Wafer detection equipment

Abstract

The utility model provides wafer detection equipment, which is used for detecting a wafer and comprises a supporting platform, the wafer bearing device comprises a wafer bearing table, an inflation mechanism, a first air flotation guide rail, a first air flotation sliding block, a second air flotation guide rail and a second air flotation sliding block, the first air flotation guide rail is fixedly installed on the supporting platform, the first air flotation sliding block is installed on the first air flotation guide rail in a sliding mode, and the second air flotation guide rail is fixedly installed on the first air flotation sliding block; the second air floating sliding block is slidably installed on the second air floating guide rail, the wafer bearing table is installed on the second air floating sliding block and used for bearing a wafer, and the inflation mechanism is used for blowing air into the space between the first air floating guide rail and the first air floating sliding block so that the first air floating sliding block can suspend on the first air floating guide rail. The inflation mechanism is further used for blowing air into the space between the second air floatation guide rail and the second air floatation sliding block. According to the wafer detection equipment provided by the utility model, the wafer on the wafer bearing table can be positioned and moved more accurately and stably.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a wafer testing device. Background Technology

[0002] In existing semiconductor testing processes, automated probe stations are highly efficient for testing large batches of wafer chips of the same specifications without the need for skip-checking. However, in early-stage research, teaching, small-sample testing, and testing of wafers of various sizes and thicknesses, different wafers of different sizes and thicknesses are involved, as well as the need to test chips at different locations. Testing different locations on the wafer requires translation to achieve this. However, during wafer movement, friction between the wafer stage and the moving track can cause jamming and inaccurate positioning. Therefore, a wafer testing device that allows for more accurate and stable wafer movement is needed. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a wafer inspection device that can more accurately and stably position and move wafers on a wafer carrier stage.

[0004] According to a first aspect of the present invention, a wafer inspection device is used to inspect wafers, comprising: a support platform; a wafer support device, the wafer support device including a wafer support stage, a gas filling mechanism, a first air flotation guide rail, a first air flotation slider, a second air flotation guide rail, and a second air flotation slider, wherein the first air flotation guide rail is fixedly mounted on the support platform, the first air flotation slider is slidably mounted on the first air flotation guide rail, the second air flotation guide rail is fixedly mounted on the first air flotation slider, the second air flotation slider is slidably mounted on the second air flotation guide rail, the wafer support stage is mounted on the second air flotation slider, the wafer support stage is used to support the wafer, the gas filling mechanism is used to blow gas between the first air flotation guide rail and the first air flotation slider to suspend the first air flotation guide rail, the gas filling mechanism is also used to blow gas between the second air flotation guide rail and the second air flotation slider to suspend the second air flotation slider on the second air flotation guide rail; and an inspection device, the inspection device being mounted on the support platform, the inspection device being used to inspect the wafers on the wafer support stage.

[0005] The wafer inspection equipment according to the first aspect of this utility model has at least the following beneficial effects: The air inflation mechanism forms an air film between the first air-bearing guide rail and the first air-bearing slider, and between the second air-bearing guide rail and the second air-bearing slider, thereby minimizing the frictional force between the first air-bearing guide rail and the first air-bearing slider, and between the second air-bearing guide rail and the second air-bearing slider. This reduces the impact of motion inertia on the wafer during startup and shutdown. Consequently, wafer movement becomes easier and positioning more precise.

[0006] According to some embodiments of the present invention, the first air-bearing slider is further provided with a first clamp, the first clamp having a first state and a second state. When the first clamp is in the first state, the first air-bearing slider slides relative to the first air-bearing guide rail. When the first clamp is in the second state, the first air-bearing slider is fixed relative to the first air-bearing guide rail.

[0007] According to some embodiments of the present invention, the second air-bearing slider is further provided with a second clamp, the second clamp including a first state and a second state. When the second clamp is in the first state, the second air-bearing slider slides relative to the second air-bearing guide rail. When the second clamp is in the second state, the second air-bearing slider is fixed relative to the second air-bearing guide rail.

[0008] According to some embodiments of the present invention, the supporting device includes two first air-bearing guide rails, the first air-bearing guide rails extending along a first direction, the two first air-bearing guide rails being spaced apart along a second direction, the first direction being perpendicular to the second direction, each of the two first air-bearing guide rails being provided with a first air-bearing slider, and the second air-bearing guide rail being arranged along the second direction and fixedly connected to the two first air-bearing sliders.

[0009] According to some embodiments of the present invention, a driving mechanism is also included, which is used to drive the first air-bearing slider to slide along the first air-bearing guide rail, and the driving mechanism is also used to drive the second air-bearing slider to slide along the second air-bearing guide rail.

[0010] According to some embodiments of the present invention, an adsorption port is provided on the wafer support stage, and the adsorption port is used to form a negative pressure to adsorb the wafer.

[0011] According to some embodiments of the present invention, the support platform includes an upper support frame, a lower support frame, and a shock-absorbing airbag, the shock-absorbing airbag being disposed between the upper support frame and the lower support frame, and the bearing plate device being disposed on the upper support frame.

[0012] According to some embodiments of the present invention, the detection device includes an array of multiple probe mechanisms, which are used to detect wafers on the wafer carrier stage.

[0013] According to some embodiments of the present invention, the detection device further includes a synchronous lifting mechanism, the probe mechanism is disposed on the synchronous lifting mechanism, and the synchronous lifting mechanism is used to drive the probe mechanisms arranged in multiple arrays to move synchronously relative to the wafer on the wafer support stage.

[0014] According to some embodiments of the present invention, the detection device further includes an observation mechanism, which is disposed on the synchronous lifting mechanism. The synchronous lifting mechanism is also used to drive the observation mechanism to move synchronously relative to the wafer on the wafer support stage.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the internal structure of the wafer inspection equipment of this utility model;

[0017] Figure 2 for Figure 1 A magnified view of a portion of the image;

[0018] Figure 3 This is a schematic diagram of the support platform structure of the wafer inspection equipment of this utility model.

[0019] Icon labels:

[0020] 1. Support platform; 11. Upper support frame; 12. Lower support frame; 13. Shock-absorbing airbag; 2. Support plate device; 21. Support plate platform; 22. First air-bearing guide rail; 23. First air-bearing slider; 24. Second air-bearing guide rail; 25. Second air-bearing slider; 26. Adsorption port; 3. Detection device; 31. Probe mechanism; 32. Observation mechanism; 33. Synchronous lifting mechanism. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0022] In the description of this utility model, it should be understood that the orientation descriptions, such as up and down, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0024] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] After the circuit pattern is fabricated on the wafer, probe testing (also known as microprobe testing) is performed. In this process, probe holders equipped with tiny probes are used to contact various circuit points on the wafer, measuring their electrical characteristics (such as resistance, capacitance, and current) to check if the chip is functioning correctly. This step helps to identify and reject defective chips early, improving product quality and reliability. Multiple probes are used to test the wafer during testing, and to ensure accuracy, these probes need to be synchronized during the sizing process to avoid inaccurate probe detection.

[0026] Reference Figure 1 , Figure 2 and Figure 3The wafer inspection equipment in the first embodiment of this utility model is used to inspect wafers, including: a support platform 1, a wafer support device 2, and an inspection device 3. The wafer support device 2 includes a wafer support stage 21, an inflation mechanism, a first air flotation guide rail 22, a first air flotation slider 23, a second air flotation guide rail 24, and a second air flotation slider 25. The first air flotation guide rail 22 is fixedly installed on the support platform 1, the first air flotation slider 23 is slidably installed on the first air flotation guide rail 22, the second air flotation guide rail 24 is fixedly installed on the first air flotation slider 23, and the second air flotation slider 25 is slidably installed on the support platform 1. On the second air-bearing guide rail 24, the wafer support stage 21 is mounted on the second air-bearing slider 25. The wafer support stage 21 is used to support the wafer. An inflation mechanism is used to blow gas between the first air-bearing guide rail 22 and the first air-bearing slider 23, so that the first air-bearing slider 23 is suspended on the first air-bearing guide rail 22. The inflation mechanism is also used to blow gas between the second air-bearing guide rail 24 and the second air-bearing slider 25, so that the second air-bearing slider 25 is suspended on the second air-bearing guide rail 24. The detection device 3 is mounted on the support platform 1 and is used to detect the wafer on the wafer support stage 21. When detecting the wafer, the wafer is first placed on the wafer support stage 21, and then the wafer support stage 21 is moved by the cooperation between the first air-bearing guide rail 22, the first air-bearing slider 23, the second air-bearing guide rail 24 and the second air-bearing slider 25, thereby changing the position of the wafer detected by the detection device 3. After the inflation mechanism injects gas between the first air-bearing guide rail 22 and the first air-bearing slider 23, and between the second air-bearing guide rail 24 and the second air-bearing slider 25, an air film is formed between these two rails, resulting in near-zero friction. Specifically, air holes are made in the first and second air-bearing guide rails 22 and 24. The inflation mechanism blows air outward through these holes, creating an air film between these rails. This results in minimal friction when the wafer stage 21 moves the wafer, leading to more precise wafer movement.

[0027] When the coefficient of friction between the slider and the slide rail is high, the static friction force that needs to be overcome when the slider is started to move is greater, thus requiring a larger force to drive the slider relative to the slide rail. Using a larger force to drive the slider results in a larger moment of inertia, thereby reducing the slider's movement accuracy.

[0028] A large moment of inertia has a significant impact on motion accuracy, affecting multiple aspects of mechanical system design. Firstly, in mechanical systems, moment of inertia refers to an object's resistance to changes in velocity. When a motor or mechanical component has a large moment of inertia, it acts like a heavy object, requiring more force and time to start or stop. In precision mechanics, this slow response speed can prevent the system from adjusting its motion state in a timely manner, thus affecting motion accuracy. For example, in high-speed printers or precision positioning systems, if the motor's response speed is not fast enough, the print head or positioning device cannot accurately reach the predetermined position, thus affecting print quality and positioning accuracy. In practical applications, control systems need to respond quickly to external changes and internal commands to ensure that moving parts can accurately perform tasks. If the motor's inertia is too large, the control system will appear cumbersome and sluggish when adjusting its motion state, leading to lag when rapid changes in direction or speed are required. For example, in the control of a robotic arm, if the inertia of the joint motors is too large, the robotic arm may experience positional deviations when performing rapid grasping actions, thus affecting the quality of task completion. Therefore, objects with large moments of inertia are difficult to control with high precision during movement.

[0029] According to some embodiments of this utility model, a first clamp is also provided on the first air-bearing slider 23. The first clamp includes a first state and a second state. When the first clamp is in the first state, the first air-bearing slider 23 slides relative to the first air-bearing guide rail 22. When the first clamp is in the second state, the first air-bearing slider 23 is fixed relative to the first air-bearing guide rail 22. A second clamp is also provided on the second air-bearing slider 25. The second clamp includes a first state and a second state. When the second clamp is in the first state, the second air-bearing slider 25 slides relative to the second air-bearing guide rail 24. When the second clamp is in the second state, the second air-bearing slider 25 is fixed relative to the second air-bearing guide rail 24. When inspecting the wafer, it is necessary to fix the wafer and stop its movement. The first clamp and the second clamp make the wafer more stably fixed. Specifically, both the first and second clamps can be air-bearing clamps. The first air-bearing slider 23 is fixed relative to the first air-bearing guide rail 22 and the second air-bearing slider 25 is fixed relative to the second air-bearing guide rail 24 by the air-bearing clamp's air-locking mechanism.

[0030] According to some embodiments of this utility model, the support device 2 includes two first air-bearing guide rails 22, which extend along a first direction and are spaced apart along a second direction. The first direction is perpendicular to the second direction. Each of the two first air-bearing guide rails 22 is provided with a first air-bearing slider 23. A second air-bearing guide rail 24 is arranged along the second direction and fixedly connected to the two first air-bearing sliders 23. For example, to make the movement of the second air-bearing guide rail 24 and the first air-bearing slider 23 relative to the first air-bearing guide rail 22 more stable, two first air-bearing guide rails 22 are provided to support the second air-bearing guide rail 24. Furthermore, the second air-bearing guide rail 24 is positioned between the two first air-bearing guide rails 22.

[0031] According to some embodiments of this utility model, a driving mechanism is also included. The driving mechanism is used to drive the first air-bearing slider 23 to slide along the first air-bearing guide rail, and the driving mechanism is also used to drive the second air-bearing slider 25 to slide along the second air-bearing guide rail. The driving mechanism can drive the movement of the plate-bearing stage 21 more precisely. Specifically, multiple stepper motors can be used for driving.

[0032] According to some embodiments of this utility model, the wafer support stage 21 is provided with an adsorption port 26, which is used to create a negative pressure to adsorb the wafer. The wafer support stage 21 is used to support the wafer, and different sized support stages can be selected according to different wafer sizes. Adsorption ports 26 of different sizes can also be provided on the support stage to adsorb and fix the wafer, thereby preventing the wafer from moving relative to the wafer support stage 21.

[0033] According to some embodiments of this utility model, the support platform 1 includes an upper support frame 11, a lower support frame 12, and a shock-absorbing airbag 13. The shock-absorbing airbag 13 is disposed between the upper support frame 11 and the lower support frame 12, and the bearing device 2 is disposed on the upper support frame 11. The lower support frame can be placed on a flat bottom surface. The upper support frame 11 can be made of granite or other stone materials, using high-precision water grinding to achieve a surface accuracy at the micron level. After the upper support frame 11 is manufactured, it has high flatness, extremely stable physical properties, and is not easily deformed. Compared to metal materials, stone hardly reacts with air. Due to these characteristics, when the bearing device 2 runs on the upper support frame 11, the coefficient of friction is low, the operation is smooth, the temperature is constant, the surface maintenance cost is low, and the service life is greatly increased. Specifically, the shock-absorbing airbag 13 can be equipped with multiple shock-absorbing airbags. Dry and controllable air is filled into the shock-absorbing airbags to put them into working condition. The airbags can control their expansion height by controlling the amount of air they are filled with. At the same time, when external vibrations are transmitted to the shock-absorbing airbag 13 through the lower support frame 12, the shock-absorbing airbag 13 will filter out a certain amplitude and frequency of vibration. The upper support frame 11 installed on the shock-absorbing airbag 13 will reduce the impact of strong vibrations. When the operator is conducting probe electrical testing on the whole machine, the contact between the wafer and the probe will be more stable, making the wafer less prone to scratches.

[0034] According to some embodiments of the present invention, the detection device 3 includes a plurality of probe mechanisms 31 arranged in an array, the probe mechanisms 31 being used to detect the wafer on the wafer stage 21. Multiple probe mechanisms 31 simultaneously detect multiple points on the wafer.

[0035] According to some embodiments of this utility model, the detection device 3 further includes a synchronous lifting mechanism 33, on which probe mechanisms 31 are disposed. The synchronous lifting mechanism 33 is used to drive multiple arrayed probe mechanisms 31 to move synchronously up and down relative to the wafer on the wafer support stage 21. The synchronous lifting mechanism 33 enables multiple probe mechanisms 31 to rise and fall synchronously, preventing tilting of the probe mechanisms 31 relative to the wafer during rising and falling. This also prevents multiple probe mechanisms 31 from failing to detect the wafer simultaneously.

[0036] According to some embodiments of this utility model, the detection device 3 further includes an observation mechanism 32, which is mounted on a synchronous lifting mechanism 33. The synchronous lifting mechanism 33 is also used to drive the observation mechanism 32 to move synchronously relative to the wafer on the wafer support stage 21. Specifically, a multi-magnification microscope is mounted on the observation mechanism 32. The microscope can be adjusted to different magnifications and heights according to observation needs, allowing real-time observation of the wafer and core positions detected by the probe. This magnifies wafer details, detects whether the cutting lines of the core within the wafer are normal, and observes whether there are any defects such as deposits or scratches on the core surface.

[0037] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A wafer inspection device, characterized in that, Used for inspecting wafers, including: Support platform; A wafer support device includes a wafer support platform, an inflation mechanism, a first air-bearing guide rail, a first air-bearing slider, a second air-bearing guide rail, and a second air-bearing slider. The first air-bearing guide rail is fixedly mounted on the support platform, the first air-bearing slider is slidably mounted on the first air-bearing guide rail, the second air-bearing guide rail is fixedly mounted on the first air-bearing slider, and the second air-bearing slider is slidably mounted on the second air-bearing guide rail. The wafer support platform is mounted on the second air-bearing slider and is used to support the wafer. The inflation mechanism is used to blow gas between the first air-bearing guide rail and the first air-bearing slider to suspend the first air-bearing slider on the first air-bearing guide rail. The inflation mechanism is also used to blow gas between the second air-bearing guide rail and the second air-bearing slider to suspend the second air-bearing slider on the second air-bearing guide rail. An inspection device is mounted on the support platform and is used to inspect the wafers on the wafer carrier stage.

2. The wafer inspection equipment according to claim 1, characterized in that, The first air-bearing slider is also provided with a first clamp, which includes a first state and a second state. When the first clamp is in the first state, the first air-bearing slider slides relative to the first air-bearing guide rail. When the first clamp is in the second state, the first air-bearing slider is fixed relative to the first air-bearing guide rail.

3. The wafer inspection equipment according to claim 1, characterized in that, The second air-bearing slider is also provided with a second clamp, which includes a first state and a second state. When the second clamp is in the first state, the second air-bearing slider slides relative to the second air-bearing guide rail. When the second clamp is in the second state, the second air-bearing slider is fixed relative to the second air-bearing guide rail.

4. The wafer inspection equipment according to claim 1, characterized in that, The support device includes two first air-bearing guide rails, which extend along a first direction. The two first air-bearing guide rails are spaced apart along a second direction, which is perpendicular to the second direction. Each of the two first air-bearing guide rails is provided with a first air-bearing slider. The second air-bearing guide rail is arranged along the second direction and is fixedly connected to the two first air-bearing sliders.

5. The wafer inspection equipment according to claim 1, characterized in that, It also includes a drive mechanism, which is used to drive the first air-bearing slider to slide along the first air-bearing guide rail, and the drive mechanism is also used to drive the second air-bearing slider to slide along the second air-bearing guide rail.

6. The wafer inspection equipment according to claim 1, characterized in that, The wafer support platform is provided with an adsorption port, which is used to create a negative pressure to adsorb the wafer.

7. The wafer inspection equipment according to claim 1, characterized in that, The support platform includes an upper support frame, a lower support frame, and a shock-absorbing airbag. The shock-absorbing airbag is disposed between the upper support frame and the lower support frame, and the bearing plate device is disposed on the upper support frame.

8. The wafer inspection equipment according to claim 1, characterized in that, The detection device includes an array of multiple probe mechanisms, which are used to detect the wafers on the wafer carrier stage.

9. The wafer inspection equipment according to claim 8, characterized in that, The detection device further includes a synchronous lifting mechanism, on which the probe mechanism is disposed. The synchronous lifting mechanism is used to drive the probe mechanisms arranged in multiple arrays to move synchronously up and down relative to the wafer on the wafer support stage.

10. The wafer inspection equipment according to claim 9, characterized in that, The detection device also includes an observation mechanism, which is mounted on the synchronous lifting mechanism. The synchronous lifting mechanism is also used to drive the observation mechanism to move synchronously relative to the wafer on the wafer support stage.

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