Radiator for electric load device and electronic equipment

Abstract

A heat sink for an electrical load device and an electronic device wherein the heat sink comprises: a heat dissipation housing having a main body portion and at least one heat dissipation portion protruding outward from a first side of the main body portion, the main body portion defining an evaporation cavity, each heat dissipation portion defining a condensation cavity, the condensation cavities are communicated with the evaporation cavity, the evaporation cavity is provided with an opening in the second side of the main body part, and the first side is opposite to the second side; the cover part is used for sealing the opening, and the cover part is thermally coupled with an electric load device; and the condensation cavity and / or the evaporation cavity are / is filled with a phase change working medium. By adopting the radiator of the technical scheme, the production cost can be reduced, and the radiating effect can be enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electric load device technical field especially, it relates to a radiator for electric load device and electronic equipment. BACKGROUND

[0002] In electric load device, with the device made of LED (Light Emitting Diode, light emitting diode), IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), MOS (Metal-Oxide-Semiconductor, metal oxide semiconductor field effect transistor) etc. as an example, high heat is a problem that can not be ignored. These devices will produce a large amount of heat in the working process, if not in time heat dissipation, will seriously affect the service life of electric load device, even lead to device damage. Therefore, the heat dissipation problem has become one of the key factors restricting the performance improvement and wide application of electric load device.

[0003] At present, the radiator for electric load device is mainly metal radiator, such as finned radiator etc. These radiators are usually made of solid aluminum, aluminum alloy or other metal materials, utilize the heat conduction characteristics of metal, conduct the heat of heat source device to the heat dissipation surface of radiator, and then dissipate the heat to the air through air convection (natural convection or forced convection). Although this kind of heat dissipation mode solves the heat dissipation problem of electric load device to some extent, it has some obvious shortcomings.

[0004] Firstly, the weight of metal radiator is large, and the material consumption is large, which not only increases the manufacturing cost of products, but also limits its application in some fields. Secondly, in order to pursue larger heat dissipation area to improve the heat dissipation effect, the size of the radiator will also increase accordingly, but limited by the thermal conductivity coefficient of metal material (the thermal conductivity coefficient of existing metal materials used to manufacture radiator is generally below 300W / (m·K) level), increasing the size of the radiator does not bring significant improvement of heat dissipation effect.

[0005] In addition, the manufacturing process of metal radiator is relatively complex, which needs to be processed and assembled through multiple processes, which not only increases the production cost, but also prolongs the production cycle. UTILITY MODEL CONTENTS

[0006] The utility model solves the technical problem to provide a radiator for electric load device and its manufacturing method and electronic equipment with lower production cost and better heat dissipation effect.

[0007] To solve the above technical problems, the utility model discloses a heat sink for electric load device, include: heat dissipation casing, the heat dissipation casing has the main part and at least one heat dissipation part from the first side of the main part outwardly convex, the main part is defined with evaporative cavity, every heat dissipation part is defined with condensation cavity, various condensation cavities are communicated with evaporative cavity, the evaporative cavity has the opening at the second side of the main part, the first side and the second side are opposite, cover portion, seal the opening, the cover portion is coupled with an electric load device heat, wherein, fill phase change working medium in the condensation cavity and / or evaporative cavity.

[0008] Optionally, the main part and the heat dissipation part are integrally formed.

[0009] Optionally, the main part and the heat dissipation part are integrally formed.

[0010] Optionally, each heat dissipation part has a smooth outer wall.

[0011] Optionally, the number of heat dissipation parts is multiple, and there is a non-zero gap between two adjacent heat dissipation parts in the multiple heat dissipation parts.

[0012] Optionally, the number of heat dissipation parts is multiple, and the multiple heat dissipation parts include: a first heat dissipation part extending away from the second side from the first side of the main part; and multiple second heat dissipation parts radially dispersedly connected to the outer periphery of the first heat dissipation part, and the condensation cavities defined by the multiple second heat dissipation parts are respectively communicated with the condensation cavity defined by the first heat dissipation part.

[0013] Optionally, the number of heat dissipation parts is multiple, and the multiple heat dissipation parts are centrally symmetrically arranged or axially symmetrically arranged.

[0014] Optionally, the cover portion has a recessed portion recessed towards the main part, and the recessed portion is adapted to receive at least a part of the electric load device.

[0015] Optionally, at least a part of the side wall of the cover portion forming the recessed portion and the side wall of the main part forming the evaporative cavity form a containing cavity, and the containing cavity surrounds the recessed portion and serves as a part of the evaporative cavity.

[0016] Optionally, the cover portion includes a plate portion and a first flange extending in a first direction from the outer edge of the plate portion, the heat dissipation casing includes a first extension wall extending in the first direction from the plane where the plate portion is located, at least a part of the first flange and at least a part of the first extension wall are seamlessly fitted, and the first direction is the same as the direction in which the first side points to the second side.

[0017] Optionally, the cover part further comprises a second flange, which is folded from a side of the first flange away from the plate part in a direction opposite to the first direction, the first extension wall is clamped between the first flange and the second flange, and the first flange, the first extension wall and the second flange are sequentially seamlessly attached.

[0018] Optionally, the cover part further comprises a second flange, which is folded from a side of the first flange away from the plate part in a direction opposite to the first direction, a third flange, which is folded from a side of the second flange away from the first flange in the first direction, and the heat dissipation shell further comprises a second extension wall, which is folded from a side of the first extension wall away from the plane in which the plate part is located in the first direction, wherein the third flange is clamped between the first extension wall and the second extension wall, the second extension wall is clamped between the second flange and the third flange, and the first flange, the first extension wall, the third flange, the second extension wall and the second flange are sequentially seamlessly attached.

[0019] Optionally, a capillary structure is arranged on an inner wall of the heat dissipation shell, and the liquid phase phase-change working medium is returned to the evaporation cavity from the condensation cavity under the action of the capillary structure.

[0020] To solve the above technical problems, the utility model embodiment further provides a kind of manufacturing method of heat sink for electric load device, comprising: forming heat dissipation shell, the heat dissipation shell has main part and at least one heat dissipation part, which is protruded from the first side of the main part, the main part is defined with evaporation cavity, each heat dissipation part is defined with condensation cavity, each evaporation cavity is communicated with the condensation cavity, the evaporation cavity has opening in the second side of the main part, and the first side and the second side are opposite;Phase-change working medium is filled in the condensation cavity and / or the evaporation cavity;The opening is sealed using cover part.

[0021] Optionally, the filling of phase-change working medium in the condensation cavity and / or the evaporation cavity is carried out in a vacuum environment.

[0022] Optionally, before the filling of phase-change working medium in the condensation cavity and / or the evaporation cavity, the method further comprises: vacuumizing the condensation cavity and the evaporation cavity.

[0023] Optionally, the forming of heat dissipation shell comprises: providing a profile; stamping the profile to form the main part and heat dissipation part.

[0024] Optionally, the stamping of the profile comprises: first-step stamping of the profile to form a columnar intermediate structure with opening; second-step stamping of the bottom surface of the columnar intermediate structure to form the heat dissipation part.

[0025] Optionally, the step of sealing the opening with the cover includes: providing the cover, the cover including a plate portion and a first flange extending from an outer edge of the plate portion in a first direction, the heat dissipation shell including a first extension wall extending from a plane on which the plate portion is located in the first direction, at least a portion of the first flange and at least a portion of the first extension wall being seamlessly attached, the first direction being the same as a direction in which the first side points to the second side; forming a second flange, the second flange being folded from a side of the first flange away from the plate portion in a direction opposite to the first direction, the first extension wall being clamped between the first flange and the second flange, the first flange, the first extension wall and the second flange being sequentially seamlessly attached.

[0026] Optionally, the method further includes: simultaneously applying opposite pressing forces to the first flange and the second flange to sequentially seamlessly attach the first flange, the first extension wall and the second flange.

[0027] Optionally, the step of sealing the opening with the cover includes: providing the cover, the cover including a plate portion and a first flange extending from an outer edge of the plate portion in a first direction, the heat dissipation shell including a first extension wall extending from a plane on which the plate portion is located in the first direction, at least a portion of the first flange and at least a portion of the first extension wall being seamlessly attached, the first direction being the same as a direction in which the first side points to the second side; forming a second flange, the second flange being folded from a side of the first flange away from the plate portion in a direction opposite to the first direction; forming a second extension wall, the second extension wall being folded from a side of the first extension wall away from the plane on which the plate portion is located in the first direction, the second extension wall being attached to the second flange; forming a third flange, the third flange being folded from a side of the second flange away from the first flange in the first direction, the third flange being clamped between the first extension wall and the second extension wall, the second extension wall being clamped between the second flange and the third flange, the first flange, the first extension wall, the third flange, the second extension wall and the second flange being sequentially seamlessly attached.

[0028] Optionally, the method further includes: simultaneously applying opposite pressing forces to the first flange and the second flange to sequentially seamlessly attach the first flange, the first extension wall, the third flange, the second extension wall and the second flange.

[0029] Optionally, a capillary structure is arranged on an inner wall of the heat dissipation shell, the phase change working medium in liquid state flowing back to the evaporation cavity from the condensation cavity under the action of the capillary structure.

[0030] Optionally, the electrical load device is an LED lamp or a power semiconductor device.

[0031] To solve the above technical problems, the utility model discloses an electronic equipment, comprising: electric load device;The radiator of the above.

[0032] Compared with the prior art, the technical scheme of the utility model embodiment has the following beneficial effects:

[0033] To solve the above technical problems, the utility model discloses a radiator for electric load device, comprising: radiator shell, the radiator shell has main part and at least one radiating part that protrudes from the first side of the main part, the main part is defined with evaporative cavity, each radiating part is defined with condensation cavity, each condensation cavity is communicated with the evaporative cavity, the evaporative cavity has the opening at the second side of the main part, and the first side and the second side are opposite;Cover part, seal the opening, the cover part is thermally coupled with an electric load device;Wherein, the condensation cavity and / or evaporative cavity are filled with phase change working medium.

[0034] The radiator for electric load device adopting the technical scheme of the present application, the radiator includes a radiator shell and a cover part, the radiator shell has a main part and a radiating part, the radiating part is communicated with the main part, forming a condensation cavity and an evaporative cavity. The condensation cavity and / or the evaporative cavity are filled with phase change working medium, and the physical properties of the phase change working medium are utilized to achieve efficient heat dissipation. Specifically, when the electric load device generates heat, the phase change working medium in the evaporative cavity is heated and vaporized (or evaporated) to absorb heat and carry away the heat; then the gaseous phase change working medium flows to the condensation cavity, exchanges heat with the external air through the radiating part, condenses into a liquid state and returns to the evaporative cavity, forming a circulating heat dissipation. This heat dissipation method is not only efficient, but also stable and reliable.

[0035] Further, the main part and the radiating part are formed synchronously or step by step through a stamping process. This integrated design simplifies the production process, reduces the use of complex processes such as welding, thereby reducing production costs. At the same time, the integrated design also enhances the overall structural strength of the radiator, improves the reliability and durability of the product. In addition, the stamping process not only enables the main part and the radiating part to be integrally formed, but also provides more optional space for the shape of the radiator shell. By adjusting the shape and size of the stamping die, radiators of different shapes and sizes can be conveniently produced to meet the heat dissipation needs of different electric load devices.

[0036] Further, the number, shape and arrangement of the radiating parts can be flexibly designed according to actual needs. For example, the radiating parts can be in a variety of shapes such as straight lines, arcs, dots and rings, and can be arranged centrally or axially symmetrically. This diversified design not only improves the heat dissipation efficiency of the radiator, but also increases the aesthetic and practicality of the product.

[0037] Further, the connection between the heat dissipation shell and the cover part can be closed by physical curling of the first flange and the first extension wall, without introducing additional materials or structures. This connection simplifies the production process, reduces production costs, and ensures the structural strength of the heat dissipation device as a whole. In addition, by simultaneously applying opposite pressing forces to the first flange and the second flange, the sealing and stability of the connection can be further enhanced.

[0038] To solve the above technical problems, the utility model embodiment further provides a kind of manufacturing method of heat dissipation device for electric load device, comprising: form heat dissipation shell, the heat dissipation shell has main part and at least one heat dissipation part from the first side of the main part, the main part is defined with evaporation cavity, each heat dissipation part is defined with condensation cavity, each condensation cavity is communicated with evaporation cavity, the evaporation cavity has opening in the second side of the main part, the first side and the second side are opposite;In the condensation cavity and / or evaporation cavity, fill phase change working medium;With cover part, the opening is sealed.

[0039] The technical scheme of the present application comprises the steps of forming a heat dissipation shell, filling a phase change working medium, and sealing an opening with a cover part. The phase change working medium can be filled in a vacuum environment to reduce the influence of air on the heat dissipation effect. At the same time, vacuum extraction can further improve the heat dissipation efficiency of the heat dissipation device. In addition, the heat dissipation shell and the heat dissipation part are formed by stamping process, and the connection between the heat dissipation shell and the cover part is realized by physical curling, which simplifies the production process and reduces the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is a schematic diagram of a heat dissipation device for electric load device according to an embodiment of the present utility model;

[0041] Figure 2 is Figure 1 the sectional view along A-A view angle of the structure shown in the figure;

[0042] Figure 3 is Figure 1 a schematic diagram of another specific implementation mode of the heat dissipation device shown in the figure;

[0043] Figure 4 is Figure 1 a schematic diagram of still another specific implementation mode of the heat dissipation device shown in the figure;

[0044] Figure 5 is Figure 1 a schematic diagram of yet another specific implementation mode of the heat dissipation device shown in the figure;

[0045] Figure 6 is Figure 1 a schematic diagram of still another specific implementation mode of the heat dissipation device shown in the figure;

[0046] Figure 7 is Figure 2 is a schematic view of a connection mode of a heat dissipation shell and a cover part in a region B;

[0047] Figure 8 is Figure 7 is a schematic view of a variation of the structure shown in the figure;

[0048] Figure 9 is a flow chart of a manufacturing method of a heat sink for an electrical load device according to an embodiment of the present application. DETAILED DESCRIPTION

[0049] As described in the background, the existing heat sink structure for an electrical load device is complex, the manufacturing process is cumbersome, the production cost is high, and the heat dissipation efficiency is insufficient.

[0050] To solve the problems of the prior art, the present application provides a heat sink for an electrical load device and a manufacturing method thereof and an electronic device, wherein the heat sink for an electrical load device comprises: a heat dissipation shell, the heat dissipation shell has a main body part and at least one heat dissipation part protruding outward from a first side of the main body part, the main body part defines an evaporation cavity, each heat dissipation part defines a condensation cavity, each condensation cavity is in communication with the evaporation cavity, the evaporation cavity has an opening at a second side of the main body part, the first side and the second side are opposite; a cover part seals the opening, the cover part is thermally coupled with an electrical load device; wherein the condensation cavity and / or the evaporation cavity is filled with a phase change working medium.

[0051] The heat sink for an electrical load device adopting the technical scheme of the present application comprises a heat dissipation shell and a cover part, the heat dissipation shell has a main body part and a heat dissipation part, the heat dissipation part is in communication with the main body part, forming a condensation cavity and an evaporation cavity. The condensation cavity and / or the evaporation cavity is filled with a phase change working medium, and the physical properties of the phase change working medium are utilized to achieve efficient heat dissipation. Specifically, when the electrical load device generates heat, the phase change working medium in the evaporation cavity is heated and vaporized (or evaporated) to absorb heat and take away the heat; then the gaseous phase change working medium flows to the condensation cavity, exchanges heat with the external air through the heat dissipation part, condenses into a liquid state and flows back to the evaporation cavity, forming a circulating heat dissipation. This heat dissipation mode is not only efficient, but also stable and reliable.

[0052] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0053] Figure 1 is a schematic view of a heat sink 100 for an electrical load device according to an embodiment of the present application, Figure 2 is Figure 1 is a sectional view of the structure shown in the figure along the A-A view angle.

[0054] Reference Figure 1 and Figure 2 The heat sink 100 for the electric load device comprises a heat dissipation housing 1 having a main body part 11 and at least one heat dissipation part 12 protruding outwardly from a first side 111 of the main body part 11, the main body part 11 defining an evaporation cavity 101, each of the heat dissipation parts 12 defining a condensation cavity 102, each of the condensation cavities 102 being in communication with the evaporation cavity 101, the evaporation cavity 101 having an opening at a second side 112 of the main body part 11 opposite to the first side 111, a cover part 2 sealing the opening, the cover part 2 being thermally coupled with an electric load device, wherein the condensation cavities 102 and / or the evaporation cavity 101 are filled with a phase change working medium.

[0055] The electric load device refers to an element or device for consuming or absorbing electric energy in an electric circuit. These devices can have different characteristics and functions according to different application requirements.

[0056] In an optional embodiment, the electric load device is an LED lamp or a power semiconductor device. Further, the power semiconductor device can include an insulated gate bipolar transistor (IGBT) or a power metal oxide semiconductor field effect transistor (power MOS tube) and the like.

[0057] Specifically, the main body part 11 has opposite first and second sides 111 and 112, wherein the second side 112 is closer to a heat source, i.e. the electric load device (not shown in the figure) to be cooled, than the first side 111. In other words, in a specific application scenario, the heat generated by the electric load device is transferred to the second side 112 of the main body part 11 by heat conduction.

[0058] Further, the cover part 2 is arranged on the second side 112 of the main body part 11 and is thermally coupled with the electric load device.

[0059] Further, the heat dissipation housing 1 is indirectly thermally coupled with the electric load device through the cover part 2.

[0060] Further, the main body part 11 defines the evaporation cavity 101, and the at least one heat dissipation part 12 arranged on the first side 111 of the main body part 11 defines the condensation cavity 102. In other words, the evaporation cavity 101 is closer to the heat source than the condensation cavity 102.

[0061] Further, the phase change working medium can at least be converted between gaseous and liquid states within a phase change temperature range and reciprocally flow between the evaporation cavity 101 and the condensation cavity 102.

[0062] In a specific application scenario, the initial state of the phase change working fluid can be, for example, liquid. The liquid phase change fluid is contained in the evaporation chamber 101 and is closer to the second side 112 than the first side 111. An electrical load device, acting as a heat source, transfers heat to the phase change working fluid via heat transfer, causing the temperature of the phase change working fluid to rise and gradually vaporize (or evaporate), absorbing heat in the process. The gaseous phase change working fluid diffuses from the evaporation chamber 101 in the opposite direction to the first direction D1 to at least one condensation chamber 102 (e.g., Figure 2 (As shown by the dashed arrow). The first direction D1 is in the same direction as the direction from the first side 111 to the second side 112.

[0063] Furthermore, because it is far from the heat source, the temperature inside the condensing chamber 102 is lower than the temperature inside the evaporating chamber 101. The heat carried by the gaseous phase change working fluid is dissipated in the condensing chamber 102, and the temperature gradually decreases until it re-condenses (or liquefies) into a liquid phase change working fluid. Further, the liquid phase change working fluid flows back into the evaporating chamber 101 (e.g., ...). Figure 2 (As indicated by the solid arrow in the middle), to continue absorbing heat and vaporizing (or evaporating). Thus, during the cyclic phase change process, the phase change working fluid continuously carries the heat from the heat source to the condensation chamber, and then transfers it to the external environment through the heat dissipation section 12.

[0064] In some embodiments, the phase change working medium may be selected from alcohols such as ethanol and methanol and related mixtures, or the type of phase change working medium may be determined according to the specific application scenario.

[0065] Furthermore, the boiling point of the phase change working fluid should be lower than the highest temperature threshold at which the electrical load device can operate stably, so as to ensure that the temperature of the electrical load device is always kept below the highest temperature threshold.

[0066] In some embodiments, both the evaporation chamber 101 and the condensation chamber 102 can be vacuum chambers before being filled with the phase change working fluid. This avoids the mixing of air and other substances from affecting the normal operation of the phase change working fluid.

[0067] In some embodiments, the heat dissipation housing 1 and the cover 2 may be made of materials with high thermal conductivity, such as aluminum alloy, stainless steel, copper and copper alloy, to ensure the heat dissipation efficiency of the heat sink 100.

[0068] Continue to refer to Figure 1 and Figure 2In some embodiments, the main body part 11 and the heat dissipation part 12 are integrally formed. That is, the entire heat dissipation shell 1 is integrally formed. In this way, the integrally formed main body part 11 and the heat dissipation part 12 can make the heat dissipation shell 1 have higher structural strength. And the integrally formed main body part 11 and the heat dissipation part 12 are easier to manufacture, and the production of the entire heat dissipation shell 1 can be completed through fewer manufacturing steps. In this way, the manufacturing cost can be reduced, and the production efficiency can be improved.

[0069] In some embodiments, the main body part 11 and the heat dissipation part 12 are formed synchronously or step by step through a stamping process. The stamping process is a commonly used metal processing method, which uses a mold to apply external force to a metal plate on a press machine to make it plastically deform, thereby obtaining a part with the required shape and size.

[0070] In a typical application scenario, a mold with a specific shape can be selected according to actual production needs, and the mold is used to stamp the main body part 11 and the heat dissipation part 12 synchronously. In this way, the process steps can be simplified, and the production efficiency of the heat dissipation shell 1 can be improved.

[0071] In another typical application scenario, a mold can be used to stamp the main body part 11, and another mold can be used to stamp the heat dissipation part 12. In this way, the step-by-step stamping of the heat dissipation shell 1 can improve the yield and reduce the risk of material breakage during the stamping process.

[0072] In other embodiments, the heat dissipation shell 1 can also be integrally formed using a process such as vacuum forming, hot pressing, or injection molding.

[0073] In some embodiments, each heat dissipation part 12 has a smooth outer wall. The heat dissipation part 12 with a smooth outer wall means that the outer wall of the heat dissipation part 12 is not provided with other heat dissipation structures (such as fins), and the outer wall of the heat dissipation part 12 directly exchanges heat with the external environment. In this way, the smooth outer wall of the heat dissipation part 12 directly exchanges heat with the external environment instead of through fins and other heat dissipation structures, reducing the occupation of the heat dissipation part 100 in three-dimensional space and avoiding the increase in the overall size of the heat dissipation part 100 due to fins and other heat dissipation structures. In addition, without fins and other heat dissipation structures, the cost can also be reduced.

[0074] Further, the heat dissipation part 12 has a smooth outer wall, so that each heat dissipation part 12 forms a convex polyhedron (or Euler polyhedron). Such a structure allows the heat dissipation part 12 to be formed by simple processing methods such as stamping, which is beneficial to further reduce costs.

[0075] Further, the finned or other heat-dissipating structure also limits the number and layout of the heat-dissipating portions 12, affecting the heat-dissipating effect. Thus, each heat-dissipating portion 12 having a smooth outer wall enables more heat-dissipating portions 12 to be formed on the heat-dissipating shell 1, thereby achieving a more optimal heat-dissipating effect.

[0076] Further, in a heat sink provided with finned or other heat-dissipating structures, the finned or other heat-dissipating structures usually require additional process steps such as cutting, welding or riveting for manufacturing and installation, which not only increases the processing time and cost but also can introduce potential failure points. In comparison, the heat-dissipating portions 12 having smooth outer walls simplifies the manufacturing process of the heat sink 100, reduces the processing steps and required equipment, thereby reducing the production cost. In addition, the heat sink 100 without finned or other heat-dissipating structures is also more convenient for subsequent surface treatment (such as spraying, electroplating, etc.), further reducing the processing cost.

[0077] Reference Figure 1 , Figures 3 to 6 In some embodiments, the cross-sectional shape of the main body portion 11 along a plane perpendicular to the direction pointing from the first side 111 to the second side 112 (i.e., the first direction D1) is one of a circle, an ellipse, a rectangle, and a polygon. In other words, the cross-section is perpendicular to the first direction D1.

[0078] In some embodiments, the cross-sectional shape of the main body portion 11 is adapted to the electrical load device. Thus, the shape and size of the main body portion 11 can be customized according to the specific shape, size and heat-dissipating requirement of the electrical load device, to ensure the close fit between the heat sink 100 and the electrical load device, thereby improving the heat-dissipating efficiency and reducing the thermal resistance. At the same time, the cross-sectional shape of the main body portion 11 adapted to the electrical load device can also help optimize the overall appearance and installation convenience of the electrical load device.

[0079] Continuing to refer to Figure 1 , Figures 3 to 6 The number of the heat-dissipating portions 12 is a plurality. The plurality of heat-dissipating portions 12 are dispersedly arranged on the first side of the main body portion 11. Thus, the area of the heat sink 100 can be increased, improving the heat-dissipating efficiency.

[0080] In some embodiments, the cross-sectional shape of at least one of the plurality of heat-dissipating portions 12 along a plane perpendicular to the direction pointing from the first side 111 to the second side 112 (i.e., the first direction D1) extends in a straight line.

[0081] In one specific implementation, referring to Figure 3In some embodiments, each of the plurality of heat dissipation portions 12 has a cross-sectional shape extending linearly along a plane perpendicular to the first direction D1.

[0082] Further, the plurality of heat dissipation portions 12 can extend in parallel directions from one side of the main body portion 11 to the other side. In this way, the space utilization can be improved, the number of heat dissipation portions 12 can be increased in a limited space, and the heat dissipation effect can be further improved and optimized.

[0083] In some embodiments, at least one of the plurality of heat dissipation portions 12 has a cross-sectional shape extending in an arc shape along a plane perpendicular to the first direction D1.

[0084] In a specific implementation, referring to Figure 4 , each of the plurality of heat dissipation portions 12 has a cross-sectional shape extending in an arc shape along a plane perpendicular to the first direction D1. In this way, the heat dissipation portion 12 extending in an arc shape can provide a larger heat dissipation area to improve the heat exchange efficiency.

[0085] In Figure 4 , at least two of the plurality of heat dissipation portions 12 are arranged around the first side 111 of the main body portion 11 from the outer edge, and the remaining heat dissipation portions 12 can be arranged in the space surrounded by the two heat dissipation portions 12 close to the edge to form a layer structure. In this way, a winding airflow channel is formed between the adjacent two layers of heat dissipation portions 12, which can effectively increase the heat exchange area between the heat dissipation portions 12 of the heat dissipation device 100 and the air in the external environment, thereby improving the heat dissipation efficiency.

[0086] In some embodiments, referring to Figure 1 , at least one of the plurality of heat dissipation portions 12 has a cross-sectional shape in a dot shape along a plane perpendicular to the first direction D1.

[0087] In some embodiments, at least one of the plurality of heat dissipation portions 12 has a cross-sectional shape in a ring shape.

[0088] In a specific implementation, referring to Figure 6 , at least two of the plurality of heat dissipation portions 12 have cross-sectional shapes in concentric circular rings nested with each other.

[0089] In some embodiments, a portion of the plurality of heat dissipation portions 12 have a linear cross-sectional shape and are radially distributed, and another portion of the plurality of heat dissipation portions 12 have a dot-like cross-sectional shape and are arranged between two adjacent heat dissipation portions 12 having a linear cross-sectional shape. In this way, the number of heat dissipation portions 12 can be increased, thereby optimizing the heat dissipation effect of the heat sink 100.

[0090] In some embodiments, at least one of the plurality of heat dissipation portions 12 has a cross-sectional shape different from the other heat dissipation portions 12. In actual applications, the distribution of the plurality of heat dissipation portions 12 can be designed according to the cross-sectional shape of the main body portion 11 and the actual heat dissipation requirements.

[0091] In some embodiments, there is a non-zero gap between two adjacent heat dissipation portions 12. In this way, the non-zero gap provides space for gas exchange and heat exchange outside the heat dissipation portion 12.

[0092] In one specific embodiment, referring to Figure 5 , the plurality of heat dissipation portions 12 include a first heat dissipation portion 121 extending from the first side 111 of the main body portion 11 away from the second side 112, and a plurality of second heat dissipation portions 122 radially and dispersedly connected to the outer periphery of the first heat dissipation portion 121, wherein the plurality of second heat dissipation portions 122 define the condensation cavity 102 that is in communication with the condensation cavity 102 defined by the first heat dissipation portion 121. In this way, the uniformity of heat dissipation can be improved, and the gaseous phase change working medium can flow between the first heat dissipation portion 121 and the plurality of second heat dissipation portions 122, thereby avoiding accumulation of the phase change working medium in some heat dissipation portions 12 and affecting the heat dissipation efficiency.

[0093] In some embodiments, the plurality of heat dissipation portions 12 are arranged in a central symmetry or an axial symmetry. In this way, compared with a disordered arrangement of the plurality of heat dissipation portions 12, the heat dissipation portions 12 arranged in a central symmetry or an axial symmetry can improve the space utilization, and more heat dissipation portions 12 can be arranged in a limited space to improve the heat dissipation effect.

[0094] Continuing to refer to Figure 2 , the cover portion 2 is recessed towards the first side 111 of the main body portion 11 to form a recessed portion 201 adapted to receive at least a portion of the electrical load device.

[0095] In one specific embodiment, the electrical load device can be connected to the wall of the recessed portion 201 by adhesion or clamping, etc.

[0096] Further, at least a portion of the side wall of the cover part 2 forming the recess part 201 and the side wall of the main part 11 forming the evaporation cavity 101 form a containing cavity 103, which is adapted to form a part of the evaporation cavity 101. In this way, the annular wall 103 is arranged around the heat source (for example, an electrical load device), which can increase the area of heat exchange between the phase change working medium and the heat source, and further optimize the heat dissipation effect.

[0097] With continued reference to Figure 2 , the cover part 2 includes a plate part 21 and a first flange 22 extending from an outer edge of the plate part 21 in a first direction D1, and the heat dissipation shell 1 includes a first extension wall 13 extending from a plane in which the plate part 21 is located in the first direction D1, and at least a portion of the first flange 22 and at least a portion of the first extension wall 13 are seamlessly fitted. In this way, the first flange 22 and the first extension wall 13 in face-to-face contact can strengthen the connection between the heat dissipation shell 1 and the cover part 2, and enhance the connection stability of the heat spreader 100. Further, the face-to-face contact between the first flange 22 and the first extension wall 13 has a better sealing effect than other contact modes (such as line contact). The face-to-face contact can provide a larger contact area, thereby increasing the reliability and stability of the sealing, avoiding accidental leakage of the phase change working medium, and effectively reducing the risk of performance degradation or failure due to poor sealing.

[0098] With reference to Figure 2 and Figure 7 , in some embodiments, the cover part 2 further includes a second flange 23 formed by folding away from a side of the first flange 22 away from the plate part 21 in the opposite direction of the first direction D1, and the first extension wall 13 is clamped between the first flange 22 and the second flange 23, and the first flange 22, the first extension wall 13, and the second flange 23 are sequentially seamlessly fitted. In this way, by providing the second flange 23, the connection area between the cover part 2 and the heat dissipation shell 1 is further increased, thereby further strengthening the sealing effect. Moreover, through physical folding and clamping processes, a tight and seamless connection between the heat dissipation shell 1 and the cover part 2 can be achieved without the need for additional welding processes or other connection materials, significantly simplifying the production process and reducing production costs.

[0099] With reference to Figure 2 and Figure 8In a variation, the cover part 2 can include: a second flange 23, which is folded from a side of the first flange 22 away from the plate part 21 in the opposite direction of the first direction D1; and a third flange 24, which is folded from a side of the second flange 23 away from the first flange 22 in the first direction D1. The heat dissipation shell 1 further includes: a second extension wall 14, which is folded from a side of the first extension wall 13 away from the plane of the plate part 21 in the first direction D1. The third flange 24 is clamped between the first extension wall 13 and the second extension wall 14, the second extension wall 14 is clamped between the second flange 23 and the third flange 24, and the first flange 22, the first extension wall 13, the third flange 24, the second extension wall 14, and the second flange 23 are sequentially seamlessly attached. In this way, the connection area between the cover part 2 and the heat dissipation shell 1 is further increased, and the sealing effect is further strengthened.

[0100] In some embodiments, more flanges and extension walls can be further folded to achieve a better sealing effect.

[0101] In this way, the sealing connection between the heat dissipation shell 1 and the cover part 2 is achieved only by physical folding, which is simple and helps to reduce production costs.

[0102] In some embodiments, the inner wall of the heat dissipation shell 1 can also be provided with a capillary structure (not shown in the figure), and the liquid phase change working medium can flow back to the evaporation cavity 101 under the action of the capillary structure. In this way, the circulation of the phase change working medium between the evaporation cavity 101 and the condensation cavity 102 can be accelerated, and the heat dissipation effect of the heat dissipation device 100 can be optimized.

[0103] As described above, the heat dissipation device 100 for an electric load device according to the technical scheme of the present application includes a heat dissipation shell 1 and a cover part 2. The heat dissipation shell 1 has a main body part 11 and a heat dissipation part 12, and the heat dissipation part 12 is in communication with the main body part 11 to form a condensation cavity 102 and an evaporation cavity 101. The condensation cavity 102 and / or the evaporation cavity 101 are filled with a phase change working medium, and the physical properties of the phase change working medium are used to achieve efficient heat dissipation. Specifically, when the electric load device generates heat, the phase change working medium in the evaporation cavity 101 is heated and vaporized (or evaporated) to absorb heat and carry away the heat; then the gaseous phase change working medium flows to the condensation cavity 102, exchanges heat with the external environment through the heat dissipation part 12, condenses into a liquid state, and flows back to the evaporation cavity 101, forming a circulating heat dissipation. This heat dissipation method is not only efficient, but also stable and reliable.

[0104] Further, the main body part 11 and the heat dissipation part 12 are formed synchronously or step by step through a stamping process. The integrated design simplifies the production process, reduces the use of complex processes such as welding, and thus reduces the production cost. At the same time, the integrated design also enhances the overall structural strength of the heat sink 100, improves the reliability and durability of the product. In addition, the stamping process not only enables the one-piece forming of the main body part 11 and the heat dissipation part 12, but also provides more optional space for the shape of the heat dissipation shell 1. By adjusting the shape and size of the stamping die, heat sinks 100 of different shapes and sizes can be conveniently produced to meet the heat dissipation needs of different electric load devices.

[0105] Further, the number, shape and arrangement of the heat dissipation parts 12 can be flexibly designed according to actual needs. For example, the heat dissipation parts 12 can be in a straight line, an arc, a point, a ring, etc. They can also be arranged in a central symmetry or an axial symmetry. Such diversified design not only improves the heat dissipation efficiency of the heat sink 100, but also increases the aesthetics and practicality of the product.

[0106] Further, the connection between the heat dissipation shell 1 and the cover part 2 can be closed by physical curling of the first flange 22 and the first extension wall 13, without introducing additional materials or structures. Such connection simplifies the production process, reduces the production cost, and at the same time ensures the overall structural strength of the heat sink 100. In addition, by simultaneously applying opposite pressing forces to the first flange 22 and the second flange 23, the sealing and stability of the connection can be further enhanced.

[0107] It should be understood that in typical actual applications of the heat sink 100 in the embodiments of the present application, the evaporation cavity 102 is located below the condensation cavity 101 in the direction of gravity. In some actual application scenarios, the heat sink 100 may also need to be arranged obliquely or upside down. At this time, the capillary structure arranged on the inner wall of the heat dissipation shell 1 can play a guiding role to make at least part of the liquid phase change working medium flow back to the evaporation cavity 102 against gravity.

[0108] Reference Figure 9 The embodiments of the present application also provide a manufacturing method for a heat sink for an electric load device, which can be used to manufacture the above-mentioned heat sink 100 as shown. Figures 1 to 8

[0109] Specifically, the method can include:

[0110] Step S1, forming a heat dissipation shell having a main body part and at least one heat dissipation part protruding outward from a first side of the main body part, the main body part defining an evaporation cavity, each heat dissipation part defining a condensation cavity, each condensation cavity being in communication with the evaporation cavity, the evaporation cavity having an opening at a second side of the main body part, the first side and the second side being opposite.​

[0111] Step S2, filling phase change working medium in the condensing cavity and / or the evaporating cavity;

[0112] Step S3, sealing the opening with a cover.

[0113] Wherein, the specific structure and working principle of the heat sink for the electric load device can refer to the related description of the embodiment shown in the foregoing Figures 1 to 8 , and will not be described here.

[0114] In some embodiments, step S2 can be performed in a vacuum environment.

[0115] In some embodiments, before performing step S2, the method further comprises: vacuumizing the condensing cavity and the evaporating cavity.

[0116] Therefore, the phase change working medium can be prevented from being mixed with impurities such as air and water vapor, which can affect the phase change process and further affect the heat dissipation effect.

[0117] In some embodiments, step S1 can comprise:

[0118] providing a profile;

[0119] stamping the profile to form the main body part and the heat dissipation part.

[0120] The profile can be made of materials with good plasticity, such as aluminum and aluminum alloy, stainless steel, or copper and copper alloy. In this way, the yield of the stamping process can be ensured.

[0121] In some embodiments, the stamping of the profile can be performed in steps, for example comprising:

[0122] first step stamping the profile to form a columnar intermediate structure with an opening;

[0123] second step stamping the bottom surface of the columnar intermediate structure to form the heat dissipation part.

[0124] In this way, the damage of the profile during single stamping can be avoided, and the yield of the cover can be effectively improved through step-by-step stamping.

[0125] In some embodiments, step S3 can comprise: providing the cover, the cover comprising a plate part and a first flange extending from the outer edge of the plate part in a first direction, the heat dissipation shell comprising a first extension wall extending from the plane where the plate part is located in the first direction, at least a part of the first flange and at least a part of the first extension wall being seamlessly attached, the first direction being in the same direction as the direction in which the first side points to the second side;

[0126] forming a second flange, the second flange being formed by folding the first flange away from the side of the plate part in a direction opposite to the first direction, the first extension wall being clamped between the first flange and the second flange, the first flange, the first extension wall and the second flange being seamlessly attached in sequence.

[0127] The specific structure of the first flange, the first extension wall and the second flange and the cooperation manner can refer to the related description of the embodiments shown in the foregoing Figure 7

[0128] Further, the sealing of the opening by the cover part further comprises: simultaneously applying opposite pressing forces to the first flange and the second flange to make the first flange, the first extension wall and the second flange seamlessly attached in sequence. The direction of the pressing forces can refer to F shown in Figure 7

[0129] Further, the pressing force applied to the first flange and the pressing force applied to the second flange are of the same size.

[0130] In some embodiments, the opposite pressing forces can be applied to the first flange and the second flange multiple times and at intervals to ensure the seamless attachment between the first flange, the first extension wall and the second flange.

[0131] In other embodiments, the sealing of the opening by the cover part can comprise:

[0132] providing the cover part, the cover part comprising a plate part and a first flange extending from the outer edge of the plate part in a first direction, the heat dissipation shell comprising a first extension wall extending from the plane in which the plate part is located in the first direction, at least a part of the first flange and at least a part of the first extension wall being seamlessly attached, the first direction being the same as the direction in which the first side points to the second side;

[0133] forming a second flange, the second flange being formed by folding the first flange away from the side of the plate part in a direction opposite to the first direction;

[0134] forming a second extension wall, the second extension wall being formed by folding the first extension wall away from the plane in which the plate part is located in the first direction, the second extension wall being attached to the second flange;

[0135] ​​A third flange is formed from the second flange away from the side of the first flange towards the first direction, the third flange is clamped between the first extension wall and the second extension wall, the second extension wall is clamped between the second flange and the third flange, and the first flange, the first extension wall, the third flange, the second extension wall and the second flange are sequentially seamlessly attached.

[0136] The specific structure of the first flange, the first extension wall, the third flange, the second extension wall and the second flange and the cooperation manner can be referred to the related description of the above-mentioned embodiments, and will not be repeated here. Figure 8

[0137] Further, the sealing of the opening by the cover part further comprises: simultaneously applying opposite pressing forces to the first flange and the second flange to sequentially seamlessly attach the first flange, the first extension wall, the third flange, the second extension wall and the second flange. The direction of the pressing force can be referred to F in the above-mentioned embodiments. Figure 8

[0138] Further, the pressing force applied to the first flange and the pressing force applied to the second flange are the same.

[0139] In the above-mentioned embodiments, the implementation manner of sealing the opening by the cover part can be, for example, a double-flanged sealing connection manner. The double-flanged sealing connection manner is to tightly overlap the flanges by rolling and pressing at least a part of the heat dissipation shell and the cover part, so as to ensure the sealing connection therebetween. The double-flanged sealing connection manner is advantageous in further reducing the cost.

[0140] The utility model embodiment further provides an electronic equipment, include: electric load device;The above-mentioned Figures 1 to 8 The heat sink 100 in the above-mentioned embodiments.

[0141] Therefore, the electronic equipment using the above-mentioned heat sink 100 can dissipate the heat generated by the electric load device in time, and improve the service life of the whole electronic equipment.

[0142] From the above, the method comprises the steps of forming a heat dissipation shell, filling a phase change working medium and sealing an opening by a cover part. The phase change working medium can be filled in a vacuum environment to reduce the influence of air on the heat dissipation effect. At the same time, the heat dissipation efficiency of the heat sink can be further improved by vacuumizing. In addition, the heat dissipation shell and the heat dissipation part are formed by stamping process, and the connection between the heat dissipation shell and the cover part is realized by physical curling, which simplifies the production process and reduces the production cost.

[0143] ​​It should be understood that the term "and / or" in this document is merely used to describe an associated relationship between associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this document represents an "or" relationship between the front and rear associated objects. As used herein, unless otherwise expressly stated, the term "or" encompasses all possible combinations, unless not feasible. For example, if it is stated that a component can include A or B, the component can include A, or B, or A and B, unless expressly stated otherwise or not feasible. As a second example, if it is stated that a component can include A, B, or C, the component can include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C, unless expressly stated otherwise or not feasible. "Multiple" appearing in the embodiments of the present application means two or more.

[0144] The relationship terms appearing in the embodiments of the present application, such as first, second, etc., are only used to distinguish entities or operations from another entity or operation, and do not require or imply any actual relationship or order between the entities or operations. In addition, the words "include", "have" and "contain" and other similar forms are intended to be equivalent in meaning and open, and one or more items following any of these words does not mean that it is an exhaustive list of one or more items, or means only the listed one or more items. In the drawings and the specification, exemplary embodiments have been disclosed. However, many changes and modifications can be made to these embodiments. Therefore, although specific terms are used, they are only used for general and descriptive purposes, and not for limiting purposes.

[0145] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be limited to the range defined by the claims.

Claims

1. A heat sink for an electrically loaded device, characterized in that The heat dissipation housing has a main body portion and at least one heat dissipation portion protruding outwardly from a first side of the main body portion, the main body portion defines an evaporation cavity, each of the heat dissipation portions defines a condensation cavity, each of the condensation cavities is in communication with the evaporation cavity, the evaporation cavity has an opening at a second side of the main body portion, the first side and the second side are opposite to each other; a cover portion seals the opening, the cover portion is thermally coupled with an electrical load device; wherein the condensation cavities and / or the evaporation cavity are filled with a phase change working medium; the cover portion includes a plate portion and a first flange extending from an outer edge of the plate portion in a first direction, the heat dissipation housing includes a first extension wall extending from a plane in which the plate portion is located in the first direction, at least a portion of the first flange and at least a portion of the first extension wall are seamlessly fitted, the first direction is the same as a direction in which the first side points to the second side. The main body portion and the heat dissipation portion are integrally formed.

2. The heat spreader of claim 1, wherein, The main body portion and the heat dissipation portion are formed synchronously or step by step by a stamping process.

3. The heat sink of claim 2, wherein, Each of the heat dissipation portions has a smooth outer wall.

4. The heat spreader of claim 1, wherein, The number of the heat dissipation portions is multiple, and there is a non-zero gap between two adjacent heat dissipation portions in the multiple heat dissipation portions.

5. The heat spreader of claim 1, wherein, The number of the heat dissipation portions is multiple, and the multiple heat dissipation portions include:

6. The heat spreader of claim 1, wherein, a first heat dissipation portion protruding from the first side of the main body portion in a direction away from the second side; a plurality of second heat dissipation portions radially distributed and connected to the outer periphery of the first heat dissipation portion, the condensation cavities defined by the plurality of second heat dissipation portions are respectively in communication with the condensation cavity defined by the first heat dissipation portion. The number of the heat dissipation portions is multiple, and the multiple heat dissipation portions are centrally symmetrically arranged or axially symmetrically arranged.

7. The heat spreader of claim 1, wherein, The cover portion has a recessed portion recessed toward the main body portion, the recessed portion is adapted to receive at least a portion of the electrical load device.

8. The heat spreader of claim 1, wherein, At least a portion of a side wall of the cover portion forming the recessed portion and a side wall of the main body portion forming the evaporation cavity form a containing cavity, the containing cavity surrounds the recessed portion and is part of the evaporation cavity.

9. The heat sink of claim 8, wherein, The cover portion further includes:

10. The heat sink of claim 9, wherein, a second flange formed by folding the first flange away from the plate portion in a direction opposite to the first direction, the first extension wall is clamped between the first flange and the second flange, the first flange, the first extension wall and the second flange are sequentially seamlessly fitted. The cover portion further includes:

11. The heat spreader of claim 9, wherein, a second flange formed by folding the first flange away from the plate portion in a direction opposite to the first direction; a third flange formed by folding the second flange away from the first flange in the first direction; The heat dissipation housing further includes: a second extension wall formed by folding the first extension wall away from the plane in which the plate portion is located in the first direction; wherein the third flange is clamped between the first extension wall and the second extension wall, the second extension wall is clamped between the second flange and the third flange, the first flange, the first extension wall, the third flange, the second extension wall and the second flange are sequentially seamlessly fitted. ​ 12. The heat spreader of claim 1, wherein, The inner wall of the heat dissipation shell is provided with a capillary structure, and the liquid phase phase-change working medium flows back to the evaporation cavity under the action of the capillary structure.

13. The heat spreader of claim 1, wherein, The electric load device is an LED lamp or a power semiconductor device.

14. An electronic device, comprising: Comprising: An electric load device; A heat sink as claimed in any of claims 1 to 13.

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