Silver sintering mold and sintering equipment for power semiconductor packaging module

Abstract

The utility model relates to the technical field of semiconductor dies, in particular to a silver sintering die and sintering equipment for a power semiconductor packaging module. The silver sintering mold for the power semiconductor packaging module comprises an upper mold and a lower mold, the upper die comprises an upper die plate, a pressure head module arranged on the upper die plate, a first heat insulation plate arranged on the upper die plate and a heating plate arranged on the first heat insulation plate; a pressing head of the pressing head module can penetrate out of the first heat insulation plate, and the heating plate heats the pressing head. The lower die comprises a lower die plate and a tray detachably arranged on the lower die plate. A material table is arranged on the lower die plate, a material groove is formed in the tray, and the material table is exposed in the material groove. A substrate with a chip is placed in the material groove, and the substrate is supported by the material groove and the material table. In the feeding process, a large number of substrates loaded with chips are put into the tray, and then the tray is put into the mold; and during discharging, the tray is taken out of the mold, so that the waiting time for feeding and discharging is shortened, and the production efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor mould, especially a silver sintering mould and sintering equipment for power semiconductor packaging module. BACKGROUND

[0002] The main reasons for power semiconductors adopting silver sintering technology include high thermal conductivity, high electrical conductivity and high reliability. Silver sintering technology, also known as low temperature joining technique (LTJT), is a new type of lead-free chip interconnection technology. It can obtain a sintered silver chip connection interface with high temperature resistance (> 700 DEG C) and high thermal conductivity (~ 240 W / m·K) under low temperature (< 250 DEG C) conditions.

[0003] When power semiconductors are processed by using silver sintering technology, a sintering mould is usually used. The size of the chip is generally small, and the processing is also carried out in large quantities. When processing, the chip is placed on the sintering substrate, the sintering substrate is loaded with the chip, and then the sintering substrate is placed in the mould for sintering. This design is to directly put the substrate into the mould one by one, and the convenience of this design is poor, which affects the efficiency of feeding and discharging.

[0004] For example, a silver sintering device and sintering method for a power semiconductor module are disclosed in Chinese patent application No. CN202311421582.6, which specifically discloses "an upper mould connected to the piston and arranged towards the lower mould, driven by the up-down movement of the piston to move along a set path, the bottom of the upper mould is provided with upper mould bosses corresponding in number and position to the sintered chips on the sintering substrate". "The lower mould is used for placing the sintering substrate with sintered chips attached, and the lower mould upper surface is provided with a substrate groove for positioning the sintering substrate, and the shape of the substrate groove is consistent with the shape of the ceramic layer of the sintering substrate". This design is to directly put the sintering into the lower mould, and the convenience of this design is poor, which affects the efficiency of feeding and discharging. UTILITY MODEL CONTENTS

[0005] Therefore, the utility model provides a silver sintering mould for power semiconductor packaging module, which places the substrate on the tray, and the tray is detachably arranged on the lower mould, which helps to improve the efficiency of feeding and discharging, thereby overcoming the shortcomings of the prior art.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] The application provides a silver sintering mold for a power semiconductor package module, which comprises an upper mold and a lower mold which can be closed together; the upper mold comprises an upper mold plate, a punch module arranged on the upper mold plate, a first heat insulation plate arranged on the upper mold plate, and a heating plate arranged on the first heat insulation plate; the punch of the punch module can pass through the first heat insulation plate, and the heating plate heats the punch; the lower mold comprises a lower mold plate and a tray which can be detachably arranged on the lower mold plate; a material table is arranged on the lower mold plate, a material groove is arranged on the tray, and the material table is exposed in the material groove; a chip is placed on a substrate; the substrate is placed in the material groove, and the material groove and the material table support the substrate.

[0008] Preferably, a positioning block is arranged on the lower mold plate; a first positioning part and a first supporting part are arranged on the positioning block; a first positioning opening is arranged on the tray; the first supporting part supports the tray, and the first positioning part is embedded in the first positioning opening.

[0009] Preferably, a supporting plate is arranged at a corner position in the material groove, and the supporting plate supports the substrate; a second positioning part is arranged on the inner wall of the material groove, and the second positioning part abuts against the substrate.

[0010] Preferably, a positioning groove is arranged on the heating plate, and the positioning block can be embedded in the positioning groove.

[0011] Preferably, the material table can be detachably arranged on the lower mold plate, and the material table can generate heat.

[0012] Preferably, handles are arranged on the front and back sides of the lower mold plate; and slide rails are arranged on the left and right sides of the lower mold plate.

[0013] Preferably, the handles are arranged on a mounting plate, and a second heat insulation plate is arranged between the lower mold plate and the mounting plate.

[0014] Preferably, the punch module further comprises a punch seat, and the structure of the punch is L-shaped; the root of the punch is inserted into the punch seat, and the heating plate supports the punch.

[0015] Preferably, the material table and the heating plate are resistance heating elements or electromagnetic heaters.

[0016] The application further provides a sintering device, which comprises the silver sintering mold for the power semiconductor package module; the upper mold is arranged on an upper machine table, and the lower mold is pullably arranged on a lower machine table.

[0017] Compared with the prior art, this utility model has significant advantages and beneficial effects. Specifically, as shown in the above technical solution, the chip is placed on a substrate, the substrate is placed in the material tank, and the material tank and material platform support the substrate. The tray is detachably mounted on the lower mold, and the material tank can support the substrate. During loading, a large number of substrates carrying chips are first placed into the tray, and then the tray is placed into the mold. During unloading, the tray can be directly removed, followed by the substrates from the tray. This significantly improves the efficiency of mold loading and unloading, shortens the waiting time for loading and unloading, and helps to improve production efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the mold opening state of Embodiment 1 of this utility model.

[0019] Figure 2 This is a schematic diagram of the lower mold of Embodiment 1 of this utility model.

[0020] Figure 3 This is a schematic diagram of the upper mold of Embodiment 1 of this utility model.

[0021] Figure 4 This is a top view schematic diagram of one embodiment of the present utility model.

[0022] Figure 5 This is one embodiment of the present utility model. Figure 4 Schematic diagram of the CC section.

[0023] Figure 6 This is one embodiment of the present utility model. Figure 4 Schematic diagram of the BB section.

[0024] Figure 7 This is a schematic diagram of the pressure head module according to Embodiment 1 of this utility model.

[0025] Figure 8 This is an exploded view of the lower mold of Embodiment 1 of this utility model.

[0026] Explanation of reference numerals in the attached diagram:

[0027] 10. Upper mold; 11. Upper template; 12. First heat insulation plate; 13. Heating plate; 110. Press head module; 111. Press head seat; 112. Press head; 20. Lower mold; 21. Lower template; 22. Material platform; 23. Positioning block; 24. First positioning part; 25. First lifting part; 26. Handle; 27. Mounting plate; 28. Second heat insulation plate; 30. Tray; 31. First positioning port; 32. Material trough; 33. Second positioning part; 34. Substrate; 35. Chip; 36. Polytetrafluoroethylene film; 37. Pallet. Detailed Implementation

[0028] In order to further illustrate the technical means and effects adopted by the utility model to achieve the predetermined utility model purposes, the following will be described in detail in combination with the drawings and preferred embodiments, the specific implementation, structure, features and effects according to the utility model.

[0029] Embodiment one

[0030] Please refer to Figures 1 to 7 It shows the specific structure of the preferred embodiment of the utility model, which is a silver sintering mold for power semiconductor packaging module.

[0031] Among them, the chip 35 is placed on the substrate 34, and the substrate 34 is placed on the tray 30. Since the tray 30 can be detached from the lower mold 20, a large number of substrates 34 can be placed in the lower mold 20 first, and then the tray 30 is placed on the mold. This design improves the efficiency of feeding and discharging, which is beneficial to improve the production speed.

[0032] The application provides a silver sintering mold for power semiconductor packaging module, which comprises an upper mold 10 and a lower mold 20 which can be closed together; the upper mold 10 comprises an upper mold plate 11, a pressure head module 110 arranged on the upper mold plate 11, a first heat insulation plate 12 arranged on the upper mold plate 11, and a heating plate 13 arranged on the first heat insulation plate 12; the pressure head 112 of the pressure head module 110 can pass through the first heat insulation plate 12, and the heating plate 13 heats the pressure head 112; the lower mold 20 comprises a lower mold plate 21 and a tray 30 which can be detachably arranged on the lower mold plate 21; the lower mold plate 21 is provided with a material table 22, the tray 30 is provided with a material groove 32, and the material table 22 is exposed in the material groove 32; the chip 35 is placed on the substrate 34; the substrate 34 is placed in the material groove 32, and the material groove 32 and the material table 22 support the substrate 34. The upper mold 10 and the lower mold 20 can be closed together to perform silver sintering processing on the chip 35. The pressure head module 110 has several groups, each group of pressure head module 110 has several pressure heads 112, the pressure head 112 can be heated, and the heated pressure head 112 is pressed on the chip 35. The substrate 34 is provided with a groove, and the chip 35 is placed in the groove. The material groove 32 can hold the substrate 34, so the substrate 34 will not fall in the material groove 32. The preferred working steps are as follows: 1, several chips 35 are placed on the substrate 34, and then a plurality of substrates 34 are placed on the tray 30. 2, a plurality of trays 30 are loaded into the lower mold 20, and the position is confirmed before closing. 3, after the upper mold 10 and the lower mold 20 are closed, the heated pressure head 112 is pressed on the chip 35, and the heated material table 22 supports the bottom of the substrate 34. 4, after the temperature of the pressure head 112 and the material table 22 reaches the design temperature, it lasts for a period of time, and the mold is opened to take out the tray 30. It can be seen that this design helps to improve the efficiency of feeding and discharging, thereby improving the production efficiency.

[0033] Preferably, the lower mold plate 21 is provided with a positioning block 23; the positioning block 23 is provided with a first positioning part 24 and a first lifting part 25; the tray 30 is provided with a first positioning opening 31; the first lifting part 25 can lift the tray 30, and the first positioning part 24 is embedded in the first positioning opening 31. The positioning block 23 can be used to ensure the accuracy of the mold clamping, and improve the accuracy of the mold clamping of the upper mold 10 and the lower mold 20. The positioning block 23 can hold the tray 30, and then the tray 30 is lifted by a certain distance, which facilitates the tray 30 to be taken out of the lower mold 20. The first lifting part 25 is in a stepped shape, and the first positioning part 24 is in one of a cylindrical shape, a square column shape, a dovetail shape, and an oval shape. The structure between the first positioning part 24 and the first positioning opening 31 is matched. When the tray 30 is assembled, it is pressed downward from top to bottom to the lower mold 20, the tray 30 is abutted against the first lifting part 25, the first positioning part 24 is embedded in the first positioning opening 31, so that the two can be assembled, and the structure is very simple and the assembly efficiency is high. When the tray 30 needs to be disassembled, the tray 30 can be taken out upward.

[0034] Preferably, a supporting plate 37 is arranged at a corner position in the material groove 32, and the supporting plate 37 supports the substrate 34; an inner wall of the material groove 32 is provided with a second positioning part 33, and the second positioning part 33 is abutted against the substrate 34. The supporting plate 37 and the tray 30 are integrally formed. The supporting plate 37 is in a triangular structure, which can leave a space for the protruding material table 22. The material table 22 in the embodiment can also be heated, and the chip 35 can be heated on both sides. The second positioning part 33 is in a bump structure, which can position the position of the substrate 34 in the material groove 32. A certain gap is left between the substrate 34 and the side wall of the material groove 32, which can leave a certain expansion space for the substrate 34, and ensure the processing quality.

[0035] Preferably, the heating plate 13 is provided with a positioning groove, and the positioning block 23 can be embedded in the positioning groove. The positioning block 23 and the positioning groove are used in cooperation, and when the mold is clamped, the positioning block 23 is embedded in the positioning groove, so that the accuracy of the mold clamping of the upper mold 10 and the lower mold 20 is good, and deviation does not occur.

[0036] Preferably, the material table 22 is detachably arranged on the lower mold plate 21, and the material table 22 can be heated. The material table 22 can be assembled on the lower mold plate 21 through screws. The material table 22 is detachable, and the tray 30 is also detachable. Different trays 30 and material tables 22 can be used for one lower mold 20, and the flexibility and universality of the mold are better.

[0037] Preferably, the front and rear sides of the lower mold plate 21 are provided with handles 26; the left and right sides of the lower mold plate 21 are provided with slide rails 29. The handle 26 is arranged on the mounting plate 27, and the second heat insulation plate 28 is arranged between the lower mold plate 21 and the mounting plate 27. The handle 26 facilitates the pulling out of the lower mold 20 from the equipment. The handle 26 is mounted on the mounting plate 27 by screws. The first heat insulation plate 12 and the second heat insulation plate 28 have the function of heat insulation. The first heat insulation plate 12 and the second heat insulation plate 28 are one of GLM insulation plate, Brandenburger heat insulation plate, and high-temperature-resistant heat insulation plate. When the lower mold 20 is pulled out of the equipment, the handle 26 is manually held, and then the lower mold 20 is pulled out, and the slide rail 29 slides out along the slide groove on the equipment. This structure is very simple, and the disassembly and assembly of the lower mold 20 are also very efficient.

[0038] Preferably, the pressure head module 110 further comprises a pressure head seat 111, and the structure of the pressure head 112 is L-shaped; the root of the pressure head 112 is inserted into the pressure head seat 111, and the heating plate 13 supports the pressure head 112. The pressure head 112 is mounted on the pressure head seat 111, and the heating plate 13 heats and supports the pressure head 112, so that the pressure head 112 will not be loose, and the assembly structure of the pressure head module 110 is very simple and efficient. Preferably, the pressure head seat 111 can drive the pressure head seat 111 to move up and down in a hydraulic mode, or the pressure head 112 can be extended from the pressure head seat 111 through a spring.

[0039] Preferably, the material table 22 and the heating plate 13 are resistance heating elements or electromagnetic heaters. The material table 22 and the heating plate 13 can both heat up, and can process the upper and lower surfaces of the chip 35, which helps to ensure the quality of sintering.

[0040] Embodiment two

[0041] The application provides a sintering equipment, which comprises the silver sintering mold for the power semiconductor packaging module; the upper mold 10 is arranged on the upper machine table, and the lower mold 20 is arranged on the lower machine table in a pullable manner. After the mold is arranged, the production efficiency of the sintering equipment can be greatly improved.

[0042] Embodiment three

[0043] A silver sintering method of a power semiconductor package module, comprising 1, printing silver paste on the substrate 34, drying the substrate 34 printed with the silver paste, and mounting the chip 35 on the silver paste printed area. 2, placing a plurality of substrates 34 into the material groove 32 of the tray 30, and loading the tray 30 into the lower mold 20, and covering the chip 35 with the polytetrafluoroethylene film 36. 3, closing the upper mold 10 and the lower mold 20, and the pressure head 112 of the upper mold 10 pre-presses the surface of the chip 35. 4, the material table 22 and the pressure head 112 heat, and both of them heat and sinter the chip 35 at the same time. The mold needs to be heated to a high temperature of 300 degrees, and the pressure head 112 must maintain verticality and smoothly slide up and down, and the flatness of the pressing surface of the upper and lower pressure heads 112 needs to be kept within 0.002. 5, increase the pressure of the hydraulic cylinder to the set sintering pressure, maintain the set sintering pressure, and start sintering according to the set sintering time. 6, sintering is completed, the mold is opened, the tray 30 is taken out from the lower mold 20, and a new tray 30 is replaced, and the cycle is continuously repeated.

[0044] In summary, the design focus of the utility model is that the tray 30 is detachably arranged on the lower mold 20, and the material groove 32 can hold the substrate 34. Therefore, the design greatly improves the efficiency of the mold feeding and discharging, shortens the waiting time of feeding and discharging, and helps to improve the production efficiency.

[0045] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model has been disclosed as above, it is not intended to limit the utility model. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the technical solution of the utility model. Any modification, change, equivalent change and modification of the above embodiments, which does not depart from the technical solution of the utility model, is still within the scope of the technical solution of the utility model.

Claims

1. A silver sintering mold for a power semiconductor package module, comprising an upper mold and a lower mold which are closable together; characterized in that: The upper die comprises an upper die plate, a punch module arranged on the upper die plate, a first heat insulation plate arranged on the upper die plate, and a heating plate arranged on the first heat insulation plate; a punch of the punch module penetrates through the first heat insulation plate, and the heating plate heats the punch; The lower die comprises a lower die plate and a tray detachably arranged on the lower die plate; a material table is arranged on the lower die plate, and a material groove is arranged on the tray; the material table is exposed in the material groove; A chip is placed on a substrate; the substrate is placed in the material groove, and the material groove and the material table support the substrate.

2. The silver sintering mold for a power semiconductor package module according to claim 1, characterized by: A positioning block is arranged on the lower die plate; a first positioning part and a first supporting part are arranged on the positioning block; a first positioning opening is arranged on the tray; the first supporting part supports the tray, and the first positioning part is embedded in the first positioning opening.

3. The silver sintering mold for a power semiconductor package module according to claim 1, characterized by: A supporting plate is arranged at a corner position in the material groove, and the supporting plate supports the substrate; a second positioning part is arranged on an inner wall of the material groove, and the second positioning part abuts against the substrate.

4. A silver sintering mold for a power semiconductor package module according to any one of claims 1 to 3, characterized in that: A positioning groove is arranged on the heating plate, and the positioning block can be embedded in the positioning groove.

5. The silver sintering mold for a power semiconductor package module according to claim 1, characterized by: The material table is detachably arranged on the lower die plate, and the material table can generate heat.

6. The silver sintering mold for a power semiconductor package module according to claim 1, characterized by: Handles are arranged on front and back sides of the lower die plate; slide rails are arranged on left and right sides of the lower die plate.

7. The silver sintering mold for a power semiconductor package module according to claim 6, characterized by: The handles are arranged on a mounting plate, and a second heat insulation plate is arranged between the lower die plate and the mounting plate.

8. The silver sintering mold for a power semiconductor package module according to claim 1, characterized by: The punch module further comprises a punch seat, and the punch has an L-shaped structure; a root of the punch is inserted into the punch seat, and the heating plate supports the punch.

9. The silver sintering mold for a power semiconductor package module according to claim 1 or 8, characterized by: The material table and the heating plate are resistance heating elements or electromagnetic heaters.

10. A sintering apparatus characterized by comprising: The silver sintering die for the power semiconductor packaging module comprises the silver sintering die according to any one of claims 1-9; the upper die is arranged on an upper machine table, and the lower die is detachably arranged on a lower machine table.

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