Back washing unit and gluing and developing device

Abstract

The utility model relates to the field of gluing and developing, and provides a back washing unit and a gluing and developing device, the back washing unit comprises a brush head, a rotary tray, a movable tray and a bracket, the brush head is used for moving relative to the support and is provided with a first station located in the support and a second station located outside the support. The support is provided with a first opening facing the rotating tray outwards and a second opening facing the brush head. The support is used for supporting the rotary tray. The rotary tray is fixed on the inner side or the top side of the bracket; when the rotating tray is in a working state, the rotating tray is used for driving the wafer to rotate relative to the brush head so as to clean a first area on the back surface of the wafer; the movable tray is located on the top side of the support and used for adsorbing the edge area of the back face of the wafer; when the brush head is in the moving state, the brush head is used for moving relative to the wafer to clean a second area on the back face of the wafer. The back washing unit is used for improving the cleanliness and smoothness of the back surface of the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of gluing and developing, especially to a back washing unit and gluing and developing device. BACKGROUND

[0002] The wafer is polluted by particles in the front process before entering the photoetching machine, so the back of the wafer needs to be cleaned. In the related art, when the back of the wafer is cleaned, the wafer is usually adsorbed on the front surface or clamped and fixed on the side surface. When the wafer is adsorbed on the front surface, the front surface of the wafer directly contacts the suction cup, which easily causes the structure of the front surface of the wafer to be damaged. Therefore, there is an urgent need for a back washing unit and gluing and developing device to improve the above problems. SUMMARY

[0003] The utility model aims at providing a back washing unit and gluing and developing device, which is used to improve the cleanliness and smoothness of the back of the wafer.

[0004] In the first aspect, the utility model provides a back washing unit, which is applied to a gluing and developing device and includes a brush head, a rotating tray, a moving tray and a support. The brush head is used to move relative to the support and has a first station in the support and a second station outside the support. The support has a first opening outward to the rotating tray and a second opening to the brush head. The first opening is used to accommodate the wafer, and the second opening is used to accommodate the brush head. The support is used to support the rotating tray. The rotating tray is fixed to the inner side or the top side of the support. When the rotating tray adsorbs the center area of the back of the wafer, the brush head is used to reach the first station through the second opening to contact the first area of the back of the wafer. The first area of the back of the wafer includes the edge area of the back of the wafer. When the rotating tray is in the working state, it is used to drive the wafer to rotate relative to the brush head to clean the first area of the back of the wafer. The moving tray is located on the top side of the support and is used to adsorb the edge area of the back of the wafer. When the moving tray drives the wafer to move out of the support, the brush head is used to reach the second station through the second opening to contact the second area of the back of the wafer. The second area of the back of the wafer includes the center area of the back of the wafer. When the brush head is in the moving state, it is used to move relative to the wafer to clean the second area of the back of the wafer.

[0005] Optionally, the brush head includes bristles, and the hardness of the bristles is lower than the hardness of the back of the wafer, which is used to clean the back of the wafer.

[0006] Optionally, the back of the wafer is coated with a smooth film layer, and the hardness of the bristles is lower than the hardness of the smooth film layer.

[0007] Optionally, a transmission manipulator is relatively fixed to the brush head; the transmission manipulator is used to drive the brush head to move to the first station or the second station.

[0008] Optionally, a vibration part is further connected to the brush head; when the brush head is at the second station, the vibration part is used to drive the brush head to vibrate, so that the bristles sweep away the particles in the second area on the back surface.

[0009] Optionally, a thimble is further included; the number of thimbles is set to N, where N is a positive integer greater than or equal to 3; the thimbles are located in the bracket and are arranged around the rotating tray; the thimbles are used to move relative to the rotating tray and have a raised position and a lowered position; the top end of the thimble at the raised position is higher than the top end of the rotating tray; when the thimble moves to the raised position, it is used to lift the wafer on the rotating tray, so that the back surface of the wafer is higher than the top end of the moving tray; the top end of the thimble at the lowered position is lower than the top end of the rotating tray; when the thimble moves to the lowered position, it is used to place the wafer on the rotating tray, so that the top end of the rotating tray adsorbs the central area of the back surface of the wafer.

[0010] Optionally, the rotating tray includes an upward first suction cup; after the thimble moves to the lowered position, the first suction cup is used to adsorb the wafer; before the thimble moves to the raised position, the first suction cup is used to release the wafer.

[0011] Optionally, the moving tray includes an upward second suction cup; after the thimble moves to the raised position, the second suction cup is used to adsorb the wafer; after the brush head ends its movement state, the second suction cup is used to release the vacuum on the back surface of the wafer so that the moving tray releases the wafer.

[0012] Optionally, the central area of the back surface is a circular area with a radius of R1 located at the center of the back surface of the wafer; the edge area of the back surface is an annular area with an inner diameter of R2 and an outer diameter of R3 located on the outer periphery of the back surface of the wafer, and R1 < R2 < R3 is satisfied; the first area of the back surface is an annular area with an inner diameter of R1 and an outer diameter of R3 located on the outer periphery of the back surface of the wafer; the second area of the back surface is a circular area with a radius of R2 located at the center of the back surface of the wafer.

[0013] In a second aspect, the present invention provides a coating and developing apparatus, comprising a back washing unit as described in any one of the first aspects, characterized in that it further comprises: a coating unit, a coating unit, a developing unit, a first baking unit, and a stripping unit; the coating unit is used to coat a smooth film layer on the back side of a wafer to increase the smoothness of the back side of the wafer; the coating unit is used to coat a photoresist layer on the front side of the wafer to attach the photoresist layer to be exposed to the wafer; the back washing unit is used to control the relative movement of the brush bristles with the wafer to clean the lower surface of the smooth film layer; the lower surface is the surface of the smooth film layer facing away from the wafer; the developing unit is used to coat the wafer with a developing solution to dissolve or fix a portion of the photoresist layer to the front side of the wafer to form a mask pattern; the first baking unit is used to bake and shape the photoresist layer forming the mask pattern; the stripping unit is used to remove the smooth film layer coated on the back side of the wafer.

[0014] Optionally, it also includes: a coating and developing device and an exposure unit; the coating and developing device includes a wafer cassette module, a liquid treatment module, an interlayer interface tower, and a heat treatment module arranged in a horizontal direction; the back washing unit and the exposure unit are located on the side of the heat treatment module away from the interlayer interface tower; the interlayer interface tower is used to hold wafers transferred between the liquid treatment module and the heat treatment module; the exposure unit is used to expose the wafers; the wafer cassette module is equipped with the coating unit, the wafer cassette interface tower, and an interlayer robot assembly; the wafer cassette interface tower is used to hold wafers coated with a smooth film layer; the interlayer robot assembly is used to transfer wafers from the wafer coating unit. The wafers are either sent to the wafer cassette interface tower or removed from the wafer cassette interface tower. The liquid treatment module includes the coating unit, the developing unit, and a liquid treatment robot assembly. The liquid treatment robot assembly is used to transfer the wafers from the wafer cassette interface tower to the coating unit, and also to transfer the wafers from the coating unit to the interlayer interface tower. The heat treatment module includes the first baking unit, the stripping unit, and a heat treatment robot assembly. The heat treatment robot assembly is used to transfer the wafers from the first baking unit to the stripping unit, and also to remove the wafers from the stripping unit.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: by rotating the tray to adsorb the central area of ​​the back of the wafer, and by moving the tray to adsorb the edge area of ​​the back of the wafer, the brush head can be used to process different parts of the back of the wafer at different work stations. This design avoids direct contact between the front of the wafer and any mechanical parts, reducing the risk of damage to the front structure of the wafer. Attached Figure Description

[0016] Figure 1 A schematic diagram of the back washing unit with the brush head located at the first station provided by this utility model;

[0017] Figure 2 A schematic diagram of the back washing unit with the brush head located at the second station provided by this utility model;

[0018] Figure 3 A schematic diagram of the region division on the back side of a wafer provided by this utility model;

[0019] Figure 4 A cross-sectional view of a coating and developing device provided by this utility model from the perspective of the reverse Z direction;

[0020] Figure 5 A cross-sectional view of a coating and developing device with an interface tower provided by this utility model from the perspective of the Y direction.

[0021] Figure 6 This is a cross-sectional view of a coating and developing device provided by this utility model from the perspective of the Y direction.

[0022] Explanation of the reference numerals in the figure:

[0023] 100. Interlayer module; 200. Liquid treatment module; 300. Heat treatment module; 400. Chip box module; 500. Interface module;

[0024] 1. Inbound / outbound robotic arm; 2. Second-level inter-laboratory robotic arm; 3. First-level inter-laboratory robotic arm; 4. Wafer cassette robotic arm; 5. Wafer;

[0025] 11. First liquid handling robot; 12. Second liquid handling robot; 13. Third liquid handling robot; 14. Fourth liquid handling robot; 15. Fifth liquid handling robot; 16. Sixth liquid handling robot;

[0026] 21. First heat treatment robotic arm; 22. Second heat treatment robotic arm; 23. Third heat treatment robotic arm; 24. Fourth heat treatment robotic arm; 25. Fifth heat treatment robotic arm; 26. Sixth heat treatment robotic arm;

[0027] 31. Back-washing robot; 32. Front-washing robot; 33. Interface robot; 41. Coating unit; 51. Back-washing unit;

[0028] 511. Brush head; 512. Rotating tray; 513. Moving tray; 514. Support; 515. Brush bristles; 516.

[0029] First opening; 517, second opening; 518, ejector pin; 519, transmission manipulator. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0031] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0032] In response to the problems existing in the current technology, such as Figure 1 and Figure 2As shown, this utility model provides a back washing unit 51 and a coating and developing apparatus. The first embodiment provides a back washing unit 51 applied to the coating and developing apparatus, comprising: a brush head 511, a rotating tray 512, a movable tray 513, and a support 514; the brush head 511 is used to move relative to the support 514, having a first station located inside the support 514 and a second station located outside the support 514; the support 514 has a first opening 516 facing outwards from the rotating tray 512 and a second opening 517 facing the brush head 511; the first opening 516 is used to accommodate a wafer 5; the second opening 517 is used to accommodate the brush head 511; the support 514 is used to support the rotating tray 512; the rotating tray 512 is fixed to the inner side or top side of the support 514; when the rotating tray 512 adsorbs the central area of ​​the back side of the wafer 5, the brush head 511... The brush head 511 is used to reach the first work station through the second opening 517 to contact a first region on the back side of the wafer 5; the first region on the back side includes the edge region on the back side of the wafer 5; when the rotating tray 512 is in working state, it is used to drive the wafer 5 to rotate relative to the brush head 511 to clean the first region on the back side of the wafer 5; the moving tray 513 is located on the top side of the support 514 and is used to adsorb the edge region on the back side of the wafer 5; when the moving tray 513 drives the wafer 5 to move out of the support 514, the brush head 511 is used to reach the second work station through the second opening 517 to contact a second region on the back side of the wafer 5; the second region on the back side includes the center region on the back side of the wafer 5; when the brush head 511 is in motion state, it is used to move relative to the wafer 5 to clean the second region on the back side of the wafer 5.

[0033] In some specific embodiments, the front side of the wafer 5 faces the Z direction, and the back side of the wafer 5 faces the opposite Z direction. A first opening 516 is formed on the Z-direction side of the support 514. The first workstation is located in the X direction of the second workstation. A second opening 517 is formed on the opposite X-direction side of the support 514. The Z direction is vertically upward, and the X direction is horizontal.

[0034] It is worth noting that in this embodiment, the central area of ​​the back side of the wafer 5 is adsorbed by the rotating tray 512, and the edge area of ​​the back side of the wafer 5 is adsorbed by the moving tray 513. With the help of the brush head 511, different parts of the back side of the wafer 5 can be processed at different work stations. This design avoids direct contact between the front side of the wafer 5 and any mechanical parts, reducing the risk of damage to the front side structure of the wafer 5.

[0035] In some embodiments, the brush head 511 includes bristles 515 disposed toward the wafer 5, the bristles 515 having a lower hardness than the back surface hardness of the wafer 5, for cleaning the back surface of the wafer 5.

[0036] In some specific embodiments, the materials of each portion of the wafer 5 are set to be homogeneous. For example, the back surface material of the wafer 5 is silicon, and the hardness of the bristles 515 is greater than that of silicon.

[0037] In other embodiments, the back side of the wafer 5 is coated with a smooth film layer, and the hardness of the bristles 515 is lower than the hardness of the smooth film layer.

[0038] In some specific embodiments, the main body of the wafer 5 is made of silicon, and the back side of the wafer 5 is coated with a smooth film layer. The smooth film layer is coated onto the back side of the main body using a coating process. The hardness of the brush bristles 515 is greater than the hardness of the smooth film layer. For example, the smooth film layer is a hexamethyldisilazane (HMDS) coating. The hardness of the brush bristles 515 is lower than the hardness of the hexamethyldisilazane coating.

[0039] In some embodiments, the brush head 511 is fixedly attached to a transmission manipulator 519; the transmission manipulator 519 is used to drive the brush head 511 to move to the first work station or the second work station.

[0040] In some specific embodiments, the brush head 511 is directly connected to the transmission manipulator 519. When the transmission manipulator 519 extends, it drives the brush head 511 to move to the first working position; when the transmission manipulator 519 retracts, it drives the brush head 511 to move to the second working position.

[0041] In some examples, the transmission manipulator 519 is used to drive the brush head 511 to translate between the first station and the second station. In other examples, the transmission manipulator 519 is used to drive the brush head 511 to rotate between the first station and the second station.

[0042] In some embodiments, the brush head 511 is further connected to a vibration unit; when the brush head 511 is in the second working position, the vibration unit is used to drive the brush head 511 to vibrate so that the bristles 515 sweep away particles located in the second area on the back side.

[0043] In some specific embodiments, the brush head 511 is indirectly connected to the transmission manipulator 519 via a vibrating element. In some examples, the vibrating element is configured as an eccentric motor. The housing of the eccentric motor is connected to the end of the transmission manipulator 519. The output shaft of the eccentric motor is connected to the brush head 511.

[0044] In some embodiments, the device further includes ejector pins 518; the number of ejector pins 518 is set to N, where N is a positive integer greater than or equal to 3; the ejector pins 518 are located within the support 514 and are arranged around the rotating tray 512; the ejector pins 518 are used to move relative to the rotating tray 512 and have a lifting position and a lowering position; the top of the ejector pin 518 located at the lifting position is higher than the top of the rotating tray 512; when the ejector pin 518 moves to the lifting position, it is used to lift the wafer 5 on the rotating tray 512 so that the back side of the wafer 5 is higher than the top of the moving tray 513; the top of the ejector pin 518 located at the lowering position is lower than the top of the rotating tray 512; when the ejector pin 518 moves to the lowering position, it is used to place the wafer 5 on the rotating tray 512 so that the top of the rotating tray 512 adsorbs the central region of the back side of the wafer 5.

[0045] In some specific embodiments, the number of ejector pins 518 is set to 3, and the tops of the 3 ejector pins 518 are kept at the same height and move synchronously to prevent the wafer 5 from slipping off the tops of the ejector pins 518.

[0046] In other specific embodiments, when the ejector pin 518 moves to the lifting position, it is used to receive the back side of the wafer 5. When the ejector pin 518 moves to the lowering position, its tip is lower than the tip of the rotating tray 512, and the back side of the wafer 5 falls onto the tip of the rotating tray 512 in the opposite Z direction, so that the tip of the rotating tray 512 can attract the central region of the back side of the wafer 5.

[0047] In some specific embodiments, the ejector pin 518 moves to the lifting position to raise the back side of the wafer 5 above the top of the moving tray 513. When the moving tray 513 moves along the X direction to the bottom side of the wafer 5, the ejector pin 518 moves to the lowering position to lower the top of the rotating tray 512, and the back side of the wafer 5 falls onto the top of the moving tray 513 along the opposite Z direction, so that the top of the moving tray 513 can adhere to the edge region of the back side of the wafer 5.

[0048] In some embodiments, the rotating tray 512 includes an upward-facing first suction cup; after the ejector pin 518 moves to the landing station, the first suction cup is used to adsorb the wafer 5; before the ejector pin 518 moves to the lifting station, the first suction cup is used to release the wafer 5.

[0049] In some specific embodiments, the number of the first suction cups is a positive integer greater than 0. In some examples, when the wafer 5 is adsorbed on the rotating tray 512, the center of the first suction cup with a quantity set to 1 and the center of gravity of the wafer 5 are located on the same vertical axis.

[0050] In some embodiments, the moving tray 513 includes an upward second suction cup; after the thimble 518 moves to the rising station, the second suction cup is used to adsorb the wafer 5; after the brush head 511 ends its moving state, the second suction cup is used to release the wafer 5.

[0051] In some specific embodiments, the number of the second suction cups is a positive integer greater than 1. In some examples, when the wafer 5 is adsorbed on the moving tray 513, the connecting lines of the centers of the first suction cups with a quantity set to 2 form a line segment. The midpoint of the line segment and the center of gravity of the wafer 5 are located on the same vertical axis.

[0052] In some examples, when the wafer 5 is adsorbed on the moving tray 513, the connecting lines of the centers of the first suction cups with a quantity set to 3 form a triangle. The center of the triangle and the center of gravity of the wafer 5 are located on the same vertical axis.

[0053] It should be noted that this design in this embodiment effectively ensures that the wafer 5 can maintain good balance during both the adsorption and release processes, avoiding the wafer 5 from slipping and being damaged or having a position deviation due to uneven weight.

[0054] As Figure 3 shown, in some embodiments, the central region of the back is a circular region with a radius of R1 located at the center of the back of the wafer; the edge region of the back is an annular region with an inner diameter of R2 and an outer diameter of R3 located on the outer periphery of the back of the wafer, and R1 < R2 < R3 is satisfied; the first region of the back is an annular region with an inner diameter of R1 and an outer diameter of R3 located on the outer periphery of the back of the wafer; the second region of the back is a circular region with a radius of R2 located at the center of the back of the wafer.

[0055] As Figure 4 shown, the second embodiment provides a spin coater and developer, including the back washing unit described in any one of the above embodiments, and further including: a film coating unit and a spin coating unit; the film coating unit is used to coat a smooth film layer on the back of the wafer to increase the smoothness of the back of the wafer; the spin coating unit is used to coat a photoresist layer on the front of the wafer to attach a photoresist layer to be exposed on the front of the wafer; the back washing unit is used to control the relative movement of the bristles and the wafer to clean the lower surface of the smooth film layer. The lower surface is the surface of the smooth film layer facing away from the wafer.

[0056] It is worth noting that coating a smooth film layer on the back side of the wafer using the coating unit 41 can significantly improve the smoothness of the wafer's back side, reduce particle adhesion, and improve the accuracy and reliability of subsequent processing and inspection. The back-washing unit effectively cleans the lower surface of the smooth film layer on the back side of the wafer by controlling the movement of the brush, removing contaminants. This not only helps improve the accuracy of inspection but also prevents contaminants from contaminating the wafer in subsequent processes, thus improving the overall reliability of the process.

[0057] In some embodiments, the device further includes: a coating and developing apparatus and an exposure unit; the coating and developing apparatus includes a wafer cassette module, a liquid treatment module, an interlayer interface tower, and a heat treatment module arranged sequentially in a horizontal direction; the back washing unit and the exposure unit are located on the side of the heat treatment module away from the interlayer interface tower; the interlayer interface tower is used to hold wafers transferred between the liquid treatment module and the heat treatment module; the exposure unit is used to expose the wafers; the wafer cassette module includes the coating unit, the wafer cassette interface tower, and an interlayer robot assembly; the wafer cassette interface tower is used to hold wafers coated with a smooth film layer; the interlayer robot assembly is used to move wafers from the wafer coating unit... The wafers are either transferred to the wafer cassette interface tower or removed from the wafer cassette interface tower. The liquid treatment module includes the coating unit, the developing unit, and a liquid treatment robot assembly. The liquid treatment robot assembly is used to transfer wafers from the wafer cassette interface tower to the coating unit, and also to transfer wafers from the coating unit to the interlayer interface tower. The heat treatment module includes the first baking unit, the stripping unit, and a heat treatment robot assembly. The heat treatment robot assembly is used to transfer wafers to the first baking unit, and also to transfer wafers from the first baking unit to the stripping unit, and to remove wafers from the stripping unit.

[0058] In some specific embodiments, the coating and developing equipment includes a wafer cassette module 400, a liquid treatment module 200, an interlayer module 100, a heat treatment module 300, and an interface module 500 arranged sequentially along the X direction. The wafer cassette module includes: an inbound / outbound robot 1, a second interlayer robot 2, a first loading interface LP1, a second loading interface LP2, a third loading interface LP3, a fourth loading interface, a first main interface PSI1, a wafer cassette interface tower T1, a wafer cassette robot 4, and the coating unit. The first loading interface LP1 and the third loading interface LP3 are used to load unprocessed wafers, while the second loading interface LP2 and the fourth loading interface are used to load processed wafers. The inbound / outbound robot 1 is used to move wafers from the wafer cassette interface tower T1 to the first main interface PSI1, and also to move wafers from the second loading interface LP2 and the fourth loading interface to a crane. The second interlayer robot 2 is used to transfer wafers from the first main interface PSI1 to the coating unit. The second interlayer robot 2 is also used to transfer wafers within the coating unit to the wafer cassette interface tower T1. The wafer cassette robot 4 is used to transfer wafers from the overhead crane to the first loading interface; the wafer cassette robot 4 is also used to transfer wafers from the second loading interface to the overhead crane.

[0059] like Figure 5 and Figure 6 As shown, in some other specific embodiments, the wafer cassette interface tower T1 has interfaces SCPC1, SCPC2, and SCPC3 with integrated cooling units for cooling the wafers. The second interlayer robot 2 is also used to transfer wafers within the coating unit to the interfaces SCPC1, SCPC2, and SCPC3 with integrated cooling units.

[0060] In some other specific embodiments, the wafer cassette interface tower T1 has interfaces PSI21, PSI22 and PSI23, and the inbound / outbound robot 1 is used to transfer the wafers on interfaces PSI21, PSI22 and PSI23 to the second loading interface LP2.

[0061] In some specific embodiments, the second interlayer robot 2 is located on the Y-direction side of the cassette interface tower T1. The coating unit 41 is located on the Y-direction side of the second interlayer robot 2. The first loading interface LP1 is located on the Z-direction side of the second loading interface LP2. The X, Y, and Z directions are perpendicular to each other.

[0062] In some embodiments, the interlayer module 100 is configured as the interlayer interface tower T2, including a wafer entry frame and a wafer return frame; the wafer entry frame is provided with interfaces PSI2, PSI3, and PSI4. The wafer return frame is provided with interfaces SCPC7, SCPC8, and SCPC9, and interfaces PSI15, PSI16, PSI17, PSI18, PSI19, and PSI20 for integrated cooling units.

[0063] In some embodiments, the liquid processing module includes an infeed liquid processing frame and a return liquid processing frame; the infeed liquid processing frame includes a fourth liquid processing robot 14, a fifth liquid processing robot 15, a sixth liquid processing robot 16, and a coating unit PR. The return liquid processing frame includes a first liquid processing robot 11, a second liquid processing robot 12, a third liquid processing robot 13, and a developing unit SDC.

[0064] In some specific embodiments, the third liquid handling robot 13 is used to transfer wafers on the interface SCPC9 of the integrated cooling unit to the developing unit SDC; the third liquid handling robot 13 is also used to transfer wafers in the developing unit SDC to the interface PSI19; the third liquid handling robot 13 is also used to transfer wafers on the interface PSI20 to the interface PSI23.

[0065] In other specific embodiments, the fourth liquid handling robot 14 is used to transfer the wafer on the interface SCPC1 of the integrated cooling unit to the coating unit PR; the fourth liquid handling robot 14 is used to transfer the wafer in the coating unit PR to the interface PSI2.

[0066] like Figure 5 As shown, the wafer entry solution handling frames are set as frames S4, S5, and S6. The wafer return solution handling frames are set as frames S1, S2, and S3. Each solution handling frame contains one solution handling robot.

[0067] like Figure 6As shown, in some embodiments, the interface module 500 includes a third interface tower T3, a cache unit BF, a cooling unit CPC, a second main interface PSI11, a backwash robot 31, a forward wash robot 32, an interface robot 33, and a backwash unit 51. The third interface tower T3 has interfaces PSI5, PSI6, PSI7, PSI12, PSI13, and PSI14. The backwash robot 31 is used to transfer wafers from interfaces SCPC7, SCPC8, and SCPC9 to the backwash unit 51. The backwash robot 31 is also used to transfer wafers from the backwash unit 51 to the cache unit BF. The forward wash robot 32 is used to transfer wafers from the cache unit BF to the cooling unit CPC. The interface robot 33 is used to transfer wafers from the cooling unit CPC to the lithography machine SCAN, and the interface robot 33 is also used to transfer wafers from the lithography machine SCAN to the second main interface PSI11. The forward washing robot 32 is also used to transfer wafers on the second main interface PSI11 to interfaces PSI12, PSI13, and PSI14.

[0068] In some embodiments, the heat treatment module 300 includes an infeed heat treatment frame and a return heat treatment frame. The infeed heat treatment frame includes a soft bake unit, an edge exposure unit (WEE), a fourth heat treatment robot 24, a fifth heat treatment robot 25, and a sixth heat treatment robot 26. The return heat treatment frame includes a post-exposure baking unit (PEB), a developing unit (SDC), a hard bake unit (Hard bake), a film removal unit (BRS), an optical defect detection unit (AOI), a first heat treatment robot 21, a second heat treatment robot 22, and a third heat treatment robot 23.

[0069] In some specific embodiments, the fourth heat treatment robot 24 is used to transfer the wafer on the interface PSI2 to the soft bake unit; the fourth heat treatment robot 24 is also used to transfer the wafer in the soft bake unit to the edge exposure unit WEE; the fourth heat treatment robot 24 is also used to transfer the wafer in the edge exposure unit WEE to the interface PSI5.

[0070] In other specific embodiments, the third heat treatment robot 23 is used to transfer the wafer on the interface PSI 14 to the post-exposure baking unit PEB; the third heat treatment robot 23 is also used to transfer the wafer in the post-exposure baking unit PEB to the interface SCPC9 of the integrated cooling unit; the third heat treatment robot 23 is also used to transfer the wafer on the interface PSI 19 to the hard bake unit; the third heat treatment robot 23 is also used to transfer the wafer in the hard bake unit to the film stripping unit BRS; the third heat treatment robot 23 is also used to transfer the wafer in the film stripping unit BRS to the optical defect detection unit AOI; the third heat treatment robot 23 is also used to transfer the wafer in the optical defect detection unit AOI to the interface PSI 20.

[0071] like Figure 5 As shown, the infeed heat treatment frame is set as frames H4, H5, and H6. The return heat treatment frame is set as frames H1, H2, and H3. A heat treatment robot is installed in each heat treatment frame.

[0072] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A backwashing unit, used in a coating and developing apparatus, characterized in that, include: Brush head, rotating tray, moving tray and support; The brush head is movable relative to the bracket and has a first station located inside the bracket and a second station located outside the bracket; The support has a first opening facing outward toward the rotating tray and a second opening facing the brush head; the first opening is used to receive the wafer; the second opening is used to receive the brush head; the support is used to support the rotating tray. The rotating tray is fixed to the inside or top side of the bracket; when the rotating tray adsorbs the central area of ​​the back side of the wafer, the brush head is used to reach the first station through the second opening to contact the first area of ​​the back side of the wafer; the first area of ​​the back side includes the edge area of ​​the back side of the wafer; when the rotating tray is in working state, it is used to drive the wafer to rotate relative to the brush head to clean the first area of ​​the back side of the wafer. The movable tray is located on the top side of the support and is used to adsorb the edge area of ​​the back side of the wafer; when the movable tray moves the wafer out of the support, the brush head is used to reach the second station through the second opening to contact the second area of ​​the back side of the wafer; the second area of ​​the back side includes the central area of ​​the back side of the wafer; when the brush head is in motion, it is used to move relative to the wafer to clean the second area of ​​the back side of the wafer.

2. The back-washing unit according to claim 1, characterized in that, The brush head includes bristles with a hardness lower than that of the back side of the wafer, for cleaning the back side of the wafer.

3. The back-washing unit according to claim 2, characterized in that, The back side of the wafer is coated with a smooth film, and the hardness of the brush bristles is lower than that of the smooth film.

4. The back-washing unit according to claim 1, characterized in that, The brush head is fixed to a transmission manipulator; the transmission manipulator is used to drive the brush head to move to the first station or the second station.

5. The back-washing unit according to claim 2, characterized in that, The brush head is also connected to a vibrating part; When the brush head is in the second working position, the vibrating part is used to drive the brush head to vibrate so that the bristles sweep away the particles located in the second area on the back side.

6. The back-washing unit according to claim 1, characterized in that, It also includes ejector pins; the number of ejector pins is set to N, where N is a positive integer greater than or equal to 3; the ejector pins are located within the bracket and arranged around the rotating tray; the ejector pins are used to move relative to the rotating tray and have a lifting position and a lowering position; The top of the ejector pin located at the lifting station is higher than the top of the rotating tray; when the ejector pin moves to the lifting station, it is used to lift the wafer on the rotating tray so that the back side of the wafer is higher than the top of the moving tray. The top tip of the ejector pin located at the landing station is lower than the top tip of the rotating tray; when the ejector pin moves to the landing station, it is used to place the wafer on the rotating tray so that the top tip of the rotating tray adsorbs the central region of the back side of the wafer.

7. The back-washing unit according to claim 6, characterized in that, The rotating tray includes an upward-facing first suction cup; after the ejector pin moves to the landing station, the first suction cup is used to pick up the wafer; Before the ejector pin moves to the lifting position, the first suction cup is used to release the wafer.

8. The back-washing unit according to claim 6, characterized in that, The movable tray includes an upward-facing second suction cup; after the ejector pin moves to the raised position, the second suction cup is used to adsorb the wafer; After the brush head finishes its movement, the second suction cup is used to release the wafer.

9. The back-washing unit according to claim 1, characterized in that, The central region of the back side is a circular region with radius R1 located at the center of the back side of the wafer; the edge region of the back side is an annular region with inner diameter R2 and outer diameter R3 located on the outer periphery of the back side of the wafer, and satisfies R1 <R2<R3; The first region on the back side is an annular region with an inner diameter of R1 and an outer diameter of R3 located on the outer periphery of the back side of the wafer; the second region on the back side is a circular region with a radius of R2 located at the center of the back side of the wafer.

10. A coating and developing apparatus, comprising the back washing unit according to any one of claims 1 to 9, characterized in that, Also includes: The unit includes a laminating unit, an adhesive coating unit, a developing unit, a first baking unit, and a stripping unit. The coating unit is used to coat a smooth film layer on the back side of the wafer to increase the smoothness of the back side of the wafer; The coating unit is used to coat the front side of the wafer with a photoresist layer so that the front side of the wafer is attached to the photoresist layer to be exposed. The back-washing unit is used to control the relative movement of the brush bristles with the wafer to clean the lower surface of the smooth film layer; the lower surface is the surface of the smooth film layer that faces away from the wafer. The developing unit is used to coat the wafer with a developing solution so that a portion of the photoresist layer dissolves or adheres to the front side of the wafer to form a mask pattern. The first baking unit is used to bake and shape the photoresist layer that forms the mask pattern; The film removal unit is used to remove the smooth film layer applied to the back side of the wafer.

11. The apparatus according to claim 10, characterized in that, Also includes: Coating and developing equipment and exposure unit; The coating and developing equipment includes a wafer cassette module, a liquid treatment module, an interlayer interface tower, and a heat treatment module arranged in a horizontal direction; the back washing unit and the exposure unit are located on the side of the heat treatment module away from the interlayer interface tower; the interlayer interface tower is used to hold the wafers transferred between the liquid treatment module and the heat treatment module; the exposure unit is used to expose the wafers. The wafer cassette module includes a coating unit, a wafer cassette interface tower, and an interlayer robot assembly. The wafer cassette interface tower is used to place wafers coated with a smooth film. The interlayer robot assembly is used to transfer wafers from the wafer coating unit to the wafer cassette interface tower, or to remove wafers from the wafer cassette interface tower. The liquid processing module includes the coating unit, the developing unit, and the liquid processing robot assembly; the liquid processing robot assembly is used to transfer wafers from the wafer cassette interface tower to the coating unit, and also to transfer wafers from the coating unit to the interlayer interface tower; The heat treatment module includes a first baking unit, a film removal unit, and a heat treatment robot assembly. The heat treatment robot assembly is used to transfer wafers to the first baking unit, transfer wafers from the first baking unit to the film removal unit, and remove wafers from the film removal unit.

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