Solder strip processing device and battery series welding equipment

Abstract

The utility model provides a solder strip processing device and battery series welding equipment, the solder strip processing device comprises at least one heating mechanism, the heating mechanism comprises a pressure bearing seat and a heating assembly which are oppositely arranged, a heating space is formed between the heating assembly and the pressure bearing seat, and a solder strip group enters the heating space along a first direction; the heating assembly and the pressure-bearing seat are configured to be relatively close to or far away from each other; and when the heating assembly is close to the pressure-bearing seat, the bonding part of the solder strip group located in the heating space is pressed to the pressure-bearing seat, and the bonding part is heated, so that the soldering flux on the bonding part is volatilized. According to the welding strip processing device, the bonding part, making contact with the glue point, in the welding strip set can be locally heated, so that the scaling powder at the bonding part of the welding strip set volatilizes, platinum poisoning caused by the fact that a platinum catalyst in the glue point reacts with the scaling powder at the bonding part of the welding strip set can be avoided, and the service life of the welding strip set is prolonged. And finally, the glue point can be smoothly cured.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photovoltaic production equipment, in particular to a welding strip processing device and a cell string welding device. BACKGROUND

[0002] A cell string is formed by connecting a plurality of cell pieces by a welding strip group. In order to ensure that a good metallization connection can be formed between the welding strip group and the cell piece, flux is generally applied to the welding strip group along the length direction of the welding strip, and then the welding strip group is laid along the welding trajectory and welded to the surface of the cell piece.

[0003] In order to further improve the connection strength between the welding strip group and the cell piece, and prevent the welding strip group from being pulled off the cell piece by external force, before laying the welding strip group on the cell piece, as shown in the prior art, Figure 11 a hot glue point 200 (hereinafter referred to as a glue point) can also be applied to the cell piece 100 along the welding trajectory L (for the sake of simplicity, only the welding trajectory of one welding strip in the welding strip group is shown in the figure) of the welding strip group.

[0004] In this way, the glue point 200 can adhere the welding strip group to the cell piece after solidification. The above-mentioned cell piece connection method has the following problems: after the welding strip group is laid on the cell piece, the part of the welding strip group that contacts the glue point 200 is the bonding part, and the flux at the bonding part will react with the platinum catalyst in the glue point 200, causing platinum poisoning in the glue point 200, thereby affecting the solidification of the glue point 200, and ultimately reducing the quality of the cell string. Invention content

[0005] In view of the above technical problems, the present application provides a welding strip processing device, and the detailed technical solutions are as follows:

[0006] A welding strip processing device, comprising at least one heating mechanism, the heating mechanism comprising a pressure bearing seat and a heating assembly arranged opposite to each other, wherein:

[0007] The heating assembly and the pressure bearing seat form a heating space for the welding strip group to enter, and the welding strip group enters the heating space along a first direction;

[0008] The heating assembly and the pressure bearing seat are configured to be relatively close or far away;

[0009] The heating assembly is configured to, when close to the pressure bearing seat, press the bonding part of the welding strip group in the heating space onto the pressure bearing seat and heat the bonding part, so that the flux on the bonding part volatilizes, and the bonding part of the welding strip group is the part to be bonded with the glue point on the cell piece.

[0010] The welding strip processing device provided by the application can locally heat the bonding parts of the welding strip group in contact with the glue points, so that the flux at the bonding parts of the welding strip group is volatilized, thus avoiding the reaction between the platinum catalyst in the glue points and the flux at the bonding parts of the welding strip group to cause platinum poisoning, and finally enabling the glue points to be successfully solidified. In addition, since the flux at the remaining parts of the welding strip group is not volatilized by heating, a good metallization connection between the welding strip group and the battery piece can be formed after welding, and finally the string quality of the battery is improved.

[0011] In some embodiments, the heating assembly comprises a lifting driving unit, a mounting frame and a heating plate, wherein: the mounting frame is connected to the moving part of the lifting driving unit, the heating plate is arranged on the mounting frame, a heating space is formed between the heating plate and the pressure receiving seat, and the lifting driving unit is used to drive the mounting frame to lift and lower; when the lifting driving unit drives the mounting frame to lower towards the pressure receiving seat, the heating plate presses the bonding parts of the welding strip group onto the pressure receiving seat and heats the bonding parts; when the lifting driving unit drives the mounting frame to rise away from the pressure receiving seat, the heating plate releases the bonding parts of the welding strip group.

[0012] The heating plate is separated from the lifting driving unit by the mounting frame, which can reduce the thermal influence of the heating plate on the lifting driving unit and prevent the lifting driving unit from being damaged by heat.

[0013] In some embodiments, the bottom of the heating plate is provided with a downward protruding heating part; the heating part comprises a plurality of heating strips arranged at intervals along a first direction and extending along a second direction, and each heating strip is used to heat a row of bonding parts arranged along the second direction in the welding strip group when the lifting driving unit drives the mounting frame to lower towards the pressure receiving seat; or the heating part comprises a plurality of heating blocks, each heating block corresponds to one bonding part in the welding strip group, and each heating block is used to heat the corresponding bonding part when the lifting driving unit drives the mounting frame to lower towards the pressure receiving seat; wherein the second direction is perpendicular to the first direction.

[0014] By arranging the heating part to comprise a plurality of heating strips arranged at intervals along the first direction, each heating strip corresponds to each row of bonding parts in the welding strip group to press and heat, which facilitates the arrangement and maintenance of the heating part while ensuring the local heating of the bonding parts of the welding strip group. By arranging the heating part to comprise heating blocks corresponding to the bonding parts in the welding strip group, one-to-one pressing and heating of each bonding part can be achieved, which can reduce the contact area of the heating part and the pressure receiving seat while ensuring the local heating of the bonding parts of the welding strip group, thereby reducing heat loss and energy consumption.

[0015] In some embodiments, the heating part is detachably mounted on the heating plate, or the heating part is integrally made with the heating plate.

[0016] The heating part is detachably mounted on the heating plate, so that the heating part can be conveniently maintained and replaced, and different heating parts can be replaced when the component version is replaced. The heating part is integrally formed with the heating plate, which facilitates the preparation and molding of the heating part and improves the heating effect of the heating part.

[0017] In some embodiments, the pressure bearing seat is provided with a pressure bearing unit that can float up and down relative to the pressure bearing seat; and the heating assembly is used to press the bonding sites of the solder ribbon group in the heating space to the pressure bearing unit.

[0018] By providing the pressure bearing unit that can float up and down relative to the pressure bearing seat, it can be ensured that the heating assembly can elastically press all the bonding sites of the solder ribbon group to the pressure bearing seat, thereby preventing the pressure of the heating assembly on the solder ribbon group from being too large and causing the solder ribbon group to deform, while ensuring the heating effect on the bonding sites.

[0019] In some embodiments, the pressure bearing unit includes a plurality of pressure bearing strips that are spaced apart along a first direction and extend along a second direction, each pressure bearing strip being mounted on the pressure bearing seat to be able to float up and down, and each pressure bearing strip being used to support a row of bonding sites arranged along the second direction in the solder ribbon group, wherein the second direction is perpendicular to the first direction; or the pressure bearing unit is a heat insulation plate mounted on the pressure bearing seat to be able to float up and down, and the heating assembly presses all the bonding sites in the solder ribbon group to the heat insulation plate; or the pressure bearing unit includes a plurality of support heads, each support head being mounted on the pressure bearing seat to be able to float up and down, and each support head corresponding to one bonding site in the solder ribbon group, and each support head being used to carry the corresponding bonding site.

[0020] Three simple pressure bearing units are provided, in which: a plurality of support heads corresponding one-to-one to the bonding sites in the solder ribbon group are used as the pressure bearing unit, and when the heating assembly descends towards the pressure bearing seat, each bonding site in the solder ribbon group can be pressed tightly to the corresponding support head. Since each support head can independently float, when the pressing surface of the heating assembly is uneven, the heating assembly can still ensure that all the bonding sites in the solder ribbon group are pressed tightly to the corresponding support heads, thereby ensuring effective heating of all the bonding sites.

[0021] A plurality of pressure bearing strips spaced apart along a first direction are used as the pressure bearing unit, and when the heating assembly descends towards the pressure bearing seat, each row of bonding sites arranged along a second direction in the solder ribbon group can be pressed tightly to the corresponding pressure bearing strip, thereby ensuring effective heating of all the bonding sites. In addition, using the pressure bearing strip as the pressure bearing unit can facilitate the installation and maintenance of the pressure bearing unit.

[0022] The heat insulation plate is used as a pressure bearing unit. When the heating assembly is lowered towards the pressure bearing seat, all the bonding positions in the solder strip group are pressed onto the heat insulation plate. In addition, since the heat insulation plate has very low thermal conductivity, when the heating assembly presses the bonding positions in the solder strip group onto the heat insulation plate for heating, other positions in the solder strip group will not be heated by the heat insulation plate, thereby avoiding the flux in other positions from being heated and volatilized.

[0023] In some embodiments, the pressure bearing unit further comprises a spring, wherein the support head is slidably connected to the pressure bearing seat, the spring is sleeved on the support head, the lower end of the spring abuts against the pressure bearing seat, and the upper end of the spring abuts against the support head.

[0024] When the heating assembly presses the bonding positions of the solder strip group towards the pressure bearing seat, the spring generates vertical extension and contraction deformation according to the pressure condition, thereby pushing the support head to float up and down.

[0025] The heating mechanism further comprises a guide comb arranged on the pressure bearing seat and located at the side of the pressure bearing seat, the guide comb extending along a second direction; the upper end of the guide comb is provided with a plurality of guide grooves spaced apart along the second direction, each guide groove being used for guiding and limiting one solder strip in the solder strip group; and the second direction is perpendicular to the first direction.

[0026] By arranging the guide comb, the guide of each solder strip in the solder strip group is realized, and the position deviation of the solder strip is prevented.

[0027] In some embodiments, the heating plate is provided with a heating element for heating the heating plate; and the heating plate is connected to the mounting frame through the heat insulation connecting piece.

[0028] By arranging the heating assembly in the heating plate, the heating plate has heating performance. The heating plate is connected to the mounting frame through the heat insulation connecting piece, thereby avoiding the heating plate from heating the mounting frame, and further reducing the thermal influence of the heating plate on the lifting driving unit.

[0029] In some embodiments, the lifting driving unit comprises a first lifting driving piece and a second lifting driving piece spaced apart along the second direction, wherein: the first end of the mounting frame is rotatably connected to the driving end of the first lifting driving piece through a detachable first pin shaft, and the second end of the mounting frame is rotatably connected to the driving end of the second lifting driving piece through a detachable second pin shaft.

[0030] By detaching the first pin shaft or the second pin shaft, the mounting frame can be pushed to overturn upwards, so as to overturn the heating assembly to be upwards, thereby facilitating the maintenance of the heating assembly.

[0031] In some embodiments, the solder strip processing device comprises two heating mechanisms arranged side by side along the first direction, wherein the two heating mechanisms are respectively a first heating mechanism and a second heating mechanism, the first heating mechanism is configured to heat the bonding sites on the front half of the solder strip group, the second heating mechanism is configured to heat the bonding sites on the rear half of the solder strip group, the front half of the solder strip group and the rear half of the solder strip group are separated by a transition section, and there are no bonding sites on the transition section; the solder strip processing device further comprises a first translation driving mechanism configured to drive the second heating mechanism to move along the first direction.

[0032] The solder strip group required by the battery assembly includes two types, one is a inter-tab solder strip group used to connect adjacent battery tabs of the same battery string, and the other is an inter-string solder strip group used to connect two adjacent battery strings. The transition section of the inter-tab solder strip group is relatively short, while the transition section of the inter-string solder strip group is relatively long. By arranging the solder strip processing device to comprise two heating mechanisms arranged side by side along the first direction, and arranging the second heating mechanism to be movable along the first direction under the driving of the first translation driving mechanism, the solder strip processing device can perform heating processing on the above two types of solder strip groups. In addition, the two heating mechanisms simultaneously perform heating on the bonding sites on the front half of the solder strip group and the rear half of the solder strip group, thereby improving the heating efficiency.

[0033] In some embodiments, the first translation driving mechanism comprises a first translation driving unit and a second translation driving unit, wherein: the first heating mechanism is connected to a movable part of the first translation driving unit, and the first translation driving unit is configured to drive the first heating mechanism to move along the first direction; the second heating mechanism is connected to a movable part of the second translation driving unit, and the second translation driving unit is configured to drive the second heating mechanism to move along the first direction; or, the first heating mechanism is fixedly arranged, and the second heating mechanism is connected to a movable part of the first translation driving mechanism, and the second heating mechanism is configured to drive the second heating mechanism to move along the first direction.

[0034] For the case where the first translation driving mechanism comprises a first translation driving unit and a second translation driving unit, after the solder strip group to be processed is pulled into the first heating mechanism and the second heating mechanism, according to the length of the solder strip group, the first heating mechanism is driven by the first translation driving unit to move along the first direction, so that the front half of the solder strip group completely enters the heating space of the first heating mechanism, ensuring that the first heating mechanism can heat the bonding sites on the front half of the solder strip group. Similarly, by driving the second heating mechanism to move along the first direction by the second translation driving unit, the rear half of the solder strip group can completely enter the heating space of the second heating mechanism, ensuring that the second heating mechanism can heat the bonding sites on the rear half of the solder strip group.

[0035] In the case that the first heating mechanism is fixedly arranged and the second heating mechanism is connected to the movable part of the first translation driving mechanism, when the solder strip group to be processed is pulled to the first heating mechanism and the second heating mechanism, the front half of the solder strip group is ensured to be located in the heating space of the first heating mechanism, i.e. the first heating mechanism can heat the bonding sites on the front half of the solder strip group. Then, the first translation driving mechanism drives the second heating mechanism to move in the first direction until the rear half of the solder strip group is completely located in the heating space of the second heating mechanism, so that the second heating mechanism can heat the bonding sites on the rear half of the solder strip group.

[0036] In some embodiments, the solder strip processing device comprises one heating mechanism, and further comprises a second translation driving mechanism; the heating mechanism is connected to the movable part of the second translation driving mechanism, and the second translation driving mechanism is configured to drive the heating mechanism to move in the first direction; when the heating mechanism moves to the first position, the heating mechanism heats the bonding sites on the front half of the solder strip group, and when the heating mechanism moves to the second position, the heating mechanism heats the bonding sites on the rear half of the solder strip group; the front half of the solder strip group and the rear half of the solder strip group are separated by a transition section, and there is no bonding site on the transition section.

[0037] The second translation driving mechanism drives the heating mechanism to move in the first direction, so that the heating mechanism can heat the bonding sites on the front half of the solder strip group and the rear half of the solder strip group in sequence, and thus the solder strip processing device can heat two types of solder strip groups.

[0038] In some embodiments, the pressure bearing seat is further provided with an air suction port, which is in communication with an external suction device, and is used to suck the flux volatilized by heating on the solder strip group.

[0039] During the heating process, the flux volatilized by heating on the solder strip group is sucked through the air suction port, so as to prevent the volatilized flux from polluting the surrounding environment.

[0040] On the other hand, the present application also provides a battery string welding device, which comprises a flux coating device, a solder strip laying device, a solder strip cutting device, a battery piece laying device, a welding device and the solder strip processing device as described in any one of the above, wherein:

[0041] The solder strip laying device is used to pull the solder strip group in the first direction, so that the solder strip group of a predetermined length passes through the flux coating device, the solder strip processing device and the solder strip cutting device in sequence;

[0042] The flux coating device is configured to coat the flux on the solder strip group, and the solder strip processing device is configured to heat the bonding sites in the solder strip group;

[0043] The solder strip cutting device is configured to cut the solder strip group after the heating is completed;

[0044] The welding strip laying device is further configured to cooperate with the battery piece laying device to lay the welding strip group and the battery piece with the glue point on the welding device according to a predetermined stringing rule, and each bonding site in the welding strip group corresponds to each glue point on the battery piece one by one.

[0045] The welding device is configured to weld the welding strip group to the battery piece and solidify the glue point.

[0046] The battery string welding equipment provided by the application realizes automatic welding of the battery piece provided with the glue point into a string. In particular, since the battery string welding equipment of the application is provided with the welding strip processing device, the bonding site in the welding strip group that contacts the glue point is locally heated by the welding strip processing device before the welding strip group is laid on the battery piece, so that the flux at the bonding site of the welding strip group is volatilized. In this way, the platinum catalyst in the glue point on the battery piece can be prevented from reacting with the flux at the bonding site of the welding strip group to cause platinum poisoning, so that the glue point can be solidified smoothly, and finally the stringing quality of the battery is improved. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 It is a structure schematic view of the welding strip processing device in the embodiment of the application in the first perspective view;

[0048] Figure 2 It is a structure schematic view of the welding strip processing device in the embodiment of the application in the second perspective view;

[0049] Figure 3 It is a structure schematic view of the welding strip processing device in the embodiment of the application in the third perspective view;

[0050] Figure 4 It is a C-C sectional view of Figure 3

[0051] Figure 5 It is a structure schematic view of the welding strip processing device in the embodiment of the application after removing the mounting frame and the heating plate;

[0052] Figure 6 It is a structure schematic view of the heating plate in the embodiment of the application;

[0053] Figure 7 It is a heating effect schematic view of the heating part on the welding strip group in one embodiment of the application;

[0054] Figure 8 It is a heating effect schematic view of the heating part on the welding strip group in another embodiment of the application;

[0055] Figure 9 It is a position relationship schematic view of the welding strip processing device and the flux coating device in the embodiment of the application;

[0056] ​Figure 10 Fig. 1 is a schematic diagram of the working process of the solder strip processing device in the embodiment of the present application;

[0057] Figure 11 Fig. 2 is a schematic diagram of the structure of the battery piece with the glue point;

[0058] Figure 12 Fig. 3 is a schematic diagram of the structure of the battery string.

[0059] Figures 1 to 12 The present application comprises:

[0060] The solder strip processing device 10 comprises:

[0061] The heating mechanism 1 comprises:

[0062] The pressure bearing seat 11 comprises a pressure bearing unit 111, a support head 112, a spring 113, and an air suction port 114;

[0063] The heating assembly 12 comprises a lifting driving unit 121, a mounting frame 122, a heating plate 123, a heating part 124, a heating strip 125, a heating block 126, a heat insulation connecting piece 127, a first lifting driving piece 128, a second lifting driving piece 129, a first pin shaft 1210, a second pin shaft 1211, a handle 1212, and a heating piece 1213;

[0064] The guide comb 13 comprises a guide groove 131;

[0065] The first translation driving mechanism 2 comprises:

[0066] The first translation driving unit 21 comprises:

[0067] The second translation driving unit 22 comprises:

[0068] The first heating mechanism 1a and the second heating mechanism 1b;

[0069] The flux coating device 20, the solder strip laying device 30, the solder strip cutting device 40, and the solder strip flattening device 50;

[0070] The battery piece 100, the glue point 200, the solder strip group 300, the inter-piece solder strip group 301, the inter-string solder strip group 302, and the bonding component 303. DETAILED DESCRIPTION

[0071] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0072] As mentioned in the background section, in the existing battery piece stringing mode, when the welding strip group is laid on the battery piece, the flux at the bonding position of the welding strip group in contact with the glue point will react with the platinum catalyst in the glue point, causing platinum poisoning in the glue point, thereby affecting the curing of the glue point, and ultimately reducing the quality of the battery string.

[0073] To this end, the present application provides a welding strip processing device which can locally heat the bonding position of the welding strip group in contact with the glue point, so that the flux at the bonding position of the welding strip group volatilizes.

[0074] As shown in Figures 1 to 5 The welding strip processing device 10 provided by the present application includes at least one (for example, two in the figure) heating mechanism 1, and the heating mechanism 1 includes oppositely arranged pressure bearing seat 11 and heating assembly 12, wherein: the heating assembly 12 and the pressure bearing seat 11 form a heating space for the welding strip group 300 (for the sake of simplicity, only one welding strip in the welding strip group 300 is shown in the figure) to enter, and the welding strip group 300 enters the heating space along a first direction (such as the X direction).

[0075] The heating assembly 12 and the pressure bearing seat 11 are configured to be relatively close or far away.

[0076] The heating assembly 12 is configured to press the bonding position of the welding strip group 300 in the heating space onto the pressure bearing seat 11 when the heating assembly 12 is close to the pressure bearing seat 11, and to heat the bonding position, so that the flux on the bonding position volatilizes. The bonding position of the welding strip group is the position to be bonded with the glue point on the battery piece.

[0077] As can be seen, the welding strip processing device 10 provided by the present application locally heats the bonding position of the welding strip group 300 in contact with the glue point, so that the flux at the bonding position of the welding strip group 300 volatilizes. In this way, the platinum catalyst in the glue point can be prevented from reacting with the flux at the bonding position of the welding strip group 300 to cause platinum poisoning, and ultimately the glue point can be cured smoothly.

[0078] In addition, since the flux at the remaining positions of the welding strip group 300 is not heated and volatilized, the welding strip group 300 can form a good metallization connection with the battery piece after welding, ultimately improving the quality of the battery string.

[0079] In order to realize the relative approach or distance between the heating assembly 12 and the pressure bearing seat 11, there are usually three optional implementation manners: the first is to fixedly arrange the pressure bearing seat 11, and move the heating assembly 12 towards or away from the pressure bearing seat 11; the second is to fixedly arrange the heating assembly 12, and move the pressure bearing seat 11 towards or away from the heating assembly 12; and the third is to movably arrange both the pressure bearing seat 11 and the heating assembly 12.

[0080] Optionally, the heating assembly 12 comprises a lifting driving unit 121, a mounting frame 122 and a heating plate 123, wherein the mounting frame 122 is connected to a movable part of the lifting driving unit 121, the heating plate 123 is arranged on the mounting frame 122, and the heating plate 123 and the pressure seat 11 form a heating space therebetween, and the lifting driving unit 121 is configured to drive the mounting frame 122 to move up and down.

[0081] The heating process of the solder strip group 300 by the heating assembly 12 is as follows:

[0082] In the initial state, the mounting frame 122 is at a high position, and the heating plate 123 is away from the pressure seat 11.

[0083] When the solder strip group 300 to be heated enters the heating space between the heating plate 123 and the pressure seat 11, the lifting driving unit 121 drives the mounting frame 122 to move downward toward the pressure seat 11, the heating plate 123 presses the bonding parts in the solder strip group 300 onto the pressure seat 11, and the bonding parts are heated.

[0084] After the heating process of the solder strip group 300 is completed, the lifting driving unit 121 drives the mounting frame 122 to move upward away from the pressure seat 11 to reset, and the heating plate 123 releases the bonding parts of the solder strip group 300. At this time, the solder strip group 300 can leave the heating space.

[0085] Since the heating plate 123 is separated from the lifting driving unit 121 by the mounting frame 122, the heating of the heating plate 123 to the lifting driving unit 121 can be reduced, and the lifting driving unit 121 can be prevented from being damaged by heat.

[0086] As shown in Figures 2 to 4 , the bottom of the heating plate 123 is provided with a downward protruding heating part 124. The heating plate 123 presses the bonding parts of the solder strip group 300 onto the pressure seat 11 through the heating part 124, thereby implementing local heating of the bonding parts of the solder strip group 300.

[0087] As shown in Figure 6 , optionally, the heating part 124 comprises a plurality of heating strips 125 arranged at intervals along a first direction (e.g., the X direction) and extending along a second direction (e.g., the Y direction). When the lifting driving unit 121 drives the mounting frame 122 to move downward toward the pressure seat 11, each heating strip 125 is configured to press a row of bonding parts arranged along the second direction in the solder strip group onto the pressure seat 11 and implement heating of the row of bonding parts, wherein the second direction is perpendicular to the first direction.

[0088] For example, as shown in Figure 7As shown, the solder strip group 300 to be subjected to the heating treatment includes 4 solder strips, each of which has 4 bonding sites 303, i.e., the solder strip group 300 has 4 rows of bonding sites 303 arranged at intervals along a first direction (e.g., the X direction), and each row of bonding sites 303 includes 4 bonding sites 303.

[0089] Correspondingly, the heating portion 124 includes 4 heating strips 125 arranged at intervals along the first direction and extending along a second direction (e.g., the Y direction), and each heating strip 125 presses a row of bonding sites 303 against the pressure seat 11. Of course, in actual production, the number of solder strips in the solder strip group 300 is greater than 4, and the number of bonding sites 303 on each solder strip is also greater than 4.

[0090] By arranging the heating portion 124 as a plurality of heating strips 125 arranged at intervals along the first direction, the pressing and heating of each row of bonding sites 303 in the solder strip group 300 are implemented one by one by the heating strips 125, which facilitates the arrangement and maintenance of the heating portion 124 while ensuring the local heating of the bonding sites 303 of the solder strip group 300.

[0091] In another alternative implementation, the heating portion 124 includes a plurality of heating blocks 126, each of which corresponds to one bonding site in the solder strip group 300. When the mounting frame 122 is driven by the lifting driving unit 121 to descend toward the pressure seat 11, each heating block 126 is used to press and heat the corresponding bonding site.

[0092] For example, as shown in FIG. 4, the solder strip group 300 to be subjected to the heating treatment includes 4 solder strips, each of which has 4 bonding sites 303, i.e., the solder strip group 300 has 16 bonding sites 303 in total. Figure 8

[0093] Correspondingly, the heating portion 124 includes 16 heating blocks 126, each of which presses a corresponding bonding site 303 against the pressure seat 11.

[0094] By arranging the heating portion 124 as heating blocks 126 corresponding one by one to the bonding sites in the solder strip group 300, one-to-one pressing and heating of each bonding site 303 can be achieved. While ensuring the local heating of the bonding sites of the solder strip group 300, the contact area of the heating portion 124 with the pressure seat 11 can be reduced, thereby reducing heat loss and energy consumption.

[0095] ​In order to facilitate the maintenance and replacement of the heating part 124, the heating part 124 is optionally detachably mounted on the heating plate 123. For example, when the heating part 124 is the heating strip 125, each heating strip 125 is screwed to the bottom of the heating plate 123. Of course, all the heating strips 125 can be first mounted on a unified mounting plate, and then the mounting plate is screwed to the bottom of the heating plate 123. The detachable mounting mode can replace the components version by replacing the different heating parts, and the heating plate can not be replaced, which is lower in cost.

[0096] In another optional embodiment, the heating part 124 is integrally formed with the heating plate 123. For example, the heating strip or the heating block protruding downward from the heating plate 123 is directly extruded on the bottom of the heating plate 123 by a mold. The heating part 124 is integrally formed with the heating plate 123, which facilitates the preparation and molding of the heating part 124 and is beneficial to improve the heating effect of the heating part 124.

[0097] As shown in Figure 2 Optionally, the pressure receiving seat 11 is provided with a pressure receiving unit 111 which can float up and down relative to the pressure receiving seat 11. The heating assembly 12 is used to press the bonding parts of the solder strip group 300 in the heating space to the pressure receiving unit 111. In this way, it can be ensured that the bonding parts in the solder strip group 300 can be elastically pressed to the pressure receiving seat 11 by the heating part 124, and on the premise of ensuring the heating effect of the heating part 124 on the bonding parts, the pressure of the heating part 124 on the solder strip group 300 is prevented from being too large, which causes the deformation of the solder strip group 300.

[0098] As shown in Figures 4 to 5 Optionally, the pressure receiving unit 111 includes a plurality of support heads 112, each of which is installed on the pressure receiving seat 11 to float up and down, each support head 112 corresponds to each bonding part in the solder strip group 300 one by one, and each support head 112 is used to carry a corresponding bonding part. That is, when the heating assembly 12 descends towards the pressure receiving seat 11, the heating assembly 12 will press each bonding part in the solder strip group 300 to the support head 112 one by one. Since each support head 112 can independently float, when the pressing surface of the heating assembly 12 is uneven, the heating assembly 12 can still ensure that all the bonding parts of the solder strip group 300 can be pressed to the corresponding support head 112 one by one, and finally ensure that effective heating is performed on all the bonding parts.

[0099] As shown in Figure 4 Optionally, the pressure receiving unit 111 further includes a spring 113, wherein the support head 112 is slidably connected to the pressure receiving seat 11, the spring is sleeved on the support head 112, the lower end of the spring 113 abuts against the pressure receiving seat 11, and the upper end of the spring 113 abuts against the support head 112.

[0100] Thus, when the heating assembly 12 presses the bonding sites of the solder strip group 300 towards the pressure seat 11, the spring 113 generates vertical extension and contraction deformation according to the pressure condition, thereby pushing the support head 112 to float up and down.

[0101] In another alternative embodiment, the pressure unit 111 comprises a plurality of pressure strips which are spaced apart along the first direction (e.g. X direction) and extend along the second direction (e.g. Y direction), each of the pressure strips is installed on the pressure seat 11 to float up and down, and each of the pressure strips is used to support a row of the bonding sites arranged along the second direction in the solder strip group 300.

[0102] The pressure unit 111 is arranged as the pressure strips which are spaced apart along the first direction, when the heating assembly 12 descends towards the pressure seat 11, each row of the bonding sites arranged along the second direction in the solder strip group 300 can be pressed onto the pressure strips one by one, thereby ensuring effective heating of all the bonding sites. In addition, using the pressure strips as the pressure unit can facilitate the installation and maintenance of the pressure unit.

[0103] In another alternative embodiment, the pressure unit 111 can also be a heat insulation plate which is installed on the pressure seat 11 to float up and down, and the heating assembly 12 presses all the bonding sites in the solder strip group 300 onto the heat insulation plate. Using the heat insulation plate as the pressure unit 111 can facilitate the installation and maintenance of the pressure unit 111.

[0104] In addition, since the heat insulation plate has very low thermal conductivity, when the heating assembly 12 presses each of the bonding sites in the solder strip group 300 onto the heat insulation plate for heating, the heat insulation plate will not conduct heat, and other parts of the solder strip group 300 will not be heated by the heat insulation plate, thereby avoiding the flux in other parts from being heated and volatilized.

[0105] As shown in Figure 2 and Figure 5 Optionally, the heating mechanism 1 further comprises a guide comb 13 which is arranged on the pressure seat 11 and located at the side of the pressure seat 11, and the guide comb 13 extends along the second direction (e.g. Y direction). The upper end of the guide comb 13 is spaced apart along the second direction and provided with a plurality of guide grooves 131, each of the guide grooves 131 is used to guide and limit one of the solder strips in the solder strip group 300, and the second direction is perpendicular to the first direction.

[0106] By arranging the guide comb 13, the solder strips in the solder strip group 300 are guided to prevent position deviation. Finally, it ensures that the heating assembly 12 can press the bonding sites on the solder strips onto the pressure seat 11 to implement local heating.

[0107] As shown in Figure 4As shown, the heating plate 123 is provided with a heating member 1213, which is used to heat the heating plate 123, so that the heating plate 123 has heating performance. The heating member 1213 can be a heating rod, and can further include a thermocouple for detecting the temperature of the heating plate 123. The heating rod heats the heating plate 123 accurately based on the temperature value obtained by the thermocouple, so that the temperature of the heating plate 123 is kept within a predetermined range.

[0108] As shown in Figures 2 to 3 Optionally, the heating plate 123 is connected to the mounting frame 122 through a heat insulation connector 127, so that the heating plate 123 does not heat the mounting frame 122, thereby further reducing the thermal influence of the heating plate 123 on the lifting driving unit 121.

[0109] As shown in Figures 2 to 3 Optionally, the lifting driving unit 121 includes a first lifting driving member 128 and a second lifting driving member 129 which are arranged at intervals along a second direction (e.g., the Y direction), wherein the first end of the mounting frame 122 is rotatably connected to the driving end of the first lifting driving member 128 through a detachable first pin shaft 1210, and the second end of the mounting frame 122 is rotatably connected to the driving end of the second lifting driving member 129 through a detachable second pin shaft 1211.

[0110] When the first pin shaft 1210 or the second pin shaft 1211 is detached, the mounting frame 122 is pushed to flip upward, so that the heating assembly 12 is flipped to face upward, thereby facilitating the maintenance of the heating assembly 12.

[0111] The first lifting driving member 128 and the second lifting driving member 129 can be a pneumatic cylinder, an electric cylinder or other commonly used linear driver.

[0112] Optionally, the mounting frame 122 is further provided with a handle 1212, and when the handle 1212 is gripped, the mounting frame 122 can be easily pushed to flip upward.

[0113] As shown in Figure 12 The welding ribbon group required in the production of the battery string includes two types;

[0114] One type is a inter-sheet welding ribbon group 301 used to connect adjacent battery sheets 100 in the same battery string, which includes a front half 301a having an adhesive site, a rear half 301b, and a transition section 301c without an adhesive site. The front half 301a of the inter-sheet welding ribbon group 301 is welded to the battery sheet 100 on the front side of the two adjacent battery sheets 100, and the rear half 302b of the inter-sheet welding ribbon group 301 is welded to the battery sheet 100 on the rear side of the two adjacent battery sheets 100.

[0115] Another type is the inter-string ribbon group 302 connecting the head and tail cell tabs of two adjacent cell strings. Similarly, the inter-string ribbon group 302 includes a front half 302a having bonding sites thereon, a rear half 302b having bonding sites thereon, and a transition section 302c having no bonding sites thereon. The front half 302a of the inter-string ribbon group 302 is welded to the tail cell tab of the cell string on the front side of the two adjacent cell strings, and the rear half 302b of the inter-string ribbon group 302 is welded to the head cell tab of the cell string on the rear side of the two adjacent cell strings.

[0116] As shown in FIG. 1, the length of the transition section 301c of the inter-tab ribbon group 301 is less than the length of the transition section 302c of the inter-string ribbon group 302, and correspondingly, the overall length of the inter-tab ribbon group 301 is less than the overall length of the inter-string ribbon group 302. Figure 12 To enable the ribbon processing device 10 to perform heating treatment on the above two types of ribbon groups, as shown in FIG. 2, an optional embodiment of the present application is that the ribbon processing device 10 includes two heating mechanisms 1 arranged side by side along the first direction, and the two heating mechanisms 1 are respectively a first heating mechanism 1a and a second heating mechanism 1b, wherein the first heating mechanism 1a is configured to heat each bonding site on the front half of the ribbon group 300, and the second heating mechanism 1b is configured to heat each bonding site on the rear half of the ribbon group 300, and the transition section between the front half and the rear half of the ribbon group 300 has no bonding sites thereon.

[0117] Figures 1 to 5 The ribbon processing device 10 further includes a first translation driving mechanism 2 configured to drive the second heating mechanism 1b to move along the first direction.

[0118] By arranging the ribbon processing device 10 to include two heating mechanisms 1 arranged side by side along the first direction, and arranging the second heating mechanism 1b to be movable along the first direction under the driving of the first translation driving mechanism 2, the ribbon processing device 10 can perform heating treatment on the above two types of ribbon groups.

[0119] In addition, the two heating mechanisms 1 simultaneously perform heating treatment on the bonding sites on the front half and the rear half of the ribbon group, thereby improving the heating efficiency of the ribbon group.

[0120] As shown in FIG. 3, the ribbon processing device 10 includes two heating mechanisms 1 arranged side by side along the first direction, and the two heating mechanisms 1 are respectively a first heating mechanism 1a and a second heating mechanism 1b, wherein the first heating mechanism 1a is configured to heat each bonding site on the front half of the ribbon group 300, and the second heating mechanism 1b is configured to heat each bonding site on the rear half of the ribbon group 300, and the transition section between the front half and the rear half of the ribbon group 300 has no bonding sites thereon.

[0121] As shown in FIG. 3, the ribbon processing device 10 includes two heating mechanisms 1 arranged side by side along the first direction, and the two heating mechanisms 1 are respectively a first heating mechanism 1a and a second heating mechanism 1b, wherein the first heating mechanism 1a is configured to heat each bonding site on the front half of the ribbon group 300, and the second heating mechanism 1b is configured to heat each bonding site on the rear half of the ribbon group 300, and the transition section between the front half and the rear half of the ribbon group 300 has no bonding sites thereon. Figure 1 ​In the illustrated embodiment, the first translation driving mechanism 2 comprises a first translation driving unit 21 and a second translation driving unit 22, wherein: the first heating mechanism 1a is connected to a movable part of the first translation driving unit 21, and the first translation driving unit 21 is configured to drive the first heating mechanism 1a to move along the first direction. The second heating mechanism 1b is connected to a movable part of the second translation driving unit 22, and the second translation driving unit 22 is configured to drive the second heating mechanism 1b to move along the first direction.

[0122] Figure 1 The optional heating process of the solder strip processing device on the solder strip group 300 in the illustrated embodiment is as follows:

[0123] The solder strip group 300 to be processed is pulled into the first heating mechanism 1a and the second heating mechanism 1b.

[0124] At this time, the first heating mechanism 1a can be driven by the first translation driving unit 21 to move along the first direction, so that the front half of the solder strip group 300 completely enters the heating space of the first heating mechanism 1a, ensuring that the first heating mechanism 1a can heat the bonding part on the front half of the solder strip group. Similarly, the second heating mechanism 1b can be driven by the second translation driving unit 22 to move along the second direction, so that the rear half of the solder strip group 300 completely enters the heating space of the second heating mechanism 1b, ensuring that the second heating mechanism 1b can heat the bonding part on the rear half of the solder strip group 300. The transition section of the solder strip group 300 that does not need to be heated is located at the gap between the first heating mechanism 1a and the second heating mechanism 1b.

[0125] The first heating mechanism 1a and the second heating mechanism 1b are controlled to heat the bonding parts on the front half and the rear half of the solder strip group 300, respectively.

[0126] The first translation driving unit 21 and the second translation driving unit 22 can each use an existing linear driving module that can drive the first heating mechanism 1a and the second heating mechanism 1b to move along the first direction, such as a screw driving module, a cylinder driving module, etc.

[0127] Of course, the first heating mechanism 1a can also be fixedly arranged, and the second heating mechanism 1b is connected to a movable part of the first translation driving mechanism 2. The first translation driving mechanism 2 is only configured to drive the second heating mechanism 1b to move along the first direction. In this embodiment, the optional heating process of the solder strip processing device on the solder strip group 300 is as follows:

[0128] The solder strip group 300 to be processed is pulled into the first heating mechanism 1a and the second heating mechanism 1b, and the front half of the solder strip group 300 is ensured to be located in the heating space of the first heating mechanism 1a, that is, the first heating mechanism 1a is ensured to be able to heat the bonding positions on the front half of the solder strip group 300.

[0129] Subsequently, the first translation driving mechanism 2 drives the second heating mechanism 1b to move in the first direction until the rear half of the solder strip group 300 completely enters the heating space of the second heating mechanism 1b, ensuring that the second heating mechanism 1b can heat the bonding positions on the rear half of the solder strip group.

[0130] The first heating mechanism 1a and the second heating mechanism 1b are controlled to heat the bonding positions on the front half and the rear half of the solder strip group 300, respectively.

[0131] The first translation driving unit 2 can adopt various linear driving modules capable of driving the second heating mechanism 1b to move in the first direction, such as a screw driving module, a cylinder driving module, etc.

[0132] In another embodiment, the solder strip processing device 10 of the present application only includes one heating mechanism 1. The solder strip processing device 10 further includes a second translation driving mechanism, and the heating mechanism 1 is connected to the moving part of the second translation driving mechanism, and the second translation driving mechanism is configured to drive the heating mechanism 1 to move in the first direction. The heating mechanism 1 heats each bonding position on the front half of the solder strip group 300 when moving to the first position, and the heating mechanism 1 heats each bonding position on the rear half of the solder strip group 300 when moving to the second position.

[0133] The optional heating process of the solder strip processing device 10 of this structure on the solder strip group 300 is as follows:

[0134] The solder strip group 300 to be processed is pulled into the heating mechanism 1.

[0135] Subsequently, the second translation driving mechanism drives the heating mechanism 1 to move in the first direction to the first position, so that the front half of the solder strip group 300 completely enters the heating space of the heating mechanism 1, and the heating mechanism 1 is controlled to complete the heating process on each bonding position on the front half of the solder strip group 300.

[0136] Subsequently, the second translation driving mechanism drives the heating mechanism 1 to move in the first direction to the second position, so that the rear half of the solder strip group 300 completely enters the heating space of the heating mechanism 1, and the heating mechanism 1 is controlled to complete the heating process on each bonding position on the rear half of the solder strip group 300.

[0137] The second translation driving unit can adopt various linear driving modules capable of driving the second heating mechanism 1b to move in the first direction, such as a screw rod driving module, a cylinder driving module, etc.

[0138] As shown in Figure 5 Optionally, the pressure bearing seat 11 is further provided with an air suction port 114, which is in communication with an external suction device. When the heating assembly 12 performs the heating treatment on the solder strip group 300, the air suction port 114 is used to suck off the flux volatilized from the solder strip group 300, so as to prevent the volatilized flux from polluting the surrounding environment.

[0139] The application further provides a battery string welding device for welding battery pieces provided with glue points on surfaces into a string through solder strip groups. As shown in Figures 9 to 10 The battery string welding device of the application comprises a flux coating device 20, a solder strip laying device 30, a solder strip cutting device 40, a battery piece laying device, a welding device, and the solder strip processing device 10 provided in any of the above embodiments, wherein:

[0140] The solder strip laying device 30 is used to pull the solder strip group 300 in a first direction (such as the X direction), so that the solder strip group 300 of a predetermined length passes through the flux coating device 20, the solder strip processing device 10, and the solder strip cutting device 40 in sequence.

[0141] The flux coating device 20 is configured to coat flux onto the solder strip group 300, and the solder strip processing device 10 is configured to heat each bonding site in the solder strip group.

[0142] The solder strip cutting device 40 is configured to cut the solder strip group 300 after the heating is completed.

[0143] The solder strip laying device 30 is further configured to cooperate with the battery piece laying device to lay the solder strip group and the battery pieces with glue points onto the welding device according to a predetermined stringing rule, so that each bonding site in the solder strip group corresponds to each glue point on the battery piece.

[0144] The welding device is configured to weld the solder strip group to the battery piece and solidify the glue points.

[0145] The battery string welding device provided by the application realizes the automatic welding of the battery pieces provided with glue points into a string. In particular, since the battery string welding device of the application is provided with the solder strip processing device 10, the bonding sites in the solder strip group that contact the glue points are locally heated by the solder strip processing device 10 before the solder strip group is laid on the battery piece, so that the flux at the bonding sites of the solder strip group 300 is volatilized. In this way, the platinum catalyst in the glue points can be prevented from reacting with the flux at the bonding sites of the solder strip group 300 to cause platinum poisoning, so that the glue points can be solidified smoothly, and finally the stringing quality of the battery is improved.

[0146] like Figure 9 As shown, optionally, the flux coating device 20 is a flux tank with a guide roller 201 inside. When the solder ribbon laying device 30 pulls the solder ribbon group 300, the solder ribbon group 300 passes through the flux tank under the guidance of the guide roller 201. During this process, the flux in the flux tank adheres to the solder ribbon group 300. Of course, other existing flux coating devices can also be used, such as a coating brush. When the solder ribbon group 300 passes over or under the coating brush, the coating brush applies the flux on it to the solder ribbon group 300.

[0147] The ribbon laying device 30 can be any existing device capable of clamping and pulling the ribbon group 300. For example, the ribbon laying device 30 includes a drive unit and a clamping assembly connected to the drive end of the drive unit. The drive unit drives the clamping assembly to move, thereby causing the clamping assembly to clamp the free end of the ribbon group 300 from the ribbon cutting device 40 and pull the ribbon group 300 along the first direction.

[0148] The welding strip cutting device 40 can be any existing device capable of pressing and cutting the welding strip group 300. For example, the welding strip cutting device 40 includes a pressing part and a cutting part arranged sequentially along a first direction. The welding strip group 300 passes through the pressing part and the cutting part in sequence. When it is necessary to cut the welding strip group 300, the pressing part first presses the welding strip group 300, and then the cutting part cuts the welding strip group 300.

[0149] The cell placement device can use various existing devices capable of adsorbing and transporting cells. For example, the cell placement device includes a drive unit and a suction cup assembly connected to the drive end of the drive unit. The drive unit drives the suction cup assembly to move, thereby causing the suction cup assembly to pick up the cell to be placed and place the cell onto the welding device.

[0150] The welding apparatus may include, for example, a welding conveyor line and a heating unit disposed along the conveyor path of the welding conveyor line. The ribbon laying device 30 cooperates with the cell laying device to lay the ribbon assembly and the cells with adhesive dots onto the welding conveyor line according to a predetermined stringing pattern. The welding conveyor line transports the cells and ribbon assembly to the heating unit, which heats the cells and ribbon assembly, thereby welding the ribbon assembly onto the cells. The heating unit may be, for example, an infrared light box.

[0151] like Figure 10As shown, optionally, the battery string welding device in the embodiment of the present application further comprises a welding strip flattening device 50, which is located between the welding strip processing device 10 and the welding strip cutting device 40, and is configured to perform flattening treatment on the transition section of the welding strip group without the bonding part, so as to reduce the local stress caused by the welding strip to the edge of the battery piece after stringing.

[0152] As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction. Figure 1 As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction.

[0153] Figure 12 As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction.

[0154] As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction.

[0155] As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction. Figure 10 As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction.

[0156] Figure 10 As shown in (a) of FIG. 1, the welding strip processing device 10 in the embodiment of the present application needs to include a first heating mechanism 1a and a second heating mechanism 1b, and the first heating mechanism 1a and the second heating mechanism 1b are respectively in transmission connection with a first translation driving unit 21 and a second translation driving unit 22, wherein the first translation driving unit 21 is used to drive the first heating mechanism 1a to move in a first direction, and the second translation driving unit 22 is used to drive the second heating mechanism 1b to move in a second direction.

[0157] ​​The ribbon laying device 30 pulls the ribbon group 300 one step along the first direction to pull the second ribbon group of length A into the first heating mechanism 1a and the second heating mechanism 1b. At the same time, the first ribbon group of length A, which has completed the heating treatment, enters the ribbon flattening device 50. The first heating mechanism 1a and the second heating mechanism 1b heat the first half and the second half of the second ribbon group, respectively, while the ribbon flattening device 50 flattens the first ribbon group.

[0158] Next, the welding strip laying device 30 pulls the welding strip group 300 forward once in the first direction, so that the first welding strip group that has been flattened passes through the welding strip cutting device 40, the second welding strip group that has been heated enters the welding strip flattening device 50, and the third welding strip group enters the first heating mechanism 1a and the second heating mechanism 1b.

[0159] Next, the solder strip cutting device 40 cuts the first solder strip group to obtain an inter-piece solder strip group 301.

[0160] Continue the above process until N-1 inter-piece solder strip groups 301 are obtained.

[0161] The welding strip laying device 30 pulls the welding strip group 300 one step along the first direction, thereby pulling the N+1th welding strip group of length A into the first heating mechanism 1a and the second heating mechanism 1b. At the same time, the Nth welding strip group of length A that has completed the heating treatment enters the welding strip flattening device 50.

[0162] like Figure 10 As shown in (b), the second translation drive unit 22 drives the second heating mechanism 1b to move backward, so that the distance between the first heating mechanism 1a and the second heating mechanism 1b increases to match the length of the transition section of the inter-string solder strip group 302, so that the length of the N+1th solder strip group located in the first heating mechanism 1a and the second heating mechanism 1b reaches B.

[0163] Next, the first heating mechanism 1a and the second heating mechanism 1b respectively heat the first half and the second half of the N+1th welding strip group, while the welding strip flattening device 50 flattens the Nth welding strip group.

[0164] Next, the ribbon laying device 30 pulls the ribbon group 300 forward one step along the first direction, so that the Nth ribbon group, after being flattened, passes through the ribbon cutting device 40, and the (N+1)th ribbon group enters the ribbon flattening device 50. The Nth ribbon group is cut to obtain the Nth inter-piece ribbon group 301. Figure 10As shown in (c), in order to avoid the N+1th solder strip group with a length of B, the first translation drive unit 21 needs to drive the first heating mechanism 1a to move backward toward the second heating mechanism 1b, so that the distance between the first heating mechanism 1a and the second heating mechanism 1b is restored to match the length of the transition section of the inter-piece solder strip group 301.

[0165] Next, the ribbon laying device 30 pulls the ribbon group 300 to step once in the first direction, so that the N+1th ribbon group passes through the ribbon cutting device 40, cuts the N+1th ribbon group, and obtains a series ribbon group 302.

[0166] like Figure 10 As shown in (d), the first translation drive unit 21 and the second translation drive unit 22 synchronously drive the first heating mechanism 1a and the second heating mechanism 1b to move forward and reset.

[0167] In another embodiment, the solder strip flattening device 50 may also be disposed between the flux coating device 20 and the solder strip processing device 10, or disposed before the flux coating device 10, with the solder strip processing device 10 disposed close to the solder strip cutting device 40.

[0168] In this embodiment, the first heating mechanism 1a does not need to avoid the (N+1)th welding strip group with a length of B. Therefore, in this embodiment, the position of the first heating mechanism 1a can be fixed, while the second heating mechanism 1b is connected to the first translation drive mechanism 2.

[0169] After the heating treatment of the first type of solder strip group is completed, the second heating mechanism 1b is driven by the first translation drive mechanism 2 to move along the first direction, so that the heating treatment of the second type of solder strip group can continue.

[0170] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A welding strip handling device, characterized in that, The solder strip processing device comprises at least one heating mechanism, the heating mechanism comprises oppositely arranged pressure bearing seat and heating assembly, wherein: The heating assembly and the pressure bearing seat form a heating space for the solder strip group to enter, and the solder strip group enters the heating space along the first direction; The heating assembly and the pressure bearing seat are configured to be relatively close or far away; The heating assembly is configured to press the bonding part of the solder strip group in the heating space on the pressure bearing seat when close to the pressure bearing seat, and heat the bonding part, so that the flux on the bonding part volatilizes, and the bonding part of the solder strip group is the part to be bonded with the glue point on the battery piece.

2. The solder strip handling apparatus of claim 1, wherein, The heating assembly comprises lifting driving unit, mounting frame and heating plate, wherein: The mounting frame is connected to the movable part of the lifting driving unit, the heating plate is arranged on the mounting frame, the heating plate and the pressure bearing seat form the heating space, and the lifting driving unit is used to drive the mounting frame to lift; When the lifting driving unit drives the mounting frame to descend towards the pressure bearing seat, the heating plate presses the bonding part of the solder strip group on the pressure bearing seat and heats the bonding part; When the lifting driving unit drives the mounting frame to ascend away from the pressure bearing seat, the heating plate releases the bonding part of the solder strip group.

3. The solder strip handling apparatus of claim 2, wherein, The bottom of the heating plate is provided with a downward protruding heating part; The heating part comprises a plurality of heating strips arranged at intervals along the first direction and extending along the second direction, and each heating strip is used to heat the bonding part arranged along the second direction in a row in the solder strip group when the lifting driving unit drives the mounting frame to descend towards the pressure bearing seat; Or, The heating part comprises a plurality of heating blocks, each heating block corresponds to one bonding part in the solder strip group, and each heating block is used to heat the corresponding bonding part when the lifting driving unit drives the mounting frame to descend towards the pressure bearing seat. The second direction is perpendicular to the first direction.

4. The solder strip handling apparatus of claim 3, wherein, The heating part is detachably mounted on the heating plate, or the heating part is integrally made with the heating plate.

5. The solder strip handling apparatus of claim 1, wherein, The pressure bearing seat is provided with a pressure bearing unit which can float up and down relative to the pressure bearing seat; The heating assembly is used to press the bonding part of the solder strip group in the heating space on the pressure bearing unit.

6. The solder strip processing device according to claim 5, wherein: The pressure bearing unit comprises a plurality of pressure bearing strips arranged at intervals along the first direction and extending along the second direction, each pressure bearing strip is respectively installed on the pressure bearing seat which can float up and down, and each pressure bearing strip is used to support the bonding part arranged along the second direction in a row in the solder strip group, wherein the second direction is perpendicular to the first direction; or The pressure bearing unit is a heat insulation plate which can be installed on the pressure bearing seat which can float up and down, and the heating assembly presses each bonding part in the solder strip group on the heat insulation plate; or The pressure bearing unit comprises a plurality of support heads, each of which is respectively installed on the pressure bearing seat in a floating manner, each of the support heads corresponds to each of the bonding positions in the solder ribbon group, and each of the support heads is used to carry a corresponding bonding position.

7. The solder strip handling device of claim 6, wherein, The pressure bearing unit further comprises a spring, wherein the support head is slidably connected to the pressure bearing seat, the spring is sleeved on the support head, the lower end of the spring abuts against the pressure bearing seat, and the upper end of the spring abuts against the support head.

8. The solder strip handling apparatus of claim 6, wherein, The heating mechanism further comprises a guide comb arranged on the pressure bearing seat and located at the side of the pressure bearing seat, and the guide comb extends along the second direction. The upper end of the guide comb is provided with a plurality of guide grooves in the second direction, and each guide groove is used to guide and limit one solder ribbon in the solder ribbon group. The second direction is perpendicular to the first direction.

9. The solder strip handling apparatus of claim 2, wherein, The heating plate is provided with a heating element for heating the heating plate. The heating plate is connected to the mounting frame through a heat insulation connecting piece.

10. The solder strip handling apparatus of claim 2, wherein, The lifting driving unit comprises a first lifting driving piece and a second lifting driving piece arranged in the second direction. The first end of the mounting frame is rotatably connected to the driving end of the first lifting driving piece through a detachable first pin shaft, and the second end of the mounting frame is rotatably connected to the driving end of the second lifting driving piece through a detachable second pin shaft.

11. The solder strip handling device of claim 1, wherein, The solder ribbon processing device comprises two heating mechanisms arranged side by side along the first direction, wherein the two heating mechanisms are respectively a first heating mechanism and a second heating mechanism, the first heating mechanism is configured to heat each bonding position on the front half of the solder ribbon group, the second heating mechanism is configured to heat each bonding position on the rear half of the solder ribbon group, the front half of the solder ribbon group and the rear half of the solder ribbon group are a transition section, and there is no bonding position on the transition section. The solder ribbon processing device further comprises a first translation driving mechanism, and the first translation driving mechanism is configured to drive the second heating mechanism to move along the first direction.

12. The solder strip handling apparatus of claim 11, wherein, The first translation driving mechanism comprises a first translation driving unit and a second translation driving unit, wherein the first heating mechanism is connected to the movable part of the first translation driving unit, the first translation driving unit is configured to drive the first heating mechanism to move along the first direction, the second heating mechanism is connected to the movable part of the second translation driving unit, and the second translation driving unit is configured to drive the second heating mechanism to move along the first direction; or The first heating mechanism is fixedly arranged, the second heating mechanism is connected to the movable part of the first translation driving mechanism, and the second heating mechanism is configured to drive the second heating mechanism to move along the first direction.

13. The solder strip handling device of claim 1, wherein, The solder ribbon processing device comprises one heating mechanism, and the solder ribbon processing device further comprises a second translation driving mechanism. The heating mechanism is connected to a movable part of the second translational driving mechanism, and the second translational driving mechanism is configured to drive the heating mechanism to move in the first direction; The heating mechanism is configured to heat the bonding sites on the front half of the solder strip group when the heating mechanism is in the first position, and heat the bonding sites on the rear half of the solder strip group when the heating mechanism is in the second position, wherein the front half of the solder strip group and the rear half of the solder strip group are separated by a transition section, and the transition section does not have the bonding sites.

14. The solder strip handling device of claim 1, wherein, The pressure-bearing seat is further provided with an air suction port, which is in communication with an external suction device, and is configured to suck off the flux volatilized from the solder strip group.

15. A battery string welding apparatus, characterized by, The battery string soldering device comprises a flux coating device, a solder strip laying device, a solder strip cutting device, a cell laying device, a soldering device, and the solder strip processing device according to any one of claims 1 to 14. The solder strip laying device is configured to pull the solder strip group in the first direction, so that a predetermined length of the solder strip group sequentially passes through the flux coating device, the solder strip processing device, and the solder strip cutting device; The flux coating device is configured to coat flux onto the solder strip group, and the solder strip processing device is configured to heat the bonding sites in the solder strip group; The solder strip cutting device is configured to cut the solder strip group after the heating is completed; The solder strip laying device is further configured to cooperate with the cell laying device to lay the solder strip group and the cell with the adhesive dots on the soldering device according to a predetermined string rule, wherein each of the bonding sites in the solder strip group corresponds to one of the adhesive dots on the cell; The soldering device is configured to solder the solder strip group to the cell and solidify the adhesive dots.

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