Laser soldering tin removing device for circuit board

Abstract

The utility model relates to a laser soldering tin removing device for a circuit board, and relates to the technical field of soldering tin removing devices, the laser soldering tin removing device comprises a base plate and a tool plate, and the tool plate is provided with a clamping piece; cross rods are symmetrically arranged on the two sides of the tool plate, supporting rods are fixedly arranged at the two ends of each cross rod in the vertical direction, and the lower ends of the supporting rods are fixedly connected with the base plate. Moving blocks arranged on the transverse rod in a sliding mode and a first driving piece driving the moving blocks to slide are arranged above the base plate, and an adjusting rod with the two ends fixedly connected with the two moving blocks, an adjusting block arranged on the adjusting rod in a sliding mode and a second driving piece driving the adjusting block to slide in a reciprocating mode are arranged above the base plate. A fixing block and a third driving part for driving the fixing block to slide up and down are arranged below the adjusting block, a laser spray head, a monitoring camera and a tin suction gun are arranged on the fixing block, and a control part for controlling the device to operate is arranged on the base plate. When the soldering tin removing device is applied, soldering tin on the circuit board is automatically removed, and the requirement for large-batch production is met.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of solder removal devices, and in particular to a laser solder removal device for circuit boards. BACKGROUND

[0002] Circuit boards, as the core cornerstone of electronic devices, play an indispensable role in many fields such as information communication, medical technology and automobile industry. With the rapid development of information technology, the production technology of circuit boards is also changing rapidly, giving birth to a series of new circuit boards such as flexible printed circuit boards, impurity circuit boards and organic printed circuit boards. These new circuit boards, with their excellent hardness, transmission speed and anti-interference performance, provide strong support for the iteration and upgrading of electronic products.

[0003] However, in the manufacturing and maintenance process of circuit boards, the removal of solder is always a crucial step. Traditional solder removal methods, such as using an internal hot iron combined with a solder throwing method, a solder suction device or a solder suction belt, etc. Specifically, when using these tools, the worker needs to first heat the solder joints on the circuit board, and then hold the solder suction gun to adsorb after the solder is melted.

[0004] In the above solder removal process, not only does the worker need to accurately align the solder joints with the naked eye to avoid unnecessary damage to the surrounding circuit, but also needs to face the risk of operation in a high temperature environment; this not only increases the difficulty and complexity of the operation, but also seriously restricts the efficiency of solder removal, making the entire processing process time-consuming, unable to meet the production needs of large quantities and high efficiency, and there is room for improvement. CONTENT OF THE INVENTION

[0005] The purpose of the present application is to provide a laser solder removal device for circuit boards, which solves the problem of low efficiency of traditional solder removal methods and cannot meet the production needs.

[0006] The laser solder removal device for circuit boards provided by the present application adopts the following technical solution:

[0007] The utility model provides a kind of laser soldering device for circuit board, including substrate, tooling plate fixed on substrate, the tooling plate is equipped with clamping piece for clamping circuit board;Two sides of the tooling plate are symmetrically equipped with crossbar, the crossbar both ends are fixed with support rod in vertical direction, and the support rod lower end is fixedly connected with substrate;The substrate is equipped with moving block on the top, first driving piece that drives moving block reciprocating sliding is slid on the crossbar, the substrate is equipped with two ends with two moving blocks fixedly connected adjusting rod, adjusting block is slid on adjusting rod, and second driving piece that drives adjusting block reciprocating sliding;The lower side of the adjusting block is equipped with fixed block, third driving piece that drives fixed block up and down sliding, the side of fixed block towards substrate is equipped with laser nozzle, monitoring camera and solder gun, and the substrate is equipped with control device operation control piece.

[0008] By adopting the above technical scheme, in the application of the soldering device, the circuit board is placed on the tooling plate clamped by the clamping piece in advance, then the fixed block is moved to the top of the tooling plate by the first driving element and the second driving element, the position is finely adjusted using the monitoring camera, and the height of the laser nozzle, the monitoring camera and the solder gun is adjusted using the third driving element; then the laser nozzle is started, the soldering points on the clamped circuit board are melted, and finally the molten solder is sucked using the solder gun, so as to realize automatic removal of soldering on the circuit board, improve the overall soldering removal efficiency, and meet the mass production demand.

[0009] Optionally, the control piece is an stm32 single-chip microcomputer, which can control the operation of the first driving element, the second driving element, the third driving element, the laser nozzle, the monitoring camera and the solder gun.

[0010] By adopting the above technical scheme, since the control piece is an STM32 single-chip microcomputer, the STM32 single-chip microcomputer performs well in power consumption and is suitable for various low-power applications. Through reasonable power management and clock configuration, the STM32 single-chip microcomputer can reduce power consumption while ensuring performance, prolong the endurance time of the device, integrate CPU, RAM, ROM, input and output devices on the same chip, and improve the integration and reliability of the system. At the same time, the STM32 single-chip microcomputer provides rich peripheral interfaces and communication interfaces, such as USB, I2C, CAN, etc., which facilitates connection and communication with other devices.

[0011] Optionally, the substrate is fixedly provided with a protective cover sleeved outside the first driving element.

[0012] By adopting the above technical scheme, since the protective cover is installed and arranged to protect the outside of the first driving element, the possibility of external impurities adhering to the first synchronous belt and affecting the sliding of the moving block is reduced.

[0013] Optionally, a buzzer is arranged on the outer side of the protective cover and is associated with the control element and used for reminding that the soldering is finished.

[0014] By using the above technical scheme, after the current circuit board is finished with soldering, the control element can control the buzzer to start and remind the worker to replace a new circuit board for soldering.

[0015] Optionally, the clamping element comprises clamping rods symmetrically arranged on opposite sides of the tool plate in the horizontal direction, and the ends of the two clamping rods away from each other are fixedly provided with upwardly bent clamping plates; the tool plate comprises a plate body fixedly arranged on the base plate and a plate cover mounted on the upper side of the plate body, the upper side of the plate body is provided with a receiving groove for inserting and sliding the clamping rods, and the receiving groove is provided with an elastic extrusion element for driving the two opposite clamping plates to slide towards each other.

[0016] By using the above technical scheme, when clamping the circuit board, the circuit board is first placed between the two clamping plates, and then the two clamping plates are caused to abut against the outer edges of the circuit board under the action of the elastic extrusion element, so as to clamp and fix the circuit board, thereby reducing the possibility of loosening or even falling off of the circuit board during subsequent soldering.

[0017] Optionally, limit protrusions are fixedly arranged on the outer periphery of the ends of the two clamping rods close to each other; limit sliding grooves are formed in the side walls of the receiving groove for inserting and sliding the limit protrusions; and the elastic extrusion element is a compression spring arranged in the limit sliding groove, and the two ends of the compression spring are fixedly connected with the inner wall of the limit sliding groove and the limit protrusion, respectively.

[0018] By using the above technical scheme, the compression spring in the compressed state continuously abuts against the limit protrusion, so as to keep the two opposite clamping plates in the extrusion force of moving towards each other.

[0019] Optionally, a positioning groove is formed in the plate body for clamping the plate cover, and elastic clamping elements are arranged on the opposite sides of the plate cover, and a positioning recess is formed in the inner wall of the positioning groove for clamping the elastic clamping element.

[0020] By using the above technical scheme, after the clamping element is installed, the worker inserts the plate cover into the positioning groove, so that the elastic clamping element is clamped into the corresponding positioning recess, thereby completing the assembly of the plate body and the plate cover.

[0021] Optionally, elastic pads are fixedly arranged on the sides of the clamping plates close to each other.

[0022] By adopting the technical scheme, when the circuit board is in the clamped state, the surface of the elastic pad can be elastically abut against and clamp the outer edge of the clamped circuit board, so as to reduce the possibility of wear of the edge of the circuit board due to clamping.

[0023] To sum up, the present application includes at least one of the following beneficial technical effects:

[0024] 1. In the application of the solder removing device, the solder on the circuit board is automatically removed, the overall solder removing efficiency is improved, and the mass production demand is met.

[0025] 2. The control member is an STM32 single-chip microcomputer, which has excellent performance in power consumption and is suitable for various low-power applications. Through reasonable power management and clock configuration, the STM32 single-chip microcomputer can reduce power consumption while ensuring performance and prolong the endurance time of the device. The STM32 single-chip microcomputer integrates CPU, RAM, ROM, input and output devices, etc. on the same chip, improving the integration and reliability of the system. At the same time, the STM32 single-chip microcomputer provides rich peripheral interfaces and communication interfaces such as USB, I2C, CAN, etc., facilitating connection and communication with other devices. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is a schematic diagram of the overall structure of the embodiment of the present application;

[0028] Figure 2 is a schematic diagram of the structure of the embodiment of the present application embodying the installation and cooperation of the laser nozzle and the monitoring camera;

[0029] Figure 3 is a schematic diagram of the structure of the embodiment of the present application embodying the installation and cooperation of the first driving member and the second driving member;

[0030] Figure 4 is a schematic diagram of the structure of the embodiment of the present application embodying the installation and cooperation of the buzzer;

[0031] Figure 5 is a schematic diagram of the structure of the embodiment of the present application embodying the installation and cooperation of the control member;

[0032] Figure 6 is a schematic diagram of the structure of the embodiment of the present application embodying the installation and cooperation of the clamping member and the tooling plate;

[0033] Figure 7 is an explosion structure schematic diagram of the mounting distribution of the plate body, the plate cover and the clamping piece embodied by the embodiment of the present application;

[0034] Figure 8 is a partial cross-sectional structure schematic diagram of the mounting cooperation of the elastic clamping piece.

[0035] In the figure, 1, base plate; 11, cross rod; 12, support rod; 13, moving block; 131, first engaging block; 14, first driving piece; 141, first motor; 142, first pulley; 143, first synchronous belt; 15, adjusting rod; 16, adjusting block; 161, second engaging block; 17, second driving piece; 171, second motor; 172, second pulley; 173, second synchronous belt; 18, third driving piece; 19, protective cover; 191, buzzer; 2, tooling plate; 21, plate body; 211, accommodating groove; 212, limiting sliding groove; 213, positioning groove; 214, positioning groove; 22, plate cover; 221, placing groove; 23, elastic clamping piece; 231, spring; 232, arc-shaped protrusion; 3, clamping piece; 31, clamping rod; 311, limiting protrusion; 32, clamping plate; 33, elastic pad; 34, elastic extrusion piece; 341, compression spring; 4, fixed block; 41, laser nozzle; 42, monitoring camera; 43, solder suction gun; 5, control piece; 51, stm32 single-chip microcomputer. DETAILED DESCRIPTION

[0036] The present application is further described in detail below in combination with all the drawings.

[0037] Embodiment:

[0038] Reference Figure 1 and Figure 2 A laser soldering removal device for a circuit board, comprising a base plate 1 and a tooling plate 2 fixed on the base plate 1, wherein the tooling plate 2 is provided with a clamping piece 3 for clamping a circuit board; the tooling plate 2 is symmetrically provided with a cross rod 11 on both sides, and the cross rod 11 is fixed with a support rod 12 at both ends in the vertical direction, and the lower end of the support rod 12 is fixedly connected with the base plate 1; the base plate 1 is provided above with a moving block 13 sliding on the cross rod 11, a first driving piece 14 driving the moving block 13 to reciprocatingly slide, the base plate 1 is provided above with an adjusting rod 15 fixed at both ends with two moving blocks 13, an adjusting block 16 sliding on the adjusting rod 15, and a second driving piece 17 driving the adjusting block 16 to reciprocatingly slide;

[0039] Below the adjusting block 16 is a fixing block 4 and a third driving component 18 that drives the fixing block 4 to slide up and down. The side of the fixing block 4 facing the substrate 1 is provided with a laser nozzle 41, a monitoring camera 42 and a desoldering gun 43. The substrate 1 is provided with a control component 5 for the operation of the device. When the desoldering is running, the fixing block 4 is first moved above the tooling plate 2, then the monitoring camera 42 is used to make fine adjustments to the position, then the laser nozzle 41 is started to melt the solder joints on the clamped circuit board, and finally the desoldering gun 43 is started to suck up the molten solder.

[0040] Reference Figure 2 The laser nozzle 41 has a convex lens at the nozzle to focus the laser beam at a point to melt the old solder; the monitoring camera 42 is a dedicated CDD camera used to monitor the solder removal process and position; the desoldering gun 43 is a conventional device for absorbing solder liquid. The specific structures of the laser nozzle 41, the monitoring camera 42 and the desoldering gun 43 will not be described in detail here.

[0041] Reference Figure 2 and Figure 3 The first driving component 14 includes a first motor 141, a first synchronous belt 143, and two first pulleys 142. The first motor 141 is fixed on the vertical side of one of the support rods 12 on the same side. One of the first pulleys 142 is coaxially fixedly connected to the output shaft of the first motor 141. The other first pulley 142 is fixed on the other support rod 12 on the same side. The first synchronous belt 143 is sleeved on the outer periphery of the two first pulleys 142 on the same side. The side of the moving block 13 is integrally formed with a first connecting block 131 that is fixedly connected to the belt body of the first synchronous belt 143.

[0042] The second driving component 17 includes a second motor 171 fixed to the bottom side of the moving block 13, a second pulley 172 fixed to the outer periphery of the output shafts of the two second motors 171, and a second synchronous belt 173 sleeved on the outer periphery of the two second pulleys 172. The adjusting block 16 has a second connecting block 161 integrally formed and fixedly connected to the belt body of the second synchronous belt 173. The third driving component 18 is an electric cylinder arranged in the vertical direction. This is a conventional driving structure and will not be described in detail here.

[0043] Reference Figure 4 and Figure 5 A protective cover 19 is fixed on the substrate 1 and sleeved on the outside of the first driving member 14 to reduce the possibility of external impurities adhering to the first synchronous belt 143 and thus affecting the sliding of the moving block 13; the control member 5 is an STM32 microcontroller 51 fixed on the inner side of the protective cover 19.

[0044] A buzzer 191 is fixed on the outer surface of the protective cover 19. The STM32 microcontroller 51 recognizes the signal and triggers the buzzer 191 to remind the staff. The STM32 microcontroller 51 can convert the signal into an instruction and transmit the instruction to the first drive unit 14, the second drive unit 17 and the third drive unit 18, thereby controlling them to control the movement and adjustment of the fixed block 4 in the horizontal and vertical directions. The STM32 microcontroller 51 can also control the laser nozzle 41, the monitoring camera 42 and the desoldering gun 43.

[0045] Reference Figure 6 and Figure 7 The clamping member 3 includes clamping rods 31 symmetrically arranged on opposite sides of the tooling plate 2 along the horizontal direction. The ends of the two clamping rods 31 that are far apart from each other are fixed with an upwardly bent clamping plate 32. Two symmetrical limiting protrusions 311 are integrally formed on the outer periphery of the ends of the two clamping rods 31 that are close to each other.

[0046] The tooling plate 2 includes a plate body 21 fixed on the base plate 1 and a plate cover 22 installed on the upper side of the plate body 21. The upper side of the plate body 21 is provided with a receiving groove 211 for inserting and sliding the clamping rod 31. The side wall of the receiving groove 211 is provided with a limiting groove 212 for inserting and sliding the limiting protrusion 311.

[0047] The limiting slide groove 212 is provided with an elastic pressing member 34 that drives two opposing clamping plates 32 to slide towards each other. The elastic pressing member 34 includes two compression springs 341 disposed in the limiting slide groove 212. The two ends of the compression springs 341 are fixedly connected to the inner wall of the limiting slide groove 212 and the limiting protrusion 311, respectively.

[0048] Reference Figure 7 and Figure 8 The plate 21 has a positioning groove 213 for the plate cover 22 to be inserted into. The plate cover 22 has elastic snap-fit ​​members 23 on both opposite sides. The elastic snap-fit ​​members 23 include a spring 231 and an arc-shaped protrusion 232. The plate cover 22 has a placement groove 221 for the spring 231 and the arc-shaped protrusion 232 to be inserted into. The spring 231 presses one side of the arc-shaped protrusion 232, causing a part of the arc-shaped protrusion 232 to protrude out of the placement groove 221. The protruding part of the arc-shaped protrusion 232 is an arc surface, and the arc length corresponding to the arc surface is a minor arc. The positioning groove 214 is provided on the inner wall of the positioning groove 213.

[0049] After the clamping component 3 is installed, the operator inserts the cover 22 into the positioning groove 213, so that the protruding part of the arc-shaped protrusion 232 is engaged in the corresponding positioning groove 214, thus completing the assembly of the board body 21 and the cover 22. Rubber elastic pads 33 are fixed to the adjacent sides of the clamping plates 32 with glue, which can elastically abut against the outer edge of the clamped circuit board.

[0050] The implementation principle of this application embodiment is as follows:

[0051] When this solder removal device is used, the circuit board is first placed on the fixture plate 2 and clamped by the clamping part 3. Then, the fixing block 4 is moved above the fixture plate 2, and the position is finely adjusted by the monitoring camera 42. Then, the laser nozzle 41 is activated to melt the solder joints on the clamped circuit board. Finally, the desoldering gun 43 is used to absorb the molten solder. After the current circuit board is desoldered, the STM32 microcontroller 51 controls the buzzer 191 to start, reminding the staff to replace the new circuit board.

[0052] Unless otherwise defined, the terms or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar words used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms "a" or "one," and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising," "including," and similar words mean that the element or object preceding "comprising" encompasses the element or object listed following "comprising" or "including," and their equivalents, but do not exclude other elements or objects. "Above," "below," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0053] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A laser solder removal device for circuit boards, characterized in that, The device includes a substrate (1) and a fixture plate (2) fixed on the substrate (1). The fixture plate (2) is provided with clamping parts (3) for clamping the circuit board. The fixture plate (2) has crossbars (11) symmetrically arranged on both sides. Both ends of the crossbars (11) are fixed with support rods (12) in the vertical direction. The lower end of the support rods (12) is fixedly connected to the substrate (1). The substrate (1) is provided with a movable block (13) slidably mounted on a crossbar (11) and a first driving member (14) that drives the movable block (13) to slide back and forth. The substrate (1) is provided with an adjusting rod (15) with its two ends fixedly connected to the two movable blocks (13), an adjusting block (16) slidably mounted on the adjusting rod (15), and a second driving member (17) that drives the adjusting block (16) to slide back and forth. Below the adjustment block (16) is a fixed block (4) and a third driving member (18) that drives the fixed block (4) to slide up and down. The fixed block (4) is provided with a laser nozzle (41), a monitoring camera (42) and a desoldering gun (43) on the side facing the substrate (1). The substrate (1) is provided with a control member (5) for controlling the operation of the control device.

2. The laser solder removal device for circuit boards according to claim 1, characterized in that, The control unit (5) is an STM32 microcontroller (51), which can control the operation of the first drive unit (14), the second drive unit (17), the third drive unit (18), the laser nozzle (41), the monitoring camera (42), and the desoldering gun (43).

3. The laser solder removal device for circuit boards according to claim 1, characterized in that, A protective cover (19) is fixed on the substrate (1) and sleeved on the outside of the first driving member (14).

4. The laser solder removal device for circuit boards according to claim 3, characterized in that, A buzzer (191) associated with the control unit (5) and used to indicate that the soldering is complete is fixed on the outer surface of the protective cover (19).

5. The laser solder removal device for circuit boards according to claim 1, characterized in that, The clamping member (3) includes clamping rods (31) symmetrically arranged on opposite sides of the tooling plate (2) in the horizontal direction, and clamping plates (32) bent upward are fixed at the ends of the two clamping rods (31) that are far apart from each other. The tooling plate (2) includes a plate body (21) fixed on the base plate (1) and a plate cover (22) installed on the upper side of the plate body (21). The upper side of the plate body (21) is provided with a receiving groove (211) for inserting and sliding the clamping rod (31). The receiving groove (211) is provided with an elastic extrusion member (34) that drives two opposing clamping plates (32) to slide towards each other.

6. The laser solder removal device for circuit boards according to claim 5, characterized in that, Limiting protrusions (311) are fixed on the outer periphery of the two clamping rods (31) that are close to each other; a limiting groove (212) is provided on the side wall of the receiving groove (211) for the limiting protrusions (311) to be inserted and slid; the elastic pressing member (34) is a compression spring (341) set in the limiting groove (212), and the two ends of the compression spring (341) are fixedly connected to the inner wall of the limiting groove (212) and the limiting protrusions (311) respectively.

7. The laser solder removal device for circuit boards according to claim 5, characterized in that, The plate (21) is provided with a positioning groove (213) for the plate cover (22) to be inserted into. The plate cover (22) is provided with elastic snap-fit ​​members (23) on opposite sides. The positioning groove (213) is provided with a positioning groove (214) for the elastic snap-fit ​​members (23) to be inserted into.

8. The laser solder removal device for circuit boards according to claim 5, characterized in that, Elastic pads (33) are fixed on the sides of the clamping plates (32) that are close to each other.

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