Probe seat and wafer test equipment

Abstract

The utility model provides a probe seat and wafer testing equipment, and relates to the technical field of wafer testing. The probe seat comprises the PCB, the probe assembly and the adjusting assembly, the PCB is connected with the testing machine through the cable assembly, the probe assembly is detachably connected with the PCB and used for making contact with a tested chip on a wafer to be tested, and the adjusting assembly is connected with the PCB and arranged to be controlled to adjust the position of the PCB, so that the position of the probe assembly is adjusted. According to the technical scheme, the structure of the probe card is improved, the PCB is additionally arranged, the cable assembly is used for connecting the PCB with the testing machine, and the probe assembly is detachably connected with the PCB, so that the cable assembly does not need to be disassembled when the probe assembly is replaced, only the probe assembly needs to be disassembled and replaced, the probe card can be prevented from being damaged, and the test efficiency is improved. Moreover, the replacement time of the needle card is saved, and the wafer testing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a probe holder and wafer testing equipment. Background Technology

[0002] Typically, functional testing of chips on a wafer involves using probers to contact the pads on the chip to acquire signals. Standard multi-pin connectors come with cables, the other end of which connects to the testing machine. Multi-pin connectors are typically installed from bottom to top. The number of connectors is usually 10-16. When installing or removing multi-pin connectors, it's necessary to do so from the source end of the testing machine. This can easily lead to the cable solder joints detaching due to external force, causing connector damage. This increases the risk of damage during connector replacement and is time-consuming, impacting wafer testing efficiency. Utility Model Content

[0003] One objective of this invention is to provide a probe holder that solves the technical problem in the prior art where the probe card is easily damaged and the process of replacing the probe card is time-consuming, resulting in low wafer testing efficiency.

[0004] A further objective of this invention is to improve the accuracy of position adjustment of the probe assembly on the probe holder.

[0005] Another objective of this invention is to provide a wafer testing device having the aforementioned probe holder.

[0006] Specifically, this utility model provides a probe holder, comprising:

[0007] PCB board;

[0008] A cable assembly, one end of which is connected to the PCB board and the other end of which is connected to the testing machine;

[0009] A probe assembly, which is detachably connected to the PCB board and is used to contact the chip under test on the wafer under test;

[0010] An adjustment component is connected to the PCB board and configured to controllably adjust the position of the PCB board, thereby adjusting the position of the probe component.

[0011] Optionally, the probe assembly includes:

[0012] A substrate, wherein the substrate is detachably connected to the PCB board and is electrically connected to the PCB board;

[0013] At least one probe head is mounted on the substrate and is used to contact the chip under test on the wafer under test.

[0014] Optionally, the PCB board is arranged along the vertical direction of the probe holder;

[0015] The substrate is arranged along the horizontal or vertical direction of the probe holder.

[0016] Optionally, the adjustment component includes:

[0017] X-axis adjustment module, the X-axis adjustment module is used to controllably adjust the position of the PCB board in the X-axis direction;

[0018] A Y-axis adjustment module is installed above the X-axis adjustment module and is used to controllably adjust the position of the PCB board in the Y-axis direction.

[0019] The Z-axis adjustment module is connected to the Y-axis adjustment module and is used to controllably adjust the position of the PCB board in the Z-axis direction.

[0020] Optionally, the adjustment component further includes:

[0021] The TZ axis adjustment module is installed above the Y axis adjustment module and is used to controllably rotate the PCB board in the TZ direction by a preset angle to adjust the position of the PCB board. The Z axis adjustment module is installed on the front side of the TZ axis adjustment module.

[0022] Optionally, the adjustment component further includes:

[0023] The TX axis adjustment module is installed on the front side of the Z axis adjustment module and is used to controllably drive the PCB board to rotate by a preset angle in the TX direction in order to adjust the position of the PCB board.

[0024] Optionally, the TZ axis adjustment module includes:

[0025] The second base plate is installed above the Y-axis adjustment module;

[0026] A first rotating plate, the first rotating plate including a first part installed above the second base plate, the first part being arranged in a horizontal direction and rotatably connected to the second base plate;

[0027] The third knob is mounted on the second base plate and is configured to move in a controlled manner along the Y-axis direction to push the first rotating plate to rotate by a preset angle along the TZ direction, thereby adjusting the position of the PCB board in the TZ direction.

[0028] Optionally, the first rotating plate further includes a second portion arranged vertically, the second portion being connected to the first portion and located in front of the first portion, and the Z-axis adjustment module includes:

[0029] At least one third slide rail is mounted on the front side of the second part and arranged along the Z-axis direction;

[0030] The third slide plate is mounted on the third slide rail;

[0031] A fourth knob is mounted on the third slide plate and is configured to move in a controlled manner along the Z-axis direction to push the third slide plate to slide along the third slide rail, thereby adjusting the position of the PCB board in the Z-axis direction.

[0032] Optionally, the TX axis adjustment module includes:

[0033] The second rotating plate is rotatably connected to the third sliding plate and is arranged along the Z-axis direction; the PCB board is mounted on the second rotating plate.

[0034] A fifth knob is mounted on the second rotating plate and is configured to move in a controlled manner along the Y-axis to abut against the third sliding plate, thereby pushing the first rotating plate to rotate a preset angle along the TX direction, thereby adjusting the position of the PCB board in the TX direction.

[0035] In particular, this invention also provides a wafer testing device, including the probe holder described above.

[0036] The probe holder of this invention includes a PCB board, a probe assembly, and an adjustment assembly. The PCB board is connected to the testing machine via a cable assembly. The probe assembly is detachably connected to the PCB board and is used to contact the chip under test on the wafer. The adjustment assembly is connected to the PCB board and is configured to controllably adjust the position of the PCB board, thereby adjusting the position of the probe assembly. This technical solution improves the structure of the probe holder by adding a PCB board and connecting it to the testing machine via a cable assembly. The probe assembly is detachably connected to the PCB board, eliminating the need to disassemble the cable assembly when replacing the probe assembly; only the probe assembly needs to be disassembled and replaced. This avoids damage to the probe holder, saves replacement time, and improves wafer testing efficiency.

[0037] Furthermore, the adjustment components of this utility model include an X-axis adjustment module, a Y-axis adjustment module, a Z-axis adjustment module, a TZ-axis adjustment module, and a TX-axis adjustment module. In other words, this utility model is designed with five-axis adjustment, which increases the degree of freedom adjustment in the TX direction compared with the prior art, thereby improving the accuracy of the probe component position adjustment.

[0038] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0039] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0040] Figure 1 This is a schematic structural diagram of a probe holder at one angle according to an embodiment of the present invention;

[0041] Figure 2 This is a schematic structural diagram of a probe holder from another angle according to one embodiment of the present invention;

[0042] Figure 3 This is a schematic structural diagram of a probe holder at another angle according to an embodiment of the present invention;

[0043] Figure 4 This is a schematic structural diagram of a probe holder according to another embodiment of the present invention;

[0044] Figure 5 This is a schematic structural diagram of a probe holder mounted on a target component according to an embodiment of the present invention.

[0045] Figure label:

[0046] 100-Probe mount, 200-Target component, 300-Wafer, 10-PCB board, 20-Probe assembly, 21-Substrate, 22-Probe head, 30-Adjustment assembly, 31-X-axis adjustment module, 32-Y-axis adjustment module, 33-TZ-axis adjustment module, 34-Z-axis adjustment module, 35-TX-axis adjustment module, 311-First base plate, 312-First knob, 313-First slide rail, 314-First slide plate, 315-Protrusion, 316-Second elastic element, 321-Second knob, 32 2-Second slide rail, 323-Second slide plate, 324-Third elastic element, 331-Second base plate, 332-First rotating plate, 333-Third knob, 334-First part, 335-Second part, 336-Fourth elastic element, 341-Fourth knob, 342-Third slide rail, 343-Third slide plate, 351-Fifth knob, 352-Second rotating plate, 23-Connector, 40-Limiting assembly, 41-Abutting part, 42-Operating part, 43-First elastic element, 44-Rotating shaft, 50-Bolt. Detailed Implementation

[0047] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0048] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0049] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0050] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0051] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0052] Figure 1 This is a schematic structural diagram of a probe holder 100 at one angle according to an embodiment of the present invention.

[0053] Figure 2 This is a schematic structural diagram of the probe holder 100 according to one embodiment of the present invention from another angle.

[0054] Figure 3 This is a schematic structural diagram of a probe holder 100 at another angle according to an embodiment of the present invention. Figure 4 This is a schematic structural diagram of a probe holder 100 according to another embodiment of the present invention. Figures 1 to 4 As shown, in one specific embodiment, the probe holder 100 includes a PCB board 10, a cable assembly, a probe assembly 20, and an adjustment assembly 30. One end of the cable assembly is connected to the PCB board 10, and the other end is connected to a testing machine. The probe assembly 20 is detachably connected to the PCB board 10 and is used to contact the chip under test on the wafer 300. The adjustment assembly 30 is connected to the PCB board 10 and is configured to controllably adjust the position of the PCB board 10, thereby adjusting the position of the probe assembly 20.

[0055] This embodiment improves the structure of the probe card by adding a PCB board 10 and connecting the PCB board 10 to the tester using a cable assembly. The probe assembly 20 is detachably connected to the PCB board 10, so that when replacing the probe assembly 20, it is not necessary to disassemble the cable assembly. Only the probe assembly 20 needs to be disassembled and replaced. This is equivalent to designing the probe card and cable separately, which can avoid damage to the probe card, save the replacement time of the probe card, and improve the testing efficiency of wafer 300.

[0056] In some embodiments, the probe assembly 20 includes a substrate 21 and at least one probe head 22. The substrate 21 is detachably connected to and electrically connected to the PCB board 10. The probe head 22 is mounted on the substrate 21 and is used to contact the chip under test on the wafer 300. Here, there are multiple probe heads 22, and the number of probe heads 22 can be set according to the testing requirements of the chip, for example, 5-16 probe heads 22 can be selected. Here, since the wafer 300 needs to be in a high-temperature environment when performing heating tests, the probe holder 100 also needs to be in a high-temperature environment. However, prolonged exposure to a high-temperature environment will cause thermal deformation of the probe assembly 20 of the probe holder 100, affecting the test results. Therefore, in this embodiment, the substrate 21 is designed to be made of ceramic material, which can reduce the amount of thermal deformation caused by prolonged exposure to high temperatures.

[0057] In some embodiments, the PCB board 10 is arranged along the vertical direction of the probe holder 100, and the substrate 21 is arranged along the horizontal or vertical direction of the probe holder 100. See also Figure 2 , Figure 2The substrate 31 is arranged vertically along the probe holder 100, which is equivalent to a vertical pin clip structure, with the mounting surface of the pin clip placed in the Z-direction. When the substrate 21 is arranged vertically along the probe holder 100, probes are soldered onto the PCB board 10. Pad electrodes are designed on the back of the substrate 21. After the substrate 21 and PCB board 10 are installed, the probes contact the Pad electrodes, thereby electrically connecting the substrate 21 and PCB board 10. (See also...) Figure 4 , Figure 4 The substrate 21 is arranged horizontally along the probe holder 100. When the substrate 21 is arranged horizontally along the probe holder 100, it needs to be electrically connected to the PCB board 10 through the connector 23.

[0058] In some embodiments, the adjustment assembly 30 includes an X-axis adjustment module 31, a Y-axis adjustment module 32, and a Z-axis adjustment module 34. The X-axis adjustment module 31 is used to controllably adjust the position of the PCB board 10 in the X-axis direction. The Y-axis adjustment module 32 is mounted above the X-axis adjustment module 31 and is used to controllably adjust the position of the PCB board 10 in the Y-axis direction. The Z-axis adjustment module 34 is connected to the Y-axis adjustment module 32 and is used to controllably adjust the position of the PCB board 10 in the Z-axis direction. This embodiment can achieve position adjustment of the PCB board 10 in the X, Y, and Z axes through the X-axis adjustment module 31, Y-axis adjustment module 32, and Z-axis adjustment module 34, thereby achieving position adjustment of the probe assembly 20 in the X, Y, and Z axes, allowing the probe head 22 of the probe assembly 20 to be aligned with the corresponding Pad on the chip.

[0059] In some embodiments, the X-axis adjustment module 31 includes a first base plate 311, at least one first slide rail 313, a first slide plate 314, and a first knob 312. The first slide rail 313 is mounted on the first base plate 311 and arranged along the X-axis direction. The first slide plate 314 is mounted on the first slide rail 313. The first knob 312 is mounted on the first base plate 311 and configured to move controllably along the X-axis direction to push the first slide plate 314 to slide along the first slide rail 313, thereby adjusting the position of the PCB board 10 in the X-axis direction. Here, the first knob 312 has a rod extending along the X-axis direction and a circular rotating member. The circular rotating member is mounted at the end of the rod, which is smaller in size and easier to adjust compared to the structure of a micrometer head in the prior art. In addition, a knurled structure is added to the outer periphery of the circular rotating member to improve friction.

[0060] In some embodiments, the number of first slide rails 313 is multiple, which can increase the stability of the movement of the first slide plate 314. For example, a dual slide rail design can be adopted.

[0061] In some embodiments, the first slide plate 314 has a protrusion 315 protruding downward toward the probe seat 100. The protrusion 315 is arranged opposite to the first knob 312 so that it can abut against the protrusion 315 when the first knob 312 moves, thereby pushing the first slide plate 314 to slide along the first slide rail 313. The X-axis adjustment module 31 also includes a second elastic member 316. One end of the second elastic member 316 is connected to the first base plate 311, and the other end is connected to the first slide plate 314. When the first slide plate 314 is pushed, the second elastic member 316 is in a compressed state so that when the first knob 312 is rotated in the opposite direction, the elastic force of the second elastic member 316 can be used to drive the first slide plate 314 to move in the opposite direction.

[0062] In some embodiments, the Y-axis adjustment module 32 includes at least one second slide rail 322, a second slide plate 323, and a second knob 321. The second slide rail 322 is mounted above the first slide plate 314 and arranged along the Y-axis direction. The second slide plate 323 is mounted on the second slide rail 322. The second knob 321 is mounted on the first slide plate 314 and is configured to move controllably along the Y-axis direction to push the second slide plate 323 to slide along the second slide rail 322, thereby adjusting the position of the PCB board 10 in the Y-axis direction. That is, the first slide plate 314 of the X-axis adjustment module 31 serves as the base plate for the Y-axis adjustment module 32, which can greatly compress the longitudinal space of the probe holder 100. Here, the structure of the second knob 321 is the same as that of the first knob 312, and the lever of the second knob 321 extends along the Y-axis direction.

[0063] In this embodiment, the X-axis adjustment module 31 and the Y-axis adjustment module 32 are designed with a stacked structure, which is relatively compact and can reduce the volume of the probe holder 100.

[0064] In some embodiments, the number of second slide rails 322 is multiple, which can increase the stability of the movement of the second slide plate 323. For example, a dual slide rail design can be adopted.

[0065] In some embodiments, the Y-axis adjustment module 32 further includes a third elastic element 324, one end of which is connected to the first slide plate 314 and the other end is connected to the second slide plate 323. When the second slide plate 323 is pushed, the third elastic element 324 is in a compressed state so that when the second knob 321 is rotated in the opposite direction, the elastic force of the third elastic element 324 can be used to drive the second slide plate 323 to move in the opposite direction.

[0066] In some embodiments, the adjustment assembly 30 further includes a TZ axis adjustment module 33, which is installed above the Y axis adjustment module 32 and is used to controllably drive the PCB board 10 to rotate a preset angle in the TZ direction to adjust the position of the PCB board 10. The Z axis adjustment module 34 is installed on the front side of the TZ axis adjustment module 33.

[0067] In this embodiment, the TZ axis adjustment module 33 is superimposed with the X axis adjustment module 31 and the Y axis adjustment module 32. This can be understood as the X axis adjustment module 31, the Y axis adjustment module 32 and the TZ axis adjustment module 33 being arranged vertically on the probe holder 100, making the probe holder 100 structure more compact and further reducing the volume of the probe holder 100.

[0068] In some embodiments, the adjustment assembly 30 further includes a TX axis adjustment module 35, which is mounted on the front side of the Z axis adjustment module 34 and is used to controllably rotate the PCB board 10 by a preset angle in the TX direction to adjust the position of the PCB board 10. Here, the TX direction can be understood as the horizontal direction of the probe holder 100.

[0069] In this embodiment, the Z-axis adjustment module 34 and the TX-axis adjustment module 35 are designed with a stacked structure. This can be understood as the Z-axis adjustment module 34 and the TX-axis adjustment module 35 being arranged in a horizontal stack on the probe holder 100, which can greatly compress the horizontal space of the probe holder 100 and further reduce the volume of the probe holder 100.

[0070] In a preferred embodiment, the TZ-axis adjustment module 33 is detachably connected to the Y-axis adjustment module 32. That is, the X-axis adjustment module 31 and the Y-axis adjustment module 32 are detachable from the other three axes, facilitating maintenance and replacement. Specifically, the TZ-axis adjustment module 33 is connected to the Y-axis adjustment module 32 via multiple bolts 50.

[0071] In some embodiments, the TZ axis adjustment module 33 includes a second base plate 331, a first rotating plate 332, and a third knob 333. The second base plate 331 is mounted above the Y-axis adjustment module 32. The first rotating plate 332 includes a first portion 334 mounted above the second base plate 331. The first portion 334 is arranged horizontally and rotatably connected to the second base plate 331. The third knob 333 is mounted on the second base plate 331 and is configured to move controllably along the Y-axis to push the first rotating plate 332 to rotate a preset angle along the TZ direction, thereby adjusting the position of the PCB board 10 in the TZ direction. Here, the structure of the third knob 333 is the same as that of the first knob 312, and the lever of the third knob 333 extends along the Y-axis direction.

[0072] In some embodiments, the first rotating plate 332 further includes a second portion 335 arranged vertically, which is connected to the first portion 334 and located in front of the first portion 334. The Z-axis adjustment module 34 includes at least one third slide rail 342, a third slide plate 343, and a fourth knob 341. The third slide rail 342 is mounted in front of the second portion 335 and arranged along the Z-axis. The third slide plate 343 is mounted on the third slide rail 342, and the fourth knob 341 is mounted on the third slide plate 343 and configured to move controllably along the Z-axis to push the third slide plate 343 to slide along the third slide rail 342, thereby adjusting the position of the PCB board 10 in the Z-axis direction. Here, it can be understood that the first rotating plate 332 is L-shaped, which can serve as both the base plate of the Z-axis adjustment module 34 and the rotating plate of the Z-axis adjustment module 33, making the probe holder 100 structure more compact and reducing the volume of the probe holder 100. The structure of the fourth knob 341 is the same as that of the first knob 312, and the lever of the fourth knob 341 extends along the Z-axis.

[0073] In some embodiments, the number of third slide rails 342 is multiple, which can increase the stability of the movement of the third slide plate 343. For example, a dual slide rail design can be adopted.

[0074] In some embodiments, the TZ axis adjustment module 33 further includes a fourth elastic element 336. One end of the fourth elastic element 336 is connected to the first rotating plate 332, and the other end is connected to the second sliding plate 323. The fourth elastic element 336 is in a compressed state when the first rotating plate 332 is pushed to rotate, so that when the third knob 333 is rotated in the opposite direction, the elastic force of the fourth elastic element 336 can be used to drive the first rotating plate 332 to rotate in the opposite direction.

[0075] In some embodiments, the Z-axis adjustment module 34 further includes a fifth elastic element, one end of which is connected to the first rotating plate 332 and the other end of which is connected to the third sliding plate 343. The fifth elastic element is in a compressed state when the third sliding plate 343 is pushed, so that when the fourth knob 341 is rotated in the opposite direction, the elastic force of the fifth elastic element can be used to drive the third sliding plate 343 to move in the opposite direction.

[0076] In some embodiments, the TX axis adjustment module 35 includes a second rotating plate 352 and a fifth knob 351. The second rotating plate 352 is rotatably connected to a third sliding plate 343 and is arranged along the Z-axis direction. The PCB board 10 is mounted on the second rotating plate 352. The fifth knob 351 is mounted on the second rotating plate 352 and is configured to move controllably along the Y-axis direction to abut against the third sliding plate 343, thereby pushing the first rotating plate 332 to rotate a preset angle along the TX direction, thereby adjusting the position of the PCB board 10 in the TX direction. Here, the TX direction can be understood as the left-right direction of the probe holder 100. The structure of the fifth knob 351 is the same as that of the first knob 312, and the rod of the fifth knob 351 extends along the Y-axis direction.

[0077] In some embodiments, the TX axis adjustment module 35 further includes a sixth elastic element, one end of which is connected to the second rotating plate 352 and the other end is connected to the third sliding plate 343. The sixth elastic element is in a compressed state when the second rotating plate 352 is pushed to rotate, so that when the fifth knob 351 is rotated in the opposite direction, the elastic force of the sixth elastic element can be used to drive the second rotating plate 352 to rotate in the opposite direction.

[0078] This embodiment is designed with the knob positions of each axis in an ergonomic manner and optimizes the adjustment feel, which can ensure one-handed adjustment in a small space and improve the convenience of adjustment.

[0079] In some embodiments, the probe holder 100 is mounted on the target component 200 and further includes a limiting component 40. The limiting component 40 includes a handle and a first elastic member 43. The handle is rotatably connected to the adjusting component 30. The handle has an operating part 42 and an abutting part 41 that abuts against the target component 200. The operating part 42 is configured to rotate the handle when operated, thereby causing the abutting part 41 to separate from the target component 200, so that the probe holder 100 is in a free state. One end of the first elastic member 43 is connected to the handle, and the other end is connected to the adjusting component 30. The first elastic member 43 is used to drive the handle to reset, so that the abutting part 41 abuts against the target component 200, thereby causing the probe holder 100 to be in a locked state. Here, the limiting component 40 includes a rotating shaft 44, and the handle is rotatably connected to the adjusting component 30 through the rotating shaft 44. The handle rotates about the rotating shaft 44. The first elastic member 43 is a spring. In other embodiments, the first elastic member 43 may also be other components with the same elastic properties as a spring.

[0080] Figure 5 This is a schematic structural diagram of a probe holder 100 mounted on a target component 200 according to an embodiment of the present invention. Figure 5As shown, the target component 200 is a slide rail, and the probe holder 100 is mounted on the slide rail and can slide along the slide rail. When the probe holder 100 needs to be moved to the target position so that the probe head 22 contacts the chip under test on the wafer 300, the operating part 42 of the manual operation handle is turned so that the abutment part 41 is separated from the slide rail. At this time, the probe holder 100 can be pushed to move along the slide rail, and the first elastic member 43 is in an extended state. When the probe holder 100 moves to the target position, it can be released directly. The elastic force of the first elastic member 43 can drive the handle to reset, so that the abutment part 41 abuts against the slide rail again, thereby locking the probe holder 100.

[0081] Because the probe holder 100 experiences thermal expansion during high-temperature testing of the wafer 300, the probe tip 22 may shift in the XYZ directions upon contact with the wafer 300, leading to inaccurate test data and, in severe cases, damage to the probe tip 22. Therefore, in this embodiment, the probe holder 100 is made of a metal material with an extremely low coefficient of thermal expansion, such as ceramic or Invar alloy. When tested continuously at 300°C for over two months, the stability of the device data is better than 1%, and the offset of the probe tip 22 during testing is less than 5 μm, reducing the thermal expansion problem and improving the accuracy of the test data.

[0082] This embodiment also provides a wafer testing device, the wafer 300 testing device including the probe holder 100 of any of the above embodiments. Details regarding the probe holder 100 are not provided here.

[0083] This embodiment improves the structure of the probe card by adding a PCB board 10, which is connected to the testing machine via a cable assembly. The probe assembly 20 is detachably connected to the PCB board 10, effectively separating the cable assembly from the probe assembly 20. When replacing the probe assembly 20, it is not necessary to disassemble the cable assembly; only the probe assembly 20 needs to be disassembled and replaced. This avoids damage to the probe card, saves replacement time, and improves the testing efficiency of the wafer 300. Furthermore, this embodiment uses a five-axis adjustment structure for the adjustment component 30, which improves the adjustability of the probe card's position during chip insertion.

[0084] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A probe holder, characterized in that, include: PCB board; A cable assembly, one end of which is connected to the PCB board and the other end of which is connected to the testing machine; A probe assembly, which is detachably connected to the PCB board and is used to contact the chip under test on the wafer under test; An adjustment component is connected to the PCB board and configured to controllably adjust the position of the PCB board, thereby adjusting the position of the probe component.

2. The probe holder according to claim 1, characterized in that, The probe assembly includes: A substrate, wherein the substrate is detachably connected to the PCB board and is electrically connected to the PCB board; At least one probe head is mounted on the substrate and is used to contact the chip under test on the wafer under test.

3. The probe holder according to claim 2, characterized in that, The PCB board is arranged along the vertical direction of the probe holder; The substrate is arranged along the horizontal or vertical direction of the probe holder.

4. The probe holder according to claim 1, characterized in that, The adjustment component includes: X-axis adjustment module, the X-axis adjustment module is used to controllably adjust the position of the PCB board in the X-axis direction; A Y-axis adjustment module is installed above the X-axis adjustment module and is used to controllably adjust the position of the PCB board in the Y-axis direction. The Z-axis adjustment module is connected to the Y-axis adjustment module and is used to controllably adjust the position of the PCB board in the Z-axis direction.

5. The probe holder according to claim 4, characterized in that, The adjustment component further includes: The TZ axis adjustment module is installed above the Y axis adjustment module and is used to controllably rotate the PCB board in the TZ direction by a preset angle to adjust the position of the PCB board. The Z axis adjustment module is installed on the front side of the TZ axis adjustment module.

6. The probe holder according to claim 5, characterized in that, The adjustment component further includes: The TX axis adjustment module is installed on the front side of the Z axis adjustment module and is used to controllably drive the PCB board to rotate by a preset angle in the TX direction in order to adjust the position of the PCB board.

7. The probe holder according to claim 6, characterized in that, The TZ axis adjustment module includes: The second base plate is installed above the Y-axis adjustment module; A first rotating plate, the first rotating plate including a first part installed above the second base plate, the first part being arranged in a horizontal direction and rotatably connected to the second base plate; The third knob is mounted on the second base plate and is configured to move in a controlled manner along the Y-axis direction to push the first rotating plate to rotate by a preset angle along the TZ direction, thereby adjusting the position of the PCB board in the TZ direction.

8. The probe holder according to claim 7, characterized in that, The first rotating plate further includes a second part arranged vertically, the second part being connected to the first part and located in front of the first part; the Z-axis adjustment module includes: At least one third slide rail is mounted on the front side of the second part and arranged along the Z-axis direction; The third slide plate is mounted on the third slide rail; A fourth knob is mounted on the third slide plate and is configured to move in a controlled manner along the Z-axis direction to push the third slide plate to slide along the third slide rail, thereby adjusting the position of the PCB board in the Z-axis direction.

9. The probe holder according to claim 8, characterized in that, The TX axis adjustment module includes: The second rotating plate is rotatably connected to the third sliding plate and is arranged along the Z-axis direction; the PCB board is mounted on the second rotating plate. A fifth knob is mounted on the second rotating plate and is configured to move in a controlled manner along the Y-axis to abut against the third sliding plate, thereby pushing the first rotating plate to rotate a preset angle along the TX direction, thereby adjusting the position of the PCB board in the TX direction.

10. A wafer testing device, characterized in that, Includes the probe holder as described in any one of claims 1-9.

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