Electroforming binder blade

Abstract

The utility model discloses an electroforming binder blade, which belongs to the technical field of wafer cutting blades, and comprises a blade base body and a cutting edge fixed outside the blade base body, a connecting sleeve is integrally formed in the blade base body, a connecting ring is rotatably connected outside the connecting sleeve, a connecting rod is fixed on the outer wall of the connecting ring, and the connecting rod is connected with the blade base body. A cleaning frame is movably connected to one side of the connecting rod, cleaning cloth used for cleaning a blade is fixed to the inner walls of the two sides of the cleaning frame, two positioning blocks are symmetrically fixed to the surface of the connecting rod, a fixing sleeve is rotationally connected between the two positioning blocks through a damping rotating shaft, and an adjusting rod is movably connected into the fixing sleeve. A mounting sleeve is fixed to the end face, located outside the fixing sleeve, of the adjusting rod, and a magnetic attraction block is fixed into the mounting sleeve. According to the electroforming binding agent blade, in the wafer cutting process, the cutting edge is automatically cleaned, and the cutting precision is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of wafer cutting blade technology, specifically relating to an electroforming bonded blade. Background Technology

[0002] Wafer dicing or cutting is an essential back-end packaging and testing process in semiconductor chip manufacturing. This process involves dividing a complete wafer into individual chips according to chip size. There are two methods for wafer dicing: laser dicing and mechanical diamond blade dicing. Currently, mechanical diamond blade dicing is the mainstream method.

[0003] The wafer dicing blade is round. During the electroforming process, the edge of the round blade needs to be electroformed to form the cutting edge. Therefore, during the electroforming process, the edge of the blade needs to be immersed in the electroforming bath, and then the blade is rotated to electroform the cutting edge.

[0004] During the wafer dicing process, some of the debris generated during dicing remains on the outer wall of the blade. As the dicing time increases, the amount of debris remaining on the outer wall of the blade also increases. The debris affects the cutting accuracy of the blade, thereby affecting the quality of wafer dicing. Utility Model Content

[0005] The purpose of this invention is to provide an electroformed binder blade to solve the problem mentioned in the background art where, during the wafer dicing process, some of the dicing debris remains on the outer wall of the blade. As the dicing time increases, the amount of debris remaining on the outer wall of the blade also increases, which affects the cutting accuracy of the blade and thus the quality of wafer dicing.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an electroformed binder blade, comprising a blade base and a cutting edge fixed to the outside of the blade base, a connecting sleeve integrally formed inside the blade base, a connecting ring rotatably connected to the outside of the connecting sleeve, a connecting rod fixed to the outer wall of the connecting ring, a cleaning frame movably connected to one side of the connecting rod, cleaning cloths for cleaning the cutting edge fixed to the inner walls of both sides of the cleaning frame, two positioning blocks symmetrically fixed to the surface of the connecting rod, a fixing sleeve rotatably connected between the two positioning blocks via a damping shaft, and an adjusting rod movably connected inside the fixing sleeve.

[0007] In a further embodiment, an mounting sleeve is fixed to the end face of the adjusting rod located outside the fixed sleeve, and a magnetic block is fixed inside the mounting sleeve.

[0008] In a further embodiment, threaded holes are provided at corresponding positions of the connecting rod and the cleaning frame, and fixing bolts are threadedly connected to the threaded holes of the connecting rod and the cleaning frame.

[0009] In a further embodiment, a threaded hole is also provided on one side of the outer wall of the fixing sleeve, and a positioning bolt is threaded into the threaded hole of the fixing sleeve.

[0010] In a further embodiment, a limit sleeve is fixed to the outer wall of the adjusting rod, and an assembly hole is provided at the center of the connecting sleeve.

[0011] The technical effects and advantages of this utility model are as follows:

[0012] The electroforming binder blade, with the addition of a cleaning rack and cleaning cloth, automatically cleans the blade edge during its rotation, ensuring that no debris remains on the outer wall of the blade when cutting the wafer, thus guaranteeing cutting accuracy and the quality of the cut wafer.

[0013] The detachable cleaning holder allows for quick replacement of the cleaning holder and cleaning cloth after they become soiled, further ensuring the cleaning effect on the blade.

[0014] The cleaning frame is fixed in place by magnetic blocks adsorbing and fixing the blade to the cutting equipment. During the rotation of the blade, the position of the cleaning frame is fixed. At the same time, the rotatable fixing sleeve and the movable adjusting rod can adjust the angle and height of the magnetic blocks according to the adsorption position, so as to avoid the situation where the magnetic blocks cannot be attracted to the cutting equipment. This electroformed binder blade automatically cleans the blade edge during the wafer cutting process to ensure cutting accuracy. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0018] Figure 3 This is a schematic diagram of the structure of the cleaning rack of this utility model;

[0019] Figure 4 This is an exploded view of the fixing sleeve of this utility model.

[0020] In the diagram: 1. Blade base; 2. Blade edge; 3. Connecting sleeve; 4. Connecting ring; 5. Connecting rod; 6. Cleaning rack; 7. Cleaning cloth; 8. Fixing bolt; 9. Positioning block; 10. Fixing sleeve; 11. Adjusting rod; 12. Limiting sleeve; 13. Mounting sleeve; 14. Magnetic block; 15. Positioning bolt. Detailed Implementation

[0021] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0022] Unless otherwise defined, the directions mentioned herein, such as up, down, left, right, front, back, inside, and outside, are based on the directions shown in the figures of this utility model, and are explained here together.

[0023] This utility model provides, for example Figure 1-4 The illustrated electroformed binder blade includes a blade base 1 and a cutting edge 2 fixed to the outside of the blade base 1. A connecting sleeve 3 is integrally formed inside the blade base 1. An assembly hole is provided at the center of the connecting sleeve 3. A connecting ring 4 is rotatably connected to the outside of the connecting sleeve 3 via a bearing. A connecting rod 5 is welded to the outer wall of the connecting ring 4. A cleaning frame 6 is movably connected to one side of the connecting rod 5. The cleaning frame 6 is fitted over the outside of the cutting edge 2. Cleaning cloths 7 for cleaning the cutting edge 2 are fixed to the inner walls of both sides of the cleaning frame 6. The cleaning cloths 7 are in contact with the outer wall of the cutting edge 2. Threaded holes are provided at corresponding positions on the connecting rod 5 and the cleaning frame 6. The cleaning frame 6 has a threaded hole with a fixing bolt 8. The fixing bolt 8 is screwed into the threaded hole of the connecting rod 5 and the cleaning frame 6 to fix the position of the cleaning frame 6 and facilitate the disassembly of the cleaning frame 6. With the detachable cleaning frame 6, the cleaning frame 6 and the cleaning cloth 7 can be quickly replaced after they become dirty, further ensuring the cleaning effect of the blade. With the setting of the cleaning frame 6 and the cleaning cloth 7, the blade 2 is automatically cleaned during the rotation of the blade, ensuring that there are no residual debris on the outer wall of the blade 2 when the blade cuts the wafer, thereby ensuring the cutting accuracy and the quality of the wafer after cutting.

[0024] Two positioning blocks 9 are symmetrically welded to the surface of the connecting rod 5. A fixed sleeve 10 is rotatably connected between the two positioning blocks 9 via a damping shaft. After the fixed sleeve 10 is rotated to a suitable angle, due to the setting of the damping shaft, the position of the fixed sleeve 10 can remain unchanged when no external force is applied. An adjusting rod 11 is movably connected inside the fixed sleeve 10. A limit sleeve 12 is welded to the outer wall of the adjusting rod 11. The limit sleeve 12 can restrict the position of the adjusting rod 11 and prevent the adjusting rod 11 from slipping out of the fixed sleeve 10. An installation sleeve 13 is fixed to the end face of the adjusting rod 11 outside the fixed sleeve 10 by bolts. A magnetic material is adhered inside the installation sleeve 13. The magnetic block 14 and the fixing sleeve 10 also have threaded holes on one side of their outer walls. The fixing sleeve 10 has a positioning bolt 15 threaded into its threaded hole. Tightening the positioning bolt 15 makes it fit tightly against the outer wall of the adjusting rod 11, thus fixing the position of the adjusting rod 11. The magnetic block 14 is attracted and fixed to the cutting equipment. During the rotation of the blade, the position of the cleaning frame 6 is fixed. At the same time, the rotatable fixing sleeve 10 and the movable adjusting rod 11 can adjust the angle and height of the magnetic block 14 according to the attraction position, so as to avoid the situation where the magnetic block 14 cannot attract the cutting equipment.

[0025] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The control method of this utility model is through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0026] In the description of this utility model, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] Working principle:

[0028] When using this electroformed binder blade, connect the connecting sleeve 3 to the cutting equipment and fix the position of the blade. Rotate the fixing sleeve 10 to adjust the fixing sleeve 10 to a suitable angle, then adjust the position of the adjusting rod 11 inside the fixing sleeve 10, adjust the angle and height of the magnetic block 14, and fix the blade to the cutting equipment by magnetic attraction 14. Fix the position of the cleaning frame 6, tighten the positioning bolt 15 so that the positioning bolt 15 is tightly attached to the outer wall of the adjusting rod 11, and fix the position of the adjusting rod 11.

[0029] The cutting equipment drives the blade to rotate, and the blade 2 cuts the wafer. During the rotation of the blade, the cleaning cloth 7 automatically cleans the blade 2 to ensure that there are no residual debris on the outer wall of the blade 2 when the blade cuts the wafer, thereby ensuring the cutting accuracy and the quality of the wafer after cutting.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electroformed bonded blade, comprising a blade substrate (1) and a cutting edge (2) fixed to the outside of the blade substrate (1), characterized in that: A connecting sleeve (3) is integrally formed inside the blade base (1). A connecting ring (4) is rotatably connected to the outside of the connecting sleeve (3). A connecting rod (5) is fixed to the outer wall of the connecting ring (4). A cleaning frame (6) is movably connected to one side of the connecting rod (5). A cleaning cloth (7) for cleaning the blade (2) is fixed to both inner walls of the cleaning frame (6). Two positioning blocks (9) are symmetrically fixed to the surface of the connecting rod (5). A fixing sleeve (10) is rotatably connected between the two positioning blocks (9) through a damping shaft. An adjusting rod (11) is movably connected inside the fixing sleeve (10).

2. The electroforming binder blade according to claim 1, characterized in that: The adjusting rod (11) is fixed with an installation sleeve (13) on the end face outside the fixed sleeve (10), and a magnetic block (14) is fixed inside the installation sleeve (13).

3. The electroforming binder blade according to claim 1, characterized in that: The connecting rod (5) and the cleaning rack (6) are provided with threaded holes at corresponding positions, and the connecting rod (5) and the cleaning rack (6) are connected by a fixing bolt (8) through the threaded hole.

4. The electroforming binder blade according to claim 2, characterized in that: The outer wall of one side of the fixed sleeve (10) is also provided with a threaded hole, and a positioning bolt (15) is threadedly connected to the threaded hole of the fixed sleeve (10).

5. The electroforming binder blade according to claim 1, characterized in that: The outer wall of the adjusting rod (11) is fixed with a limiting sleeve (12), and the center of the connecting sleeve (3) is provided with an assembly hole.

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