Durable LED lamp bead

Abstract

The utility model discloses a durable LED lamp bead, and relates to the technical field of LED lamp beads. Comprising a heat dissipation aluminum support, a supporting table is arranged in the middle of the heat dissipation aluminum support, annular heat dissipation fins are arranged on the periphery of the supporting table, a sinking groove is formed in the supporting table, a lead frame is installed at the bottom of the sinking groove, pins are arranged on the two sides of the lead frame, an LED chip is soldered on the lead frame, and the sinking groove is filled with resin colloid. According to the durable LED lamp bead, the arranged heat dissipation aluminum support has good heat conduction performance, heat generated inside can be effectively conducted to the surfaces of the fins and dissipated into the environment in an air convection or radiation mode, the heat dissipation aluminum support is designed to be of an encircling structure, heat dissipation is guaranteed, meanwhile, the chip can be protected to a certain degree, and the service life of the LED lamp bead is prolonged. Meanwhile, the heat of the hot spot area is conducted to the vapor chamber through the lead frame and the heat conduction silica gel sheet, the heat can be taken away more quickly, and the risk that the local temperature is too high is effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED lamp pearl technical field, specifically is a durable LED lamp pearl. BACKGROUND

[0002] LED full name is semiconductor light emitting diode, adopts semiconductor material to make, it is a kind of can directly convert electric energy into light energy, electric signal conversion light signal emitting device, because it has low energy consumption, high brightness, strong stability, environmental protection and so on Advantage, and be widely used in modern home lighting.

[0003] In prior art, most of the illumination is carried out by LED lamp pearl, however, LED lamp pearl still generates a large amount of heat due to current thermal effect when working, which causes temperature rise in space, which will make LED lamp pearl work at a higher temperature all the time, greatly influence the service life of LED lamp pearl. UTILITY MODEL CONTENTS

[0004] The utility model provides a durable LED lamp pearl to solve the problem in the background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a durable LED lamp pearl, including heat dissipation aluminum support, the middle part of heat dissipation aluminum support is equipped with support station, and the periphery of support station is equipped with annular heat dissipation fin, be equipped with the recess in the support station, and the recess bottom of recess is installed lead frame, the both sides of lead frame are equipped with lead pin, the lead frame is soldered with LED chip, the recess is filled with resin colloid, and resin colloid covers on LED chip, the bottom of support station is embedded with the heat spreader, and the bottom between heat spreader and lead frame is provided with heat-conducting silica gel piece.

[0006] Further, the outer side of annular heat dissipation fin is equipped with hollow hole, and the hollow hole is uniformly distributed in annular heat dissipation fin.

[0007] Further, the top of lead frame is flush with the recess bottom, and the resin colloid is flush with the top of recess.

[0008] Further, the recess bottom is equipped with stepped hole, and the lead frame is fixed in the stepped hole.

[0009] Further, the bottom of support station is equipped with slot, and the slot is communicated with the stepped hole.

[0010] Further, the heat-conducting silica gel piece is located in the stepped hole, and the heat spreader is fixed in the slot, and the bottom is flush with the bottom of support station.

[0011] Further, the lead pin is bent, and extends to the bottom of heat dissipation aluminum support from the both sides of stepped hole.

[0012] Compared with the prior art, the durable LED lamp bead has the following beneficial effects:

[0013] The durable LED lamp bead has the following beneficial effects: The heat generated inside can be effectively conducted to the fin surface through the heat dissipation aluminum support, and dissipated to the environment through air convection or radiation, and the heat dissipation aluminum support is designed as a ring type structure, which can not only ensure heat dissipation but also protect the chip, and the heat in the hot spot area is conducted to the heat plate through the lead frame and the heat conductive silica gel sheet, so that the heat can be quickly taken away, and the risk of local high temperature is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 The structure of the utility model is shown in the figure.

[0015] Fig. 2 The local plan view of the utility model is shown in the figure.

[0016] Fig. 3 The front view of the utility model is shown in the figure.

[0017] In the figure: 1, heat dissipation aluminum support; 2, support table; 3, annular heat dissipation fin; 4, sink; 5, lead frame; 6, lead pin; 7, LED chip; 8, resin colloid; 9, heat plate; 10, heat conductive silica gel sheet; 11, hollow hole; 12, stepped hole; 13, slotted. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0019] Please refer to Figs. 1-3The utility model discloses a durable LED lamp pearl, including heat dissipation aluminum support 1, the middle part of heat dissipation aluminum support 1 is equipped with support 2, and the periphery of support 2 is equipped with annular heat dissipation fin 3, be equipped with the groove 4 on support 2, and the groove bottom of groove 4 is installed and leads to the frame 5, the both sides of lead frame 5 are equipped with pin 6, the tin solder of lead frame 5 is equipped with LED chip 7, the resin colloid 8 is filled in the groove 4, and resin colloid 8 covers on LED chip 7, the bottom embedding of support 2 is equipped with the heat evenly plate 9, and the bottom between heat evenly plate 9 and lead frame 5 is provided with heat conduction silica gel piece 10, and the heat dissipation aluminum support 1 that sets up has good heat conduction performance, can effectively conduct the heat generated inside to the fin surface, and is sent to the environment through air convection or radiation mode, and heat dissipation aluminum support 1 is designed as the embracing type structure, can also play certain protective effect to chip while guaranteeing the heat dissipation, simultaneously, the heat of hot spot area is conducted to the heat evenly plate 9 on lead frame 5 and heat conduction silica gel piece 10, can more quickly take away the heat, effectively reduces the risk of local temperature excessively high.

[0020] Specifically, the outer side of the annular heat dissipation fin 3 is provided with a hollow hole 11, and the hollow hole 11 is uniformly distributed on the annular heat dissipation fin 3.

[0021] In the embodiment, the hollow hole 11 can make the middle part of the annular heat dissipation fin 3 have better ventilation effect, increase air circulation, and improve the heat dissipation performance of the product.

[0022] Specifically, the top of the lead frame 5 is flush with the groove bottom of the groove 4, and the resin colloid 8 is flush with the top of the groove 4.

[0023] In the embodiment, the lead frame 5 serves as a chip carrier of an integrated circuit, which is a key structural component for realizing the electrical connection between the internal circuit lead-out end of the chip and the external lead wire by means of bonding material (gold wire, aluminum wire, copper wire), and plays a role of bridge connecting the external lead wire. The main functions of the resin colloid 8 include protecting the chip, controlling the light emitting angle, improving the light extraction efficiency, and enhancing the durability. Specifically, the resin glue can fix and protect the internal chip and its lead wire (such as gold wire), prevent the chip and lead wire from oxidizing, thereby prolonging the service life of the LED lamp pearl. The resin glue plays the role of lens in the packaging process, can control the light emitting angle of the LED, realize the effect of condensing or diffusing light, the refractive index of the resin glue can reduce the internal total reflection of light, thereby improving the light extraction efficiency, so that more light can be emitted from the LED lamp pearl. High-quality resin glue has high refractive index and high light transmittance, can increase the luminous flux of the LED, and has small viscosity and is easy to defoam, which is suitable for pouring and molding, so that the LED lamp pearl has good durability and reliability.

[0024] Specifically, the groove bottom of the sink 4 is provided with a stepped hole 12, and the lead frame 5 is fixed in the stepped hole 12.

[0025] In the embodiment, the stepped hole 12 is a mounting structure for mounting and fixing the lead frame 5.

[0026] Specifically, the bottom of the support platform 2 is provided with a slot 13, and the slot 13 is in communication with the stepped hole 12.

[0027] In the embodiment, the slot 13 is a mounting structure for mounting and fixing the heat plate 9.

[0028] Specifically, the heat-conducting silica gel sheet 10 is located in the stepped hole 12, and the heat plate 9 is fixed in the slot 13, and the bottom of the heat plate 9 is flush with the bottom of the support platform 2.

[0029] In the embodiment, the heat-conducting silica gel sheet 10 is a heat-conducting medium material synthesized by adding various auxiliary materials such as metal oxides to silica gel as a base material through a special process, which is specially designed for heat transfer through gaps. It can fill the gaps and open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption, sealing, etc. The main function of the heat plate 9 is to transfer and distribute heat efficiently through liquid-vapor phase change, thereby effectively preventing overheating of the equipment.

[0030] Specifically, the pin 6 is bent, and extends outward from both sides of the stepped hole 12 and extends to the bottom of the heat dissipation aluminum support 1.

[0031] In the embodiment, the pin 6 is an elongated metal strip on the lead frame 5, which extends from the chip seat and is used to connect with the external circuit. Its main function is to realize the electrical connection between the chip and the external circuit.

[0032] In use, the heat dissipation aluminum support 1 has good heat conduction performance, can effectively conduct the heat generated inside to the fin surface, and dissipate to the environment through air convection or radiation, and the heat dissipation aluminum support 1 is designed as a ring structure, which can not only ensure heat dissipation but also protect the chip to a certain extent. At the same time, the heat of the hot spot area is conducted to the heat plate 9 through the lead frame 5 and the heat-conducting silica gel sheet 10, which can quickly take away the heat and effectively reduce the risk of local high temperature.

[0033] In summary, the durable LED lamp bead, the heat dissipation aluminum support 1 arranged has good heat conduction performance, can effectively conduct the heat generated inside to the fin surface, and is radiated to the environment through air convection or radiation, and the heat dissipation aluminum support 1 is designed as a ring type structure, which can protect the chip while ensuring heat dissipation, and the heat of the hot spot area is conducted to the heat plate 9 through the lead frame 5 and the heat conduction silica gel sheet 10, which can quickly take away the heat and effectively reduce the risk of local temperature being too high.

[0034] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A durable LED lamp bead comprising a heat-dissipating aluminum bracket (1), characterized in that: The middle part of the heat-dissipating aluminum support (1) is provided with a support (2), and the periphery of the support (2) is provided with annular heat-dissipating fins (3), the support (2) is provided with a sink (4), the bottom of the sink (4) is provided with a lead frame (5), the two sides of the lead frame (5) are provided with pins (6), the lead frame (5) is soldered with LED chips (7), the sink (4) is filled with resin colloid (8), and the resin colloid (8) covers the LED chips (7), the bottom of the support (2) is embedded with a uniform heating plate (9), and the bottom of the uniform heating plate (9) is provided with a heat-conducting silica gel sheet (10).

2. The LED lamp of claim 1, wherein: The outer side of the annular heat-dissipating fins (3) is provided with hollow holes (11), and the hollow holes (11) are uniformly distributed on the annular heat-dissipating fins (3).

3. The LED lamp of claim 1, wherein: The top of the lead frame (5) is flush with the bottom of the sink (4), and the resin colloid (8) is flush with the top of the sink (4).

4. The LED lamp of claim 1, wherein: The bottom of the sink (4) is provided with a stepped hole (12), and the lead frame (5) is fixed in the stepped hole (12).

5. The LED lamp of claim 4, wherein: The bottom of the support (2) is provided with a slot (13), and the slot (13) is in communication with the stepped hole (12).

6. The LED lamp of claim 5, wherein: The heat-conducting silica gel sheet (10) is located in the stepped hole (12), and the uniform heating plate (9) is fixed in the slot (13), and the bottom of the uniform heating plate (9) is flush with the bottom of the support (2).

7. The LED lamp of claim 4, wherein: The pins (6) are bent, and extend outward from the two sides of the stepped hole (12) and extend to the bottom of the heat-dissipating aluminum support (1).

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