Power supply adopting double-layer printed board structure

By using a single-sided assembly of a double-layer printed circuit board structure and an FR-4 cover plate design, the problems of space constraints in the layout of power supply components and thermal deformation are solved, thus achieving the safety and stability of the power supply.

CN223810011UActive Publication Date: 2026-01-16SHANGHAI JUNTAO POWER EQUIP CO LTD
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Patent Information

Application Number
CN202520212915.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-11
Publication Date
2026-01-16
Estimated Expiration
2035-02-11

AI Technical Summary

Technical Problem

Existing power supplies suffer from limitations in device layout space, interference, and easy deformation after heating in a double-layer printed circuit board structure, resulting in unsafe and unstable power supplies.

Method used

It adopts a double-layer printed circuit board structure, and the single-sided assembly method makes the distance between the printed circuit boards closer. It also utilizes a nested design with different device heights, combined with the use of FR-4 cover plates, to avoid device wear and heat deformation.

Benefits of technology

While meeting the power supply height restrictions, it solved the problem of device interference, improved the safety and stability of the power supply, and avoided deformation after heating.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a power supply adopting a double-layer printed board structure, which comprises a shell and a double-layer printed board, the double-layer printed board comprises a first printed board and a second printed board fixedly connected with the first printed board, the first printed board is electrically connected with the second printed board, and the first printed board is electrically connected with the second printed board. The double-layer printed board is fixedly connected to the bottom of the shell; the first printed board is provided with an opposite surface opposite to the second printed board, and the first printed board is not provided with a power supply magnetic core at the opposite surface; the top of the housing is provided with a power interface, and the power interface is electrically connected with the double-layer printed board. According to the power supply adopting the double-layer printed board structure provided by the utility model, a single-face assembly mode is arranged in the double-layer printed board, so that the specified power supply height range is met, the problem of height interference of the power supply structure is solved, the condition that devices on the printed boards in the power supply are abraded or the devices are damaged due to interconnection is avoided, and the power supply reliability is improved. And the power supply is safer and more stable.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the field of integrated circuit, especially to a power supply with double-layer printed board structure. BACKGROUND

[0002] When the input voltage of the power supply is 25V~115V and the input power reaches 1000W, two-stage power topology structure needs to be used due to the wide input voltage range, but the device layout on the single-layer board will be limited by space, which leads to unreasonable placement, so the structure form of upper and lower board support connection needs to be designed.

[0003] However, the height of the standard power module is limited, and the total height requirement is 12.7mm, the existing power supply plastic cover plate adopts PLC material, and the thickness is 1~2.3mm, which leads to the problem of interference of the height of the device assembled on the printed board when the double-layer printed board structure is placed, and the power supply is easy to deform (bulge) after heating in the oven, so it is urgent to provide a power supply with double-layer printed board structure to solve the problems of printed board interference and power supply bulging after heating, and provide a power supply with safe and stable structure. SUMMARY

[0004] The utility model aims at providing a power supply with double-layer printed board structure to solve the above technical problems, and realizes the safety and stability of the power supply with double-layer printed board structure.

[0005] In order to solve the above technical problems, the utility model provides a power supply with double-layer printed board structure, which comprises a shell, and further comprises: a double-layer printed board, wherein:

[0006] The double-layer printed board comprises a first printed board and a second printed board fixedly connected with the first printed board, the first printed board and the second printed board are electrically connected, and the double-layer printed board is fixedly connected at the bottom of the shell;

[0007] The first printed board is provided with an opposite surface at the opposite position of the second printed board, and the first printed board does not assemble the power supply magnetic core at the opposite surface;

[0008] The shell is provided with a power supply interface on the top, and the power supply interface is electrically connected with the double-layer printed board.

[0009] The above scheme provides a power supply with double-layer printed board structure, which is assembled on one side of the double-layer printed board, so that the distance between the two printed boards is more compact, which solves the problem of height interference of the power supply structure while meeting the specified power supply height range, avoids the wear and tear of the device on the opposite surface of the internal printed board of the power supply or the damage of the device in the interconnection, and makes the power supply more safe and stable.

[0010] Further, the power supply further comprises a PIN needle, wherein: the first printed board and the second printed board are electrically connected and fixedly connected through the PIN needle; the shell top is provided with a PIN through hole, and the PIN needle is embedded out of the shell top through the PIN through hole and serves as a power supply interface.

[0011] Further, the power supply further comprises a PIN needle, wherein: the first printed board and the second printed board are electrically connected and fixedly connected through the PIN needle; the shell top is provided with a PIN through hole, and the PIN needle is embedded out of the shell top through the PIN through hole and serves as a power supply interface.

[0012] The above scheme realizes the electrical connection and the fixed connection between the double-layer printed boards through the PIN needle and the pin, and designs the PIN needle to be embedded out of the power supply shell as a power supply interface to realize the electrical connection between the power supply and other devices.

[0013] Further, the shell comprises a cover plate and a shell body, wherein: the cover plate and the shell body are embeddedly connected; the double-layer printed boards are fixedly connected to the bottom of the shell body; and the power supply interface is located on the cover plate.

[0014] The above scheme comprises the cover plate and the shell body which are embeddedly connected, so that the power supply is fully wrapped, and the metal shell body can be generally used to realize heat dissipation and the plastic cover plate can be used for insulation.

[0015] Further, the power supply further comprises a screw, wherein: the bottom of the shell body is provided with a threaded hole, the second printed board is provided with a threaded through hole, and the screw is fixedly connected to the threaded through hole and the threaded hole.

[0016] The above scheme fixedly connects the double-layer printed boards to the shell body through the screw, so that the structure of the power supply is stable and convenient for disassembly and inspection.

[0017] Further, the cover plate is of an FR-4 structure.

[0018] The above scheme uses the FR-4 structure as the cover plate structure of the power supply, which has the advantages of high temperature resistance, corrosion resistance, high mechanical strength, good insulation performance, good dimensional stability, good environmental protection, high flame retardant grade and the like, and solves the problem of easy bulging and deformation of the power supply after heating.

[0019] Further, the first printed board is provided with a corner defect, and the screw is located at the corner defect when the double-layer printed boards are installed on the bottom of the shell body.

[0020] Further, the cover plate is provided with a groove, and the length of the screw is set to a preset safe length, and the cover plate covers the top of the screw through the groove when the double-layer printed boards are installed on the bottom of the shell body.

[0021] The above scheme reasonably uses the internal space of the power supply by designing corresponding space positions on the printed board and the cover plate, and further reduces unnecessary height occupation.

[0022] Further, the power supply further comprises an insulating pad, wherein: the insulating pad is located between the double-layer printed board and the bottom of the shell, and the insulating pad is provided with a notch position, and when the double-layer printed board is installed on the bottom of the shell, the screw is fixedly connected to the bottom of the shell through the notch position.

[0023] In the above scheme, by adding the insulating pad, the direct electrical connection relationship between the double-layer printed board and the shell of the power supply is avoided, and the notch position is arranged to facilitate the fixing and connection of the double-layer printed board to the bottom of the shell by the screw.

[0024] Further, the second printed board is provided with a second opposite surface at a position opposite to the first printed board, wherein: the second printed board has a high device assembly area at the second opposite surface, and the first printed board and the second printed board are arranged to be nested in space at the high device assembly area.

[0025] In the above scheme, by arranging the first printed board and the second printed board to be nested in space, the height of the double-layer printed board is further compressed under the premise of avoiding interference.

[0026] The power supply provided by the utility model adopts the double-layer printed board structure, the single-sided assembly is arranged in the double-layer printed board, and the double-layer printed boards are arranged to be nested in space by using the devices with different heights, so that the space distance between the double-layer printed boards is more compact, the height interference problem of the power supply structure is solved while the height range of the power supply is met, the device wear or damage of the interconnection on the opposite surface of the internal printed board of the power supply is avoided, and the epoxy board FR-4 is used as the power supply cover plate structure, so that the problem of easy deformation (bulging) of the power supply after heating in the oven is avoided, and the power supply is more safe and stable. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A power supply adopting a double-layer printed board structure is provided for an embodiment of the utility model, and a side view schematic diagram of the power supply is shown in the figure;

[0028] Figure 2 A double-layer printed board of a power supply adopting a double-layer printed board structure is provided for an embodiment of the utility model, and a side view schematic diagram of the double-layer printed board is shown in the figure;

[0029] Figure 3 A shell of a power supply adopting a double-layer printed board structure is provided for an embodiment of the utility model, and a schematic diagram of the shell is shown in the figure;

[0030] Figure 4 A screw of a power supply adopting a double-layer printed board structure is provided for an embodiment of the utility model, and a schematic diagram of the screw is shown in the figure;

[0031] Figure 5 A cover plate of a power supply adopting a double-layer printed board structure is provided for an embodiment of the utility model, and a schematic diagram of the cover plate is shown in the figure;

[0032] Figure 6 A power supply cover plate profile schematic view provided by one embodiment of the utility model adopts double-layer printed board structure;

[0033] Figure 7 A power supply printed board overhead schematic view provided by one embodiment of the utility model adopts double-layer printed board structure;

[0034] Figure 8 A power supply double-layer printed board structure expansion schematic view provided by one embodiment of the utility model adopts double-layer printed board structure;

[0035] Figure 9 A power supply double-layer printed board structure assembly schematic view provided by one embodiment of the utility model adopts double-layer printed board structure;

[0036] Figure 10 A power supply structure schematic view provided by one embodiment of the utility model adopts FR-4 cover plate double-layer printed board structure;

[0037] Figure 11 A power supply profile schematic view provided by one embodiment of the utility model adopts FR-4 cover plate double-layer printed board structure;

[0038] Figure 12 A power supply profile local schematic view provided by one embodiment of the utility model adopts FR-4 cover plate double-layer printed board structure;

[0039] In the drawing: 1, cover plate;2, first printed board;3, row pin;4, PIN pin;5, screw;6, second printed board;7, insulating pad;8, shell;9, threaded hole;10, recess;11, threaded through hole. DETAILED DESCRIPTION

[0040] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0041] Embodiment one:

[0042] The embodiment provides a power supply adopting double-layer printed board structure, the power supply comprises a shell, and further comprises a double-layer printed board, wherein:

[0043] The double-layer printed board comprises a first printed board 2 and a second printed board 6 fixedly connected with the first printed board 2, the first printed board 2 and the second printed board 6 are electrically connected, and the double-layer printed board is fixedly connected at the bottom of the shell;

[0044] The first printed board 2 is provided with an opposite surface at a position opposite to the second printed board 6, and the first printed board 2 is not assembled with a power supply magnetic core at the opposite surface;

[0045] The top of the shell is provided with a power supply interface, and the power supply interface is electrically connected with the double-layer printed board.

[0046] The embodiment provides a power supply with a double-layer printed board structure. By arranging the single-surface assembly in the double-layer printed board, the distance between the two printed boards is closer, the height interference problem of the power supply structure is solved while the height range of the power supply is met, the device abrasion or the device damage of the interconnection on the opposite surface of the internal printed board of the power supply is avoided, and the power supply is safer and more stable.

[0047] Optionally, the power supply further comprises a PIN pin 4, wherein the first printed board 2 and the second printed board 6 are electrically connected and fixedly connected through the PIN pin 4; the top of the shell is provided with a PIN through hole, and the PIN pin 4 is embedded out of the top of the shell through the PIN through hole and serves as the power supply interface.

[0048] Optionally, the power supply further comprises a row pin 3, wherein the first printed board 2 and the second printed board 6 are electrically connected and fixedly connected through the row pin 3.

[0049] In the specific implementation process, the electrical connection and the fixed connection between the double-layer printed boards are realized through the PIN pin 4 and the row pin 3, and the PIN pin 4 is designed to be transmitted out of the power supply shell to serve as the power supply interface and realize the electrical connection between the power supply and other devices.

[0050] Optionally, the shell comprises a cover plate 1 and a shell body 8, wherein the cover plate 1 and the shell body 8 are embeddedly connected; the double-layer printed board is fixedly connected to the bottom of the shell body 8; and the power supply interface is located on the cover plate 1.

[0051] In the specific implementation process, the power supply shell comprises the embeddedly connected cover plate 1 and shell body 8, so that the power supply is fully wrapped, and the metal shell body 8 can be usually used to realize heat dissipation, and the cover plate 1 can be used to realize insulation. Figure 1 As shown in the power supply side view, the total height requirement of the standard power supply module is 12.7 mm (the height is limited); as shown in the double-layer printed board structure, Figure 2 as shown in the double-layer printed board structure, the total height (including the device and the accumulated tolerance) of the double-layer printed board is 11.1 mm, and calculation shows that the total height of the shell body 8 and the cover plate 1 should be less than 1.6 mm; the total height of the cover plate 1 and the shell body 8 needs to be designed within 1.6 mm, and the bottom surface thickness of the shell body 8 is designed to be 1 mm (less than 1 mm will cause deformation and affect heat dissipation), and the thickness of the cover plate 1 is designed to be 0.6 mm.

[0052] Optionally, the power supply further comprises a screw 5, wherein: the bottom of the shell 8 is provided with a threaded hole 9, the second printed board 6 is provided with a threaded through hole, and the screw 5 is fixedly connected with the threaded hole 9 through the threaded through hole.

[0053] In the specific implementation process, the screw 5 is fixedly connected with the threaded hole 9 through the threaded through hole, so that the second printed board 6 is fixedly connected at the bottom of the shell 8, that is, the double-layer printed board is fixedly connected at the bottom of the shell 8. In actual application, a plurality of screws 5 can be used for fixation. Assuming that four M5x0.8 (M5x0.8 external thread, M3x0.5 internal thread) stainless steel screws 5 are mechanically fixed on the shell, the shell 8 is as shown in Figure 3 At this time, four threaded holes 9 are arranged at the four corners of the shell 8, and a protrusion is separately arranged at the threaded hole 9, without affecting the space position inside the shell 8; the upper part of the side wall around the shell 8 is inwardly recessed, facilitating embedded connection with the cover plate 1. The screw 5 is as shown in the schematic view Figure 4 The cross screw 5 has a cross width of 1mm (as shown in the screw 5 top view (b) in Figure 4 The external thread is designed according to the installation of the internal thread M5x0.8 of the shell, and the external thread of the installation screw 5 is designed to be M5x0.8; the internal thread is designed to be M3 thread according to the installation requirement, that is, the installation threaded hole 9 is designed to be M3x0.5, as shown in the screw 5 front view (c). Figure 4 The height is designed as follows: ① in actual application, if the distance from the upper surface of the second printed board 6 to the bottom shell is 6.5mm (including cumulative tolerance), the threaded length can be calculated as 6.2mm (the bottom end surface of the screw 5 cannot exceed the bottom surface of the shell, and the error range is set to 0.5mm); ② if the distance from the upper surface of the second printed board 6 to the upper surface of the cover plate 1 is 6.2mm (including cumulative tolerance), the height of the head of the screw 5 can be calculated as 5.9mm (the top end surface of the screw 5 cannot exceed the upper surface of the cover plate 1, and the error range is set to 0.5mm); ③ the top diameter of the screw 5 can be directly designed as 6.5mm (due to the safety distance limitation requirement of the internal wiring of the PCBA, the outer diameter of the installation hole cannot be greater than 6.6mm, and the error range is set to 0.1mm), as shown in the screw 5 cross-sectional view (a). Figure 4

[0054] Optionally, the cover plate 1 is of FR-4 structure.

[0055] In the specific implementation process, the existing cover plate 1 is usually of PLC structure, and the thickness is 1-2.3mm, which cannot meet the actual thickness requirement. Therefore, the FR-4 structure with the advantages of high temperature resistance, corrosion resistance, high mechanical strength, good insulation performance, good dimensional stability, good environmental protection, high flame retardant grade, etc. is adopted as the power supply cover plate 1 structure, and is milled and formed, with a wall around, keeping insulation with the double-layer printed board and the edge device, meeting the height limitation of the power supply, and solving the problems of easy bulging and deformation of the power supply after heating.​

[0056] Optionally, the first printed board 2 is provided with a notch, and the screw 5 is located at the notch when the double-layer printed board is installed at the bottom of the shell 8.

[0057] Optionally, the cover plate 1 is provided with a groove 10, and the length of the screw 5 is set to a preset safe length, and the cover plate 1 covers the top of the screw 5 through the groove 10 when the double-layer printed board is installed at the bottom of the shell 8.

[0058] In the specific implementation process, as shown in Figure 5 , the cover plate 1 is provided with four grooves 10 at four corners, and is provided with a power supply interface, and is embedded and connected with the shell 8 through the cover plate side wall of the cover plate 1, and the cross-sectional view is as shown in Figure 6 , the thickness of the cover plate 1 is set to 0.6mm.

[0059] In the specific implementation process, by designing the corresponding space position on the printed board and the cover plate 1, the internal space of the power supply is reasonably utilized, and unnecessary height occupation is further reduced.

[0060] Optionally, the power supply further comprises an insulating pad 7, wherein: the insulating pad 7 is located between the double-layer printed board and the bottom of the shell 8, and the insulating pad 7 is provided with a notch position, and the screw 5 is fixedly connected to the bottom of the shell 8 through the notch position when the double-layer printed board is installed at the bottom of the shell 8.

[0061] In the specific implementation process, by adding the insulating pad 7, direct electrical connection relationship between the double-layer printed board of the power supply and the shell is avoided, and the notch position is set to facilitate the double-layer printed board to be fixedly connected to the bottom of the shell 8 through the screw 5.

[0062] Optionally, the second printed board 6 is provided with a second opposite surface at the opposite position of the first printed board 2, wherein: the second printed board 6 has a high device assembly area at the second opposite surface, and the first printed board 2 and the second printed board 6 are arranged to be nested in space at the high device assembly area.

[0063] In the specific implementation process, the top view of the first printed board 2 and the second printed board 6 can be as shown in Figure 7 , by arranging the first printed board 2 and the second printed board 6 to be nested in space, the height of the double-layer printed board is further compressed under the premise of avoiding interference, and the unfolded schematic view of the double-layer printed board and the first printed board 2 and the second printed board 6 before being electrically connected and fixedly connected through the pin 3 and the PIN pin 4 is as shown in Figure 8 , and the nested structure after being connected is as shown in Figure 9 .

[0064] The power supply with the double-layer printed board structure provided by the embodiment is characterized in that: single-sided assembly is arranged in the double-layer printed board, and the double-layer printed boards are nested with each other by using the devices with different heights, so that the space distance between the double-layer printed boards is more compact, the height interference problem of the power supply structure is solved while the height range of the power supply is met, the device abrasion or the device damage of the interconnection on the opposite surface of the internal printed board of the power supply is avoided, and the epoxy board FR-4 is used as the cover plate 1 structure of the power supply, so that the deformation (bulging) problem of the power supply after heating in the oven is avoided, and the power supply is more safe and stable.

[0065] Embodiment two

[0066] The power supply with the double-layer printed board structure provided by the embodiment is characterized in that: single-sided assembly is arranged in the double-layer printed board, and the double-layer printed boards are nested with each other by using the devices with different heights, so that the space distance between the double-layer printed boards is more compact, the height interference problem of the power supply structure is solved while the height range of the power supply is met, the device abrasion or the device damage of the interconnection on the opposite surface of the internal printed board of the power supply is avoided, and the epoxy board FR-4 is used as the cover plate 1 structure of the power supply, so that the deformation (bulging) problem of the power supply after heating in the oven is avoided, and the power supply is more safe and stable. Figure 10 The power supply with the double-layer printed board structure provided by the embodiment is characterized in that: single-sided assembly is arranged in the double-layer printed board, and the double-layer printed boards are nested with each other by using the devices with different heights, so that the space distance between the double-layer printed boards is more compact, the height interference problem of the power supply structure is solved while the height range of the power supply is met, the device abrasion or the device damage of the interconnection on the opposite surface of the internal printed board of the power supply is avoided, and the epoxy board FR-4 is used as the cover plate 1 structure of the power supply, so that the deformation (bulging) problem of the power supply after heating in the oven is avoided, and the power supply is more safe and stable.

[0067] In the specific implementation process, the heat-insulating pad is used as the insulating pad 7, the FR-4 structure is used as the cover plate 1, and the metal shell is used as the shell 8.

[0068] In the specific implementation process, the power supply structure is assembled, and the cross-sectional view is as shown in Figure 11 The partial schematic view of the circled part I is as shown in Figure 12 The cross-sectional view of the screw 5 for fixing the double-layer printed board is as shown in the figure, the height from the upper surface of the second printed board 6 to the lower surface of the bottom of the shell 8 is controlled to be 6.5 mm, and the height from the upper surface of the second printed board 6 to the upper surface of the cover plate 1 is controlled to be 6.2 mm.

[0069] In the specific implementation process, the power supply structure adopts double-layer printed board assembly, the lower printed board adopts double-sided assembly, the upper printed board adopts single-sided assembly, the magnetic core of the power supply is divided on the upper and lower printed boards, is fixed by fixing glue, the upper and lower printed boards are both welded and fixed by PIN pins 4 and row pins 3, and the electrical connection is realized by interconnection of the PIN pins 4 and the row pins 3, the lower printed board is mechanically fixed on the shell 8 by four M5*0.8 stainless steel screws 5, and finally is fixed in the shell 8 by pouring sealing glue.

[0070] The above is the preferred embodiment of the utility model, and it should be pointed out that, for ordinary skilled persons in the technical field, some improvements and refinements can be made without departing from the principles of the utility model, and these improvements and refinements are also regarded as the protection scope of the utility model.

Claims

1. A power supply employing a double-layer printed board structure, the power supply comprising a housing, characterized by Also comprising: A double-layer printed board, wherein: The double-layer printed board comprises a first printed board and a second printed board fixedly connected with the first printed board, the first printed board and the second printed board are electrically connected, and the double-layer printed board is fixedly connected at the bottom of the shell; The first printed board is provided with an opposite surface at a position opposite to the second printed board, and the first printed board is not assembled with a power supply magnetic core at the opposite surface; The top of the shell is provided with a power supply interface, and the power supply interface is electrically connected with the double-layer printed board.

2. The power supply of claim 1, wherein the power supply is configured to be mounted on a double layer printed board structure. Also comprising a PIN pin, wherein: The first printed board and the second printed board are electrically connected and fixedly connected through the PIN pin; The top of the shell is provided with a PIN through hole, and the PIN pin is embedded out of the top of the shell through the PIN through hole and serves as a power supply interface.

3. The power supply of claim 1, wherein the power supply is configured to be mounted on a double layer printed board structure. Also comprising a pin, wherein:

4. The power supply of claim 1, wherein the power supply is configured to be mounted on a double layer printed board structure. The first printed board and the second printed board are electrically connected and fixedly connected through the pin. The shell comprises a cover plate and a shell body, wherein: The cover plate and the shell body are embeddedly connected; The double-layer printed board is fixedly connected at the bottom of the shell body; 5. The power supply of claim 4, wherein the power supply is configured to be mounted on a double layer printed board structure. The power supply interface is located on the cover plate. Also comprising a screw, wherein:

6. The power supply of claim 4, wherein the power supply is configured to be mounted on a double layer printed board structure. The bottom of the shell body is provided with a threaded hole, the second printed board is provided with a threaded through hole, and the screw is fixedly connected with the threaded hole through the threaded through hole.

7. The power supply of claim 5, wherein the power supply is configured to be mounted on a double layer printed board structure. The cover plate is of FR-4 structure. The first printed board is provided with a missing corner, and when the double-layer printed board is installed at the bottom of the shell body, the screw is located at the missing corner.

8. The power supply with a double-layer printed board structure according to claim 5, wherein:

9. The power supply of claim 5, wherein the power supply is configured to be mounted on a double layer printed board structure. The cover plate is provided with a groove, the length of the screw is set as a preset safe length, and when the double-layer printed board is installed at the bottom of the shell body, the cover plate covers the top of the screw through the groove. Also comprising an insulating pad, wherein:

10. The power supply of claim 1, wherein the power supply is configured to be mounted on a double layer printed board structure. The insulating pad is located between the double-layer printed board and the bottom of the shell body, the insulating pad is provided with a notch position, and when the double-layer printed board is installed at the bottom of the shell body, the screw is fixedly connected at the bottom of the shell body through the notch position. The second printed board is provided with a second opposite surface at a position opposite to the first printed board, wherein: The second printed board has a high device assembly area at the second opposite surface, and the first printed board and the second printed board are spatially nested with each other at the high device assembly area.