Circuit board assembly and electronic equipment

By embedding support components in the circuit board assembly to adjust the adhesive layer thickness, the problem of unstable chip warpage was solved, thereby improving stability and adhesion while reducing manufacturing costs.

CN223816289UActive Publication Date: 2026-01-20NANCHANG OFILM HUAGUANG TECH CO LTD
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Patent Information

Application Number
CN202423235858.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2026-01-20
Estimated Expiration
2034-12-26

AI Technical Summary

Technical Problem

In existing technologies, the uncertainty during adhesive curing leads to unstable chip warpage, affecting the chip's fixation effect.

Method used

A support component is embedded in the first adhesive layer, making the thickness of the first adhesive layer along the direction from the circuit board to the chip greater than the thickness of the second adhesive layer along the same direction from the circuit board to the chip. This forms a structure that adjusts the warpage in an oriented manner. The design of the support component reduces the space occupied by the adhesive layer to ensure adhesion.

Benefits of technology

It improves chip warpage stability, enhances chip-to-circuit board adhesion, reduces adhesive overflow, improves appearance quality, and reduces manufacturing costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of circuit boards, and specifically provides a circuit board assembly comprising a circuit board; the chip is electrically connected with the circuit board and is provided with a convex part and a concave part which are connected; the first adhesive layer is arranged between the lug boss and the circuit board and is respectively connected with the lug boss and the circuit board; the second adhesive layer is arranged between the concave part and the circuit board and is respectively connected with the concave part and the circuit board; and the supporting piece is embedded in the first adhesive layer, so that the thickness of the first adhesive layer in the direction of pointing to the chip along the circuit board is greater than that of the second adhesive layer in the direction of pointing to the chip along the circuit board. In the circuit board assembly, the supporting piece embedded in the first adhesive layer enables the thickness of the first adhesive layer in the direction of pointing to the chip along the circuit board to be greater than the thickness of the second adhesive layer in the direction of pointing to the chip along the circuit board, so that the warping degree of the chip after being fixed by the first adhesive layer and the second adhesive layer can be directionally adjusted; and the stability of the chip warping degree can be improved. The utility model further provides electronic equipment comprising the circuit board assembly.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit boards, in particular to a circuit board assembly and an electronic device. BACKGROUND

[0002] In the process of circuit board and chip packaging in electronic devices, the circuit board and the chip are usually bonded by glue. However, due to the uncertainty of the curing force and direction of the glue, the warpage of the chip cannot be controlled, resulting in unstable warpage of the chip. CONTENT OF THE UTILITY MODEL

[0003] In view of the above, it is necessary to provide a circuit board assembly and an electronic device to improve the stability of the warpage of the chip.

[0004] The present application provides a circuit board assembly, comprising:

[0005] a circuit board;

[0006] a chip electrically connected to the circuit board and provided with a connected protruding portion and a recessed portion;

[0007] a first glue layer arranged between the protruding portion and the circuit board and connected to the protruding portion and the circuit board respectively;

[0008] a second glue layer arranged between the recessed portion and the circuit board and connected to the recessed portion and the circuit board respectively;

[0009] a support member embedded in the first glue layer, so that the thickness of the first glue layer along the direction of the circuit board pointing to the chip is greater than the thickness of the second glue layer along the direction of the circuit board pointing to the chip.

[0010] In the above circuit board assembly, the first glue layer is arranged between the protruding portion and the circuit board, the second glue layer is arranged between the recessed portion and the circuit board, and the support member embedded in the first glue layer makes the thickness of the first glue layer along the direction of the circuit board pointing to the chip greater than the thickness of the second glue layer along the direction of the circuit board pointing to the chip, so as to adjust the warpage of the chip fixed by the first glue layer and the second glue layer in a directional manner, which is conducive to improving the stability of the warpage of the chip.

[0011] In some embodiments, the cross-sectional area of the support member gradually decreases from the middle of the support member to the end of the support member close to the chip, and the cross-sectional area of the support member gradually decreases from the middle of the support member to the end of the support member away from the chip.

[0012] Therefore, the above arrangement makes the support member form a structure with large middle and small ends, which can not only support the chip, but also reduce the space occupied by the first glue layer to ensure that the first glue layer has sufficient bonding force for the chip and the circuit board.

[0013] In some embodiments, the support is a hollow structure.

[0014] Therefore, the support with the hollow structure can reduce the weight of the support, so as to realize the lightweight setting of the circuit board assembly.

[0015] In some embodiments, the support is a plurality of supports, and the plurality of supports are arranged at intervals along the circumference of the first adhesive layer.

[0016] Therefore, the plurality of supports can support the chip at multiple points to improve the stability of the position of the chip relative to the circuit board.

[0017] In some embodiments, the two ends of the support abut the chip and the circuit board, respectively.

[0018] Therefore, the two ends of the support abut the chip and the circuit board, respectively, which can reduce the movement of the chip relative to the circuit board when pressing the first adhesive layer, thereby improving the stability of the position of the chip relative to the circuit board.

[0019] In some embodiments, the distance between the support and the edge of the chip is greater than the width of the support in a direction parallel to the circuit board.

[0020] Therefore, through the above setting, a sufficient extension area can be formed between the edge of the chip and the support to avoid overflow of the first adhesive layer from the chip, thereby improving the appearance quality of the circuit board assembly.

[0021] In some embodiments, the first adhesive layer and the second adhesive layer are an integral structure.

[0022] Therefore, the first adhesive layer and the second adhesive layer with the integral structure can reduce the manufacturing cost of the circuit board assembly.

[0023] In some embodiments, the circuit board comprises:

[0024] a reinforcing body connected to the first adhesive layer and the second adhesive layer, respectively;

[0025] a body provided on the reinforcing body and arranged around the chip.

[0026] Therefore, the reinforcing body can increase the overall strength of the circuit board assembly, and the body arranged around the chip is conducive to the miniaturization of the circuit board assembly.

[0027] In some embodiments, the chip is at least one of a photosensitive chip, a pressure sensor chip, an inertial sensor chip, and a temperature sensor chip.

[0028] Therefore, by setting multiple types of chips, the circuit board assembly can realize different functions to be suitable for multiple types of electronic devices.

[0029] The application also provides an electronic device, comprising:

[0030] The circuit board assembly described above.

[0031] In the circuit board assembly of the electronic device described above, the first adhesive layer is arranged between the protruding part and the circuit board, the second adhesive layer is arranged between the recessed part and the circuit board, and the support arranged in the first adhesive layer makes the thickness of the first adhesive layer along the direction of the circuit board pointing to the chip greater than the thickness of the second adhesive layer along the direction of the circuit board pointing to the chip, so that the warpage of the chip after being fixed by the first adhesive layer and the second adhesive layer can be adjusted, and the stability of the warpage of the chip is improved, thereby improving the performance of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 FIG. 1 is a cross-sectional view of a circuit board assembly according to an embodiment of the application.

[0033] Figure 2 FIG. 2 is a top view of a part of the circuit board assembly according to the embodiment of the application.

[0034] Figure 3 FIG. 4 is a cross-sectional view of a circuit board assembly according to another embodiment of the application.

[0035] Figure 4 FIG. 5 is a top view of a part of the circuit board assembly according to the embodiment of the application.

[0036] Main element symbol explanation: circuit board assembly 100, circuit board 110, reinforcing body 111, body 112, chip 120, protruding part 121, recessed part 122, first adhesive layer 130, second adhesive layer 140, support 150. DETAILED DESCRIPTION

[0037] The embodiments of the application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the application, and cannot be understood as a limitation of the application.

[0038] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. In the description of the present application, it should be noted that the meaning of "multiple" is two or more than two, unless otherwise explicitly specified and limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0040] Embodiment one

[0041] Please refer to Figure 1 and Figure 2 The present embodiment provides a circuit board assembly 100, comprising a circuit board 110, a chip 120, a first adhesive layer 130, a second adhesive layer 140 and a support 150. The chip 120 is electrically connected to the circuit board 110 and is provided with a protruding portion 121 and a recessed portion 122 connected thereto, the first adhesive layer 130 is arranged between the protruding portion 121 and the circuit board 110 and is connected to the protruding portion 121 and the circuit board 110 respectively, the second adhesive layer 140 is arranged between the recessed portion 122 and the circuit board 110 and is connected to the recessed portion 122 and the circuit board 110 respectively, and the support 150 is embedded in the first adhesive layer 130, so that the thickness of the first adhesive layer 130 along the direction of the circuit board 110 pointing to the chip 120 is greater than the thickness of the second adhesive layer 140 along the direction of the circuit board 110 pointing to the chip 120. Exemplarily, the first adhesive layer 130 and the second adhesive layer 140 can both be light-transmitting structures.

[0042] In the above-mentioned circuit board assembly 100, the first adhesive layer 130 is arranged between the protruding portion 121 and the circuit board 110, the second adhesive layer 140 is arranged between the recessed portion 122 and the circuit board 110, and the support 150 embedded in the first adhesive layer 130 makes the thickness of the first adhesive layer 130 along the direction of the circuit board 110 pointing to the chip 120 greater than the thickness of the second adhesive layer 140 along the direction of the circuit board 110 pointing to the chip 120, so as to be able to adjust the warping degree of the chip 120 after being fixed by the first adhesive layer 130 and the second adhesive layer 140 in a directional manner, which is beneficial to improve the stability of the warping degree of the chip 120.

[0043] In the present embodiment, the chip 120 is substantially square in structure, and the protruding portion 121 is arranged around the recessed portion 122. Correspondingly, the first adhesive layer 130 is arranged around the second adhesive layer 140.

[0044] Please refer to Figure 2In the embodiment, the cross-sectional area of the support member 150 gradually decreases from the middle of the support member 150 to the end of the support member 150 close to the chip 120, and the cross-sectional area of the support member 150 gradually decreases from the middle of the support member 150 to the end of the support member 150 away from the chip 120. For example, the support member 150 can be a spherical shape, a conical spherical shape, or the like.

[0045] Therefore, the support member 150 forms a structure of large in the middle and small at both ends by the above arrangement, which can effectively support the chip 120 and reduce the space occupied by the first adhesive layer 130 to ensure that the first adhesive layer 130 has sufficient adhesion to the chip 120 and the circuit board 110.

[0046] In the embodiment, the support member 150 is a hollow structure.

[0047] Therefore, the support member 150 with a hollow structure can reduce the weight of the support member 150 to achieve lightweight of the circuit board assembly 100.

[0048] In the embodiment, the support member 150 is a plurality of support members 150 arranged at intervals along the circumference of the first adhesive layer 130.

[0049] Therefore, the plurality of support members 150 can support the chip 120 at multiple points to improve the stability of the position of the chip 120 relative to the circuit board 110.

[0050] In some embodiments, the two ends of the support member 150 respectively abut the chip 120 and the circuit board 110.

[0051] Therefore, the two ends of the support member 150 abut the chip 120 and the circuit board 110, respectively, which can reduce the movement of the chip 120 relative to the circuit board 110 when pressing the first adhesive layer 130, thereby improving the stability of the position of the chip 120 relative to the circuit board 110.

[0052] In the embodiment, the distance between the support member 150 and the edge of the chip 120 is greater than the width of the support member 150 in the direction parallel to the circuit board 110.

[0053] Therefore, by the above arrangement, a sufficient extension area can be formed between the edge of the chip 120 and the support member 150 to avoid the first adhesive layer 130 overflowing the chip 120, thereby improving the appearance quality of the circuit board assembly 100.

[0054] In the embodiment, the first adhesive layer 130 and the second adhesive layer 140 are integrated structures. For example, the first adhesive layer 130 and the second adhesive layer 140 can be drawn by the same adhesive dispenser at the corresponding positions of the circuit board 110, and after drawing, the support 150 is arranged between the protruding portion 121 and the circuit board 110. The adhesive between the protruding portion 121 and the circuit board 110 forms the first adhesive layer 130 after curing, and the adhesive between the recessed portion 122 and the circuit board 110 forms the second adhesive layer 140 after curing.

[0055] Therefore, the integrated first adhesive layer 130 and the second adhesive layer 140 can reduce the manufacturing cost of the circuit board assembly 100.

[0056] Referring to Figure 1 and Figure 2 In the embodiment, the circuit board 110 includes a reinforcing body 111 and a body 112. The reinforcing body 111 is connected to the first adhesive layer 130 and the second adhesive layer 140, respectively, and the body 112 is arranged around the chip 120 and arranged on the reinforcing body 111. For example, the reinforcing body 111 can be a steel sheet, and the body 112 can be a flexible circuit board.

[0057] Therefore, the reinforcing body 111 can increase the overall strength of the circuit board assembly 100, and the body 112 arranged around the chip 120 is conducive to the miniaturization of the circuit board assembly 100.

[0058] In the embodiment, the chip 120 is at least one of a photosensitive chip, a pressure sensor chip, an inertial sensor chip, and a temperature sensor chip.

[0059] Therefore, by arranging multiple types of chips 120, the circuit board assembly 100 can achieve different functions to be suitable for multiple types of electronic devices.

[0060] Embodiment Two

[0061] Referring to Figure 3 and Figure 4 Compared with the first embodiment, the circuit board assembly 100 in the embodiment also includes a circuit board 110, a chip 120, a first adhesive layer 130, a second adhesive layer 140, and a support 150, and the chip 120 is also substantially square. The difference is that in the embodiment, the recessed portion 122 is arranged around the protruding portion 121, and correspondingly, the second adhesive layer 140 is arranged around the first adhesive layer 130.

[0062] Embodiment Three

[0063] The embodiment provides an electronic device (not shown), which includes any one of the circuit board assemblies 100 in the first embodiment and the second embodiment. The electronic device can be a mobile phone, a tablet computer, etc.

[0064] In the circuit board assembly 100 of the electronic device, the first adhesive layer 130 is arranged between the protruding portion 121 and the circuit board 110, the second adhesive layer 140 is arranged between the recessed portion 122 and the circuit board 110, and the support 150 embedded in the first adhesive layer 130 makes the thickness of the first adhesive layer 130 along the direction of the circuit board 110 pointing to the chip 120 greater than the thickness of the second adhesive layer 140 along the direction of the circuit board 110 pointing to the chip 120, so that the warping degree of the chip 120 after being fixed by the first adhesive layer 130 and the second adhesive layer 140 can be adjusted, and the stability of the warping degree of the chip 120 is improved, thereby improving the performance of the electronic device.

[0065] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to include all changes falling within the meaning and range of equivalents of the claims.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application rather than limit the present application, and although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A circuit board assembly, characterized by The circuit board comprises: a circuit board; a chip electrically connected to the circuit board and provided with a connecting protrusion and a connecting recess; a first adhesive layer arranged between the protrusion and the circuit board and connected to the protrusion and the circuit board respectively; a second adhesive layer arranged between the recess and the circuit board and connected to the recess and the circuit board respectively; a support member embedded in the first adhesive layer, so that the thickness of the first adhesive layer in the direction of the circuit board pointing to the chip is greater than the thickness of the second adhesive layer in the direction of the circuit board pointing to the chip.

2. The circuit board assembly of claim 1, wherein, The cross-sectional area of the support member gradually decreases from the middle of the support member to the end of the support member close to the chip, and the cross-sectional area of the support member gradually decreases from the middle of the support member to the end of the support member away from the chip.

3. The circuit board assembly of claim 1, wherein, The support member is a hollow structure.

4. The circuit board assembly of claim 1, wherein, The support member is a plurality of support members, and the plurality of support members are arranged in a circumferential direction of the first adhesive layer.

5. The circuit board assembly of claim 1, wherein, The two ends of the support member respectively abut against the chip and the circuit board.

6. The circuit board assembly of claim 1, wherein, The distance between the support member and the edge of the chip is greater than the width of the support member in the direction parallel to the circuit board.

7. The circuit board assembly of claim 1, wherein, The first adhesive layer and the second adhesive layer are an integral structure.

8. The circuit board assembly of claim 1, wherein, The circuit board comprises: a reinforcing body connected to the first adhesive layer and the second adhesive layer respectively; a main body arranged on the reinforcing body and surrounding the chip.

9. The circuit board assembly of claim 1, wherein, The chip is at least one of a photosensitive chip, a pressure sensor chip, an inertial sensor chip, and a temperature sensor chip.

10. An electronic device, comprising: The circuit board assembly comprises: the circuit board assembly according to any one of claims 1 to 9.