Efficient grinding and cleaning integrated device for wafer

Abstract

The utility model discloses a high-efficiency polishing and cleaning integrated device for a wafer, relates to the technical field of wafer polishing, and aims to solve the problems that the wafer needs to be taken out for cleaning after being polished in the prior art, the cleaning is very inconvenient, a large amount of water resources are used in the cleaning process, and the overall environmental protection property is reduced. According to the technical scheme, the wafer polishing device is characterized by comprising a workbench, one end of the workbench is movably connected with a polishing device used for polishing a wafer, the other end of the workbench is movably connected with a spraying pipe used for cleaning the wafer, and the middle end in the workbench is fixedly connected with a positioning suction cup used for positioning the wafer; a first adjusting mechanism for driving the polishing device to adjust is arranged between the workbench and the polishing device, a second adjusting mechanism for driving the spraying pipe to move is arranged between the spraying pipe and the workbench, and a collecting box for collecting cleaning water is placed at the lower end of the workbench. And the effects of sufficient grinding, efficient machining and circulating cleaning are achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing technology, and in particular to a high-efficiency integrated polishing and cleaning device for wafers. Background Technology

[0002] Integrated circuits are a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.). Using certain processes, the transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnected wiring, are fabricated on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a package to become a miniature structure with the required circuit function.

[0003] During the processing of wafers, they need to be polished and cleaned to facilitate subsequent processing.

[0004] The existing technical solutions mentioned above have the following drawbacks: after the existing wafers are polished, they need to be removed for cleaning, which is very inconvenient. At the same time, the cleaning process uses a lot of water resources, which reduces the overall environmental friendliness. Utility Model Content

[0005] The purpose of this invention is to provide a high-efficiency integrated grinding and cleaning device for wafers using a circulating spray system.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A high-efficiency integrated grinding and cleaning device for wafers includes a worktable. A grinding device for wafer grinding is movably connected to one end of the worktable, and a spray pipe for wafer cleaning is movably connected to the other end of the worktable. A positioning suction cup for positioning wafers is fixedly connected to the middle of the worktable. A first adjustment mechanism for adjusting the grinding device is provided between the worktable and the grinding device. A second adjustment mechanism for moving the spray pipe is provided between the spray pipe and the worktable. A collection tank for collecting cleaning water is placed at the lower end of the worktable. A through hole for water flow is opened at the upper end of the worktable, and the through hole is located outside the positioning suction cup.

[0008] By adopting the above technical solution, the first adjustment mechanism and the second adjustment mechanism are used to drive the grinding device and the spray pipe to move and adjust, thereby ensuring a good overall adjustment effect, facilitating the overall grinding and cleaning of the wafer, and the grinding device and the spray pipe are located on both sides, which facilitates the cleaning of the polished wafer and achieves the effect of efficient processing.

[0009] Furthermore, the first adjustment mechanism and the second adjustment mechanism each include a first lateral adjustment mechanism for driving the grinding device or spray pipe to move laterally and a longitudinal adjustment mechanism for driving the grinding device or spray pipe to move longitudinally.

[0010] By adopting the above technical solution, the horizontal adjustment mechanism and the vertical adjustment mechanism can easily drive the grinding device and the spray pipe to move and adjust, ensuring that the two do not interfere with each other when working relative to each other, thus increasing the overall processing effect and improving the overall practicality.

[0011] Furthermore, both the first lateral adjustment mechanism and the longitudinal adjustment mechanism include an installation frame. An adjustment motor is fixedly connected to the outside of the installation frame. The output end of the adjustment motor extends through the outside of the installation frame into the inside of the installation frame. A lead screw body is fixedly connected to the output end of the adjustment motor. A lead screw slider is movably connected to the outside of the lead screw body. The lead screw slider inside the first lateral adjustment mechanism is fixedly connected to the installation frame of the longitudinal adjustment mechanism. The lead screw slider inside the longitudinal adjustment mechanism is fixedly connected to the spray pipe.

[0012] By adopting the above technical solution, the adjusting motor can drive the lead screw body to rotate, and during the rotation of the lead screw body, the lead screw slider can be moved, which facilitates the adjustment of the position of the grinding device and the spray pipe, and increases the overall flexibility.

[0013] Furthermore, a second lateral adjustment mechanism is provided between the grinding device and the longitudinal adjustment mechanism. The second lateral adjustment mechanism has the same structure as the first lateral adjustment mechanism, and the adjustment directions of the second lateral adjustment mechanism and the first lateral adjustment mechanism are perpendicular to each other.

[0014] By adopting the above technical solution, a second horizontal adjustment mechanism, a vertical adjustment mechanism, and a first horizontal adjustment mechanism are set to adjust the position of the polishing device, ensuring that the whole device can polish the wafer from all directions, thus increasing the overall polishing effect.

[0015] Furthermore, a circulation pump for water resource recycling is fixedly connected to the outside of the collection tank. The suction end of the circulation pump extends through the outside of the collection tank into the inside of the collection tank. A connecting hose is fixedly connected to the outlet end of the circulation pump. The end of the connecting hose away from the circulation pump is connected to the spray pipe. Spray nozzles with equal spacing are fixedly connected to the lower end of the spray pipe.

[0016] By adopting the above technical solution, the circulating pump draws the circulating water inside the collection box and injects it into the spray pipe through the connecting hose. The spray nozzle then sprays the wafers, facilitating comprehensive cleaning of the entire wafer.

[0017] Furthermore, a filter element for circulating water filtration is fixedly connected inside the collection box. The filter element has a structure of two layers of filter cloth sandwiched with activated carbon.

[0018] By adopting the above technical solution, the filter element with a two-layer filter cloth sandwiched with activated carbon structure increases the overall filtration effect, facilitates overall circulation and cleaning, and increases the overall environmental friendliness.

[0019] In summary, the beneficial technical effects of this utility model are as follows:

[0020] 1. The first and second adjustment mechanisms are used to drive the grinding device and the spray pipe to move and adjust, thereby ensuring a good overall adjustment effect, facilitating the overall grinding and cleaning of the wafer, and the grinding device and the spray pipe are located on both sides, which facilitates the cleaning of the polished wafer and produces a high-efficiency processing effect.

[0021] 2. The position of the polishing device is adjusted by setting a second horizontal adjustment mechanism, a vertical adjustment mechanism and a first horizontal adjustment mechanism to ensure that the whole device can polish the wafer from all directions, which increases the overall polishing effect and produces a thorough polishing effect.

[0022] 3. A circulating pump is used to draw the circulating water from inside the collection tank and inject it into the spray pipe through a connecting hose. The spray nozzle is then used to spray the crystals, facilitating comprehensive cleaning and producing a circulating cleaning effect. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a three-dimensional structural diagram of the collection box of this utility model;

[0025] Figure 3 This is a schematic diagram of the disassembled structure of the filter element of this utility model.

[0026] In the diagram, 1. Workbench; 2. Grinding device; 3. Spray pipe; 4. Positioning suction cup; 5. First adjustment mechanism; 6. Second adjustment mechanism; 7. Collection box; 8. Through hole; 31. Spray head; 51. First lateral adjustment mechanism; 52. Longitudinal adjustment mechanism; 53. Mounting frame; 54. Adjustment motor; 55. Lead screw body; 56. Lead screw slider; 57. Second lateral adjustment mechanism; 71. Circulation pump; 72. Connecting hose; 73. Filter element. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings.

[0028] Reference Figure 1A high-efficiency integrated grinding and cleaning device for wafers includes a worktable 1. A grinding device 2 for wafer grinding is movably connected to one end of the worktable 1, and a spray pipe 3 for wafer cleaning is movably connected to the other end of the worktable 1. A positioning suction cup 4 for positioning wafers is fixedly connected to the middle of the worktable 1. A first adjustment mechanism 5 is provided between the worktable 1 and the grinding device 2 to adjust the grinding device 2. A second adjustment mechanism 6 is provided between the spray pipe 3 and the worktable 1 to move the spray pipe 3. A collection tank 7 for collecting cleaning water is placed at the lower end of the worktable 1, and a passage for water flow is provided at the upper end of the worktable 1. Hole 8, the through hole 8 is located on the outside of the positioning suction cup 4. The first adjustment mechanism 5 and the second adjustment mechanism 6 facilitate the adjustment of the polishing device 2 and the spray pipe 3, thereby ensuring a good overall adjustment effect, so as to facilitate efficient polishing and cleaning. The positioning suction cup 4 has a built-in suction mechanism, which is mainly a clamp for positioning the wafer, but it is not the focus of the design, so it will not be described in detail. The first adjustment mechanism 5 and the second adjustment mechanism 6 include a first lateral adjustment mechanism 51 for moving the polishing device 2 or the spray pipe 3 laterally and a longitudinal adjustment mechanism for moving the polishing device 2 or the spray pipe 3 longitudinally. 52. The overall adjustment is convenient and enhances the overall movement and adjustment effect. Both the first horizontal adjustment mechanism 51 and the vertical adjustment mechanism 52 include a mounting frame 53. An adjustment motor 54 is fixedly connected to the outside of the mounting frame 53. The output end of the adjustment motor 54 extends through the outside of the mounting frame 53 and into the inside of the mounting frame 53. A lead screw body 55 is fixedly connected to the output end of the adjustment motor 54. A lead screw slider 56 is movably connected to the outside of the lead screw body 55. The lead screw slider 56 inside the first horizontal adjustment mechanism 51 is fixedly connected to the mounting frame 53 of the vertical adjustment mechanism 52. The lead screw slider 56 inside the vertical adjustment mechanism 52... The slider 56 is fixedly connected to the spray pipe 3. The adjusting motor 54 can drive the lead screw body 55 to rotate, and the lead screw body 55 drives the slider 56 to move during the rotation, which facilitates the adjustment of the lateral and longitudinal positions of the grinding device 2 and the spray pipe 3. A second lateral adjustment mechanism 57 is provided between the grinding device 2 and the longitudinal adjustment mechanism 52. The second lateral adjustment mechanism 57 has the same structure as the first lateral adjustment mechanism 51. The adjustment directions of the second lateral adjustment mechanism 57 and the first lateral adjustment mechanism 51 are perpendicular to each other, ensuring that the grinding device 2 can be fully adjusted, thereby ensuring a good overall adjustment effect.

[0029] Reference Figure 2A circulation pump 71 for water recycling is fixedly connected to the outside of the collection tank 7. The suction end of the circulation pump 71 extends through the outside of the collection tank 7 and into the inside of the collection tank 7. A connecting hose 72 is fixedly connected to the outlet end of the circulation pump 71. The end of the connecting hose 72 away from the circulation pump 71 is connected to the spray pipe 3. The lower end of the spray pipe 3 is fixedly connected to the nozzles 31 that are evenly distributed. The nozzles 31 that are evenly distributed at the lower end of the spray pipe 3 have a good cleaning effect and increase the overall practicality.

[0030] Reference Figure 3 Inside the collection box 7, there is a filter element 73 for circulating water filtration. The filter element 73 has a structure of two layers of filter cloth sandwiched with activated carbon. The filter element 73 with two layers of filter cloth sandwiched with activated carbon can fully filter the circulating water and ensure a good overall circulation and cleaning effect.

[0031] The implementation principle of this embodiment is as follows: First, the wafer is placed on the upper end of the positioning suction cup 4 for suction and positioning. Then, the motor 54 is adjusted to drive the lead screw body 55 to rotate. During the rotation of the lead screw body 55, the lead screw slider 56 is moved to facilitate the adjustment of the horizontal and vertical positions of the polishing device 2, ensuring good polishing of the wafer. After polishing, the polishing device 2 is moved to one side, and the first horizontal adjustment mechanism 51 and the vertical adjustment mechanism 52 are used to drive the spray pipe 3 to the wafer for cleaning. The cleaned water falls into the collection box 7 through the through hole 8 and the filter element 73 for collection. At the same time, the circulation pump 71 draws the circulation inside the collection box 7 and injects it into the spray pipe 3 through the connecting hose 72. The spray nozzle 31 sprays the wafer to facilitate all-round cleaning.

[0032] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high-efficiency polishing and cleaning integrated device for wafers, comprising a worktable (1), characterized in that: One end of the workbench (1) is movably connected to a polishing device (2) for wafer polishing, and the other end of the workbench (1) is movably connected to a spray pipe (3) for wafer cleaning. The middle of the workbench (1) is fixedly connected to a positioning suction cup (4) for positioning wafers. A first adjustment mechanism (5) is provided between the workbench (1) and the polishing device (2) to drive the polishing device (2) to adjust. A second adjustment mechanism (6) is provided between the spray pipe (3) and the workbench (1) to drive the spray pipe (3) to move. A collection box (7) for collecting cleaning water is placed at the lower end of the workbench (1). A through hole (8) for water flow is opened at the upper end of the workbench (1). The through hole (8) is located outside the positioning suction cup (4).

2. The integrated high-efficiency polishing and cleaning device for wafers according to claim 1, characterized in that: The first adjustment mechanism (5) and the second adjustment mechanism (6) include a first lateral adjustment mechanism (51) for driving the grinding device (2) or the spray pipe (3) to move laterally and a longitudinal adjustment mechanism (52) for driving the grinding device (2) or the spray pipe (3) to move longitudinally.

3. The integrated high-efficiency polishing and cleaning device for wafers according to claim 2, characterized in that: Both the first lateral adjustment mechanism (51) and the longitudinal adjustment mechanism (52) include an installation frame (53). An adjustment motor (54) is fixedly connected to the outside of the installation frame (53). The output end of the adjustment motor (54) extends through the outside of the installation frame (53) into the inside of the installation frame (53). A lead screw body (55) is fixedly connected to the output end of the adjustment motor (54). A lead screw slider (56) is movably connected to the outside of the lead screw body (55). The lead screw slider (56) inside the first lateral adjustment mechanism (51) is fixedly connected to the installation frame (53) of the longitudinal adjustment mechanism (52). The lead screw slider (56) inside the longitudinal adjustment mechanism (52) is fixedly connected to the spray pipe (3).

4. The integrated high-efficiency polishing and cleaning device for wafers according to claim 3, characterized in that: A second transverse adjustment mechanism (57) is provided between the grinding device (2) and the longitudinal adjustment mechanism (52). The second transverse adjustment mechanism (57) has the same structure as the first transverse adjustment mechanism (51), and the adjustment directions of the second transverse adjustment mechanism (57) and the first transverse adjustment mechanism (51) are perpendicular to each other.

5. The integrated high-efficiency polishing and cleaning device for wafers according to claim 1, characterized in that: A circulation pump (71) for water resource circulation is fixedly connected to the outside of the collection box (7). The suction end of the circulation pump (71) extends through the outside of the collection box (7) into the inside of the collection box (7). A connecting hose (72) is fixedly connected to the outlet end of the circulation pump (71). The end of the connecting hose (72) away from the circulation pump (71) is connected to the spray pipe (3). The lower end of the spray pipe (3) is fixedly connected to nozzles (31) that are evenly distributed.

6. The integrated high-efficiency polishing and cleaning device for wafers according to claim 1, characterized in that: The collection box (7) is fixedly connected to a filter element (73) for circulating water filtration. The filter element (73) is a structure with two layers of filter cloth sandwiched with activated carbon.

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