Rapid fixing device for semiconductor device

Abstract

The utility model relates to the technical field of fixing devices, in particular to a quick fixing device for a semiconductor device, which comprises a fixing seat, a semiconductor device substrate is movably clamped in the fixing seat, and clamping grooves are respectively arranged in a shell of the fixing seat and positioned on two sides of the semiconductor device substrate. Clamping pieces located in the clamping grooves are fixedly installed on the two sides of the semiconductor device substrate respectively, movable blocks are clamped in the clamping grooves in a sliding mode, clamping blocks movably clamped in the clamping pieces are fixed to the movable blocks, a movement driving device for driving the movable blocks to move relatively is arranged on the fixed base, and a lower bottom plate is arranged below the fixed base. An upper bottom plate is fixed at the bottom of the fixing seat, and two hinge rods with midpoints hinged together are arranged between the upper bottom plate and the lower bottom plate, so that the height of a semiconductor device substrate can be adjusted in a lifting manner, a worker can conveniently adjust a proper working position according to own conditions, discomfort of the worker caused by long-time stooping is avoided, and the working efficiency is improved. And the working efficiency is influenced.

Description

TECHNICAL FIELD

[0001] The utility model relates to fixing device technical field, concretely is a kind of semiconductor device quick fixing device. BACKGROUND

[0002] Substrate material is the basic material of manufacturing semiconductor device and printed circuit board, such as the material silicon, gallium arsenide, silicon epitaxial needle, garnet used in semiconductor industry, etc., which is made of high-purity alumina (bauxite) as main raw material through high-pressure forming, high-temperature sintering, and then cutting and polishing, ceramic substrate is the basic material of manufacturing thick film, thin film circuit, and copper-clad laminate is the substrate material of manufacturing printed circuit board, which is used as support for various components and devices, and can realize electrical connection or electrical insulation between them, metal substrate refers to metal-based copper-clad plate made of metal sheet, insulating dielectric layer and copper foil, metal substrate is widely used in electronic components and integrated circuit support materials and heat sink due to its excellent heat dissipation performance, mechanical processing performance, electromagnetic shielding performance, dimensional stability, magnetic performance and multifunctionality, and plays an important role in power electronic devices, microelectronic devices, microwave communication, automatic control, power conversion, aerospace and other fields.

[0003] At present, when testing semiconductor device substrate, different shapes of semiconductor device substrate need to be positioned, and the positioned semiconductor device needs to be fixed, and the fixing mechanism is too simple, which is not convenient for quick disassembly, and different heights of operators can easily cause physical discomfort of workers when bending for a long time, thereby affecting work efficiency, therefore, a semiconductor device quick fixing device is provided to solve the above problems. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a semiconductor device quick fixing device to solve the problems in the background art.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] The utility model provides a kind of semiconductor device fast fixing device, including fixed seat, semiconductor device substrate is movably clamped in the fixed seat, the shell inside the fixed seat and located the both sides of semiconductor device substrate are respectively equipped with clamping groove, the both sides of semiconductor device substrate are respectively fixedly installed with the clamping piece located in the inside of clamping groove, slidingly clamped with movable block in the inside of clamping groove, the movable block is fixed with the clamping block that is movably clamped in the inside of clamping piece, the fixed seat is equipped with movement drive device that drives movable block relative movement, the lower of fixed seat is equipped with lower bottom plate, the bottom of fixed seat is fixed with upper bottom plate, the articulation lever of two midpoint articulations is arranged between the upper bottom plate and lower bottom plate, the articulation lever one end is articulated with lower bottom plate or upper bottom plate, the lower bottom plate, upper bottom plate are respectively equipped with second sliding slot, the other end of articulation lever is fixed with the second sliding block that is slidingly clamped in the inside of second sliding slot, the lower bottom plate is fixedly installed with pneumatic telescopic device for driving the horizontal movement of second sliding block on lower bottom plate.

[0007] The utility model provides a kind of semiconductor device fast fixing device as described above: spring is fixedly connected between movable block and clamping groove.

[0008] The utility model provides a kind of semiconductor device fast fixing device as described above: the outside dimension of clamping block is compatible with the inner dimension of clamping piece, and the clamping block is movably embedded in the inside of clamping piece.

[0009] The utility model provides a kind of semiconductor device fast fixing device as described above: movement drive device includes the two-way threaded rod that is rotatably installed on fixed seat by bearing, two threaded sleeves are threadedly connected on the two-way threaded rod, limiting sliding slot is equipped in the inside of clamping groove, limiting sliding plate is slidingly clamped in the inside of limiting sliding slot and is fixed on the threaded sleeve, and the movable block is fixedly connected with the top of limiting sliding plate.

[0010] The utility model provides a kind of semiconductor device fast fixing device as described above: motor is fixedly installed on fixed seat, and the output end of motor is connected with two-way threaded rod by shaft coupling.

[0011] The utility model provides a kind of semiconductor device fast fixing device as described above: pneumatic telescopic device is hydraulic cylinder or air cylinder.

[0012] The utility model provides a kind of semiconductor device fast fixing device as described above: controller is fixedly installed on fixed seat to control device power component.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] (1), before the semiconductor device substrate is processed, the staff drives the second sliding block on the lower base plate to move horizontally by starting the pneumatic telescopic device, which can drive the second sliding block to slide inside the second sliding groove, thereby driving the articulated rod to rotate, thereby driving the upper base plate to lift, thereby adjusting the height of the fixing seat, thereby adjusting the height of the semiconductor device substrate fixedly connected to the fixing seat, thereby facilitating the staff to adjust the appropriate working position according to their own conditions, avoiding long-time bending to make the staff feel uncomfortable, thereby affecting the work efficiency;

[0015] (2), when the semiconductor device substrate is fixed, the motor is started to drive the bidirectional threaded rod to rotate, and the threaded sleeve and the bidirectional threaded rod are threadedly connected to drive the threaded sleeve to move horizontally, thereby driving the limiting sliding plate to slide inside the limiting sliding groove, thereby driving the movable blocks on both sides of the semiconductor device substrate to move relatively, thereby driving the clamping blocks to move and be clamped inside the clamping pieces on both sides of the semiconductor device substrate to clamp and fix the semiconductor device substrate, and when disassembled, the motor is reversed to drive, thereby the semiconductor device substrate can be quickly disassembled. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a front view structure schematic diagram of a semiconductor device quick fixing device.

[0017] Figure 2 It is a whole structure schematic diagram of a semiconductor device quick fixing device.

[0018] Figure 3 It is a semiconductor device quick fixing device Figure 2 partial enlarged structure schematic diagram.

[0019] In the figure: 1, semiconductor device substrate; 2, clamping piece; 3, fixing seat; 4, movable block; 5, clamping block; 6, spring; 7, bidirectional threaded rod; 8, threaded sleeve; 9, limiting sliding groove; 10, limiting sliding plate; 11, motor; 12, lower base plate; 13, upper base plate; 14, articulated rod; 15, second sliding groove; 16, second sliding block; 17, pneumatic telescopic device. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0021] Please refer to Figures 1-3As an embodiment of the utility model, a kind of semiconductor device fast fixing device, including fixed seat 3, semiconductor device substrate 1 is movably clamped in fixed seat 3, the shell inside fixed seat 3 and located the both sides of semiconductor device substrate 1 are respectively provided with clamping groove, the both sides of semiconductor device substrate 1 are respectively fixedly installed with the clamping piece 2 located in the inside of clamping groove, slidingly clamped with movable block 4 in the inside of clamping groove, movable block 4 is fixed with the clamping block 5 that is movably clamped in the inside of clamping piece 2, mobile drive device for driving movable block 4 relative movement is provided on fixed seat 3, lower bottom plate 12 is provided below fixed seat 3, upper bottom plate 13 is fixed on the bottom of fixed seat 3, two midpoint articulated rods 14 articulated together are provided between upper bottom plate 13 and lower bottom plate 12, articulated rod 14 one end is articulated with lower bottom plate 12 or upper bottom plate 13, second sliding slot 15 is respectively provided on lower bottom plate 12 and upper bottom plate 13, second sliding block 16 slidingly clamped in the inside of second sliding slot 15 is fixed to the other end of articulated rod 14, pneumatic telescopic device 17 for driving second sliding block 16 horizontal movement on lower bottom plate 12 is fixedly installed on lower bottom plate 12.

[0022] In the embodiment, when semiconductor device substrate 1 is fixed, start motor 11 drives bidirectional screw rod 7 to rotate, and the threaded sleeve 8 is connected with the bidirectional screw rod 7 by screw thread, so that the threaded sleeve 8 can be moved horizontally, thereby the movable block 4 on both sides of the semiconductor device substrate 1 can be moved relatively, so that the clamping block 5 is moved to be clamped in the clamping piece 2 on both sides of the semiconductor device substrate 1, thereby the semiconductor device substrate 1 is clamped and fixed, and when disassembled, the motor 11 is reversed; before processing the semiconductor device substrate 1, the staff drives the second sliding block 16 on the lower bottom plate 12 to move horizontally by starting the pneumatic telescopic device 17, so that the second sliding block 16 can slide in the second sliding slot 15, thereby the articulated rod 14 can be rotated, so that the upper bottom plate 13 can be jacked up, thereby the height of the fixed seat 3 can be adjusted, and the height of the semiconductor device substrate 1 clamped and fixed on the fixed seat 3 can be adjusted.

[0023] As a further scheme of the utility model, the spring 6 is fixedly connected between the movable block 4 and the clamping groove.

[0024] In the embodiment, the spring 6 is used to apply pressure to the movable block 4 when the clamping block 5 is clamped in the clamping piece 2, so that the movable block 4 and the clamping piece 2 are more tightly and stably clamped, and the spring 6 can also buffer the shaking of the clamping block 5 and the clamping piece 2 when they are clamped.

[0025] As a further scheme of the utility model, the outer dimension of the clamping block 5 is matched with the inner dimension of the clamping piece 2, and the clamping block 5 is movably embedded in the clamping piece 2.

[0026] In this embodiment, the movable block 4 is clamped with the clamping piece 2 to fix the semiconductor device substrate 1 by clamping the movable block 5 in the clamping piece 2.

[0027] As a further scheme of the utility model, the mobile driving device comprises a two-way threaded rod 7 rotatably installed on the fixed seat 3 through a bearing, two threaded sleeves 8 are threadedly connected on the two-way threaded rod 7, a limiting sliding groove 9 is arranged in the clamping groove, a limiting sliding plate 10 is fixed on the threaded sleeve 8 and clamped in the limiting sliding groove 9, and the top of the limiting sliding plate 10 is fixedly connected with the movable block 4.

[0028] In this embodiment, when the semiconductor device substrate 1 is fixed, the two-way threaded rod 7 is rotated, the threaded sleeve 8 is driven to move horizontally by the threaded connection between the threaded sleeve 8 and the two-way threaded rod 7, the limiting sliding plate 10 is driven to slide in the limiting sliding groove 9, the movable blocks 4 on both sides of the semiconductor device substrate 1 are driven to move relatively, the clamping block 5 is driven to move and clamp in the clamping piece 2 on both sides of the semiconductor device substrate 1 to clamp and fix the semiconductor device substrate 1, and the motor 11 is reversed to disassemble.

[0029] As a further scheme of the utility model, the motor 11 is fixedly installed on the fixed seat 3, and the output end of the motor 11 is connected with the two-way threaded rod 7 through a shaft coupling.

[0030] In this embodiment, the motor 11 is started to drive the two-way threaded rod 7 to rotate, and the threaded sleeve 8 is driven to move horizontally by the threaded connection between the threaded sleeve 8 and the two-way threaded rod 7.

[0031] As a further scheme of the utility model, the pneumatic telescopic device 17 is a hydraulic cylinder or an air cylinder.

[0032] In this embodiment, the second sliding block 16 on the lower bottom plate 12 is driven to move horizontally by the pneumatic telescopic device 17, the second sliding block 16 is driven to slide in the second sliding groove 15, and the hinged rod 14 is driven to rotate.

[0033] As a further scheme of the utility model, the controller for controlling the power components of the device is fixedly installed on the fixed seat 3.

[0034] In this embodiment, the power components of the device are automatically controlled, and the degree of automation is improved.

[0035] The working principle of the utility model is: before processing the semiconductor device substrate 1, the staff drives the second sliding block 16 on the lower bottom plate 12 to move horizontally by starting the pneumatic telescopic device 17, which can drive the second sliding block 16 to slide in the second sliding groove 15, thereby driving the articulated rod 14 to rotate, thereby driving the upper bottom plate 13 to lift, thereby adjusting the height of the fixing seat 3, thereby lifting and adjusting the height of the semiconductor device substrate 1 fixed on the fixing seat 3, thereby the staff can adjust the appropriate working position according to the own condition, avoiding the staff to feel uncomfortable due to long time bending, thereby affecting the work efficiency; in addition, when fixing the semiconductor device substrate 1, the staff drives the bidirectional screw rod 7 to rotate by starting the motor 11, which can drive the threaded sleeve 8 to move horizontally by the threaded connection between the threaded sleeve 8 and the bidirectional screw rod 7, thereby driving the limiting sliding plate 10 to slide in the limiting sliding groove 9, thereby driving the movable block 4 on both sides of the semiconductor device substrate 1 to move relatively, thereby driving the clamping block 5 to move and clamp in the clamping piece 2 on both sides of the semiconductor device substrate 1 to clamp and fix the semiconductor device substrate 1; when disassembling, the staff can reverse the motor 11, thereby the utility model can quickly disassemble the semiconductor device substrate 1.

[0036] The above examples are exemplary rather than limiting, and the technical solutions of the utility model can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model, which are all included in the utility model.

Claims

1. A fastening device for semiconductor devices, comprising a fastening seat (3), characterized in that, The semiconductor device substrate (1) is movably clamped in the fixing seat (3), clamping grooves are arranged in the shell of the fixing seat (3) and located at both sides of the semiconductor device substrate (1), clamping pieces (2) are fixedly installed at both sides of the semiconductor device substrate (1) and located in the clamping grooves, movable blocks (4) are slidably clamped in the clamping grooves, clamping blocks (5) are fixed on the movable blocks (4) and movably clamped in the clamping pieces (2), a moving driving device is arranged on the fixing seat (3) and used for driving the movable blocks (4) to move, a lower bottom plate (12) is arranged below the fixing seat (3), an upper bottom plate (13) is fixed to the bottom of the fixing seat (3), two hinge rods (14) are arranged between the upper bottom plate (13) and the lower bottom plate (12) and hingedly connected together, one end of the hinge rod (14) is hingedly connected to the lower bottom plate (12) or the upper bottom plate (13), second sliding grooves (15) are arranged in the lower bottom plate (12) and the upper bottom plate (13) respectively, second sliding blocks (16) are fixed to the other end of the hinge rod (14) and slidably clamped in the second sliding grooves (15), and pneumatic telescopic devices (17) are fixedly installed on the lower bottom plate (12) and used for driving the second sliding blocks (16) on the lower bottom plate (12) to move horizontally.

2. The apparatus according to claim 1, wherein The spring (6) is fixedly connected between the movable block (4) and the clamping groove.

3. The apparatus of claim 1, wherein the apparatus is a semiconductor device quick fixer. The outer dimension of the clamping block (5) is matched with the inner dimension of the clamping piece (2), and the clamping block (5) is movably embedded in the clamping piece (2).

4. The apparatus according to claim 1, wherein The moving driving device comprises a bidirectional threaded rod (7) rotatably installed on the fixing seat (3) through a bearing, two threaded sleeves (8) are threadedly connected to the bidirectional threaded rod (7), a limiting sliding groove (9) is arranged in the clamping groove, a limiting sliding plate (10) is fixed to the threaded sleeve (8) and slidably clamped in the limiting sliding groove (9), and the limiting sliding plate (10) is fixedly connected to the movable block (4).

5. The apparatus according to claim 4, wherein The motor (11) is fixedly installed on the fixing seat (3), and the output end of the motor (11) is connected with the bidirectional threaded rod (7) through a shaft coupling.

6. The apparatus of claim 1, wherein the apparatus is a semiconductor device quick fixer. The pneumatic telescopic device (17) is a hydraulic cylinder or an air cylinder.

7. The apparatus of claim 1, wherein the apparatus is a semiconductor device quick fixer. The controller is fixedly installed on the fixing seat (3) and used for controlling the power components of the device. The controller is fixedly installed on the fixing seat (3) and used for controlling the power components of the device.

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