Stacking device for shielding circuit board processing

Abstract

The utility model discloses a stacking device for shielding circuit board processing, which comprises a bearing plate, the top of the bearing plate is provided with an alignment assembly, the alignment assembly comprises a fixed plate placed on the outer wall of the top of the bearing plate, and the top of the bearing plate is provided with a vertically arranged movable plate. The outer wall of one side of the movable plate is attached to the inner wall of one side of the fixed plate, the movable plate and the extending part of the fixed plate are symmetrically arranged, the extending part of the fixed plate and the end of the movable plate are both arranged in an arc shape, one side of the outer wall of the top of the bearing plate is provided with one or more abutting columns, and the abutting columns and the fixed plate are oppositely arranged. According to the circuit board alignment device, through the arrangement of the alignment assembly, a stacked multi-layer structure can be rapidly corrected, the multi-layer structure can be rapidly aligned, the machining efficiency can be improved, corresponding adjustment can be conducted according to the specification of a circuit board, and the adaptability of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board processing technical field, concretely for a kind of for shielding circuit board processing layering device. BACKGROUND

[0002] Laminated shielding circuit board is usually composed of multiple layers of insulating medium and conductive copper foil, and in the multi-layer structure, a dedicated shielding layer such as a ground plane layer and a power plane layer is usually provided. These shielding layers can effectively absorb and reflect electromagnetic interference, protecting the internal signal layer from external interference. For such a multi-layer structure circuit board, the layering device plays a more important role in the production of the circuit board.

[0003] According to the search, the utility model with patent announcement number CN214481451U discloses a PCB layering structure and a circuit board. The PCB layering structure includes a first substrate and a second substrate that are layered. The analog signal traces and the digital signal traces are arranged in different layers of the first substrate, and the power signal traces are arranged in the second substrate. The analog signal traces, the digital signal traces, and the power signal traces are signal-isolated from each other by a ground layer.

[0004] As mentioned above, the circuit board composed of multiple layers needs to be aligned and then pressed to tightly combine. In the current processing process, each layer structure is aligned in turn and then further operated. The operation is relatively cumbersome. Moreover, due to different requirements, the size of the circuit board also varies, and therefore, many positioning molds need to be prepared, which is inconvenient to use and has room for improvement. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a layering device for shielding circuit board processing to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a layering device for shielding circuit board processing, including a receiving plate, the receiving plate top is equipped with alignment assembly, the alignment assembly includes the fixed plate placed on the receiving plate top outer wall, the receiving plate top is placed with the vertically arranged moving plate, the moving plate one side outer wall and the fixed plate one side inner wall are in close contact, the moving plate and the fixed plate extension part are symmetrically arranged, and the fixed plate extension part and the moving plate end part are both arranged in an arc shape, one or more abutment columns are arranged on one side of the receiving plate top outer wall, and one or more abutment columns are arranged opposite to the fixed plate.

[0007] As a further preferred embodiment of the present technical solution, a horizontal screw rod is rotatably connected inside the fixed plate, a moving seat is threadedly sleeved outside the screw rod, two horizontal limiting rods are fixedly connected inside the fixed plate, and the moving seat is slidably sleeved outside the two limiting rods.

[0008] The stacked multi-layer structure can be quickly corrected to be aligned faster, which is beneficial to improve the processing efficiency, and can be adjusted according to the specifications of the circuit board, which is beneficial to increase the adaptability of the device. The positions of the fixed plate and the moving plate are driven to move synchronously. If part of the structure is offset, it will be gradually guided to be parallel to the vertical part by the arc-shaped part of the moving plate. Then the multi-layer structure is pushed by the fixed plate to move as a whole until it contacts the abutting column. The multi-layer structure is completely corrected and aligned. When the specifications of the circuit board change, the screw rod is driven to rotate by the knob. The moving seat will displace along the horizontal direction under the cooperation of the screw rod drive and the limiting rod, and the position of the moving plate will also change, so that the production of circuit boards of other specifications can be adapted.

[0009] As a further preferred embodiment of the present technical solution, a preheating assembly is mounted on one side of the fixed plate, the preheating assembly comprises a heating cover fixedly connected to the outer wall of one side of the fixed plate, a hydraulic cylinder II is fixedly installed on one side of the outer wall of the top of the receiving plate, the hydraulic cylinder II is fixedly connected to the heating cover, and one or more than one gas outlet hole is formed in the outer wall of one side of the fixed plate, and the gas outlet hole is vertically arranged.

[0010] As a further preferred embodiment of the present technical solution, a baffle is slidably inserted into the heating cover, a connecting rod is slidably inserted into the outer wall of one end of the heating cover and arranged horizontally, and one end of the connecting rod is fixedly connected to the moving seat.

[0011] The external hot air blower is started, hot air flows into the space formed by the heating cover and the fixed plate through the inlet of the heating cover, and then flows towards the material through the plurality of gas outlet holes. The hot air can preheat the multi-layer material, and the adhesive or resin between the materials can be preliminarily heated to facilitate the subsequent pressing work. When the moving seat moves, the connecting rod will also be driven to move, and then the baffle will move synchronously with the connecting rod to avoid waste of hot air flowing outward.

[0012] As a further preferred embodiment of the present technical solution, a pressing assembly is mounted on the top of the receiving plate, and the pressing assembly is located at one end of the alignment assembly.

[0013] As a further preferred embodiment of the present technical solution, the pressing assembly comprises a support frame fixedly connected to one end of the outer wall of the top of the receiving plate, a hydraulic cylinder I is fixedly installed on the outer wall of the top of the support frame, a connecting flange is fixedly arranged on the hydraulic cylinder I, a pressing plate is detachably connected to the bottom of the connecting flange through bolts, and one or more than one electric heating tube is arranged in the pressing plate.

[0014] As a further preferred embodiment of the present technical solution, the thread angle of the external thread of the screw rod is smaller than the equivalent friction angle.

[0015] The utility model provides a kind of for shielding circuit board processing laminating device, with following beneficial effects:

[0016] (1) the utility model is quickly corrected by being set to alignment component, the multilayer structure stacked can be, it can be more quickly aligned, it is favorable to improve processing efficiency, and can be adjusted according to the specification of circuit board, increase the adaptability of device, the position of fixed plate and moving plate is driven synchronous movement, if there is partial structure position deviation, it will be gradually guided gradually with its vertical portion parallel by arc-shaped portion of moving plate, subsequently multilayer structure is pushed by fixed plate and moves integrally, until it contacts with abutting column, multilayer structure will be completely corrected and aligned, such as circuit board specification changes, by knob drive screw rod to rotate, moving seat will displace along horizontal direction under the cooperation of screw rod drive and limiting rod, and the position of moving plate will also change, to be able to adapt to the manufacture of other specifications circuit board.

[0017] (2) the utility model is preheated by being set to preheating component, start external air heater, hot airflow enters the space formed by heating cover and fixed plate through the inlet of heating cover, subsequently flows towards material direction through a plurality of gas outlets, hot airflow can preheat multilayer material, the adhesive or resin between each material can be preliminarily heated, to facilitate the subsequent pressing work, and connecting rod will also be driven to move when moving seat moves, subsequently baffle will move synchronously with connecting rod, avoid hot airflow to flow to outer layer and cause waste. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the overall first visual angle structure schematic diagram of the utility model;

[0019] Figure 2 It is the overall second visual angle structure schematic diagram of the utility model;

[0020] Figure 3 It is the Figure 1 Amplification structure schematic diagram of place B in the utility model;

[0021] Figure 4 It is the Figure 2 Amplification structure schematic diagram of place A in the utility model;

[0022] In the drawing: 1, receiving plate; 2, alignment component; 3, pressing assembly; 4, preheating component; 201, fixed plate; 202, screw rod; 203, limiting rod; 204, moving seat; 205, moving plate; 206, abutting column; 301, support frame; 302, hydraulic cylinder one; 303, connecting flange; 304, pressing plate; 401, heating cover; 402, gas outlet; 403, hydraulic cylinder two; 404, connecting rod; 405, baffle. DETAILED DESCRIPTION

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] This utility model provides a technical solution: such as Figure 2 and Figure 4 As shown in this embodiment, a device for processing and stacking shielded circuit boards includes a receiving plate 1. An alignment component 2 is installed on the top of the receiving plate 1. The alignment component 2 includes a fixed plate 201 placed on the outer wall of the top of the receiving plate 1. A vertically arranged movable plate 205 is placed on the top of the receiving plate 1. One outer wall of the movable plate 205 is in contact with one inner wall of the fixed plate 201. Under the restriction of the fixed plate 201, it can be ensured that the movable plate 205 will not flip arbitrarily. The movable plate 205 and the extended portion of the fixed plate 201 are symmetrically arranged, and the extended portion of the fixed plate 201 and the end of the movable plate 205 are both arc-shaped. One or more abutment posts 206 are provided on one side of the outer wall of the top of the receiving plate 1. One or more abutment posts 206 are arranged opposite to the fixed plate 201.

[0025] The fixed plate 201 is rotatably connected to a horizontally arranged lead screw 202. The lead screw 202 is threaded with a movable seat 204. The fixed plate 201 is fixedly connected to two horizontally arranged limit rods 203. The movable seat 204 is slidably sleeved on the outside of the two limit rods 203.

[0026] The fixed plate 201 and the movable plate 205 are moved synchronously. If some structural positions are misaligned, the curved part of the movable plate 205 will gradually guide it to become parallel with its vertical part. Then, the multi-layer structure is pushed by the fixed plate 201 to move as a whole until it contacts the abutment post 206. The multi-layer structure will then be completely corrected and aligned. If the circuit board specifications change, the screw 202 is rotated by the knob. The movable seat 204 will be displaced in the horizontal direction under the drive of the screw 202 and the cooperation of the limit rod 203. As a result, the position of the movable plate 205 will also change, so as to adapt to the production of circuit boards of other specifications.

[0027] like Figure 2 and Figure 4 As shown, a preheating component 4 is installed on one side of the fixed plate 201. The preheating component 4 includes a heating cover 401 fixedly connected to the outer wall of one side of the fixed plate 201. A hydraulic cylinder 403 is fixedly installed on one side of the top outer wall of the receiving plate 1. The hydraulic cylinder 403 is fixedly connected to the heating cover 401. One or more air vents 402 are evenly distributed on one side of the outer wall of the fixed plate 201. All air vents 402 are vertically arranged.

[0028] The baffle 405 is slidingly inserted into the heating cover 401, and the connecting rod 404 horizontally arranged is slidingly inserted into the outer wall of one end of the heating cover 401, and one end of the connecting rod 404 is fixedly connected with the moving seat 204.

[0029] The external hot air blower is started, the hot air flow enters the space formed by the heating cover 401 and the fixed plate 201 through the inlet of the heating cover 401, and then flows towards the material through the multiple air outlets 402, so that the multiple layers of materials are preheated, and the adhesive or resin between the materials is preliminarily heated, so that the subsequent pressing work is facilitated.

[0030] As shown in Figure 1 and Figure 3 The pressing assembly 3 is installed at the top of the receiving plate 1, and the pressing assembly 3 is located at one end of the alignment assembly 2.

[0031] The pressing assembly 3 comprises a support frame 301 fixedly connected to one end of the outer wall at the top of the receiving plate 1, a hydraulic cylinder one 302 fixedly installed at the top of the outer wall of the support frame 301, a connecting flange 303 coaxially fixed to the hydraulic cylinder one 302, and a pressing plate 304 detachably connected to the bottom of the connecting flange 303 through bolts, and more than one electric heating tube is arranged in the pressing plate 304.

[0032] The hydraulic cylinder one 302 at the top of the support frame 301 is started, the hydraulic cylinder one 302 drives the pressing plate 304 to move downward through the connecting flange 303, and then the pressing plate 304 presses and heats the aligned materials, until the adhesive or resin is completely cured, and the pressing plate 304 is replaced conveniently, and the corresponding size can be replaced when needed, which is beneficial to increase the adaptability of the device.

[0033] As shown in Figure 4 The thread angle of the external thread of the lead screw 202 is smaller than the equivalent friction angle, so that the lead screw 202 has self-locking property, and the positions of the moving seat 204 and the moving plate 205 connected with the lead screw 202 will not be changed at will.

[0034] The utility model provides a kind of for shielding circuit board processing layering device, specific working principle as follows:

[0035] When the device works, the multilayer structure is placed between the fixed plate 201 and the moving plate 205 in sequence, then the hydraulic cylinder two 403 at the top of the receiving plate 1 is started, then the positions of the fixed plate 201 and the moving plate 205 are driven to move synchronously, if part of the structure position deviates, it will be gradually guided by the arc-shaped part of the moving plate 205 to gradually parallel to the vertical part, then the multilayer structure is pushed by the fixed plate 201 to move as a whole, until it contacts the abutting column 206, the multilayer structure will be completely corrected and aligned, if the circuit board specification changes, the screw rod 202 is driven to rotate by the knob, the moving seat 204 will displace along the horizontal direction under the cooperation of the screw rod 202 driving and the limiting rod 203, and then the position of the moving plate 205 will also change, so that other specifications of circuit board can be made, during which the external air heater is started, the hot air flow enters the space formed by the heating cover 401 and the fixed plate 201 through the inlet of the heating cover 401, then flows towards the material direction through the plurality of air outlets 402, the hot air flow can preheat the multilayer material, the adhesive or resin between the materials can be preliminarily heated, so as to facilitate the subsequent pressing work, and when the moving seat 204 moves, the connecting rod 404 will also be driven to move, then the baffle 405 will move synchronously with the connecting rod 404, to avoid waste of the hot air flow flowing outward, finally the hydraulic cylinder one 302 at the top of the support frame 301 is started, the hydraulic cylinder one 302 drives the pressing plate 304 to move downward through the connecting flange 303, then the pressing plate 304 will press and heat the aligned material until the adhesive or resin is completely cured, the processing is completed, and the pressing plate 304 is more convenient to replace, corresponding size can be replaced when needed, which is beneficial to increase the adaptability of the device.

[0036] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A shielding circuit board processing laminating apparatus comprising a receiving plate (1), characterized in that: The alignment assembly (2) is arranged on the top of the receiving plate (1), the alignment assembly (2) comprises a fixed plate (201) arranged on the outer wall of the top of the receiving plate (1), a moving plate (205) is arranged on the top of the receiving plate (1) and arranged vertically, the outer wall of one side of the moving plate (205) is attached to the inner wall of one side of the fixed plate (201), the moving plate (205) and the fixed plate (201) are arranged symmetrically, the end of the fixed plate (201) and the end of the moving plate (205) are arranged in an arc shape, and more than one abutting column (206) is arranged on one side of the outer wall of the top of the receiving plate (1), and more than one abutting column (206) is arranged opposite to the fixed plate (201).

2. The apparatus according to claim 1, wherein: The fixed plate (201) is rotatably connected with a horizontally arranged lead screw (202), the outer thread of the lead screw (202) is sleeved with a moving seat (204), and the inner wall of the fixed plate (201) is fixedly connected with two horizontally arranged limiting rods (203), and the moving seat (204) is slidably sleeved on the outer wall of the two limiting rods (203).

3. The apparatus according to claim 1, wherein: The fixed plate (201) is rotatably connected with a horizontally arranged lead screw (202), the outer thread of the lead screw (202) is sleeved with a moving seat (204), and the inner wall of the fixed plate (201) is fixedly connected with two horizontally arranged limiting rods (203), and the moving seat (204) is slidably sleeved on the outer wall of the two limiting rods (203).

4. The apparatus according to claim 3, wherein: The fixed plate (201) is rotatably connected with a horizontally arranged lead screw (202), the outer thread of the lead screw (202) is sleeved with a moving seat (204), and the inner wall of the fixed plate (201) is fixedly connected with two horizontally arranged limiting rods (203), and the moving seat (204) is slidably sleeved on the outer wall of the two limiting rods (203).

5. The apparatus according to claim 1, wherein: the first and second conveyors are arranged to convey the circuit board in a direction perpendicular to the direction of conveyance of the circuit board by the first and second conveyors. The fixed plate (201) is rotatably connected with a horizontally arranged lead screw (202), the outer thread of the lead screw (202) is sleeved with a moving seat (204), and the inner wall of the fixed plate (201) is fixedly connected with two horizontally arranged limiting rods (203), and the moving seat (204) is slidably sleeved on the outer wall of the two limiting rods (203).

6. The apparatus according to claim 5, wherein: The fixed plate (201) is rotatably connected with a horizontally arranged lead screw (202), the outer thread of the lead screw (202) is sleeved with a moving seat (204), and the inner wall of the fixed plate (201) is fixedly connected with two horizontally arranged limiting rods (203), and the moving seat (204) is slidably sleeved on the outer wall of the two limiting rods (203).

7. The apparatus according to claim 2, wherein: The thread angle of the outer thread of the lead screw (202) is smaller than the equivalent friction angle.

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