Chip structure

Abstract

The utility model discloses a chip structure. The chip structure comprises a chip body and a plurality of pin structures connected with the chip body. Each pin structure comprises a first connecting part extending from the chip body and a second connecting part extending from one end of the first connecting part; one part of the second connecting part protrudes out of the first side face of the chip body, the other part of the second connecting part protrudes out of the second side face of the chip body, and the first side face and the second side face are two side faces of the chip body in the first direction. According to the chip structure, the parts protruding out of the two side faces of the chip body are arranged on each pin structure, so that front welding or turn-over welding on a PCB can be achieved, mirror image turning of the pin structures with different functions around the chip body is achieved, the arrangement modes of the chip structure on the PCB are enriched, and the chip structure is more compact. And the problems of crossing of strong and weak signals and difficulty in layout can be avoided.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a chip structure. Background Technology

[0002] The chip receives electrical signals from various parts of the circuit through its pins. These signals include switching device voltages / currents, feedback voltages, and input voltage information. However, these signals vary in strength. When these signals of different strengths converge on a small chip, the close proximity of the signals means that strong signals may interfere with weak signals, leading to control abnormalities. Therefore, during circuit design, it is necessary to arrange the strong and weak signal areas appropriately to minimize the impact of strong signals on weak signals. However, since the pin functions and arrangement of the chip are fixed, in some complex circuit designs, it is difficult to meet the layout requirements of ensuring that traces in the strong signal area do not cross the weak signal area and that traces between the strong and weak signal areas do not intersect, resulting in limited circuit layout.

[0003] For example, in the design of switching power supply circuits, such as Figure 1 As shown, the switching power supply chip is divided into four regions based on function and signal strength: a slow bridge control strong signal region, a fast bridge control strong signal region, an input sampling weak signal sensitive region, and an output sampling weak signal sensitive region. The slow bridge control strong signal region controls the slow bridge arm, the fast bridge control strong signal region controls the fast bridge arm, and both the input sampling weak signal sensitive region and the output sampling weak signal sensitive region are easily interfered with by the strong signal region. Figure 2 Taking the totem pole PFC topology shown as an example, the power flow direction is usually divided into the following categories: Figure 3 The "on the road" shown Figure 4 The two "bottom-path" methods shown require that, if the power flow must be routed to the bottom path due to PCB constraints, and there should be no intersection between sampled signals. According to traditional gull-pin manufacturing processes, the chip can only rotate within the same plane, inevitably leading to intersections between strong and weak signal areas, making the layout impossible to meet the requirements. Utility Model Content

[0004] This utility model provides a chip structure to solve the problem of circuit layout limitations caused by the fixed pin functions and arrangements of existing chips.

[0005] This utility model embodiment provides a chip structure, including a chip body and a plurality of pin structures connected to the chip body;

[0006] Each of the pin structures includes a first connection portion extending from the chip body and a second connection portion extending from one end of the first connection portion;

[0007] Part of the second connecting part protrudes from the first side of the chip body, and another part of the second connecting part protrudes from the second side of the chip body, the first side and the second side being two sides of the chip body along the first direction.

[0008] Preferably, the second connecting part comprises a first connecting segment extending from one end of the first connecting part along the first direction, a second connecting segment extending from one end of the first connecting segment along the second direction away from one end of the chip body, a third connecting segment extending from one end of the second connecting segment along the first direction, and a fourth connecting segment extending from one end of the third connecting segment along the second direction.

[0009] The first connecting segment and the third connecting segment are oppositely arranged.

[0010] The second connecting segment protrudes from the first side of the chip body.

[0011] The fourth connecting segment protrudes from the second side of the chip body.

[0012] Preferably, the fourth connecting segment extends from one end of the third connecting segment along the second direction towards the chip body.

[0013] Alternatively, the fourth connecting segment extends from one end of the third connecting segment along the second direction away from the chip body.

[0014] Preferably, the widths of the first connecting segment, the second connecting segment, the third connecting segment and the fourth connecting segment are all 0.3-0.6mm.

[0015] The lengths of the second connecting segment and the fourth connecting segment are both 0.5-1.5mm.

[0016] The length of the third connecting segment is 1.5-2.5mm.

[0017] Preferably, the second connecting part comprises an arc segment.

[0018] The first end of the arc segment is connected with the first connecting part, and the second end of the arc segment extends along the arc direction.

[0019] The two ends of the projection of the arc segment along the second direction protrude from the first side and the second side of the chip body, respectively.

[0020] Preferably, the second end of the arc segment extends along the arc direction and connects with the first connecting part.

[0021] Preferably, the width of the arc segment is 0.3-0.6mm.

[0022] The interval between the two ends of the projection of the arc-shaped section along the second direction is 1.5-2.5 mm.

[0023] Preferably, the second connecting part comprises a first connecting piece and a second connecting piece respectively extending from the two ends of the first connecting part along the first direction;

[0024] The free end of the first connecting piece protrudes from the first side of the chip body, and the free end of the second connecting piece protrudes from the second side of the chip body.

[0025] Preferably, the thickness of the first connecting piece and the second connecting piece is 0.3-0.6 mm;

[0026] The width of the first connecting piece and the second connecting piece is 0.5-1.5 mm;

[0027] The interval between the free end of the first connecting piece and the free end of the second connecting piece along the first direction is 1.5-2.5 mm.

[0028] Preferably, a first mark is arranged on the first side of the chip body, and a second mark is arranged on the second side of the chip body;

[0029] The shape and / or size of the first mark and the second mark are different.

[0030] The chip structure provided by the embodiment of the utility model, through setting the part protruding from the two side surfaces of the chip body on each pin structure, can realize the front welding or the reverse welding on the PCB, so as to realize the mirror image reverse of the arrangement position of each pin structure with different functions around the chip body, enriches the arrangement mode of the chip structure on the PCB, and can avoid the problems of strong and weak signal crossing and difficult layout. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will briefly introduce the drawings needed to be used in the description of the embodiment of the utility model, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0032] Figure 1 It is the pin function distribution diagram of the switching power supply chip in the prior art;

[0033] Figure 2 It is the totem column PFC topological structure schematic diagram of the switching power supply chip in the prior art;

[0034] Figure 3is a power layout mode of a switching power supply circuit in the prior art;

[0035] Figure 4 is another power layout mode of a switching power supply circuit in the prior art;

[0036] Figure 5 is a structural schematic view of a chip structure in an embodiment of the present application;

[0037] Figure 6 is another structural schematic view of a chip structure in an embodiment of the present application;

[0038] Figure 7 is another structural schematic view of a chip structure in an embodiment of the present application;

[0039] Figure 8 is another structural schematic view of a chip structure in an embodiment of the present application;

[0040] Figure 9 is another structural schematic view of a chip structure in an embodiment of the present application;

[0041] Figure 10 is another structural schematic view of a chip structure in an embodiment of the present application.

[0042] In the figure: 1, chip body; 2, pin structure; 21, first connecting part; 22, second connecting part; 221, first connecting section; 222, second connecting section; 223, third connecting section; 224, fourth connecting section; 225, arc section; 226, first connecting sheet; 227, second connecting sheet; 3, first mark; 4, second mark. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and beneficial effects solved by the present application more clearly understood, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0044] In the description of the utility model, it is necessary to understand that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model. In the description of the utility model, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0045] In the description of the utility model, it should be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0046] The utility model embodiment provides a kind of chip structure, as shown in Figure 5 Each pin structure 2 includes first connecting portion 21 extended from chip body 1, second connecting portion 22 extended from one end of first connecting portion 21;Part of second connecting portion 22 protrudes from the first side of chip body 1, another part of second connecting portion 22 protrudes from the second side of chip body 1, the first side and the second side are two sides of chip body 1 along the first direction.

[0047] As an example, the chip structure includes chip body 1 and multiple pin structures 2, chip body 1 can be a sheet-like component, pin structure 2 can be arranged on chip body 1 in surface mounting manner, one end of each pin structure 2 is connected with one side of chip body 1 in thickness direction, or connected with the side of chip body 1 in width and / or length direction, the other end of each pin structure 2 is used for welding with pad. Each pin structure 2 includes first connecting portion 21 extended from chip body 1 along the second direction, second connecting portion 22 extended from one end of first connecting portion 21;Part of second connecting portion 22 protrudes from the first side of chip body 1, another part of second connecting portion 22 protrudes from the second side of chip body 1, the first side and the second side are two sides of chip body 1 along the first direction, wherein, the second direction is perpendicular to the first direction, for example, the first direction can be the thickness direction of chip body 1, and the second direction can be the width or length direction of chip body 1.

[0048] When the chip structure is surface-mounted on the PCB, the first side of the chip structure in the thickness direction is arranged close to the PCB, and the second side of the chip structure in the thickness direction is arranged away from the PCB. At this time, the part of the second connecting portion 22 protruding from the first side of the chip body 1 on the pin structure 2 representing the A function is surface-mounted on the pad on the PCB. When the chip structure is flip-mounted on the PCB, the second side of the chip structure in the thickness direction is arranged close to the PCB, and the first side of the chip structure in the thickness direction is arranged away from the PCB. At this time, the part of the second connecting portion 22 protruding from the second side of the chip body 1 on the pin structure 2 representing the A function is flip-mounted on the pad on the PCB. The chip structure can be surface-mounted and flip-mounted on the PCB to realize mirror flipping of the arrangement positions of the pin structures 2 with different functions around the chip body 1, thereby enriching the arrangement mode of the chip structure on the PCB and avoiding the problem of strong and weak signal crossing and difficult layout.

[0049] In an embodiment, the second connecting portion 22 includes a first connecting segment 221 extending from one end of the first connecting portion 21 in a first direction, a second connecting segment 222 extending from one end of the first connecting segment 221 in a second direction away from one end of the chip body 1, a third connecting segment 223 extending from one end of the second connecting segment 222 in the first direction, and a fourth connecting segment 224 extending from one end of the third connecting segment 223 in the second direction. The first connecting segment 221 and the third connecting segment 223 are oppositely arranged. The second connecting segment 222 protrudes from the first side of the chip body 1. The fourth connecting segment 224 protrudes from the second side of the chip body 1.

[0050] As an example, the second connecting portion 22 can be a lead structure extending from one end of the first connecting portion 21. The second connecting portion 22 includes a first connecting segment 221 extending from one end of the first connecting portion 21 in a first direction, a second connecting segment 222 extending from one end of the first connecting segment 221 in a second direction away from one end of the chip body 1, a third connecting segment 223 extending from one end of the second connecting segment 222 in the first direction, and a fourth connecting segment 224 extending from one end of the third connecting segment 223 in the second direction. The second connecting segment 222 protrudes from the first side of the chip body 1. The fourth connecting segment 224 protrudes from the second side of the chip body 1. For example, the first connecting segment 221 can extend upward in the thickness direction of the chip body 1, the second connecting segment 222 can extend away from the chip body 1 in the width direction of the chip body 1, the third connecting segment 223 can extend downward in the thickness direction of the chip body 1, and the fourth connecting segment 224 can extend toward or away from the chip body 1 in the width direction of the chip body 1, so that the first connecting segment 221, the second connecting segment 222, the third connecting segment 223, and the fourth connecting segment 224 together constitute a lead structure as shown inFigure 6 As shown in the "few" structure, the second connecting section 222 protrudes from the first side of the chip body 1, for welding with the pads when the chip structure is welded on the PCB board on the front side; the fourth connecting section 224 protrudes from the second side of the chip body 1, for welding with the pads when the chip structure is welded on the PCB board on the back side.

[0051] In an embodiment, as shown in Figure 6 and Figure 7 The fourth connecting section 224 extends from one end of the third connecting section 223 in the second direction towards the chip body 1; or, the fourth connecting section 224 extends from one end of the third connecting section 223 in the second direction away from the chip body 1.

[0052] As an example, the fourth connecting section 224 can extend from one end of the third connecting section 223 in the second direction towards the chip body 1, or extend from one end of the third connecting section 223 in the second direction away from the chip body 1. When the fourth connecting section 224 extends towards the chip body 1, the area occupied by the chip pins when the chip structure is welded on the back side can be reduced. When the fourth connecting section 224 extends away from the chip body 1, it can be more convenient to weld.

[0053] In an embodiment, the width of the first connecting section 221, the second connecting section 222, the third connecting section 223 and the fourth connecting section 224 is 0.3-0.6mm; the length of the second connecting section 222 and the fourth connecting section 224 is 0.5-1.5mm; the length of the third connecting section 223 is 1.5-2.5mm.

[0054] As an example, the width of the first connecting section 221, the second connecting section 222, the third connecting section 223 and the fourth connecting section 224 is 0.3-0.6mm, changing the width can change the carrying capacity of the second connecting section 22; the length of the second connecting section 222 and the fourth connecting section 224 is 0.5-1.5mm; the length of the third connecting section 223 is 1.5-2.5mm, and the length of the third connecting section 223 is greater than the thickness of the chip body 1, so that the second connecting section 222 protrudes from the first side of the chip body 1, and the fourth connecting section 224 protrudes from the second side of the chip body 1.

[0055] In an embodiment, as shown in Figure 8 The second connecting section 22 includes an arc-shaped section 225; the first end of the arc-shaped section 225 is connected to the first connecting section 21, and the second end of the arc-shaped section 225 extends in the arc direction; the projection of the arc-shaped section 225 in the second direction protrudes from the first side and the second side of the chip body 1.

[0056] As an example, the second connecting portion 22 includes an arc-shaped segment 225; the first end of the arc-shaped segment 225 is connected to the first connecting portion 21, and the second end of the arc-shaped segment 225 extends along an arc direction. The two ends of the projection of the arc-shaped segment 225 along the second direction protrude from the first and second sides of the chip body 1, respectively. The portions protruding from the first and second sides of the chip body 1 are used for soldering to pads on the PCB board. The arc-shaped segment can be, for example,... Figure 8 The standard circular arc shown can also be as follows: Figure 9 The elliptical arc shown. When the arc segment 225 is a standard circular arc and the second end extends along the circumference of the standard circle, the length of the entire arc segment 225 can be greater than or equal to three-quarters of the circle's length, so that when the chip body 1 is placed face up or face down, the surface of the PCB board can be tangent to the arc segment 225, facilitating soldering at the tangent point. At this time, on the arc segment 225, a quarter-circle arc starting from the point where the arc segment 225 connects to the first connecting part 21 protrudes from the first side of the chip body 1, used for soldering to the pads when the chip structure is soldered face up on the PCB board. On the arc segment 225, a three-quarter-circle arc starting from the point where the arc segment 225 connects to the first connecting part 21 protrudes from the second side of the chip body 1, used for soldering to the pads when the chip structure is flipped face up on the PCB board.

[0057] In one embodiment, the second end of the arc segment 225 extends along the arc direction and connects with the first connecting portion 21.

[0058] As an example, the first end of the arc segment 225 is connected to the first connecting part 21. After the second end of the arc segment 225 extends along the arc direction, it returns to the starting point of the arc and connects with the first connecting part 21 to form a closed standard circular ring or a closed elliptical ring. This pin structure 2 can make the distance from the wafer to the pin structure 2 consistent when the chip structure is soldered to the front or flipped of the PCB board, and the parasitic inductance generated on the pin structure 2 is also consistent.

[0059] In one embodiment, the width of the arc segment 225 is 0.3~0.6mm; the distance between the two ends of the projection of the arc segment 225 along the second direction is 1.5~2.5mm.

[0060] As an example, the second connecting portion 22 can be a lead structure. The width of the arc segment 225 is 0.3-0.6 mm, and changing the width can change the carrying capacity of the arc segment 225. When the arc segment 225 is a standard circular arc, the circumferential diameter of the arc segment 225 extending in the circumferential direction is 1.5-2.5 mm, and when the arc segment 225 is an elliptical arc, the distance between the two ends of the projection of the arc segment 225 in the second direction is 1.5-2.5 mm, which is greater than the thickness of the chip body 1, so that the two ends of the projection of the arc segment 225 in the second direction can protrude from the first side and the second side of the chip body 1, respectively

[0061] In an embodiment, as shown in Figure 10 the second connecting portion 22 includes a first connecting piece 226 and a second connecting piece 227 extending from the two ends of the first connecting portion 21 in the first direction, respectively; the free end of the first connecting piece 226 protrudes from the first side of the chip body 1, and the free end of the second connecting piece 227 protrudes from the second side of the chip body 1.

[0062] As an example, the second connecting portion 22 can be a sheet structure extending from the first connecting portion 21. The second connecting portion 22 includes a first connecting piece 226 extending from the first connecting portion 21 in the first direction towards the first side, and a second connecting piece 227 extending from the first connecting portion 21 in the first direction towards the second side, and the first connecting portion 21, the first connecting piece 226 and the second connecting piece 227 cooperate to form an inverted "T" shape structure. The free end of the first connecting piece 226 protrudes from the first side of the chip body 1 for welding with the pads when the chip structure is soldered on the PCB board face up, and the free end of the second connecting piece 227 protrudes from the second side of the chip body 1 for welding with the pads when the chip structure is soldered on the PCB board face down. This kind of lead structure 2 can make the distance from the wafer to the lead structure 2 consistent when the chip structure is soldered on the PCB board face up or face down, and the parasitic inductance generated on the lead structure 2 is also consistent.

[0063] In an embodiment, the thickness of the first connecting piece 226 and the second connecting piece 227 is 0.3-0.6 mm; the width of the first connecting piece 226 and the second connecting piece 227 is 0.5-1.5 mm; and the distance between the free end of the first connecting piece 226 and the free end of the second connecting piece 227 in the first direction is 1.5-2.5 mm.

[0064] As an example, the thickness of the first connecting piece 226 and the second connecting piece 227 is 0.3-0.6mm; the width of the first connecting piece 226 and the second connecting piece 227, that is, the size of the first connecting piece 226 and the second connecting piece 227 in the second direction is 0.5-1.5mm; the interval of the free end of the first connecting piece 226 and the free end of the second connecting piece 227 in the first direction is 1.5-2.5mm, which is greater than the thickness of the chip body 1, so that the free end of the first connecting piece 226 protrudes from the first side of the chip body 1, and the free end of the second connecting piece 227 protrudes from the second side of the chip body 1.

[0065] In an embodiment, the first side of the chip body 1 is provided with a first mark 3, and the second side of the chip body 1 is provided with a second mark 4; the shape and / or size of the first mark 3 and the second mark 4 are different.

[0066] As an example, the first side of the chip body 1 is provided with a first mark 3, and the second side of the chip body 1 is provided with a second mark 4, the first mark 3 and the second mark 4 are used to prompt the flip side welding, when the second mark 4 faces up, the chip structure is face welding with the PCB board, when the first mark 3 faces up, the chip structure is flip side welding with the PCB board. The shape and / or size of the first mark 3 and the second mark 4 are different, the first mark 3 can be a prismatic mark extending from the first side of the chip body 1, and the second mark 4 can be a cylindrical mark extending from the second side of the chip body 1.

[0067] The above-described embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A chip structure, characterized by The chip body and a plurality of pin structures connected to the chip body are included; Each of the pin structures includes a first connecting part extending from the chip body, and a second connecting part extending from one end of the first connecting part; Part of the second connecting part protrudes from a first side of the chip body, and another part of the second connecting part protrudes from a second side of the chip body, the first side and the second side being two sides of the chip body along a first direction.

2. The chip structure of claim 1, wherein, The second connecting part includes a first connecting segment extending from one end of the first connecting part along the first direction, a second connecting segment extending from one end of the first connecting segment along a second direction away from one end of the chip body, a third connecting segment extending from one end of the second connecting segment along the first direction, and a fourth connecting segment extending from one end of the third connecting segment along the second direction. The first connecting segment and the third connecting segment are oppositely arranged; The second connecting segment protrudes from the first side of the chip body; The fourth connecting segment protrudes from the second side of the chip body.

3. The chip structure of claim 2, wherein, The fourth connecting segment extends from one end of the third connecting segment along the second direction towards the chip body; Alternatively, the fourth connecting segment extends from one end of the third connecting segment along the second direction away from the chip body.

4. The chip structure of claim 2, wherein, The widths of the first connecting segment, the second connecting segment, the third connecting segment, and the fourth connecting segment are all 0.3-0.6 mm; The lengths of the second connecting segment and the fourth connecting segment are both 0.5-1.5 mm; The length of the third connecting segment is 1.5-2.5 mm.

5. The chip structure of claim 1, wherein, The second connecting part includes an arc segment; A first end of the arc segment is connected to the first connecting part, and a second end of the arc segment extends along an arc direction; The two ends of the projection of the arc segment along the second direction protrude from the first side and the second side of the chip body, respectively.

6. The chip structure of claim 5, wherein, The second end of the arc segment extends along the arc direction and is connected to the first connecting part.

7. The chip structure of claim 5, wherein, The width of the arc segment is 0.3-0.6 mm; The distance between the two ends of the projection of the arc segment along the second direction is 1.5-2.5 mm.

8. The chip structure of claim 1, wherein, The second connecting part includes a first connecting piece and a second connecting piece extending from both ends of the first connecting part along the first direction, respectively; The free end of the first connecting piece protrudes from the first side of the chip body, and the free end of the second connecting piece protrudes from the second side of the chip body.

9. The chip structure of claim 8, wherein, The thicknesses of the first connecting piece and the second connecting piece are both 0.3-0.6 mm; The widths of the first connecting piece and the second connecting piece are both 0.5-1.5 mm; The distance between the free end of the first connecting piece and the free end of the second connecting piece along the first direction is 1.5-2.5 mm.

10. The chip structure of claim 1, wherein, A first mark is provided on the first side of the chip body, and a second mark is provided on the second side of the chip body; The shapes and / or sizes of the first mark and the second mark are different.

Images