Backlight module with piezoelectric assembly

Abstract

A backlight module with a piezoelectric assembly comprises a substrate, a light-emitting assembly, a packaging colloid, a resonance tube body, a heat-conducting glue layer, a shell and the piezoelectric assembly. The resonance tube body is adjacent to the packaging colloid. The resonance pipe body comprises a high-temperature exchanger, a lamination layer and a low-temperature exchanger, the lamination layer comprises a plurality of sheets, each sheet is provided with a plurality of micropores, and the micropores corresponding in position form micropore channels. The piezoelectric assembly is arranged on the bottom wall of the shell, and a gap is formed between the piezoelectric assembly and the packaging colloid. The heat energy generated by the light-emitting assembly heats the laminated high-temperature exchanger through the heat-conducting glue layer, the high-temperature exchanger and the low-temperature exchanger form a temperature gradient, the thermoacoustic effect converts the heat energy into sound energy, the piezoelectric assembly vibrates, the piezoelectric assembly generates electric energy, and the effect that part of the heat energy generates the electric energy is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a backlight module, especially a backlight module with a resonance tube body and a piezoelectric component. BACKGROUND

[0002] In the prior art, a backlight module generates a large amount of heat energy when it is in operation, and the heat energy accumulation may cause thermal damage to the backlight module.

[0003] Therefore, how to improve the problem of waste heat generated by the backlight module through structural design improvement, and improve the performance and service life of the backlight module, has become one of the important topics that the industry wants to solve. UTILITY MODEL CONTENT

[0004] A backlight module with a piezoelectric component includes a substrate, a light-emitting component, an encapsulating gel, a resonance tube body, a heat-conducting adhesive layer, a shell, and a piezoelectric component. The substrate has a top surface and a bottom surface. The light-emitting component is disposed on the top surface of the substrate. The encapsulating gel is connected to the bottom surface. The resonance tube body is located below the substrate and adjacent to the encapsulating gel. The resonance tube body is disposed along the extension direction of the encapsulating gel. The resonance tube body includes, in order, a high-temperature exchanger, a laminate, and a low-temperature exchanger. The laminate includes a plurality of sheets. Each sheet has a plurality of micropores. A plurality of micropores corresponding in position form a micropore channel. The heat-conducting adhesive layer is located between the substrate and the encapsulating gel. The heat-conducting adhesive layer extends into the resonance tube body along the extension direction and contacts the high-temperature exchanger. The side wall of the shell covers the substrate and the encapsulating gel. The light-emitting component protrudes outside the shell. There is a gap between the bottom wall of the shell and the encapsulating gel. The piezoelectric component is disposed on the bottom wall of the shell.

[0005] According to a feasible implementation, the backlight module with a piezoelectric component further includes a heat-insulating material that laterally covers the resonance tube body corresponding to the high-temperature exchanger.

[0006] According to a feasible implementation, the piezoelectric component includes a fixed part and a swinging part. The bottom wall of the shell corresponds to the fixed part and the swinging part. A pivot assembly is provided to pivotally connect the fixed part and the swinging part. The bottom wall of the shell further has a through U-shaped slot that surrounds the swinging part.

[0007] According to a feasible implementation, the backlight module with a piezoelectric component further includes a support block that is disposed outside the shell corresponding to the swinging part.

[0008] According to a feasible implementation, the pore size of the micropores is 0.01-0.15 mm.

[0009] According to a feasible implementation, the distance between the laminate and the bottom surface of the substrate is 1:4 compared to the length of the resonance tube body.

[0010] According to a feasible implementation, the length of the resonance tube body is 20-21 mm.

[0011] According to an embodiment, the side wall of the shell is connected with the bottom wall through an inclined surface.

[0012] According to an embodiment, the piezoelectric component comprises a piezoelectric material and a battery, and the piezoelectric material is electrically connected with the battery.

[0013] According to an embodiment, the outer edge of the bottom surface of the substrate is provided with a stepped structure.

[0014] One of the beneficial effects of the utility model lies in that the backlight module with the piezoelectric component provided by the utility model, in an embodiment, when the light-emitting component runs on the substrate, the heat energy generated is used to heat the high-temperature exchanger on the laminated layer through the heat-conducting adhesive layer, the high-temperature exchanger and the low-temperature exchanger form a temperature gradient, when the temperature difference reaches a certain degree, the heat energy is converted into sound energy by using the thermoacoustic effect, the frequency of the sound wave is the same as the resonance frequency of the piezoelectric component, so that the piezoelectric component generates vibration, the piezoelectric component generates electric energy, and the effect of generating electric energy by using part of the heat energy is achieved, so that the backlight module can generate electric energy at the same time when running, and the energy loss is reduced.

[0015] In order to further understand the features and technical contents of the utility model, please refer to the following detailed description and drawings of the utility model, however, the drawings provided are only used for providing reference and illustration, and are not used to limit the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component.

[0017] Figure 2 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component.

[0018] Figure 3 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component.

[0019] Figure 4 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component.

[0020] Figure 5 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component.

[0021] Figure 6 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component.

[0022] Figure 7 It is a backlight module structure sectional view of an embodiment of the utility model with a piezoelectric component. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of the "backlight module with piezoelectric components" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0024] Please see Figure 1 This is a cross-sectional schematic diagram of a backlight module structure Z1 with a piezoelectric component according to an embodiment of the present invention. The backlight module Z1 with a piezoelectric component includes a housing 1, a substrate 2, two light-emitting components 3, a resonant tube 4, a thermally conductive adhesive layer 5, an encapsulating adhesive 6, and a piezoelectric component 7. The housing 1 is made of, for example, ferrous metal. The housing 1 has a groove 11. The substrate 2 is located in the groove 11, and the substrate 2 has a top surface 21 and a bottom surface 22. According to some embodiments, the substrate 2 is such as a flexible circuit board or a printed circuit board. The light-emitting components 3 are disposed on the top surface 21 of the substrate 2, protruding from the groove 11. The light-emitting components 3 are, for example, light-emitting diodes (LEDs). The encapsulating adhesive 6 is connected to the bottom surface 22 of the substrate 2. The resonant tube 4 is located below the substrate 2, adjacent to the encapsulating colloid 6. The resonant tube 4 is positioned along the extending direction of the encapsulating colloid 6 (orthogonal to the substrate 2). The resonant tube 4 sequentially includes a high-temperature exchanger T1, a stack 42, and a low-temperature exchanger T2. The stack 42 includes multiple sheets 421, each sheet 421 having multiple micropores 4211. The multiple micropores 4211 at corresponding positions form a microchannel 422 along the extending direction (i.e., the extending direction of the resonant tube 4 is consistent with the extending direction of the microchannel 422). The resonant tube 4 is filled with a working fluid, such as air. A thermally conductive adhesive layer 5 is located between the substrate and the encapsulating colloid 6, extending along the extending direction D1 into the resonant tube 4 and contacting the high-temperature exchanger T1. The sidewall 112 of the housing 1 covers the substrate 2 and the encapsulating colloid 6. The light-emitting component 3 protrudes from the housing 1. There is a gap H between the bottom wall 111 of the housing 1 and the encapsulating colloid 6. A piezoelectric component 7 is disposed on the bottom wall 111 of the housing 1 (within the groove 11). According to one embodiment, the piezoelectric component 7 includes a piezoelectric material 71 and a battery 72, the piezoelectric material 71 being electrically connected to the battery 72 (e.g., a storage battery). Figure 1In one embodiment, the battery 72 is disposed on the inner wall of the housing 1, and the piezoelectric material 71 is connected to the battery 72 via leads. The piezoelectric material 71 is electrically connected to a storage battery, and the electrical energy stored in the storage battery can be used by the substrate 2 or the light-emitting component 3. The materials of the piezoelectric material are generally classified as single crystal, ceramic, thin film, etc. Single crystal materials are, for example, lithium niobate (LiNbO3). Ceramic materials are, for example, barium titanate (BaTiO3) or lead zirconate titanate (PZT). Thin film materials are, for example, zinc oxide (ZnO) or aluminum nitride (AlN). In other embodiments, the battery 72 is disposed inside the piezoelectric component 7 (not shown in the figure).

[0025] When the light-emitting component 3 operates on the substrate 2, the heat generated heats one end of the stack 42 (high-temperature exchanger T1) through the thermally conductive adhesive layer 5. A temperature gradient is formed between the high-temperature exchanger T1 and the low-temperature exchanger T2. When the temperature difference reaches a certain level, the heat energy is converted into sound energy using the thermoacoustic effect. The frequency of the sound wave is the same as the resonant frequency of the piezoelectric component 7, so that the piezoelectric component 7 vibrates. The piezoelectric component 7 generates electrical energy, which is further stored in the battery and then fed back to the substrate 2 or the light-emitting component 3.

[0026] Because a smaller length L of the resonant cavity tube results in a higher frequency (higher angular frequency) of excited sound waves, excessively high frequencies make it difficult for the working fluid (as described above) to exchange heat with the tube wall of the resonant tube 4, thus hindering the conversion of heat into sound energy. The product of angular frequency and relaxation time is a crucial parameter representing the system's heat exchange efficiency. This product must be maintained within a suitable range to achieve selective heat and sound energy conversion efficiency. The radius of the micropore 4211 is closely related to the relaxation time. According to one embodiment, the product of angular frequency and relaxation time in this invention ranges from 1 to 10. In some embodiments of this invention, the aperture of the micropore 4211 is 0.01-0.15 mm. In other embodiments, the length L of the resonant tube 4 is 20-21 mm. In still other embodiments, the distance W between the stack 42 and the bottom surface 22 of the substrate 2 is in a ratio of 1:4 to the length of the resonant tube 4.

[0027] Please see Figure 2This is a cross-sectional schematic diagram of a backlight module structure Z2 with a piezoelectric component according to an embodiment of the present invention. According to this embodiment, the backlight module Z2 with the piezoelectric component also includes a heat insulation material 8, which laterally covers the resonant tube 4 corresponding to the high-temperature exchanger T1. The purpose of providing the heat insulation material 8 is to ensure that the heat generated by the light-emitting component 3 can sufficiently heat the high-temperature exchanger T1 of the stack 42. According to some embodiments, a material with good thermal conductivity (not shown) can be added to the outer wall of the resonant tube 4 corresponding to the low-temperature exchanger T2 to help maintain the temperature of the low-temperature exchanger T2 at the indoor temperature or a low-temperature indoor temperature. For example, a heat-conducting material can be connected to the housing 1, and a vent hole can be opened at the connection point to dissipate some heat and maintain the temperature of the low-temperature exchanger T2 (see below for details). This increases the temperature gradient.

[0028] Please see Figure 3 as well as Figure 4 , Figure 3 This is a partial top view of the bottom wall 111 of the shell 1 according to an embodiment of the present invention, viewed from a top angle. Figure 4 This is a cross-sectional schematic diagram of the Z3 backlight module with piezoelectric components according to an embodiment of the present invention. Figure 3 In the illustrated embodiment, the piezoelectric component 7 includes a fixed portion 711 and a swing portion 712. A pivoting component 10 is provided on the bottom wall 111 of the housing 1 corresponding to the fixed portion 711 and the swing portion 712. The bottom wall 111 is pivotally connected to the fixed portion 711 and the swing portion 712 via the pivoting component 10. A through U-shaped slot 1111 is formed on the bottom wall 111 of the housing 1, surrounding the swing portion 712. When the piezoelectric component 7 resonates with sound waves, the portion of the bottom wall 111 with the U-shaped slot 1111 can vibrate along a direction perpendicular to the surface of the bottom wall 111 (i.e., vibrate along the extension direction D1), and the U-shaped slot 1111 provides space for thermal and acoustic convection, enabling the cryogenic exchanger T2 to maintain its temperature. One purpose of the U-shaped slot 1111 is that when the piezoelectric component 7 resonates with the sound wave, the swinging part 712 of the piezoelectric component 7 swings along with part of the inner shell 1 of the U-shaped slot 1111 (i.e., swings along the extension direction D1), while the fixing part 711 is fixed, so that the piezoelectric material bends and deforms to generate electrical energy. Another purpose is that air can be convected from the U-shaped slot 1111, so that the low-temperature exchanger (low-temperature end) can maintain room temperature.

[0029] in accordance with Figure 4In the embodiment shown, the backlight module Z3 with piezoelectric components also includes multiple support blocks 9, which correspond to the positions of the swinging portion 712 of the piezoelectric component 7 and are disposed outside the bottom of the groove 11, i.e., outside the housing 1. Since piezoelectric materials are inherently fragile, the fixed portion 711 and the swinging portion 712 bend and deform when the piezoelectric material vibrates. The support blocks 9 support the swinging portion 712 to control the resonant frequency and amplitude.

[0030] Please see Figure 5 This is a cross-sectional schematic diagram of a backlight module Z4 with a piezoelectric component according to an embodiment of the present invention. In this embodiment, the corner of the groove 11 (the connection between the side wall 112 and the bottom wall 111) has an inclined surface 1112. With this structure, the sound waves propagated from the resonant tube 4 can be reflected by the inclined surface 1112 and projected onto the piezoelectric component 7, thereby increasing the electrical energy generated by the increase in the vibration frequency of the piezoelectric component 7.

[0031] Please see Figure 6 This is a cross-sectional schematic diagram of the backlight module Z5 with a piezoelectric component according to an embodiment of the present invention. Since the heat energy generated by the light-emitting component 3 cannot be entirely converted into sound energy, to ensure that the high-temperature exchanger T1 maintains a high temperature, as mentioned above, if the high-temperature exchanger T1 corresponding to the resonant tube 4 is covered with heat-insulating material 8, the heat energy may damage the light-emitting component 3. Therefore, the positions of the light-emitting component 3 and the resonant tube 4 can be staggered. In other words, when projected along the extension direction D1, the projection of the light-emitting component 3 and the projection of the resonant tube 4 do not overlap.

[0032] Please see Figure 7 This is a schematic diagram of a backlight module Z5 with a piezoelectric component according to an embodiment of the present invention. In this embodiment, a stepped structure 23 is formed on the outer edge of the bottom surface 22 of the substrate 2. By increasing the surface area of ​​the bottom surface 22 of the substrate 2, the overall heat dissipation effect of the backlight module Z5 can also be improved.

[0033] It should also be noted that the high temperature and low temperature referred to in this utility model refer to the relative temperatures of the components of the high temperature exchanger and the low temperature exchanger.

[0034] Beneficial effects of the embodiments

[0035] According to one embodiment, the backlight module with piezoelectric components provided by this utility model heats the high-temperature exchangers of the stacked layers through the thermally conductive adhesive layer when the light-emitting component is running on the substrate. A temperature gradient is formed between the high-temperature exchangers and the low-temperature exchangers. When the temperature difference reaches a certain level, the heat energy is converted into sound energy using the thermoacoustic effect. The frequency of the sound wave is the same as the resonant frequency of the piezoelectric component, causing the piezoelectric component to vibrate and generate electrical energy. This achieves the effect of generating electrical energy from a portion of the heat energy, thus enabling the backlight module to generate electricity simultaneously during operation, thereby reducing energy loss.

[0036] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of protection of the claims of the present utility model. Therefore, all equivalent technical changes made based on the content of the present utility model specification and drawings are included in the scope of protection of the claims of the present utility model.

Claims

1. A backlight module with a piezoelectric component, characterized in that, The backlight module with piezoelectric components includes: A substrate having a top surface and a bottom surface; A light-emitting component is disposed on the top surface of the substrate; An encapsulating colloid is attached to the bottom surface; A resonant tube is located under the substrate and adjacent to the encapsulating colloid. The resonant tube is arranged along an extension direction of the encapsulating colloid. The resonant tube sequentially includes a high-temperature exchanger, a stack, and a low-temperature exchanger. The stack includes multiple sheets, each sheet having multiple micropores. The multiple micropores at corresponding positions form a microchannel. A thermally conductive adhesive layer is located between the substrate and the encapsulating colloid, and the thermally conductive adhesive layer extends along the extension direction into the resonant tube body and contacts the high-temperature exchanger; A housing, wherein one side wall of the housing at least covers the substrate and the encapsulating colloid, wherein the light-emitting component protrudes from the housing, and a gap exists between a bottom wall of the housing and the encapsulating colloid; and A piezoelectric component is disposed on the bottom wall of the housing.

2. The backlight module with a piezoelectric component according to claim 1, characterized in that, The backlight module with piezoelectric components also includes a heat insulation material that, corresponding to the high-temperature exchanger, laterally covers the resonant tube.

3. The backlight module with a piezoelectric component according to claim 1, characterized in that, The piezoelectric component includes a fixed part and a swinging part; the bottom wall of the housing is provided with a pivoting component corresponding to the fixed part and the swinging part, which pivotally connects the fixed part and the swinging part; the bottom wall of the housing is also provided with a through U-shaped slot, which surrounds the swinging part.

4. The backlight module with a piezoelectric component according to claim 3, characterized in that, The backlight module with piezoelectric components also includes a support block, which is disposed on the outside of the housing corresponding to the swinging part.

5. The backlight module with a piezoelectric component according to claim 1, characterized in that, The pore size of the micropores is 0.01-0.15 mm.

6. The backlight module with a piezoelectric component according to claim 1, characterized in that, The distance between the stacked layer and the bottom surface of the substrate is in a ratio of 1:4 to the length of the resonant tube.

7. The backlight module with a piezoelectric component according to claim 1, characterized in that, The length of the resonant tube along the extending direction is 20-21 mm.

8. The backlight module with a piezoelectric component according to claim 1, characterized in that, The side wall of the housing has an inclined surface at the junction with the bottom wall.

9. The backlight module with a piezoelectric component according to claim 1, characterized in that, The piezoelectric component includes a battery and a piezoelectric material, wherein the piezoelectric material is electrically connected to the battery.

10. The backlight module with a piezoelectric component according to claim 1, characterized in that, A stepped structure is formed on the outer edge of the bottom surface of the substrate.

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