CPU (Central Processing Unit) radiator with high loading capacity
By incorporating flat tubes, fins, and baffles into the CPU heatsink, the problem of insufficient heat dissipation in traditional heatsinks under high computing power is solved, achieving high pressure resistance and efficient heat dissipation.
Patent Information
- Application Number
- CN202520081288.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-14
AI Technical Summary
Traditional air-cooled heat sinks are unable to meet the heat dissipation requirements under high computing power demands, especially under high flow rates and high operating pressures.
A high-pressure-bearing CPU cooler was designed. By setting multiple flat tubes and fins inside the cooler housing, and installing baffles and slots in the coolant inlet and outlet manifolds, the spacing between the baffles can be flexibly adjusted to improve the pressure-bearing capacity and ensure uniform coolant flow.
It improves the heat sink's pressure resistance and heat dissipation performance under high flow and high pressure, meeting the heat dissipation needs of high computing power equipment.
Smart Images

Figure CN223815535U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to CPU radiator technical field, concretely is a high pressure capacity CPU radiator. BACKGROUND
[0002] With the rapid development of data center and artificial intelligence, a large amount of computing power is required, and the improvement of computing power puts forward higher requirements for heat dissipation, and the ability of approaching or exceeding air cooling heat dissipation limit, the traditional air cooling heat dissipation form has been difficult to meet the requirements, and the development of higher heat dissipation capacity radiator has become the consensus of the industry, and a radiator used under larger flow and higher working pressure is proposed, and the radiator has superior heat dissipation performance. SUMMARY
[0003] The utility model discloses a high pressure capacity CPU radiator to solve the problems in the background art.
[0004] To achieve the above object, the utility model provides the following technical scheme: a high pressure capacity CPU radiator, including upper end board and lower end board, the upper end board and lower end board both ends are equipped with the cooling liquid inlet manifold box body and the cold area liquid outlet manifold box body connected with it, the upper end board, lower end board, cooling liquid inlet manifold box body and cold area liquid outlet manifold box body form the radiator box body and be equipped with multiple flat tubes and multiple fins.
[0005] Further optimization, the upper end board and lower end board both sides are equipped with the fan mounting plate fixedly connected with it, and multiple fan mounting hole positions are symmetrically arranged on it.
[0006] Further optimization, the cold area liquid outlet manifold box body upper end is equipped with the cooling liquid outlet pipe connected with it, and the cooling liquid inlet manifold box body upper end is equipped with the cooling liquid inlet pipe connected with it.
[0007] Further optimization, the cooling liquid inlet manifold box body and cold area liquid outlet manifold box body are equipped with multiple equidistantly arranged partitions inside.
[0008] Further optimization, multiple partitions are equipped with partition notches at both ends.
[0009] Further optimization, the cooling liquid inlet manifold box body and cold area liquid outlet manifold box body are equipped with flat tube clamping grooves on the side close to multiple flat tubes.
[0010] Advantages
[0011] The high-pressure-resistant CPU radiator provided by the utility model is provided with a row of parallel arranged partition sheets in the collecting pipe, the both ends of the partition sheets are provided with corresponding notches, the size of the notches can be designed flexibly according to the specific working condition design requirement of the product, the interval of the partition sheets can be adjusted flexibly according to the pressure-resistant design requirement of the product, that is, the narrower the interval of the partition sheets is arranged, the higher the pressure-resistant capacity of the radiator is, on the contrary, the lower the pressure resistance is, the pressure-resistant range is 200KPa-400KPa, the pressure-resistant capacity of the cooling liquid into / out of the collecting pipe is improved, the working condition of the radiator under the large flow and high pressure is met, the shunting effect is realized, the flow into the flat pipe is more uniform through the flow equalizing groove arranged on the partition sheet, and the performance of the radiator is improved. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 It is the whole structure schematic diagram of the utility model;
[0013] Figure 2 It is the whole structure schematic diagram of the utility model removing the cooling liquid into collecting pipe box body side plate structure;
[0014] Figure 3 It is the cooling liquid into collecting pipe box body structure schematic diagram of the utility model;
[0015] Figure 4 It is the partition sheet structure schematic diagram of the utility model. DETAILED DESCRIPTION
[0016] The following is the specific embodiment of the utility model and the technical scheme of the utility model is further described in combination with the drawings, but the utility model is not limited to these embodiments.
[0017] EMBODIMENT
[0018] As Figures 1-4 shown, a high-pressure-resistant CPU radiator, comprising upper end plate 1 and lower end plate 5, upper end plate 1 and lower end plate 5 two ends are respectively provided with cooling liquid into collecting pipe box body 3 and cold area liquid out collecting pipe box body 10 connected with it, upper end plate 1, lower end plate 5, cooling liquid into collecting pipe box body 3 and cold area liquid out collecting pipe box body 10 are arranged in the radiator box body and are provided with multiple flat tubes 6 and multiple fins 7.
[0019] In the embodiment, the both sides of upper end plate 1 and lower end plate 5 are provided with fan mounting plate fixedly connected with it, and multiple fan mounting hole positions 8 are symmetrically arranged on the fan mounting plate, and the fan is connected with the radiator box body through multiple mounting holes to carry out heat dissipation.
[0020] The upper end of cold area liquid out collecting pipe box body 10 is provided with cooling liquid outlet pipe 9 connected with it, and the upper end of cooling liquid into collecting pipe box body 3 is provided with cooling liquid inlet pipe 2 connected with it, and the cooling liquid enters the flat tube through two pipe lines to realize the heat dissipation function.
[0021] The cooling liquid inlet header box 3 and the cooling liquid outlet header box 10 are internally provided with a plurality of equidistantly arranged partitions 4.
[0022] The plurality of partitions are provided with partition notches 12 at both ends.
[0023] The cooling liquid inlet header box 3 and the cooling liquid outlet header box 10 are provided with flat tube clamping notches 11 on the side close to the plurality of flat tubes 6.
[0024] The radiator is provided with a plurality of flat tubes arranged in parallel, heat dissipation fins arranged between the flat tubes, cooling liquid inlet and outlet headers arranged on both sides of the flat tubes, clamping notches of the cooling liquid inlet and outlet headers into which the flat tubes are inserted, upper and lower end plates arranged at both ends of the flat tubes, three fan fixing holes arranged on the upper and lower end plates for fixing the fans, a plurality of parallel partitions arranged in the cooling liquid inlet and outlet headers, and a cooling liquid inlet pipe and a cooling liquid outlet pipe arranged at the front ends of the cooling liquid inlet and outlet headers.
[0025] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, should be included in the scope of the present application.
Claims
1. A high pressure capable CPU heat spreader, characterized by: The application relates to a radiator box body which comprises an upper end plate (1) and a lower end plate (5), the upper end plate (1) and the lower end plate (5) are respectively provided with a cooling liquid inlet manifold box body (3) and a cooling liquid outlet manifold box body (10) connected therewith, and the upper end plate (1), the lower end plate (5), the cooling liquid inlet manifold box body (3) and the cooling liquid outlet manifold box body (10) are provided with a plurality of flat tubes (6) and a plurality of fins (7) in the radiator box body.
2. The high-pressure-capability CPU heat spreader of claim 1, wherein: The upper end plate (1) and the lower end plate (5) are respectively provided with a fan mounting plate fixedly connected therewith, and a plurality of fan mounting hole positions (8) are symmetrically arranged on the fan mounting plates.
3. The high-pressure-capability CPU heat spreader of claim 1, wherein: The cooling liquid outlet manifold box body (10) is provided with a cooling liquid outlet pipe (9) connected therewith at the upper end, and the cooling liquid inlet manifold box body (3) is provided with a cooling liquid inlet pipe (2) connected therewith at the upper end.
4. The high-capacity CPU heat spreader of claim 1, wherein: The cooling liquid inlet manifold box body (3) and the cooling liquid outlet manifold box body (10) are respectively provided with a plurality of spacer plates (4) arranged at equal intervals.
5. The high-pressure-capability CPU heat spreader of claim 4, wherein: The spacer plates are respectively provided with spacer slot openings (12) at the two ends.
6. The high-capacity CPU heat spreader of claim 1, wherein: The cooling liquid inlet manifold box body (3) and the cooling liquid outlet manifold box body (10) are respectively provided with flat tube clamping grooves (11) on the sides close to the plurality of flat tubes (6).