the limiting groove 9 and the L-shaped limiting strip 10, the semiconductor to be dried is installed on the placing seat 7 after being reset, and when the drying process of the bottom placing seat 7 is completed, the top placing seat 7 is rotated to the bottom by the stepping motor 5 for continuous drying, the processed semiconductor is taken out for subsequent processing, new semiconductor is continuously loaded, and the continuous drying process is repeated, thereby solving the problem of low semiconductor drying processing efficiency caused by the difficulty of continuous processing of the existing processing platform.

[0033] In the description of the present application, it should be explained that, unless otherwise specified and limited, the terms "setting", "installing", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific situation.

[0034] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device processing platform comprising a base plate (1), characterized in that: The top of the bottom plate (1) is symmetrically and fixedly connected with the stand plate (2), the rotating seat (3) is arranged between the stand plate (2), the rotating rod (4) is fixedly connected on both sides of the rotating seat (3), the step motor (5) is fixedly connected on one side of the stand plate (2), the placing table (6) is rotatably arranged on the top and bottom of the rotating seat (3), the placing seat (7) is arranged on the top of the placing table (6), the pin slot (8) is formed in the top of the placing seat (7), the limiting slot (9) is formed in both sides of the placing seat (7), the L-shaped limiting strip (10) is arranged in the inner cavity of the limiting slot (9), the bolt (11) is penetrated and screwed on the top of the placing seat (7), the blocking strip (12) is fixedly connected on the top of the placing table (6), the dryer (13) is arranged on the top of the bottom plate (1), the driving mechanism (14) is arranged on one side of the stand plate (2), and the receiving mechanism (15) is arranged between the stand plate (2).

2. The semiconductor device processing platform of claim 1, wherein: The rotating seat (3) is rotatably connected between the stand plate (2) through the rotating rod (4), and the output shaft of the step motor (5) penetrates the stand plate (2) and is fixedly connected with the rotating rod (4).

3. The semiconductor device processing platform of claim 1, wherein: The L-shaped limiting strip (10) is fixedly connected with the placing table (6), the blocking strip (12) is attached to the placing seat (7), the bolt (11) penetrates the placing seat (7) into the inner wall of the placing table (6), and the bolt (11) is in threaded connection with the placing table (6).

4. The semiconductor device processing platform of claim 1, wherein: The driving mechanism (14) comprises a groove (141) formed on one side of the right stand plate (2), the inner cavity of the groove (141) is fixedly connected with the motor (142), the output shaft of the motor (142) is fixedly connected with the rubber wheel (143), and the outer circle of the placing table (6) is fixedly connected with the rubber strip (144).

5. The semiconductor device processing platform of claim 4, wherein: The rubber wheel (143) is in interference extrusion contact with the rubber strip (144), the rotating groove (145) is formed in the top of the placing table (6), the rotating column (146) is rotatably connected in the inner cavity of the rotating groove (145), and the rotating column (146) is fixedly connected with the rotating seat (3).

6. The semiconductor device processing platform of claim 1, wherein: The receiving mechanism (15) comprises a moving groove (151) formed in one side of the stand plate (2), the inner cavity of the moving groove (151) is slidably provided with a U-shaped receiving plate (152), and the U-shaped receiving plate (152) is made of ordinary glass.

7. The semiconductor device processing platform of claim 6, wherein: The left side of the right stand plate (2) is slidably provided with the collecting box (153), the bottom of the U-shaped receiving plate (152) is fixedly connected with the support (154), and the bottom of the support (154) is rotatably connected with the ball (155).

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