Semiconductor cleaning device

Abstract

The utility model provides a semiconductor cleaning device, which is characterized in that a wafer transportation structure is used for moving, lifting and limiting and driving a wafer to rotate, and a cleaning brush transfer arm is used for moving a semiconductor cleaning brush; and the cleaning sheet is detachably and fixedly connected with the placing table and is used for removing residues on the semiconductor cleaning brush. According to the utility model, the cleaning sheet is arranged to clean the semiconductor cleaning brush, so that the problem that residues fall on a wafer after the semiconductor cleaning brush is used is reduced; meanwhile, the cleaning sheet with the zeta potential opposite to that of the semiconductor cleaning brush enables the semiconductor cleaning brush to be close to the cleaning sheet, residues generated after the semiconductor cleaning brush is used are adsorbed to the cleaning sheet for self-cleaning through electrostatic force when the semiconductor cleaning brush is close to the cleaning sheet, and the residues generated after the semiconductor cleaning brush is used are further prevented from falling onto the wafer; in addition, the cleaning piece is of a detachable structure and can be replaced, and the self-cleaning effect of the cleaning piece on the semiconductor cleaning brush is guaranteed; finally, the cleaning efficiency is improved through electrostatic force, self-cleaning can be achieved before the semiconductor cleaning brush is used every time, and the residue risk is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor equipment, especially a kind of semiconductor cleaning device. BACKGROUND

[0002] In the chemical mechanical polish (CMP) process, the wafer is attracted by the polishing head to contact with the polishing pad in the polishing liquid environment, and the chemical and mechanical effects are combined to achieve the effect of polishing and flattening the wafer surface.

[0003] After the CMP process is polished, the Brush is used to clean the wafer surface in the machine to remove the pollutants such as organic matter, derivative and polishing particle brought by the polishing liquid. However, when cleaning the wafer surface, the Brush made of porous PVA (polyvinyl alcohol) material is usually used for cleaning. The polishing particles or organic matter remaining in the pores of the Brush are difficult to remove, which may cause the cleaning effect of the Brush on the wafer surface to be poor, so that the organic matter may remain on the wafer surface after cleaning. The organic matter remaining on the wafer surface will form additional holes when removed in the subsequent etching process. After electroplating copper by ECP (Electrochemical Plating) or other methods, the additional holes formed on the wafer surface will be filled with copper, which may cause short circuit and other problems between the components insulated by the flat surface. Therefore, it is very important to reduce the organic matter remaining in the Brush.

[0004] In the prior art, when cleaning the polishing particles and organic matter remaining in the pores of the Brush, the machine flushes the Brush from the inside to the outside by spraying water. However, this method has the disadvantages of long self-cleaning time and low efficiency of the Brush. Moreover, since it needs a long cleaning time, it can only be cleaned when the machine is idle. When the machine needs to run continuously and a large amount of goods, the Brush cannot be cleaned in time, which will become dirtier and dirtier, resulting in gradually poor quality of the cleaned wafers and affecting the product yield.

[0005] Therefore, there is an urgent need for a structure that can improve the self-cleaning efficiency of the Brush used to clean the wafer surface.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of clearly and completely describing the technical scheme of the present application and for the convenience of understanding by those skilled in the art, and the above technical scheme cannot be considered as known to those skilled in the art only because it is described in the background section of the present application. CONTENT OF THE UTILITY MODEL

[0007] In view of the above-mentioned prior art defects, the semiconductor cleaning device is provided to solve the problem of poor cleaning effect of the semiconductor cleaning brush on the wafer.

[0008] To achieve the above object and other related objects, the utility model provides the following technical scheme:

[0009] The utility model provides a semiconductor cleaning device, the semiconductor cleaning device includes: cleaning chamber, wafer transportation structure, cleaning structure, cleaning brush transfer arm and self cleaning structure,

[0010] The cleaning chamber includes a working area and an idle area, the wafer transportation structure and the cleaning structure are located in the working area, and the self cleaning structure is located in the idle area.

[0011] The wafer transportation structure includes a wafer moving mechanical arm and a wafer rotating fixture, the wafer moving mechanical arm is used to move the wafer in and out of the cleaning chamber, and the wafer rotating fixture is used to lift and position the wafer at a cleaning position and drive the wafer to perform a central rotational motion.

[0012] The cleaning structure includes a cleaning liquid supply mechanism, a semiconductor cleaning brush, a cleaning brush rotating drive mechanism and a cleaning brush transfer arm, the cleaning liquid supply mechanism is located above the cleaning position of the wafer and is used to provide cleaning liquid during the cleaning of the wafer by the semiconductor cleaning brush, the cleaning brush rotating drive mechanism is connected with the semiconductor cleaning brush and is used to drive the semiconductor cleaning brush to roll, and the cleaning brush transfer arm is connected with the semiconductor cleaning brush and is used to drive the semiconductor cleaning brush to move horizontally and vertically between the working area and the idle area.

[0013] The self cleaning structure includes a placement table, a detachable fixing structure and a cleaning sheet, the cleaning sheet is located on the placement table, the cleaning sheet is detachably fixedly connected with the placement table through the detachable fixing structure, and the cleaning sheet is used to remove the residues on the semiconductor cleaning brush.

[0014] Optionally, one of the cleaning sheet and the semiconductor cleaning brush has a positive zeta potential, and the other has a negative zeta potential.

[0015] Optionally, the semiconductor cleaning brush has a negative zeta potential.

[0016] Optionally, the cleaning sheet is made of an insulating material.

[0017] Optionally, the cleaning sheet is made of one or more than one of Si, SiC, SiCN, SiCO, SiN or SiO2 in any combination.

[0018] Optionally, a direction parallel to the central axis of the semiconductor cleaning brush is a first direction, and a length of the cleaning sheet along the first direction is greater than or equal to a diameter of the wafer.

[0019] Optionally, the semiconductor cleaning brush is polyvinyl alcohol with a negative zeta potential, and the cleaning sheet is a silicon sheet with a positive zeta potential.

[0020] Optionally, the detachable fixing structure is one or any combination of more than one of a detachable buckle, a magnetic attraction structure, a bolt fixing structure, a key connection structure, a lock connection structure, and a pin connection structure.

[0021] Optionally, the detachable fixing structure includes two or more detachable buckles, and each detachable buckle is distributed at an edge of the cleaning sheet.

[0022] Optionally, the semiconductor cleaning device further includes a pressurizing structure configured to drive the semiconductor cleaning brush to exert pressure on the cleaning sheet to increase a friction force between the semiconductor cleaning brush and the cleaning sheet, so as to clean the semiconductor cleaning brush.

[0023] As described above, the semiconductor cleaning device has the following beneficial effects:

[0024] The semiconductor cleaning brush can be cleaned by the cleaning sheet arranged in the cleaning chamber, so that residues of the semiconductor cleaning brush after use can be reduced to fall on the wafer to cause a problem.

[0025] The semiconductor cleaning device can further reduce residues of the semiconductor cleaning brush after use to fall on the wafer to form a hole, cause a short circuit, and other defect problems in subsequent processes. Figure 2 As shown in the figure, the cleaning sheet is replaced, and the cleaning sheet and the placement table are detachably fixed and connected through the detachable fixing structure, so that the cleaning sheet is a detachable structure, and the self-cleaning effect of the cleaning sheet on the semiconductor cleaning brush can be ensured.

[0026] This invention, by using an insulating material for the cleaning sheet, avoids potential corrosion of the cleaning sheet in the humid environment of the semiconductor cleaning device, thereby extending the service life of the cleaning sheet. It also reduces the risk of the cleaning sheet corroding, causing loose particles to stick to the semiconductor cleaning brush during self-cleaning, thus preventing secondary contamination of the brush. Furthermore, using an insulating material prevents charged particles from the cleaning sheet from adhering to the semiconductor cleaning brush and affecting the electrical properties of the subsequently cleaned wafers, improving wafer production yield and operational reliability.

[0027] This invention, by setting the length of the cleaning plate in the first direction, ensures that the portion of the semiconductor cleaning brush that contacts the wafer can contact the cleaning plate and be cleaned by it. This further ensures the self-cleaning effect of the cleaning plate on the semiconductor cleaning brush and further reduces the problem of residual contaminants on the semiconductor cleaning brush falling onto the wafer and causing defects.

[0028] By aligning the cleaning plate with the midpoint of the wafer in the first direction, this invention can further ensure that the cleaning plate can clean all positions on the semiconductor cleaning brush corresponding to the wafer, and minimize the path of the semiconductor cleaning brush from the wafer surface to the cleaning plate surface, thus maximizing efficiency.

[0029] This invention utilizes the fact that the semiconductor cleaning brush is made of polyvinyl alcohol (PVA) with a negative zeta potential and the cleaning sheet is made of silicon wafer with a positive zeta potential. By using polyvinyl alcohol as the commonly used semiconductor cleaning brush material in semiconductor cleaning devices and silicon wafer as a readily available material in semiconductor processes, it can better adapt to the improved conditions in existing processes.

[0030] This invention achieves the best self-cleaning effect for the semiconductor cleaning brush under specific experimental application scenarios by setting the zeta potential of the materials of the semiconductor cleaning brush and the cleaning sheet.

[0031] This invention uses a planar cleaning plate, which can be used in conjunction with a generally roller-shaped semiconductor cleaning brush, thereby improving the self-cleaning effect of the semiconductor cleaning brush on the cleaning plate.

[0032] This utility model, by setting various detachable fixing structures and their combinations, can select the appropriate detachable fixing structure according to specific application needs to achieve the effect of both detachable and fixed cleaning sheets on the placement table in two application scenarios.

[0033] This utility model, by setting two or more of the aforementioned detachable buckles, can fix the cleaning sheet at different positions on the placement table, thereby improving the fixing effect of the cleaning sheet on the placement table;

[0034] This invention, by setting two detachable buckles at the two opposite edges of the placement platform and the cleaning plate, can ensure that the cleaning plate maintains a stable relative position during the self-cleaning process of the semiconductor cleaning brush under pressure and rotation, thereby improving the reliability of the semiconductor cleaning brush in self-cleaning.

[0035] This invention, by setting a pressurizing structure, enables the semiconductor cleaning brush to apply pressure to the cleaning plate. By utilizing the dual effects of rotation and pressure, the friction between the semiconductor cleaning brush and the cleaning plate and the attraction between positive and negative zeta potentials are increased, further improving the self-cleaning effect and efficiency of the cleaning plate on the semiconductor cleaning brush. Attached Figure Description

[0036] Figure 1 The diagram shown is a three-dimensional perspective view of the semiconductor cleaning device of this utility model.

[0037] Figure 2 The diagram shown is an enlarged schematic of the semiconductor cleaning brush and self-cleaning structure in the semiconductor cleaning device of this utility model.

[0038] Figure 3 This diagram illustrates the process of replacing the cleaning pad in the semiconductor cleaning device of this invention.

[0039] Figure 4 The image shown is a magnified microscopic schematic diagram of the surface of self-cleaning contaminants on the cleaning plate of the semiconductor cleaning device of this invention.

[0040] Explanation of reference numerals in the attached figures

[0041] 1. Placement stage; 2. Cleaning sheet; 21. Old cleaning sheet; 22. New cleaning sheet; 3. Semiconductor cleaning brush; 4. Detachable fixing structure; 5. Contaminant; 60. Cleaning chamber; 61. Wafer moving robotic arm; 62. Wafer rotating support; 63. Cleaning fluid supply mechanism; 64. Cleaning brush transfer arm; 65. Wafer; 66. Cleaning brush rotation drive mechanism; A. Working area; B. Idle area. Detailed Implementation

[0042] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0043] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0044] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0045] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0046] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0047] In existing technologies, however, since cleaning wafer surfaces typically involves removing organic residues from the brush, it is crucial to minimize this residue.

[0048] In existing technologies, after CMP (Chemical Mechanical Polishing) grinding, the wafer surface needs to be cleaned with a brush in the machine to remove contaminants such as organic matter, derivatives, and abrasive particles brought in by the polishing slurry. However, since the brush is usually made of porous PVA (polyvinyl alcohol), the abrasive particles or organic matter remaining in the pores of the brush are often difficult to remove, resulting in a poor cleaning effect on the wafer surface. Consequently, organic matter remains on the wafer after surface cleaning, which can lead to product defects in subsequent processes. When the machine uses water spraying from the inside out to rinse away the abrasive particles and organic matter remaining in the brush pores, the self-cleaning time of the brush is long and the efficiency is low. Moreover, because the cleaning time is long, it can only be cleaned during the machine's idle period. When the machine needs to continuously process large quantities of products, the brush cannot be cleaned in time, thus becoming increasingly dirty, leading to a gradual deterioration in the quality of the cleaned wafers and affecting product yield.

[0049] This invention provides a semiconductor cleaning device, such as... Figures 1-2 As shown, the semiconductor cleaning device includes: a cleaning chamber 60, a wafer transport structure, a cleaning structure, a cleaning brush transfer arm 64, and a self-cleaning structure;

[0050] The cleaning chamber 60 includes a working area A and an idle area B. The wafer transport structure and the cleaning structure are located in the working area A, and the self-cleaning structure is located in the idle area B.

[0051] The wafer transport structure includes a wafer moving robotic arm 61 and a wafer rotating support 62; the wafer moving robotic arm 61 is used to move the wafer 65 into and out of the cleaning chamber 60, and the wafer rotating support 62 is used to lift and limit the wafer 65 in the cleaning position and drive the wafer 65 to perform a central rotational movement.

[0052] The cleaning structure includes a cleaning fluid supply mechanism 63, a semiconductor cleaning brush 3, a cleaning brush rotation drive mechanism 66, and a cleaning brush transfer arm 64. The cleaning fluid supply mechanism is located above the cleaning position of the wafer 65 and is used to provide cleaning fluid during the cleaning process of the semiconductor cleaning brush 3 on the wafer 65. The cleaning brush rotation drive mechanism 66 is connected to the semiconductor cleaning brush 3 and is used to drive the semiconductor cleaning brush 3 to rotate. The cleaning brush transfer arm 64 is connected to the semiconductor cleaning brush 3 and is used to drive the semiconductor cleaning brush 3 to move horizontally and vertically between the working area A and the idle area B.

[0053] The self-cleaning structure includes a placement platform 1, a detachable fixing structure 4, and a cleaning plate 2; the cleaning plate 2 is located on the placement platform 1, and the cleaning plate 2 is detachably fixed to the placement platform 1 through the detachable fixing structure 4; the cleaning plate 2 is used to remove residues from the semiconductor cleaning brush 3.

[0054] This invention, through the arrangement of the cleaning plate 2 in the cleaning chamber 60 and the cleaning brush transfer arm 64, allows the semiconductor cleaning brush 3 to be moved onto the cleaning plate 2 when it is idle, and the semiconductor cleaning brush 3 to be cleaned by the cleaning plate 2. This reduces the problem of residue from the semiconductor cleaning brush 3 falling onto the wafer 65 after use and causing defects.

[0055] Specifically, the cleaning brush rotation drive mechanism 66, which "drives the semiconductor cleaning brush 3 to roll", can make the semiconductor cleaning brush 3 roll on the surface of the wafer 65 to be cleaned to clean the wafer 65, or make the semiconductor cleaning brush 3 roll on the cleaning plate 2 to perform self-cleaning of the semiconductor cleaning brush 3. The position of the semiconductor cleaning brush 3 is changed by the cleaning brush transfer arm 64 to move the semiconductor cleaning brush 3.

[0056] Specifically, the cleaning brush transfer arm 64 can be an existing robotic arm inside the semiconductor cleaning device, or other suitable moving structures can be set up as the cleaning brush transfer arm 64 to move the semiconductor cleaning brush 3, so as to avoid potential contamination risks to the existing robotic arm that needs to be operated.

[0057] Specifically, the idle area B where the placement platform 1 and the cleaning plate 2 are located is adjacent to the working area A when the wafer 65 in the semiconductor cleaning device is cleaned. This facilitates the self-cleaning of the semiconductor cleaning brush 3 and saves the time required for self-cleaning. Alternatively, the idle area B and the working area A can be set to other suitable distribution methods as needed, so that the semiconductor cleaning brush 3 can be moved to the cleaning plate 2 by the moving structure as soon as possible after completing the cleaning process, and the setting of the cleaning plate 2 does not affect the movement and use of the various components in the semiconductor cleaning device.

[0058] In one embodiment, one of the cleaning pads 2 and the semiconductor cleaning brush 3 has a positive zeta potential and the other has a negative zeta potential.

[0059] This invention uses a material with an opposite zeta potential to the semiconductor cleaning brush 3 as the cleaning plate 2. The two materials with opposite zeta potentials generate electrostatic force when brought close together. This electrostatic force attracts residue from the semiconductor cleaning brush 3 onto the cleaning plate 2 for self-cleaning, further reducing the risk of residue falling onto the wafer 65 and causing defects such as holes and short circuits in subsequent processes. Simultaneously, because it utilizes electrostatic force, the cleaning speed is fast and effective, improving cleaning efficiency. This allows for self-cleaning during the short interval before each use of the semiconductor cleaning brush 3, eliminating the need to wait until the machine is idle, thus reducing the risk of residue on the semiconductor cleaning brush 3 before use. Furthermore, as... Figure 2 The process of replacing the cleaning pad 2 is shown. By setting the cleaning pad 2 and the placement platform 1 to be detachably fixedly connected by a detachable fixing structure 4, the cleaning pad 2 is a detachable and replaceable structure, thereby ensuring the self-cleaning effect of the cleaning pad 2 on the semiconductor cleaning brush 3.

[0060] Specifically, the limitation on the zeta potential of the cleaning plate 2 and the semiconductor cleaning brush 3 in this invention is only used to select existing materials with suitable properties for the cleaning plate 2 and the semiconductor cleaning brush 3, and is not an improvement on the composition of the materials themselves.

[0061] In one embodiment, the zeta potential of the semiconductor cleaning brush 3 is negative.

[0062] Specifically, the semiconductor cleaning brush 3 commonly used in this field has a negative zeta potential, which is more suitable for the needs of existing semiconductor cleaning devices for the semiconductor cleaning brush 3; however, the semiconductor cleaning brush 3 can also be replaced with a material with a positive zeta potential according to specific needs, and this solution does not make any special restrictions.

[0063] In one embodiment, the cleaning sheet 2 is an insulating material.

[0064] By using an insulating material, this invention avoids potential corrosion of the cleaning sheet 2 in the humid environment of the semiconductor cleaning device, thereby improving its service life. It also reduces the risk of the cleaning sheet 2 becoming loose and sticking to the semiconductor cleaning brush 3 during self-cleaning due to corrosion, thus preventing secondary contamination. Furthermore, using an insulating material prevents charged particles from the cleaning sheet 2 from adhering to the semiconductor cleaning brush 3 and affecting the electrical properties of the subsequently cleaned wafer 65, improving the wafer 65's production yield and operational reliability.

[0065] In one embodiment, the cleaning sheet 2 is one or more of Si, SiC, SiCN, SiCO, SiN, or SiO2, and any combination thereof.

[0066] Specifically, the cleaning sheet 2 can also be made of other suitable existing insulating materials, all of which are within the protection scope of this utility model.

[0067] In one embodiment, the direction parallel to the central axis of the semiconductor cleaning brush 3 is the first direction, and the length of the cleaning plate 2 along the first direction is greater than or equal to the diameter of the wafer 65.

[0068] By setting the length of the cleaning plate 2 in the first direction, this utility model ensures that the part of the semiconductor cleaning brush 3 that contacts the wafer 65 can contact the cleaning plate 2 and be cleaned by the cleaning plate 2. This further ensures the self-cleaning effect of the cleaning plate 2 on the semiconductor cleaning brush 3 and further reduces the problem of residual contaminants 5 on the semiconductor cleaning brush 3 falling onto the wafer 65 and causing defects.

[0069] In one embodiment, the midpoint of the cleaning plate 2 in the first direction coincides with the projection of the midpoint of the wafer 65 in the first direction. Specifically, by aligning the midpoint of the cleaning plate 2 with the midpoint of the wafer 65 in the first direction, it can be further ensured that the cleaning plate 2 can clean all positions on the semiconductor cleaning brush corresponding to the cleaning wafer 65, and the path of the semiconductor cleaning brush 3 from the surface of the wafer 65 to the surface of the cleaning plate 2 is minimized, resulting in the highest efficiency.

[0070] In one embodiment, the semiconductor cleaning brush 3 is polyvinyl alcohol (PVA) with a negative zeta potential, and the cleaning plate 2 is a silicon wafer with a positive zeta potential.

[0071] This invention utilizes the fact that the semiconductor cleaning brush 3 is made of polyvinyl alcohol (PVA) with a negative zeta potential, and the cleaning plate 2 is made of silicon wafer with a positive zeta potential. By using polyvinyl alcohol as the material commonly used in semiconductor cleaning devices and silicon wafer as a readily available material in semiconductor processes, this invention can better adapt to the improved conditions in existing processes.

[0072] Specifically, however, the materials of the semiconductor cleaning brush 3 and the cleaning plate 2 can also be any other suitable materials, as long as the zeta potential of the semiconductor cleaning brush 3 and the cleaning plate 2 is opposite.

[0073] In one embodiment, the semiconductor cleaning brush 3 is polyvinyl alcohol with a zeta potential of -24.8mV, and the cleaning plate 2 is a silicon wafer with a zeta potential of +12.5mV.

[0074] By setting the zeta potential of the materials of the semiconductor cleaning brush 3 and the cleaning sheet 2, this invention can achieve the best self-cleaning effect for the semiconductor cleaning brush 3 under specific experimental application scenarios.

[0075] Specifically, the zeta potential of the materials of the semiconductor cleaning brush 3 and the cleaning plate 2 does not need to be specifically limited, as long as one of them has a positive zeta potential and the other has a negative zeta potential, so as to generate an electrostatic force that allows the contaminants 5 on the semiconductor cleaning brush 3 to be adsorbed onto the cleaning plate 2; in particular, the selection and matching of the materials of the semiconductor cleaning brush 3 and the cleaning plate 2 that have the best adsorption effect on the contaminants 5 on the semiconductor cleaning brush 3 can also be obtained through experiments.

[0076] Specifically, the polyvinyl alcohol with a zeta potential of -24.8mV and the silicon wafer with a zeta potential of +12.5mV are both selections of existing materials, rather than improvements to the composition of the materials themselves.

[0077] In one embodiment, such as Figure 2 As shown, the cleaning sheet 2 has a planar structure.

[0078] This utility model, by employing a planar cleaning sheet 2, can be used in conjunction with, generally speaking, such as Figure 1 The semiconductor cleaning brush 3 shown in the roller shape is beneficial to improving the self-cleaning effect of the semiconductor cleaning brush 3 on the cleaning plate 2.

[0079] Specifically, the cleaning sheet 2 can also be configured in other suitable forms according to specific application requirements, all of which are within the protection scope of this utility model.

[0080] In one embodiment, the detachable fixing structure 4 is any combination of one or more of the following: detachable buckle, magnetic structure, bolt fixing structure, key connection structure, locking connection structure, and pin connection structure.

[0081] This utility model, by setting various detachable fixing structures 4 and their combinations, can select the appropriate detachable fixing structure 4 according to specific application requirements to achieve the effect of both detachable and fixed cleaning sheet 2 on the placement table 1 in two application scenarios.

[0082] Specifically, other suitable detachable fixing structures 4 can also be selected, all of which are within the protection scope of this utility model.

[0083] In one embodiment, the detachable fixing structure 4 includes two or more detachable buckles, each of which is distributed along the edge of the cleaning sheet 2.

[0084] This utility model, by setting two or more of the aforementioned detachable buckles, can fix the cleaning sheet 2 at different positions on the placement platform 1, thereby improving the fixing effect of the cleaning sheet 2 on the placement platform 1.

[0085] In one embodiment, such as Figure 2 As shown, the detachable fixing structure 4 includes two detachable buckles.

[0086] In one embodiment, such as Figure 2 As shown, the two detachable buckles are located at the two opposite edges where the placement platform 1 contacts the cleaning sheet 2.

[0087] This invention provides two detachable buckles at the two opposite edges of the placement platform 1 and the cleaning plate 2, thereby ensuring that the cleaning plate 2 maintains a stable relative position during the self-cleaning process of the semiconductor cleaning brush 3 under pressure and rotation, thus improving the reliability of the self-cleaning of the semiconductor cleaning brush 3.

[0088] Specifically, the number of detachable clips can be evenly and symmetrically placed on the edge of the placement platform 1 and the cleaning plate 2 for fixing, or other suitable methods can be used to arrange the position distribution of the detachable clips, all of which are within the protection scope of this utility model.

[0089] In one embodiment, the semiconductor cleaning device further includes a pressurizing structure for driving the semiconductor cleaning brush 3 to apply pressure to the cleaning plate 2 to increase the friction between the semiconductor cleaning brush 3 and the cleaning plate 2, so as to clean the semiconductor cleaning brush 3.

[0090] This invention, by setting a pressurizing structure, enables the semiconductor cleaning brush 3 to apply pressure to the cleaning plate 2. By utilizing the dual effects of rotation and pressurization, the frictional force and the attraction between the positive and negative zeta potentials of the semiconductor cleaning brush 3 and the cleaning plate 2 are increased, thereby further improving the self-cleaning effect and efficiency of the cleaning plate 2 on the semiconductor cleaning brush 3.

[0091] In one embodiment, the pressurizing structure can drive the semiconductor cleaning brush 3 to apply a pressure of 0-15N to the cleaning plate 2. Specifically, other pressure ranges that meet the requirements can also be set, all of which are within the protection scope of this utility model.

[0092] In one embodiment, the method of using the semiconductor cleaning device is as follows:

[0093] The wafer moving robotic arm 61 transports the wafer 65 to be cleaned to the working area A inside the cleaning chamber 60, so that the wafer 65 is lifted by the wafer rotating support 62.

[0094] The cleaning brush transfer arm 64 moves the semiconductor cleaning brush 3 above the wafer 65, the wafer rotation support 62 drives the wafer 65 to rotate, and the cleaning brush rotation drive mechanism 66 drives the semiconductor cleaning brush 3 to rotate, so that the semiconductor cleaning brush 3 cleans the wafer 65.

[0095] After cleaning, the wafer rotating tray 62 stops operating, and the wafer moving robotic arm 61 transports the wafer 65 out of the cleaning chamber 60.

[0096] The cleaning brush transfer arm 64 moves the semiconductor cleaning brush 3 to the surface of the cleaning sheet 2 on the placement table 1 in the idle area B;

[0097] The cleaning brush rotation drive mechanism 66 and the pressurizing structure drive the semiconductor cleaning brush 3 to rotate on the cleaning plate 2 and apply pressure to the cleaning plate 2 to perform self-cleaning of the semiconductor cleaning brush 3;

[0098] After cleaning is completed, the cleaning brush transfer arm 64 moves the semiconductor cleaning brush 3 to the working area A to clean the surface of the wafer 65 that has been newly transported to the working area A.

[0099] like Figure 3As shown, when the old cleaning pad 21 has been used for a preset time, the detachable fixing structure 4 is released, the old cleaning pad 21 is removed from the placement table 1, and a new cleaning pad 22 is installed. The new cleaning pad 22 is then fixed to the placement table 1 again using the detachable fixing structure 4.

[0100] Specifically, the cleaning pad 2 can be replaced at fixed intervals, or other suitable methods can be used to determine whether the cleaning pad 2 needs to be replaced, such as judging the cleanliness of the surface of the cleaning pad 2 or the self-cleaning effect of the semiconductor cleaning brush 3.

[0101] Specifically, such as Figure 4 The image shown is a magnified microscopic view of the surface of the semiconductor cleaning brush 3 after the cleaning sheet 2 has been self-cleaned by the semiconductor cleaning brush 3. It can be seen that there are many contaminants 5 left by the semiconductor cleaning brush 3 on the cleaning sheet 2 after self-cleaning.

[0102] In summary, the semiconductor cleaning device of this invention can clean the semiconductor cleaning brush by placing a cleaning plate in the cleaning chamber, reducing the risk of residue from the semiconductor cleaning brush falling onto the wafer and causing defects. Simultaneously, the cleaning plate is made of a material with the opposite zeta potential to the semiconductor cleaning brush. The two materials with opposite zeta potentials generate electrostatic force when brought close together, which attracts the residue from the semiconductor cleaning brush onto the cleaning plate for self-cleaning. This further reduces the risk of residue from the semiconductor cleaning brush falling onto the wafer and forming holes, short circuits, and other defects in subsequent processes. Furthermore, by making the cleaning plate detachable and replaceable, the self-cleaning effect of the cleaning plate on the semiconductor cleaning brush can be guaranteed. Finally, the electrostatic force results in fast and effective cleaning, improving cleaning efficiency and allowing the semiconductor cleaning brush to self-clean before each use, reducing the risk of residue on the brush before use.

[0103] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0104] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor cleaning device, characterized in that, The semiconductor cleaning device includes: a cleaning chamber, a wafer transport structure, a cleaning structure, a cleaning brush transfer arm, and a self-cleaning structure; The cleaning chamber includes a working area and an idle area. The wafer transport structure and the cleaning structure are located in the working area, and the self-cleaning structure is located in the idle area. The wafer transport structure includes a wafer moving robotic arm and a wafer rotating support; the wafer moving robotic arm is used to move the wafer into and out of the cleaning chamber, and the wafer rotating support is used to lift and limit the wafer at the cleaning position and drive the wafer to perform a central rotational motion. The cleaning structure includes a cleaning fluid supply mechanism, a semiconductor cleaning brush, a cleaning brush rotation drive mechanism, and a cleaning brush transfer arm. The cleaning fluid supply mechanism is located above the cleaning position of the wafer and is used to provide cleaning fluid during the wafer cleaning process by the semiconductor cleaning brush. The cleaning brush rotation drive mechanism is connected to the semiconductor cleaning brush and is used to drive the semiconductor cleaning brush to rotate. The cleaning brush transfer arm is connected to the semiconductor cleaning brush and is used to drive the semiconductor cleaning brush to move horizontally and vertically between the working area and the idle area. The self-cleaning structure includes a placement platform, a detachable fixing structure, and a cleaning plate; the cleaning plate is located on the placement platform, and the cleaning plate is detachably fixed to the placement platform through the detachable fixing structure; the cleaning plate is used to remove residues from the semiconductor cleaning brush.

2. The semiconductor cleaning apparatus according to claim 1, characterized in that: In the cleaning plate and the semiconductor cleaning brush, one has a positive zeta potential and the other has a negative zeta potential.

3. The semiconductor cleaning apparatus according to claim 2, characterized in that: The zeta potential of the semiconductor cleaning brush is negative.

4. The semiconductor cleaning apparatus according to claim 1, characterized in that: The cleaning sheet is made of insulating material.

5. The semiconductor cleaning apparatus according to claim 1, characterized in that: The cleaning sheet is one or more of Si, SiC, SiCN, SiCO, SiN, or SiO2, and any combination thereof.

6. The semiconductor cleaning apparatus according to claim 1, characterized in that: The direction parallel to the central axis of the semiconductor cleaning brush is the first direction, and the length of the cleaning plate along the first direction is greater than or equal to the diameter of the wafer.

7. The semiconductor cleaning apparatus according to any one of claims 2-6, characterized in that: The semiconductor cleaning brush is made of polyvinyl alcohol with a negative zeta potential, and the cleaning plate is made of silicon with a positive zeta potential.

8. The semiconductor cleaning apparatus according to claim 1, characterized in that: The detachable fixing structure is any combination of one or more of the following: detachable buckle, magnetic structure, bolt fixing structure, key connection structure, lock connection structure, and pin connection structure.

9. The semiconductor cleaning apparatus according to claim 8, characterized in that: The detachable fixing structure includes two or more detachable buckles, each of which is distributed on the edge of the cleaning sheet.

10. The semiconductor cleaning apparatus according to claim 9, characterized in that: The semiconductor cleaning device further includes a pressurizing structure for driving the semiconductor cleaning brush to apply pressure to the cleaning plate to increase the friction between the semiconductor cleaning brush and the cleaning plate, so as to clean the semiconductor cleaning brush.

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