Memory bank aging test device

Abstract

The utility model discloses a memory bank aging test device, which comprises a bottom plate, and a power supply module, a communication module, a signal test module and a plurality of reliability test modules which are arranged on the bottom plate, one end of the power supply module is connected with the signal test module and the reliability test module, and the other end is connected with an external power supply; one end of the communication module is also connected to the signal test module and the reliability test module, and the other end is used for accessing an external main control device; and the signal test module and the reliability test module are both used for accessing the memory bank. According to the memory bank aging test device provided by the utility model, the power supply module, the communication module, the signal test module and the plurality of reliability test modules are integrated on the bottom plate, so that high-efficiency and comprehensive reliability verification and signal test can be carried out on the plurality of memory banks, and the problems of low test efficiency and incomplete test results are avoided; and the structure compactness and the space utilization rate of the memory bank aging test device are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the memory bank test technical field especially relates to a memory bank aging test device. BACKGROUND

[0002] With the rapid development of electronic equipment, as a key storage component, the performance and reliability of the memory bank directly affect the overall operation stability of the equipment. In the production and use process of the memory bank, due to manufacturing process, material defects or long-term use induced aging problems, may lead to the performance decline, data loss or abnormal failure of the memory bank. Therefore, before the memory bank leaves the factory, comprehensive signal test and reliability verification are the key steps to ensure product quality.

[0003] In the prior art, the test device of the memory bank is usually designed for single function. For example, the signal detection device is mainly used for checking the signal integrity of the memory bank, and the accelerated aging test device is used for verifying the long-term reliability of the memory bank. However, these devices often cannot realize the multifunctional test requirement on the same platform, resulting in low test efficiency and large space occupied by the device. UTILITARY MODEL CONTENTS

[0004] The utility model aims at overcoming the defects in the prior art, and provides a memory bank aging test device.

[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0006] The utility model embodiment provides a memory bank aging test device, which comprises a bottom plate, a power supply module, a communication module, a signal test module and a plurality of reliability test modules arranged on the bottom plate, one end of the power supply module is connected to the signal test module and the reliability test module, and the other end is used for connecting external power supply; one end of the communication module is also connected to the signal test module and the reliability test module, and the other end is used for connecting external host equipment; the signal test module and the reliability test module are used for connecting the memory bank.

[0007] In an embodiment, the memory bank aging test device further comprises an indicator light module, the number of the indicator light modules corresponds to the number of the reliability test modules; one end of the indicator light module is connected to the power supply module, and the other end is connected to the reliability test module.

[0008] In an embodiment, the reliability test module is provided with a power state connection bit, the indicator light module comprises an LED diode; one end of the power state connection bit is connected to the cathode of the LED diode, and the other end is connected to the power state indication end of the memory bar; and the power supply module is connected to the anode of the LED diode.

[0009] In an embodiment, the memory bar aging test device further comprises a voltage stabilizing module, one end of which is connected to the power supply module, and the other end is connected to the signal test module and the reliability test module.

[0010] In an embodiment, the reliability test module and the signal test module are both provided with a power connection bit and an EN enable connection bit; one end of the power connection bit is connected to the power supply module, and the other end is connected to the power end of the memory bar; one end of the EN enable connection bit is connected to the voltage stabilizing module away from the power supply module, and the other end is connected to the EN enable end of the memory bar.

[0011] In an embodiment, the power supply module comprises a power connector and a first filter assembly, the power connector is provided with a power output end, the power output end is connected to the first filter assembly, the power connection bit and the voltage stabilizing module.

[0012] In an embodiment, the voltage stabilizing module comprises a voltage stabilizer, a second filter assembly and a third filter assembly, the voltage stabilizer is provided with a voltage input end and a voltage output end, the power output end, the second filter assembly and the voltage input end are connected in sequence; the voltage output end, the third filter assembly and the EN enable connection bit are connected in sequence.

[0013] In an embodiment, the signal test module is provided with a plurality of signal connection bits, the signal connection bits are connected to the signal end of the memory bar.

[0014] In an embodiment, the communication module comprises a first communication submodule and a second communication submodule, the first communication submodule is connected to the reliability test module, and the second communication submodule is connected to the signal test module.

[0015] In an embodiment, the memory bar aging test device further comprises a first connecting piece and a second connecting piece; the bottom plate and the reliability test module are both provided with a first connecting hole, the memory bar is detachably connected to the first connecting hole through the first connecting piece; the bottom plate and the signal test module are both provided with a second connecting hole, and the memory bar is detachably connected to the second connecting hole through the second connecting piece.

[0016] The memory bar aging test device has the beneficial effects that, compared with the prior art, the power supply module, the communication module, the signal test module and the plurality of reliability test modules are integrated on the bottom plate, the plurality of memory bars can be efficiently and comprehensively verified in reliability and tested in signal, the problems of low test efficiency and incomplete test results are avoided, and the compactness and the space utilization of the memory bar aging test device are improved.

[0017] The utility model will be further described below in combination with the drawings and specific embodiments. DRAWINGS

[0018] In order to make the technical scheme in the embodiments of the utility model clearer, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0019] Figure 1 The structural schematic diagram of the memory bar aging test device provided by the utility model is shown in the figure.

[0020] Figure 2 The schematic block diagram of the memory bar aging test device provided by the utility model is shown in the figure.

[0021] Figure 3 The circuit principle of the power supply module provided by the utility model is shown in the figure. Figure 1 ;

[0022] Figure 4 The circuit principle of the power supply module provided by the utility model is shown in the figure. Figure 2 ;

[0023] Figure 5 The circuit principle diagram of the voltage stabilizing module provided by the utility model is shown in the figure.

[0024] Figure 6 The circuit principle diagram of the indicator lamp module provided by the utility model is shown in the figure. DRAWINGS

[0026] 1, bottom plate;11, first connecting hole;12, second connecting hole;2, power supply module;3, communication module;31, first communication submodule;32, second communication submodule;4, signal test module;5, reliability test module;6, voltage stabilizing module;7, indicator lamp module. DETAILED DESCRIPTION

[0027] In order to make the technical scheme in the embodiments of the utility model clearer, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0029] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0030] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0031] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be connected, or detachable, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate media, or the connection or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In the present application, unless otherwise specifically defined and limited, the first feature "above" or "below" the second feature can include direct contact between the first and second features, or indirect contact between the first and second features through another feature between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0033] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0034] Referring to Figures 1 to 6 As shown in the drawings, the utility model discloses a kind of specific embodiments of memory aging test device, comprising: base plate 1, and be located on base plate 1 Power supply module 2, communication module 3, signal test module 4 and several reliability test modules 5;Power supply module 2 one end is connected to signal test module 4 and reliability test module 5, the other end is used for accessing external power supply;Communication module 3 one end is also connected to signal test module 4 and reliability test module 5, the other end is used for accessing external host equipment;Signal test module 4 and reliability test module 5 are all used for accessing memory.

[0035] Specifically, in the test process, first, several memory sticks are connected with several reliability test modules 5 one by one, and power supply module 2 supplies power for memory stick through reliability test module 5, so that memory stick can be tested under the condition of power on, while receiving instructions from external host equipment (for example computer) through communication module 3, corresponding test operation is carried out on memory stick according to instruction, and data and state information in test process are fed back to external host equipment through communication module 3, so as to complete the reliability test of memory stick, to detect which memory stick exists exception;Again, abnormal memory stick is connected to signal test module 4, and power supply module 2 and communication module 3 are also used to cooperate signal test module 4 to detect which signal end of abnormal memory stick operates abnormally.

[0036] The memory bar aging test device provided in the embodiment integrates the power supply module 2, the communication module 3, the signal test module 4 and the reliability test module 5, has a compact structure, improves the space utilization, can simultaneously test the reliability of multiple memory bars, greatly improves the test efficiency, especially in the scene of quality control of a large number of memory bars, through parallel test, more test tasks can be completed in a shorter time, thereby improving the test efficiency. When a memory bar is detected to have an abnormality by the reliability test module 5, the memory bar aging test device can further locate the specific signal end operation abnormality through the signal test module 4. The precise fault locating capability helps to quickly identify the problem root cause, provides strong support for subsequent memory bar repair or improvement, improves the comprehensiveness and accuracy of detection. In addition, by testing the memory bar under the condition of power-on, the device can more realistically simulate the performance of the memory bar in the actual working environment, thereby improving the reliability and accuracy of the test.

[0037] Referring to Figures 1 to 2 In a specific embodiment, the communication module 3 includes a first communication submodule 31 and a second communication submodule 32, the first communication submodule 31 is connected to the reliability test module 5, and the second communication submodule 32 is connected to the signal test module 4.

[0038] Specifically, the signal test module 4 and the reliability test module 5 may have different communication requirements and data transmission characteristics when testing the memory bar. By providing independent communication submodules for them, more targeted communication management can be achieved. For example, the signal test module 4 may need to frequently transmit and receive a large amount of signal data, such as memory bar data signals, address signals and other test data, while the reliability test module 5 may focus on transmitting state information related to reliability, test results, error information and the like. By separating them, interference and congestion caused by transmission of different types of data in the same communication channel can be avoided, and the respective communication channels can be optimized according to their data characteristics. More specifically, the first communication submodule 31 can be connected to multiple reliability test modules 5 at the same time, so that the reliability of multiple memory bars can be tested at the same time through one first communication submodule 31, and the signal test of the abnormal memory bar is performed by the second communication submodule 32, so that the two operations can be performed at the same time, further improving the test efficiency and reducing the test cost.

[0039] Further, according to the range of the number of reliability test modules 5 that each first communication submodule 31 can control, a plurality of reliability test modules 5 can be divided into n reliability test groups, and the number of reliability test groups corresponds to the number of first communication submodules 31. By explicitly grouping the reliability test modules 5 and connecting the reliability test modules 5 in the reliability test groups to the first communication submodules 31, the communication capabilities of each first communication submodule 31 can be fully utilized, and the situation of some first communication submodules 31 being overloaded and some being idle can be avoided. This makes the communication resources balanced and reasonably configured in the entire memory bar aging test device, improves the overall communication efficiency, ensures that each reliability test module 5 can timely and accurately communicate with the external host device, and ensures that the test work can be carried out smoothly.

[0040] Referring to Figure 1 As shown in the drawings, in a specific embodiment, the memory bar aging test device further comprises a first connecting piece (not shown in the drawings) and a second connecting piece (not shown in the drawings); the bottom plate 1 and the reliability test module 5 are each provided with a first connecting hole 11, and the memory bar is detachably connected to the first connecting hole 11 through the first connecting piece; the bottom plate 1 and the signal test module 4 are each provided with a second connecting hole 12, and the memory bar is detachably connected to the second connecting hole 12 through the second connecting piece.

[0041] Specifically, the first connecting piece and the second connecting piece are introduced, and the corresponding first connecting hole 11 and the second connecting hole 12 are respectively provided on the bottom plate 1, the reliability test module 5 and the signal test module 4, so that the memory bar is detachably connected to the memory bar aging test device. Such a design facilitates the installation and disassembly of the memory bar, and improves the operability and maintainability of the memory bar aging test device.

[0042] When the memory bar needs to be tested for reliability, the memory bar is connected to the first connecting hole 11 through the first connecting piece; when the memory bar needs to be tested for signal, the memory bar is connected to the second connecting hole 12 through the second connecting piece. After the test is completed, the memory bar can be easily disassembled. Through such a design, the installation and disassembly of the memory bar are facilitated, the time for installing and replacing the memory bar is reduced, the test efficiency is improved, and the risk of damaging the memory bar aging test device or the memory bar during frequent replacement of the memory bar is reduced.

[0043] More specifically, the first and second connecting pieces are screws. By using screws as the first and second connecting pieces, a firm connection effect can be provided. During the memory stick aging test process, the memory stick aging test device may be affected by a certain degree of vibration or other external forces, and the use of screws can ensure the stable connection of the memory stick with the signal test module 4 and the reliability test module 5, avoiding test interruption or inaccurate test results due to loose connection. This firm connection method can ensure the stability of signal transmission and power supply during the test process, improving the reliability of the test. And the screw is a widely used and user familiar connecting piece, the installation and disassembly operation is relatively simple, and it is convenient to adjust, by adjusting the tightness of the screw, the installation position of the memory stick can be fine-tuned to a certain extent, to ensure good contact between it and the test module, improve the adaptability of the connection, and reduce the problem of poor connection caused by the size deviation of the memory stick. It can be understood that the positions and numbers of the first connecting hole 11 and the second connecting hole 12 can be reasonably set according to the internal circuit distribution of the memory stick and the reliability test module 5 and the signal test module 4, so that the memory stick and the reliability test module 5 and the signal test module 4 can be stably connected without damaging the circuit.

[0044] It can also be understood that the first and second connecting pieces can also use common connecting piece types, such as plug-in connectors, snap-in connectors, etc. These connectors can ensure stable connection of the memory stick during the test process, while facilitating disassembly and replacement. The size and shape of the first connecting hole 11 and the second connecting hole 12 can be customized according to the interface design of the memory stick to ensure the reliability and stability of the connection.

[0045] Referring to Figure 1 , Figure 2 and Figure 5 , in a specific embodiment, the memory stick aging test device further comprises a voltage stabilizing module 6, one end of which is connected to the power supply module 2, and the other end is connected to the signal test module 4 and the reliability test module 5.

[0046] Specifically, during the test process, the voltage output by the power supply module 2 first enters the voltage stabilizing module 6, which processes the input voltage and stabilizes it within the required voltage range, and the stabilized voltage is output to the signal test module 4 and the reliability test module 5 for use. Through such a design, the stability and reliability of the test are improved, and the signal test module 4, the reliability test module 5 and the memory stick can be effectively protected from damage caused by unstable voltage.

[0047] Referring to Figures 3 to 4As shown, in a specific embodiment, the reliability test module 5 and the signal test module 4 are both provided with a power supply connection site and an EN enable connection site; one end of the power supply connection site is connected to the power supply module 2, and the other end is connected to the power supply end of the memory stick; one end of the EN enable connection site is connected to the voltage stabilizing module 6 away from the power supply module 2, and the other end is connected to the EN enable end of the memory stick.

[0048] Specifically, in this embodiment, the structure of the reliability test module 5 and the signal test module 4 can be seen from J1 N in Figure 3 and J1 P in Figure 4 . By providing the power supply connection site and the EN enable connection site on the reliability test module 5 and the signal test module 4, the power supply connection site connects the power supply module 2 with the power supply end of the memory stick, which can ensure that the memory stick is normally powered; the EN enable connection site connects the voltage stabilizing module 6 with the EN enable end of the memory stick, and the voltage output by the voltage stabilizing module 6 controls the enable state of the memory stick, thereby realizing the opening and closing control of the memory stick. During the test process, the power supply module 2 provides power for the memory stick through the power supply connection site, and the voltage output by the voltage stabilizing module 6 controls the EN enable end of the memory stick through the EN enable connection site, when the voltage of the EN enable end reaches the predetermined driving voltage value, the memory stick starts to work, and when the voltage is lower than a certain value, the memory stick stops working. The signal test module 4 and the reliability test module 5 test the memory stick in the state of opening. Through this design, the fine management of the power supply and enable control of the memory stick is realized, which ensures that the working state of the memory stick can be accurately controlled during the test process, thereby improving the controllability and safety of the test, and avoiding the test errors caused by the abnormal opening or closing of the memory stick.

[0049] In a specific embodiment, the power supply module 2 includes a power supply connector J14 and a first filter assembly, the power supply connector J14 is provided with a power output end, the power output end is connected to the first filter assembly, the power supply connection site and the voltage stabilizing module 6.

[0050] Specifically, in this embodiment, the first filter assembly includes a first capacitor C14 and a second capacitor C15 connected in parallel; the power output end of the power supply connector J14 is connected to one end of the first capacitor C14 and one end of the second capacitor C15, and is connected to the power supply connection site and the voltage stabilizing module 6; the other end of the power supply connector J14, the first capacitor C14 and the second capacitor C15 are all in a grounded state. The power supply connector J14 provides power input for the entire device, the first capacitor C14 and the second capacitor C15 play a role in preliminary filtering of the input power, reducing the clutter and interference in the power supply, thereby improving the quality of the power supply, providing a purer power supply for the subsequent modules, and reducing test errors caused by power supply clutter; and the filter circuit structure is simple, low in cost and easy to implement.

[0051] Further, the power supply module 2 further comprises a third capacitor C1, one end of the third capacitor C1 is connected to the power supply connection position, and the other end is directly grounded, so as to guide the high-frequency noise signal to the ground, effectively reduce the noise level on the power supply line, make the power supply provided to the signal test module 4, the reliability test module 5 and the memory bar more pure, reduce the test error and performance instability caused by the power supply noise.

[0052] Referring to Figure 5 As shown in the figure, in a specific embodiment, the voltage stabilizing module 6 comprises a voltage stabilizer U1, a second filter assembly and a third filter assembly, the voltage stabilizer U1 is provided with a voltage input end VIN and a voltage input end VOUT, a power supply output end, the second filter assembly and the voltage input end VIN are connected in sequence; the voltage input end VOUT, the third filter assembly and the EN enable connection position are connected in sequence.

[0053] Specifically, the voltage stabilizer U1, the second filter assembly and the third filter assembly can effectively filter out power supply noise and interference, provide stable voltage input and output, so as to ensure the stability of the memory bar power supply and the accuracy of the signal transmission in the test process, and further improve the reliability and accuracy of the test results.

[0054] It can be understood that the voltage stabilizer U1 can adopt various existing voltage stabilizers, such as linear voltage stabilizer U1 or switching voltage stabilizer U1. The second filter assembly and the third filter assembly can adopt a filter circuit composed of capacitors, resistors and the like, and the specific element selection and parameters can be designed and adjusted according to actual requirements.

[0055] In a specific embodiment, the voltage stabilizer U1 is further provided with an enable pin EN; the second filter assembly comprises a fourth capacitor C13, a fifth capacitor C9 and a first resistor R41; one end of the fourth capacitor C13 is connected to the power supply output end and the voltage input end VIN, and the other end is in a grounded state; the connection structure of the fifth capacitor C9 is consistent with that of the fourth capacitor C13; one end of the first resistor R41 is connected to the voltage input end VIN, and the other end is connected to the enable pin EN.

[0056] Specifically, by designing the second filter component as an RC filter network composed of the fourth capacitor C13, the fifth capacitor C9, and the first resistor R41, high-frequency noise in the power supply can be effectively filtered out, improving the quality of the power supply and reducing power supply ripple, providing a more stable input voltage for the voltage regulator U1. This helps the voltage regulator U1 output a more stable voltage, ensuring that the signal test module 4 and the reliability test module 5 can work in a stable voltage environment, improving the accuracy and reliability of the test results. A more stable power supply helps reduce circuit abnormalities caused by power supply noise, reduces errors and failures caused by power supply fluctuations during testing, and improves the reliability of the entire memory module aging test device. It can prevent test module misoperation, signal interference, and other problems caused by power supply noise, protect sensitive components in the test module, and improve the performance and service life of the test equipment. In addition, by connecting the enable pin EN and the voltage input terminal VIN with the first resistor R41, the voltage regulator U1 can be turned on and off, providing a flexible power management mechanism for the entire system. When the voltage difference between the voltage input terminal VIN and the enable pin EN reaches the predetermined voltage difference, the voltage regulator U1 can work normally, stabilizing the input voltage to the required output voltage; when the voltage difference between the voltage input terminal VIN and the enable pin EN does not reach the predetermined voltage difference, the voltage regulator U1 can be turned off, thereby cutting off the power supply to the subsequent circuit.

[0057] In a specific embodiment, the voltage regulator U1 also has a null pin NC; the third filter component includes a sixth capacitor C10, a seventh capacitor C11, and an eighth capacitor C12; the sixth capacitor C10 and the seventh capacitor C11 are connected in parallel, and one end of the sixth capacitor C10 and the seventh capacitor C11 is connected to the voltage output terminal VOUT and the EN enable connection bit, and the other end of the sixth capacitor C10 and the seventh capacitor C11 is grounded; one end of the eighth capacitor C12 is connected to the null pin NC, and the other end is grounded.

[0058] Specifically, through the synergistic effect of the sixth capacitor C10, the seventh capacitor C11 and the eighth capacitor C12, the high-frequency noise signals that the voltage output terminal VOUT can generate are effectively filtered out, so that the circuit voltage provided to the EN enable connection bit is more pure and stable, thereby ensuring that the signal test module 4 and the reliability test module 5 can work based on accurate enable control state when testing the memory bank, reducing the test errors caused by power supply noise, and improving the accuracy and reliability of the test results. And the design of the NC empty pin being grounded through the eighth capacitor C12 helps to block the high-frequency interference that can be transmitted from the outside, improves the stability of the entire circuit system, reduces the probability of abnormal circuit conditions caused by external interference, thereby effectively protecting the sensitive elements in the signal test module 4 and the reliability test module 5, ensuring the stable operation of the entire memory bank aging test device, prolonging its service life, and helping to improve the overall performance of the test equipment.

[0059] Referring to Figure 1 , Figure 2 and Figure 6 , in a specific embodiment, the memory bank aging test device further comprises an indicator light module 7, the number of the indicator light module 7 corresponds to the number of the reliability test module 5; one end of the indicator light module 7 is connected to the power supply module 2, and the other end is connected to the reliability test module 5.

[0060] Specifically, in this embodiment, the reliability test module 5 can refer to J10 shown in Figure 6 . The indicator light module 7 is used to indicate the test state of the memory bank. One end of the indicator light module 7 is connected to the power supply module 2 to obtain the required power for work, and the other end is connected to the reliability test module 5, forming a complete path. The reliability test module 5 can obtain the related state information of the memory bank during the test process, and when the memory bank is in an abnormal state, the reliability test module 5 can transmit this abnormal signal to the corresponding indicator light module 7. Since the indicator light module 7 is always powered by the power supply module 2, once it receives the abnormal signal transmitted from the reliability test module 5, it has the condition to light up, so as to intuitively present the abnormal condition of the memory bank. When the memory bank connected to any one of the reliability test modules 5 is in an abnormal state, the indicator light module 7 connected to the reliability test module 5 will light up accordingly, so that in this way, the state of each reliability test module 5 can be indicated by the corresponding indicator light module 7, thereby realizing real-time monitoring of the test state of each memory bank and quickly locating the abnormal memory bank, thereby speeding up the progress of the entire memory bank aging test work and improving the overall efficiency of the test work.

[0061] In a specific embodiment, the reliability test module 5 is provided with a power state connection bit, and the indicator light module 7 comprises an LED diode D1; one end of the power state connection bit is connected to the cathode of the LED diode D1, and the other end is connected to the power state indication end of the memory bank; and the power supply module 2 is connected to the anode of the LED diode D1.

[0062] Specifically, in the circuit design, the power supply module 2 is connected to the anode of the LED diode D1 to provide a forward voltage input for it, so that it has the power basis to be turned on to emit light. The power state connection bit provided on the reliability test module 5 has one end connected to the power state indication end of the memory bank and the other end connected to the cathode of the LED diode D1. Under normal circumstances, when the power state of the memory bank is normal, the power state indication end thereof is in a corresponding normal level state, and at this time the entire circuit can be in a specific state (such as insufficient current to turn on the LED diode D1 to emit light). However, when the memory bank is abnormal, the level of the power state indication end thereof changes, which causes the level conducted to the cathode of the LED diode D1 through the power state connection bit to change, and then forms a suitable voltage difference with the voltage from the power supply module 2 to the anode, so as to meet the turn-on condition of the LED diode D1. The current can flow from the anode through the LED diode D1 and then return to the circuit part (forms a loop) where the memory bank is located through the power state connection bit, so as to make the LED diode D1 emit light and realize the function of indicating whether the power state of the memory bank is abnormal through the light-on and light-off of the LED diode D1. Through such a design, the change of the power state of the memory bank can be converted into the change of the voltage across the LED diode D1, and then the power state of the memory bank can be reflected in the form of light emission, so as to achieve the indication purpose.

[0063] Further, the indicator light module 7 further comprises a second resistor R1, and the anode of the LED diode D1 is connected to the power output end of the power supply module 2 through the second resistor R1.

[0064] Specifically, the second resistor R1 can effectively limit the current to prevent the LED diode D1 from being damaged due to overcurrent, thereby prolonging the service life of the LED diode D1 and reducing the maintenance cost and the impact on the continuity of the test work caused by frequent replacement due to component damage. In addition, the working current of the LED diode D1 is more stable, which avoids abnormal flickering or false light-on, false light-off and other situations of the LED diode D1 caused by unstable current, and improves the accuracy and stability of the indicator light module 7 in indicating the power state of the memory bank, which is helpful for better assisting the development of the memory bank aging test work.

[0065] In a specific embodiment, the reliability test module 5 and the signal test module 4 are respectively provided with a first burning connection bit and a second burning connection bit; one end of each of the first burning connection bit and the second burning connection bit is connected to the communication module 3, and the other end is used for connecting the burning end of the memory bank.

[0066] Specifically, the first communication submodule 31 is connected to the memory bar on the reliability test module 5 through the first burning connection bit, and the second communication submodule 32 is connected to the memory bar on the signal test module 4 through the second burning connection bit. When it is detected that the memory bar needs to change the SPD (Serial Presence Detect) or needs to change the PMIC (Power Management Integrated Circuit) burning information, so that the external host device can accurately convey the burning related instructions to the burning end corresponding to the memory bar through the connection between the first communication submodule 31 or the second communication submodule 32 and the burning end, and realize the change operation of the burning information of the memory bar. This connection architecture ensures the continuity and effectiveness of the instruction transmission path, thereby realizing precise burning control and ensuring the integrity of the test function, which helps to more comprehensively and accurately control the quality and detect the performance of the memory bar.

[0067] In a specific embodiment, the signal test module 4 is provided with a plurality of signal connection bits, which are connected to the signal end of the memory bar.

[0068] Specifically, the types of the signal connection bits include but are not limited to data signal connection bits, address signal connection bits and control signal connection bits, and are connected to different signal ends of the memory bar, and the signal test module 4 is respectively provided with different silk screen marks corresponding to different types of signal connection bits. Through such a design, when the signal test module 4 detects that the memory bar has a signal abnormality, the type and position of the abnormal signal end can be accurately located, and the type and position of the abnormal signal end are transmitted to the external host device through the first communication submodule 3, thereby greatly reducing the time and workload of troubleshooting and facilitating subsequent maintenance operations.

[0069] Further, the power connection bit, the EN enable connection bit, the power state connection bit, the first burning connection bit, the second burning connection bit and the signal test point are in contact. When the memory bar is connected to the reliability test module 5, the power connection bit, the EN enable connection bit, the power state connection bit and the first burning connection bit provided by the reliability test module 5 are respectively abutted to the power end, the EN enable end, the power state indication end and the burning end of the memory bar; when the memory bar is connected to the signal test module 4, the power connection bit, the EN enable connection bit, the second burning connection bit and the signal connection bit provided by the signal test module 4 are respectively abutted to the power end, the EN enable end, the burning end and the signal end of the memory bar.

[0070] Specifically, the detachable connection of the first connecting piece, the first connecting hole 11, the second connecting piece and the second connecting hole 12 is arranged in a contact mode, which makes the connection operation of the memory bar and the reliability test module 5 and the signal test module 4 simple and convenient, effectively reduces the problems of unstable power transmission, signal interruption or mis-transmission caused by loose connection, virtual connection and the like, and ensures that each connection position can accurately act on a specific port of the memory bar, thereby ensuring the accurate function interaction between each functional module and the memory bar, and ensuring that the power supply, signal transmission, control and burning and other functions can be stably and reliably realized during the whole test process, thereby providing a solid connection foundation for obtaining accurate test results and reducing the possibility of test errors caused by poor connection.

[0071] Referring to Figure 1 In a specific embodiment, as shown in the drawings, a plurality of reliability test modules 5 are arranged in a rectangular array on the base plate 1, and the reliability test groups corresponding to the division are sub-matrices in the rectangular array. The indicator light module 7 is arranged corresponding to the reliability test module 5, the first communication sub-module 31 is arranged corresponding to the reliability test group, the signal test module 4 is located on any side of the rectangular array formed by the reliability test module 5, the power supply module 2 and the voltage stabilizing module 6 are located at one end of the signal test module 4, and the second communication sub-module 32 is located at the other end of the signal test module 4.

[0072] Specifically, the rectangular array distribution of the reliability test module 5 and the reasonable position arrangement of other functional modules make the layout of the whole memory bar aging test device on the base plate 1 more compact and orderly, and the relatively reasonable position arrangement between the modules can shorten the length of the connection line, reduce the detour and intersection of the line, reduce power loss and signal interference, and ensure stable power supply, thereby improving the test performance and reliability of the whole device and making the cooperative work between the modules more smooth and efficient.

[0073] Further, the voltage stabilizing module 6 is located between the rectangular array formed by the power supply module 2 and the reliability test module 5, the indicator light module 7 is located at one end of the reliability test module 5 close to the voltage stabilizing module 6, and the first communication sub-module 31 is located at one end of the reliability test group away from the voltage stabilizing module 6.

[0074] Specifically, the position of the voltage stabilizing module 6 enables the voltage stabilizing module 6 to efficiently stabilize the voltage output by the power supply module 2 and provide stable voltage for the reliability test module 5 and the signal test module 4 in time, thereby avoiding problems such as inaccurate test data and abnormal module operation caused by unstable voltage, improving the test reliability and accuracy of the whole memory bar aging test device, and ensuring that each module can stably operate in a good voltage environment, thereby providing powerful power supply guarantee for accurately detecting the performance of the memory bar.

[0075] The indicator light module 7 is arranged close to the voltage stabilizing module 6 and the reliability test module 5, which can ensure stable power supply and normal operation of the indicator light module 7, and quickly respond to the abnormal signal transmitted by the reliability test module 5, so that the operator can see the test state of the memory bank in time and intuitively, quickly locate the abnormal memory bank, reduce the time cost of troubleshooting, improve the efficiency and convenience of the whole test process, help to process the abnormal memory bank in time, and ensure the smooth progress of the test work.

[0076] The first communication submodule 31 is arranged away from the voltage stabilizing module 6, and the first communication submodule 31 is also arranged away from the second communication submodule 32, which effectively reduces the electromagnetic interference between the first communication submodule 31 and the power supply circuit, the second communication submodule 32 and other circuits, so that the communication between the first communication submodule 31 and the external host device is more smooth, the test data, state information and the like transmitted are more accurate and correct, and the external host device can accurately master the reliability test situation of the memory bank, and at the same time, it is also beneficial to timely issue subsequent test instructions according to the accurate information received, optimize the whole test process, and improve the overall efficiency and quality of the test.

[0077] In summary, such arrangement of the modules makes the internal layout of the whole memory bank aging test device more reasonable and orderly, different functional modules can be relatively clearly distributed, mutual interference is reduced, the collaborative work between the modules is more smooth and efficient, the overall performance of the device is improved, and it has a positive effect on ensuring test accuracy, improving test efficiency, facilitating operation and maintenance and the like, and is more conducive to meeting the actual production needs of batch and efficient test of memory banks.

[0078] The above embodiment is a preferred implementation scheme of the present application, in addition to this, the present application can also be implemented in other ways, and any obvious replacement without departing from the technical scheme concept is within the protection scope of the present application.

Claims

1. A memory module aging test device, characterized in that, include: A base plate, and a power supply module, a communication module, a signal testing module, and several reliability testing modules mounted on the base plate; One end of the power supply module is connected to the signal test module and the reliability test module, and the other end is used to connect to an external power source; one end of the communication module is also connected to the signal test module and the reliability test module, and the other end is used to connect to an external main control device; both the signal test module and the reliability test module are used to connect to a memory module.

2. The memory module aging test apparatus according to claim 1, characterized in that, The memory module aging test device also includes indicator light modules, the number of which corresponds to the number of reliability test modules; one end of each indicator light module is connected to the power supply module, and the other end is connected to the reliability test module.

3. The memory module aging test apparatus according to claim 2, characterized in that, The reliability testing module is provided with a power status connection position, and the indicator module includes an LED diode; one end of the power status connection position is connected to the cathode of the LED diode, and the other end is connected to the power status indicator terminal of the memory module; the power supply module is connected to the anode of the LED diode.

4. The memory module aging test apparatus according to claim 1, characterized in that, The memory module aging test device also includes a voltage regulator module, one end of which is connected to the power supply module, and the other end is connected to the signal test module and the reliability test module.

5. The memory module aging test apparatus according to claim 4, characterized in that, Both the reliability testing module and the signal testing module are provided with a power connection bit and an EN enable connection bit; one end of the power connection bit is connected to the power supply module and the other end is connected to the power supply terminal of the memory module; one end of the EN enable connection bit is connected to the end of the voltage regulator module away from the power supply module and the other end is connected to the EN enable terminal of the memory module.

6. The memory module aging test apparatus according to claim 5, characterized in that, The power supply module includes a power connector and a first filter component. The power connector has a power output terminal, which is connected to the first filter component, the power connection point, and the voltage regulator module.

7. The memory module aging test apparatus according to claim 6, characterized in that, The voltage regulator module includes a voltage regulator, a second filter component, and a third filter component. The voltage regulator has a voltage input terminal and a voltage output terminal. The power output terminal, the second filter component, and the voltage input terminal are connected in sequence. The voltage output terminal, the third filter component, and the EN enable connection bit are connected in sequence.

8. The memory module aging test apparatus according to claim 1, characterized in that, The signal testing module is provided with several signal connection bits, which are connected to the signal terminals of the memory module.

9. The memory module aging test apparatus according to claim 1, characterized in that, The communication module includes a first communication submodule and a second communication submodule. The first communication submodule is connected to the reliability testing module, and the second communication submodule is connected to the signal testing module.

10. The memory module aging test apparatus according to claim 1, characterized in that, The memory module aging test device further includes a first connector and a second connector; both the base plate and the reliability test module are provided with a first connection hole, and the memory module is detachably connected to the first connection hole through the first connector; both the base plate and the signal test module are provided with a second connection hole, and the memory module is detachably connected to the second connection hole through the second connector.

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