Wafer processing device

Abstract

The utility model provides a wafer processing device, and the device comprises a scrubbing mechanism which comprises a brush head used for scrubbing a wafer; the detection mechanism is arranged on one side of the wafer in the radial direction of the wafer and comprises a conduction structure and a sensor connected with the conduction structure, the conduction structure is provided with a conduction face, when the brush head abuts against the conduction face, the conduction structure transmits the pressure applied by the brush head to the sensor, and the conduction face is parallel to the upper surface of the wafer and keeps a preset distance with the upper surface of the wafer. The conduction surface of the conduction structure and the upper surface of the wafer are arranged in parallel, so that the balance degree of the conduction structure is improved, the posture of the brush head abutting against the wafer can be completely simulated when the brush head reaches the conduction surface, pressure transmission is more accurate, and the precision of pressure detection is improved; the sensor measurement error caused by the angle deviation between the brush head and the conduction surface is reduced, and the accuracy of the pressure detection result of the brush head is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, and in particular to a wafer processing device. BACKGROUND

[0002] The processing of wafers mainly includes steps such as polishing, cleaning, thin film deposition, etching, doping, and packaging. In the processing step of wafer cleaning, by precisely controlling the contact between the brush head and the wafer surface, using the rotation of the brush head and the physical action of the bristles, the contaminants such as particles and organic matter on the wafer surface are effectively removed.

[0003] In the existing wafer cleaning process, the brush head applies a certain pressure to the wafer surface for brushing, but over time, the brush head may change the applied pressure due to wear or other reasons, and this change in pressure will affect the cleaning effect of the wafer, and even cause damage to the wafer. Therefore, it is necessary to regularly detect the pressure of the brush head to ensure that the pressure value applied to the wafer surface meets the standard, thereby protecting the safety of the wafer and ensuring the cleaning quality. However, as time goes by, the mechanical parts in the pressure detection equipment will be fatigued and aged due to long-term use, resulting in insufficient stability and balance of the mechanical parts, and thus inaccurate pressure transmission, affecting the pressure measurement accuracy of the detection equipment. CONTENT OF THE INVENTION

[0004] The present application aims to solve the technical problems existing in the prior art. To this end, the present application provides a wafer processing device to solve the technical problem of poor pressure detection accuracy in the prior art.

[0005] To solve the above technical problems, the technical solution adopted by the present application is:

[0006] A wafer processing device, comprising:

[0007] A brushing mechanism comprising a brush head for brushing the wafer;

[0008] A detection mechanism arranged on one side of the wafer along the radial direction of the wafer, comprising a conduction structure and a sensor connected thereto, the conduction structure having a conduction surface, when the brush head contacts the conduction surface, the conduction structure transmits the pressure applied by the brush head to the sensor, wherein the conduction surface is parallel to the upper surface of the wafer and a predetermined distance is maintained therebetween.

[0009] Preferably, the wafer processing device further comprises:

[0010] The cleaning mechanism comprises a liquid supply assembly and a cleaning box body, the cleaning box body comprises an immersion cavity, the immersion cavity is provided with a cleaning liquid inlet, an overflow port and a cleaning liquid outlet, the liquid supply assembly is used for supplying liquid to the brush head in the immersion cavity through the cleaning liquid inlet to make the brush head, the overflow port is located below the cleaning liquid inlet in the height direction of the cleaning box body, and is used for discharging the cleaning liquid exceeding the preset liquid level, and the cleaning liquid outlet is located below the overflow port in the height direction of the cleaning box body, and is used for discharging all the cleaning liquid in the immersion cavity.

[0011] Preferably, the cleaning box body further comprises a top plate with a first opening and a bottom plate with a second opening, the top plate and the bottom plate define the immersion cavity, the immersion cavity is provided with the conductive structure, the first opening is located above the conductive surface for passing the brush head, and the second opening is used for passing one end of the conductive structure away from the conductive surface to connect with the sensor.

[0012] Preferably, in the height direction of the cleaning box body, the conductive surface is located below the plane where the cleaning liquid inlet is located and above the plane where the overflow port is located.

[0013] Preferably, the wafer processing device further comprises:

[0014] The displacement mechanism is connected with the brushing mechanism, is arranged on one side of the wafer, and comprises a first moving assembly and a second moving assembly, the first moving assembly comprises a first sliding rail and a first sliding table slidably connected to the first sliding rail, the second moving assembly comprises a second sliding rail and a second sliding table slidably connected to the second sliding rail, and the second sliding rail is arranged on the first sliding table, wherein the sliding direction of the first sliding table is perpendicular to the sliding direction of the second sliding table.

[0015] Preferably, the wafer processing device further comprises:

[0016] The driving mechanism is arranged on one side of the displacement mechanism, and comprises a first driving assembly and a second driving assembly, the first driving assembly is connected with the first moving assembly to drive the first sliding table to move, and the second driving assembly is connected with the second moving assembly to drive the second sliding table to move.

[0017] Preferably, the brushing mechanism further comprises a mounting seat, a rotating assembly arranged on the mounting seat, and a rotating rod connected between the rotating assembly and the brush head, and the rotating assembly is used for driving the brush head to rotate through the rotating rod.

[0018] Preferably, the wafer processing device further comprises:

[0019] The connecting structure has a first part and a second part perpendicular to each other, the first part is connected with the second slide, and the second part is connected with the mounting seat.

[0020] Preferably, the wafer processing device further comprises:

[0021] The carrying mechanism comprises a carrying part for carrying the wafer and a protection part, one end of the protection part is surrounded by the carrying part, and the other end can extend and contract relative to the carrying part, and is used for covering the wafer.

[0022] Preferably, the conducting structure comprises a conducting block and a conducting rod connected with the conducting block, one side of the conducting block facing the wafer is the conducting surface, and one end of the conducting rod away from the conducting block is connected with the sensor.

[0023] According to the specific embodiments provided in the present application, the following technical effects are disclosed:

[0024] In the technical scheme of the present application, a wafer processing device is provided, which comprises: a brushing mechanism comprising a brush head for brushing the wafer; a detection mechanism arranged on one side of the wafer along the radial direction of the wafer, comprising a conducting structure and a sensor connected therewith, the conducting structure has a conducting surface, when the brush head contacts the conducting surface, the conducting structure transmits the pressure applied by the brush head to the sensor, wherein the conducting surface is parallel to the upper surface of the wafer and a predetermined distance is maintained therebetween. By arranging the conducting surface of the conducting structure and the upper surface of the wafer in parallel, the balance of the conducting structure is improved, so that when the brush head reaches the conducting surface, the posture of the brush head when it contacts the wafer can be completely simulated, the pressure transmission is more accurate, the precision of pressure detection is improved, the measurement error of the sensor caused by the angle deviation between the brush head and the conducting surface is reduced, and the accuracy of the pressure detection result of the brush head is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is a whole schematic view of the wafer processing device provided by the embodiments of the present application;

[0027] Figure 2 is one of the side view schematic views of the wafer processing device provided by the embodiments of the present application;

[0028] Figure 3 is the second side view schematic view of the wafer processing device provided by the embodiments of the present application;

[0029] Figure 4 FIG. 3 is a side view of a wafer processing device according to an embodiment of the present application;

[0030] Figure 5 FIG. 4 is a top view of a wafer processing device according to an embodiment of the present application;

[0031] Figure 6 FIG. 5 is an enlarged view of a conduction structure according to an embodiment of the present application.

[0032] Reference signs:

[0033] 10, scrubbing mechanism; 20, wafer; 30, detection mechanism; 40, cleaning box; 50, displacement mechanism; 60, connecting structure; 100, brush head; 110, mounting seat; 120, rotating assembly; 130, rotating rod; 300, conduction structure; 310, sensor; 400, cleaning liquid inlet; 410, overflow port; 420, cleaning liquid outlet; 430, top plate; 440, bottom plate; 500, first sliding rail; 510, first sliding table; 520, second sliding rail; 530, second sliding table; 600, first part; 610, second part; 3000, conduction surface; 3100, conduction block; 3200, conduction rod; 4300, first opening. DETAILED DESCRIPTION

[0034] In order to make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0035] As described in the background, in the existing wafer cleaning process, the brush head applies a certain pressure to the wafer surface for scrubbing. However, as time goes by, the brush head may change the applied pressure due to wear or other reasons. Such a change in pressure will affect the cleaning effect of the wafer, and even cause damage to the wafer. Therefore, it is necessary to regularly detect the pressure of the brush head to ensure that the pressure value applied to the wafer surface meets the standard, thereby protecting the safety of the wafer and ensuring the cleaning quality. However, as time goes by, the mechanical parts in the pressure detection device will be fatigued and aged due to long-term use, resulting in insufficient stability and balance of the mechanical parts, and further leading to inaccurate pressure transmission and affecting the pressure measurement accuracy of the detection device.

[0036] Therefore, the present application provides a wafer processing device to solve the technical problem of poor pressure detection accuracy in the prior art

[0037] Reference Figures 1 to 5 The wafer processing device of the present application generally comprises: a brushing mechanism 10 for cleaning a wafer 20; a detection mechanism 30 for detecting the pressure value of a brush head 100; a cleaning mechanism for cleaning the brush head 100; and a displacement mechanism 50 for moving the brushing mechanism 10. During the operation of the device, first, the brushing mechanism 10 uses the brush head 100 to perform a brushing operation on the wafer 20. After the brushing operation is completed, the detection mechanism 30 detects the pressure of the brush head 100 to ensure that the pressure value applied by the brush head 100 to the wafer 20 meets the standard. After the detection is completed, the cleaning mechanism cleans the brush head 100 so as to perform the next wafer cleaning operation.

[0038] The wafer processing device of the present application will be specifically analyzed below in combination with the accompanying drawings of the specification. Referring to Figures 1 to 5 The wafer processing device comprises: a brushing mechanism 10 comprising a brush head 100 for brushing a wafer 20; a detection mechanism 30 arranged on one side of the wafer 20 along the radial direction of the wafer 20, comprising a conduction structure 300 and a sensor 310 connected thereto, the conduction structure 300 has a conduction surface 3000, when the brush head 100 contacts the conduction surface 3000, the conduction structure 300 transmits the pressure applied by the brush head 100 to the sensor 310, wherein the conduction surface 3000 is parallel to the upper surface of the wafer 20 and a predetermined distance is maintained therebetween.

[0039] The brush head 100 is always located above the wafer 20, and the brush head 100 is always parallel to the upper surface of the wafer 20 to perform a brushing operation on the upper surface of the wafer 20. The detection mechanism 30 is arranged on one side of the wafer 20, which shortens the moving distance of the brush head 100 between the detection mechanism 30 and the wafer 20, so that the brush head 100 can quickly move to the detection mechanism 30 for detection operation after the brushing operation is completed, thereby improving the work efficiency. The conduction surface 3000 of the conduction structure 300 is arranged in parallel to the upper surface of the wafer 20, which improves the balance of the conduction structure 300. When the brush head 100 moves to the conduction surface 3000, the posture of the brush head 100 when contacting the wafer 20 can be completely simulated, so that the pressure applied by the brush head 100 is accurate, the pressure transmission of the conduction structure 300 is also more accurate, the precision of the pressure detection is improved, and at the same time, the measurement error of the sensor 310 caused by the angle deviation between the brush head 100 and the conduction surface 3000 is reduced, thereby ensuring the accuracy of the pressure detection result of the brush head 100.

[0040] In one embodiment of the operation of the wafer processing device, referring to Figure 5The displacement mechanism 50 drives the brush head 100 to move to a preset height above the wafer 20 to brush the wafer 20 with an initial pressure value. After the brushing is completed, the brush head 100 is driven to move to a preset height above the conductive surface 3000 to abut against the conductive surface. At this time, the control module in the device acquires the current pressure value of the brush head 100 measured by the sensor 310, and checks the current pressure value and the initial pressure value to determine whether the current pressure value and the initial pressure value meet a preset condition. If yes, it indicates that the height of the brush head 100 when cleaning the wafer 20 is normal, and the pressure applied is moderate, which is maintained in the new brushing operation. If not, it indicates that the height of the brush head 100 when cleaning the wafer 20 is deviated. If the height is too high, the pressure applied by the brush head 100 is small, and the wafer 20 cannot be cleaned completely. If the height is too low, the pressure applied by the brush head 100 is large, and there is a risk of extrusion damage to the wafer 20. Therefore, the height of the brush head 100 needs to be adjusted until the pressure value measured after the adjustment and the initial pressure value meet the preset condition, and the adjusted height is maintained in the new brushing operation. In this way, the process can not only record the effective pressure data and the corresponding height data in production in real time, correct the process data in real time, and improve the production efficiency, but also set the parameters (such as the brushing height) in advance according to the brushing requirements of the wafer 20, flexibly adjust the parameters, provide an effective working period for the brush head 100, and ensure the quality and running stability of wafer processing.

[0041] In a specific embodiment, as shown in Figure 2 , the preset distance is zero, that is, the conductive surface 3000 and the upper surface of the wafer 20 are coincident. In this way, the small movement error caused by the movement of the brush head 100 by a preset distance when abutting against the conductive surface 3000 is avoided. The movement error is caused by the accuracy limitation and friction of the transmission mechanism of the brush head. Since there is no movement error, the position and posture of the brush head 100 when abutting against the conductive surface 3000 can more accurately simulate the state during actual brushing of the wafer. Therefore, the sensor 310 can more accurately measure the pressure applied by the brush head 100, improve the accuracy of the pressure detection result, ensure that the brush head 100 can apply a standard pressure to the surface of the wafer 20 in the new brushing process, and thus protect the safety of the wafer 20 and ensure the cleaning quality.

[0042] Preferably, referring to Figure 2 and Figure 3 , the surface area of the brush head 100 is smaller than the area of the conductive surface 3000, and the brush head 100 is located in a preset circumferential range of the conductive surface 3000 when the brush head 100 abuts against the conductive surface 3000.

[0043] The conductive surface 3000 provides a large enough contact area to accommodate the brush head 100. Since the brush head 100 is located within a predetermined circumferential range of the conductive surface 3000, it is ensured that the pressure applied by the brush head 100 when in contact with the conductive surface 3000 can be accurately and uniformly transmitted to the sensor 310, improving the stability and accuracy of pressure detection. At the same time, the area of the conductive surface 3000 is larger than the surface area of the brush head 100, which reduces the measurement error caused by slight deviation of the position of the brush head 100, better simulates the pressure distribution of the brush head 100 when actually brushing the wafer 20, and thus ensures the reliability of the pressure detection result.

[0044] Preferably, with reference to Figure 2 、 Figure 3 and Figure 6 , the conductive structure 300 includes a conductive block 3100 and a conductive rod 3200 connected thereto. The conductive block 3100 has a conductive surface 3000 facing the wafer 20. The conductive rod 3200 is connected to the sensor 310 at an end thereof away from the conductive block 3100.

[0045] When the brush head 100 applies pressure, the conductive block 3100 transmits the pressure to the sensor 310 through the conductive rod 3200, ensuring the directness of pressure transmission and reducing the accumulation of errors caused by too many intermediate transmission links.

[0046] In one specific embodiment, the sensor 310 is a pressure sensor, and the pressure sensor has a baffle on one side thereof. The conductive rod 3200 is abutted against the baffle at an end thereof away from the conductive block 3100.

[0047] In one specific embodiment, as shown in Figure 2 and Figure 3 , when the brush head 100 abuts against the conductive surface 3000, the brush head 100, the conductive block 3100 and the conductive rod 3200 are coaxial. In this way, the coaxial arrangement of the three avoids the moment and uneven pressure distribution caused by eccentricity, ensures the accuracy and consistency of the contact position of the brush head 100 and the conductive structure 300, reduces the measurement error of the sensor 310 caused by insufficient contact between the brush head 100 and the conductive surface 3000, and ensures the accuracy of the pressure detection result of the brush head 100.

[0048] Preferably, with reference to Figures 1 to 5The wafer processing device further comprises a cleaning mechanism including a liquid supply assembly and a cleaning box 40, the cleaning box 40 including an immersion cavity provided with a cleaning liquid inlet 400, an overflow port 410 and a cleaning liquid outlet 420, the liquid supply assembly being configured to supply liquid to the brush head 100 located in the immersion cavity through the cleaning liquid inlet 400, the overflow port 410 being located below the cleaning liquid inlet 400 in the height direction of the cleaning box 40 and configured to discharge cleaning liquid exceeding a preset liquid level, and the cleaning liquid outlet 420 being located below the overflow port 410 in the height direction of the cleaning box 40 and configured to discharge all the cleaning liquid in the immersion cavity.

[0049] In one specific embodiment, as shown in Figures 1 to 3 , the immersion cavity is symmetrically provided with two cleaning liquid inlets 400 on opposite sides, each of the cleaning liquid inlets 400 being connected to the liquid supply assembly through a through joint, and the liquid supply assembly being configured to perform liquid spraying cleaning operation on the brush head 100 located between the two cleaning liquid inlets 400.

[0050] In one specific embodiment, as shown in Figure 1 and Figure 2 , when the waste cleaning liquid in the immersion cavity accumulates to a certain extent, i.e., the liquid level exceeds the preset liquid level, the waste cleaning liquid flows out of the cleaning box 40 to a recycling mechanism outside the cleaning box 40 through a pipeline connected to the overflow port 410, so as to recycle the waste cleaning liquid. When the processing device stops running, a worker opens the cleaning liquid outlet 420, so that all the waste cleaning liquid is discharged out of the cleaning box 40 to the recycling mechanism outside the cleaning box 40 through a pipeline connected to the cleaning liquid outlet 420.

[0051] Preferably, referring to Figures 1 to 3 , the cleaning box 40 further comprises a top plate 430 having a first opening 4300 and a bottom plate 440 having a second opening (not shown in the figure), the top plate 430 and the bottom plate 440 defining the immersion cavity, the immersion cavity being provided with the conductive structure 300, the first opening 4300 being located above the conductive surface 3000 and configured to allow the brush head 100 to pass through, and the second opening being configured to allow the end of the conductive structure 300 away from the conductive surface 3000 to pass through to be connected to the sensor 310.

[0052] In this way, the conductive structure 300 is arranged in the cleaning box 40, so that the functions of pressure detection and brush head cleaning are integrated, and a stable detection and cleaning environment is provided.

[0053] In one specific embodiment, as shown in Figures 1 to 3 , the cleaning box 40 further comprises a plurality of side plates connected between the top plate 430 and the bottom plate 440, the side plates being provided with a pipeline connected to the overflow port 410 and a through joint connected to the cleaning liquid inlet 400.

[0054] In one specific embodiment, as shown in Figure 2 ,Figure 3 and Figure 6 As shown in FIG. 3, the conduction structure 300 includes a conduction block 3100 and a conduction rod 3200 connected therewith, one end of the conduction rod 3200 passing through the second opening and connecting with the sensor 310 away from the conduction block 3100.

[0055] Preferably, referring to FIG. 3, the conduction surface 3000 is located below the plane where the cleaning liquid inlets 400 are located and above the plane where the overflow ports 410 are located in the height direction of the cleaning box 40. Figure 2 and Figure 3 Preferably, referring to FIG. 3, the conduction surface 3000 is located below the plane where the cleaning liquid inlets 400 are located and above the plane where the overflow ports 410 are located in the height direction of the cleaning box 40.

[0056] Preferably, referring to FIG. 3, the conduction surface 3000 is located below the plane where the cleaning liquid inlets 400 are located and above the plane where the overflow ports 410 are located in the height direction of the cleaning box 40.

[0057] In one specific embodiment, as shown in FIG. 4, after the brush head 100 completes the wafer brushing operation, the brush head 100 first extends into the soaking cavity of the cleaning box 40 through the first opening 4300, moves to between the two cleaning liquid inlets 400, and the liquid supply assembly sprays liquid to clean the brush head 100. During the cleaning, the brush head 100 keeps rotating, and then the brush head 100 moves downward until it contacts the conduction surface 3000 to perform the pressure detection operation. Figure 2 and Figure 3 In one specific embodiment, as shown in FIG. 4, after the brush head 100 completes the wafer brushing operation, the brush head 100 first extends into the soaking cavity of the cleaning box 40 through the first opening 4300, moves to between the two cleaning liquid inlets 400, and the liquid supply assembly sprays liquid to clean the brush head 100. During the cleaning, the brush head 100 keeps rotating, and then the brush head 100 moves downward until it contacts the conduction surface 3000 to perform the pressure detection operation.

[0058] In another specific embodiment, as shown in FIG. 5, after the brush head 100 completes the wafer brushing operation, the brush head 100 first extends into the soaking cavity of the cleaning box 40 through the first opening 4300, moves downward until it contacts the conduction surface 3000 to perform the pressure detection operation, and then the brush head 100 moves upward to between the two cleaning liquid inlets 400, and the liquid supply assembly sprays liquid to clean the brush head 100. During the cleaning, the brush head 100 keeps rotating. Figure 2 Figure 3 In another specific embodiment, as shown in FIG. 5, after the brush head 100 completes the wafer brushing operation, the brush head 100 first extends into the soaking cavity of the cleaning box 40 through the first opening 4300, moves downward until it contacts the conduction surface 3000 to perform the pressure detection operation, and then the brush head 100 moves upward to between the two cleaning liquid inlets 400, and the liquid supply assembly sprays liquid to clean the brush head 100. During the cleaning, the brush head 100 keeps rotating.

[0059] Preferably, referring to FIG. 6, the wafer processing device further includes a displacement mechanism 50 connected with the brushing mechanism 10 and located at one side of the wafer 20, which includes a first moving assembly and a second moving assembly. The first moving assembly includes a first sliding rail 500 and a first sliding table 510 slidingly connected thereto, and the second moving assembly includes a second sliding rail 520 and a second sliding table 530 slidingly connected thereto. The second sliding rail 520 is arranged on the first sliding table 510, wherein the sliding direction of the first sliding table 510 is perpendicular to the sliding direction of the second sliding table 530. Figures 1 to 5 Further, referring to FIG. 6, the wafer processing device further includes a displacement mechanism 50 connected with the brushing mechanism 10 and located at one side of the wafer 20, which includes a first moving assembly and a second moving assembly. The first moving assembly includes a first sliding rail 500 and a first sliding table 510 slidingly connected thereto, and the second moving assembly includes a second sliding rail 520 and a second sliding table 530 slidingly connected thereto. The second sliding rail 520 is arranged on the first sliding table 510, wherein the sliding direction of the first sliding table 510 is perpendicular to the sliding direction of the second sliding table 530.

[0060] Figures 1 to 5 ​​The wafer processing device further comprises a driving mechanism arranged on one side of the displacement mechanism 50, comprising a first driving assembly and a second driving assembly, the first driving assembly being connected with the first moving assembly to drive the first sliding table 510 to move, and the second driving assembly being connected with the second moving assembly to drive the second sliding table 530 to move.

[0061] As shown in Figure 5 , the displacement mechanism 50 is located below the wafer 20, the cleaning mechanism is located to the right of the wafer 20, and the brushing mechanism 10 can move above the wafer 20. Through the arrangement of the displacement mechanism 50 and the driving mechanism, the movement and positioning of the brush head 100 in the horizontal and vertical directions are realized, meeting the requirements of wafer brushing and brush head detection in different positions.

[0062] In a specific embodiment, as shown in Figure 5 , the brush head 100 is attached to the wafer 20, the first driving assembly drives the first sliding table 510 to move, so that the brush head 100 swings back and forth on the surface of the wafer 20 along the radial direction of the wafer 20 to perform brushing operation on the wafer 20; after the brushing operation is completed, the second driving assembly drives the second sliding table 530 to move upward by a distance, the first driving assembly drives the first sliding table 510 to move until the brush head 100 is located above the first opening 4300, and the second driving assembly drives the second sliding table 530 to move downward, so that the brush head 100 and the conductive surface 3000 are in contact to perform pressure detection operation, wherein the conductive surface 3000 coincides with the upper surface of the wafer 20; after the pressure detection operation is completed, the second driving assembly drives the second sliding table 530 to move upward between the two cleaning liquid inlets 400, and the liquid supply assembly performs cleaning operation on the brush head 100.

[0063] The sequence of the above-mentioned brush head cleaning operation and brush head detection operation can be changed.

[0064] In a specific embodiment, the driving mechanism further comprises a mechanical linkage assembly connected between the first driving assembly and the second driving assembly, used to coordinate the actions of the two driving assemblies, ensuring the synchronization and coordination of the driving actions.

[0065] In a specific embodiment, the first driving assembly and the second driving assembly both adopt servo motors with high speed and low inertia.

[0066] In a specific embodiment, the first moving assembly and the second moving assembly both adopt lead screw modules with high precision and low lead.

[0067] Preferably, referring to Figures 1 to 4 , the brushing mechanism 10 further comprises a mounting seat 110, a rotating assembly 120 arranged on the mounting seat 110, and a rotating rod 130 connected between the rotating assembly 120 and the brush head 100, the rotating assembly 120 being used to drive the brush head 100 to rotate through the rotating rod 130.

[0068] In one specific embodiment, the rotating assembly 120 comprises a motor and a coupling (not shown in the figures), the output of the motor is connected to the rotating rod 130 through the coupling, the motor provides rotating power which is transmitted to the rotating rod 130 through the coupling, thereby driving the brush head 100 to rotate.

[0069] Preferably, referring to Figure 1 and Figure 4 , the wafer processing device further comprises a connecting structure 60 having a first part 600 and a second part 610 which are perpendicular to each other, the first part 600 is connected to the second slide 530, and the second part 610 is connected to the mounting base 110.

[0070] In one specific embodiment, as shown in Figure 4 , the first part 600 is perpendicular to the second part 610, forming a triangular structure, to realize the connection between the second moving assembly and the brushing mechanism 10.

[0071] Preferably, the wafer processing device further comprises a carrying mechanism (not shown in the figures) comprising a carrying part and a protection part, the carrying part is used to carry the wafer 20, one end of the protection part is surrounded by the carrying part, and the other end can extend and contract relative to the carrying part, to cover the wafer 20 when brushing the wafer 20.

[0072] In one specific embodiment, the distance from the brush head 100 to the mounting base 110 is greater than the length of the carrying part in the extended state, to avoid the brush head 100 from touching the carrying part and causing damage to the carrying mechanism when performing the brushing operation.

[0073] In one specific embodiment, the carrying part can drive the wafer 20 to rotate when performing the brushing operation.

[0074] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0075] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0076] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and that changes, modifications, substitutions and variations can be made by those skilled in the art without departing from the scope of the present application.

Claims

1. A wafer processing apparatus, characterized in that, The wafer processing apparatus includes: The brushing mechanism (10) includes a brush head (100) for brushing the wafer (20); The detection mechanism (30) is disposed on one side of the wafer (20) along the radial direction of the wafer (20), and includes a conductive structure (300) and a sensor (310) connected thereto. The conductive structure (300) has a conductive surface (3000), which is parallel to the upper surface of the wafer (20) and maintains a preset distance therebetween. The sensor (310) acquires the pressure applied by the brush head (100) to the conductive surface (3000).

2. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus further includes: The cleaning mechanism includes a liquid supply assembly and a cleaning box (40). The cleaning box (40) includes a soaking chamber with a cleaning liquid inlet (400), an overflow port (410), and a cleaning liquid outlet (420). The liquid supply assembly is used to supply liquid to the brush head (100) located in the soaking chamber through the cleaning liquid inlet (400). The overflow port (410) is located below the cleaning liquid inlet (400) along the height direction of the cleaning box (40), and the cleaning liquid outlet (420) is located below the overflow port (410) along the height direction of the cleaning box (40).

3. The wafer processing apparatus according to claim 2, characterized in that, The cleaning box (40) further includes a top plate (430) having a first opening (4300) and a bottom plate (440) having a second opening, the top plate (430) and the bottom plate (440) defining the soaking chamber, in which the conductive structure (300) is provided, the first opening (4300) being located above the conductive surface (3000) to allow the brush head (100) to pass through, and the second opening allowing one end of the conductive structure (300) away from the conductive surface (3000) to pass through for connection with the sensor (310).

4. The wafer processing apparatus according to claim 3, characterized in that, In the height direction of the cleaning box (40), the conductive surface (3000) is located below the plane where the cleaning liquid inlet (400) is located and above the plane where the overflow port (410) is located.

5. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus further includes: The displacement mechanism (50), connected to the brushing mechanism (10), is located on one side of the wafer (20) and includes a first moving component and a second moving component. The first moving component includes a first slide rail (500) and a first slide table (510) slidably connected thereto. The second moving component includes a second slide rail (520) and a second slide table (530) slidably connected thereto. The second slide rail (520) is located on the first slide table (510), wherein the sliding direction of the first slide table (510) is perpendicular to the sliding direction of the second slide table (530).

6. The wafer processing apparatus according to claim 5, characterized in that, The wafer processing apparatus further includes: The driving mechanism is located on one side of the displacement mechanism (50) and includes a first driving component and a second driving component. The first driving component and the first moving component are connected to drive the first slide (510) to move, and the second driving component and the second moving component are connected to drive the second slide (530) to move.

7. The wafer processing apparatus according to claim 5, characterized in that, The brushing mechanism (10) further includes a mounting base (110), a rotating component (120) disposed on the mounting base (110), and a rotating rod (130) connected between the rotating component (120) and the brush head (100). The rotating component (120) drives the brush head (100) to rotate through the rotating rod (130).

8. The wafer processing apparatus according to claim 7, characterized in that, The wafer processing apparatus further includes: The connecting structure (60) has a first part (600) and a second part (610) that are perpendicular to each other. The first part (600) is connected to the second slide (530), and the second part (610) is connected to the mounting base (110).

9. The wafer processing apparatus according to claim 1, characterized in that, The wafer processing apparatus further includes: The support mechanism includes a support portion and a protection portion. The support portion is used to support the wafer (20). One end of the protection portion surrounds the support portion, and the other end can extend and retract relative to the support portion.

10. The wafer processing apparatus according to claim 1 or 3, characterized in that, The conductive structure (300) includes a conductive block (3100) and a conductive rod (3200) connected thereto. The side of the conductive block (3100) facing the wafer (20) is the conductive surface (3000), and the end of the conductive rod (3200) away from the conductive block (3100) is connected to the sensor (310).

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