Connector and connector assembly

Abstract

The utility model provides a connector and a connector assembly. The connector is mounted on a substrate (100) and into which a module substrate of an external module is inserted in a first direction (D1), the substrate (100) having a plurality of power supply pads (121Z, 121X) disposed apart from each other in a second direction (D2), the module substrate having a plurality of power supply electrodes, the connector being provided with: a connector body into which the module substrate is inserted; one or a plurality of power supply pins (240) housed inside the connector main body and in contact with the plurality of power supply electrodes of the module substrate; and at least one bus bar (220) connected to the one or more power supply pins (240) and connected to a plurality of power supply pads (121Z, 121X) disposed apart from each other in the second direction (D2).

Description

Technical Field

[0001] This utility model relates to a connector and a connector assembly. Background Technology

[0002] Increasing the number of layers on a printed circuit board (PCB) to facilitate high-speed signal routing can lead to increased manufacturing costs and reduced reliability, which is not preferable. Therefore, there is a desire to reduce the total number of layers while minimizing the thickness of the PCB.

[0003] On the other hand, in order to transmit high-speed signals (such as signals above 224Gbps), it is desirable to maximize the line width and spacing (Line / Space (L / S)) of the wiring to reduce insertion loss.

[0004] In view of the above, it is preferable to reduce the power layer of the printed wiring board.

[0005] Therefore, the purpose of this disclosure is to provide a connector and connector assembly for reducing the thickness of a printed wiring board by reducing the total number of layers through the reduction of power layers. Utility Model Content

[0006] To address the aforementioned issues, the connector and connector assembly disclosed herein employ the following methods.

[0007] The connector according to the first aspect of this disclosure is mounted on a substrate and inserted into a module substrate of an external module along a first direction. The substrate has a plurality of power pads separately arranged in a second direction substantially orthogonal to the first direction, and the module substrate has a plurality of power electrodes. The connector comprises: a connector body for insertion into the module substrate; one or more power pins housed within the connector body and in contact with the plurality of power electrodes of the module substrate; and at least one busbar connected to the one or more power pins and connected to the plurality of power pads separately arranged in the second direction.

[0008] Since the busbar is connected to one or more power pins and to multiple power pads that are separately configured in the second direction, it is possible to electrically connect the power pads and power pins via the busbar.

[0009] Furthermore, since the busbar is connected to one or more power pins and to multiple power pads separately arranged in the second direction, the multiple power pads separately arranged in the second direction can be electrically connected to each other via the busbar. Therefore, even if the power layer is omitted from the substrate, the busbar will replace that power layer. In other words, the power layer can be omitted from the substrate. In addition, since the power layer can be omitted from the substrate, the substrate thickness can be reduced, and reliability can be improved. Furthermore, since the inner layer wiring for power can be omitted from the inner layer of the substrate, the layout freedom of inner layer wiring for purposes other than power (signal / grounding) can be increased.

[0010] The connector involved in the second aspect of this disclosure is, in the first aspect, the connector body has: two second side surfaces facing each other in the second direction; two third side surfaces facing each other in a third direction orthogonal to the first direction and the second direction; the busbar has: a busbar main surface that coincides with the third side surfaces; two busbar side surfaces that are connected to the busbar main surface and coincide with each of the second side surfaces; and each of the busbar side surfaces is connected to each of the power supply pads.

[0011] Since the busbar has a main busbar surface that coincides with at least one third side and two busbar sides that are connected to the main busbar surface and coincide with each second side, and each busbar side is connected to each power supply pad, a circuit / wire / wiring can be formed along the side of the connector body through the busbar.

[0012] Furthermore, since the busbar has a main surface that coincides with the third side and two side surfaces that connect to the main surface and coincide with each of the second sides, the shape of the busbar can be made to conform to the shape of the connector body, thus minimizing the shape of the connector.

[0013] The connector involved in the third aspect of this disclosure is, in the second aspect, wherein the substrate has a plurality of pads for purposes other than power supply arranged in the second direction, the module substrate has a plurality of electrodes for purposes other than power supply, the connector has a plurality of contact pins, the plurality of contact pins being housed inside the connector body and extending in the first direction and contacting the electrodes for purposes other than power supply of the module substrate, each contact pin having: a mounting portion that engages with the electrodes for purposes other than power supply of the substrate; a holding portion that is held against the inner peripheral wall of the connector body; and a contact portion that tilts away from the inner peripheral wall of the connector body and includes a contact position that contacts the module substrate, the main surface of the busbar viewed from the third aspect being configured in a range that does not overlap with the mounting portion and the holding portion in the first direction.

[0014] Because the main surface of the busbar, viewed from a third-party perspective, is positioned in a range that does not overlap with the mounting portion and the retaining portion in the first direction, it is possible to avoid positioning the main surface of the busbar near the contact pins. In other words, the main surface of the busbar can be positioned in any range that overlaps with the contact portion away from the inner peripheral wall of the connector body or in any range where there are no contact pins. Therefore, the main surface of the busbar is separated from the contact pins, making it difficult for the radiated components of the signal transmitted through the contact pins to transfer to the main surface of the busbar (difficult electromagnetic coupling). As a result, the possibility of the radiated components of the signal affecting adjacent channels via the main surface of the busbar is reduced, thus reducing crosstalk between channels.

[0015] The connector involved in the fourth aspect of this disclosure is, in the second or third aspect, provided that the number of busbars is two, and one or more of the power pins are fixed to the two busbar main surfaces facing each other on the third side.

[0016] Because there are two busbars, and one or more power pins are fixed to the two opposing main surfaces of the busbars facing upwards, the power pins can be securely fixed relative to the busbars. This provides a connector whose power pins are resistant to damage.

[0017] The connector involved in the fifth aspect of this disclosure is such that, in the second or third aspect, the number of busbars is set to one, and one or more of the power pins are fixed on the main surface of one busbar.

[0018] Because the busbar is configured as a single unit, and one or more power pins are fixed to the main surface of the busbar, a simple busbar structure and power pins fixed to the busbar can be provided. This results in a connector with reduced manufacturing costs.

[0019] The connector involved in the sixth aspect of this disclosure is such that, in any one of the second to fifth aspects, each of the busbars has a tab-shaped side tab, and each of the side tabs is engaged with each of the power supply pads of the substrate.

[0020] Because each busbar has tab-shaped side protrusions that engage with power pads on the substrate, a large engagement area with the power pads can be achieved. Therefore, power can be efficiently supplied from the power pads to the busbars and vice versa. Furthermore, the larger engagement area makes it difficult to peel the busbars off the power pads, resulting in a securely mounted connector on the substrate.

[0021] The connector involved in the seventh aspect of this disclosure is, in any one of the second to sixth aspects, equipped with at least one cover that covers the busbar.

[0022] Because it has at least one cover that covers the busbar, the busbar is not visible from the connector. Therefore, it is difficult for workers to touch the busbar. This avoids the danger of electric shock caused by current flowing through the busbar.

[0023] The connector involved in the eighth aspect of this disclosure is, in the seventh aspect, the number of covers is the same as the number of busbars, and the cover has: a cover main surface that coincides with the main surface of the busbar; and two cover side surfaces that are connected to the cover main surface and coincide with the side surfaces of each of the busbars.

[0024] The number of covers is the same as the number of busbars. Each cover has a main surface that coincides with the main surface of the busbar and two side surfaces that connect to the main surface and coincide with the side surfaces of each busbar. For example, if there is only one busbar, one cover can be used to cover the busbar; if there are two busbars, two covers can be used to cover each busbar. In this way, the covers can be appropriately set according to the number of busbars.

[0025] The connector involved in the ninth aspect of this disclosure is, in the eighth aspect, provided that the number of the covers is two, the two covers are arranged opposite each other in the third direction, and the two covers are integrated by engaging the respective cover sides of one cover with the respective cover sides of the other cover.

[0026] Since the two covers are integrated by joining the sides of one cover with the sides of the other cover, the area around the busbar can be reliably covered by the two covers.

[0027] The connector according to the tenth aspect of this disclosure is, in a first aspect, wherein the module substrate has multiple electrodes for purposes other than power supply, the connector has a first pin group and a second pin group housed inside the connector body, the first pin group and the second pin group having multiple contact pins extending in a first direction and contacting the electrodes for purposes other than power supply of the module substrate, the first pin group being formed by the multiple contact pins arranged in a second direction, the second pin group being formed by the multiple contact pins arranged in the second direction, the first pin group and the second pin group being arranged opposite to each other in a third direction orthogonal to the first direction and the second direction, the busbar having: a central portion disposed between the first pin group and the second pin group and extending in the second direction; and two side portions connected to the two ends of the central portion in the second direction, each side portion being connected to each of the power supply pads.

[0028] Since the busbar has a central portion disposed between the first pin group and the second pin group and extending in the second direction, and two side portions connected to the two ends of the central portion in the second direction, each side portion being connected to a power supply pad, it is possible to form a line / wire / wiring along the second direction inside the connector body through the busbar.

[0029] The connector involved in the eleventh aspect of this disclosure is such that, in the tenth aspect, when the connector is mounted on the substrate and inserted into the module substrate, the central portion is located between the first pin group and the second pin group facing each other in the third direction.

[0030] When the connector is mounted on the substrate and inserted into the module substrate, the center portion is located between the first pin group and the second pin group facing each other from the third direction. Therefore, the center portion of the busbar can be set using the space formed between the first pin group and the second pin group.

[0031] The connector involved in the twelfth aspect of this disclosure is, in the first aspect, the busbar is indirectly connected to one or more of the power pins.

[0032] Because the busbar is indirectly connected to one or more power pins, it is not necessary to directly connect the busbar to the power pins. This increases the design freedom of the busbar and / or power pins.

[0033] The connector assembly according to the thirteenth aspect of this disclosure comprises: a connector as described in any one of the first to eleventh aspects; a substrate on which the connector is mounted, the substrate having a plurality of power supply pads separately arranged in the second direction.

[0034] It is possible to provide a connector assembly having a connector and a substrate on which the connector is mounted, and the substrate having a plurality of power supply pads separately arranged in a second direction.

[0035] The connector assembly involved in the fourteenth aspect of this disclosure is, in the thirteenth aspect, the substrate having: an inner layer comprising a plurality of signal layers and a power layer; a surface layer covering the surface of the inner layer; a plurality of vias through which power pads are connected to the power layer of the inner layer, the power layer being disposed closer to the surface layer than the signal layers.

[0036] Because the power layer, which connects to the power pads via vias, is located closer to the surface than the signal layer, the vias connecting to the power layer do not penetrate the signal layer. This increases the flexibility of signal routing within the signal layer. Conversely, if the power layer were located further away from the surface than the signal layer and vias penetrated the signal layer, signal routing would have to avoid these vias, thus limiting the available routing area.

[0037] The connector assembly involved in the fifteenth aspect of this disclosure is, in the thirteenth aspect, further comprising the connector described in any one of the first to eleventh aspects, wherein the first connector and the second connector are adjacent in the second direction, and the busbar of the first connector and the busbar of the second connector are connected to the shared power pad provided between the first connector and the second connector.

[0038] Since the first connector and the second connector are adjacent in the second direction, the busbars of the first connector and the second connector are connected on a shared power pad located between the first connector and the second connector. Therefore, the power supplied to the busbar of the first connector can be supplied to the second connector (specifically, the power pin of the second connector) via the shared power pad and the busbar of the second connector.

[0039] The connector assembly according to the sixteenth aspect of this disclosure includes: the connector of the twelfth aspect; the substrate on which the connector is mounted, one or more of the power pins being connected to pads disposed on the substrate, and the busbar being connected to the pads connected to the one or more of the power pins.

[0040] Since one or more power pins are connected to pads provided on the substrate, and the busbar is connected to pads connected to one or more power pins, the busbar can be electrically connected to the power pins via the pads provided on the substrate.

[0041] Furthermore, there is no need to make the power pins have a special shape to fit the busbar shape; for example, the shape of the power pins can be the same as the shapes of other contact pins (signal pins, ground pins). In other words, there is no need to distinguish the shape of the power pins from the shapes of other contact pins. As a result, components can be shared, reducing the manufacturing cost of the connector assembly. Attached Figure Description

[0042] Figure 1 This is a 3D view of the connector assembly.

[0043] Figure 2 To indicate in Figure 1 The diagram shows a three-dimensional view of the connector assembly with an optical module mounted on the connector.

[0044] Figure 3 This is a perspective view of the connector according to the first embodiment.

[0045] Figure 4 A perspective view of the connector with the cover decomposed.

[0046] Figure 5 A 3D view of the connector (cover omitted).

[0047] Figure 6 To observe from the bottom Figure 5 A 3D view of the connector shown.

[0048] Figure 7 This is an exploded 3D view of the connector (cover omitted).

[0049] Figure 8 A perspective view of the connector, broken down into the connector body and busbar (cover omitted).

[0050] Figure 9 A 3D view of the busbar before the power supply pins are installed.

[0051] Figure 10 An exploded 3D view of the busbar before the power pins are installed (only one busbar is shown).

[0052] Figure 11 A 3D view of a busbar with power pins installed (only one busbar is shown).

[0053] Figure 12 This is a magnified view of a portion of the area near the riveting protrusions of the power supply pins and the riveting holes of the busbar (before riveting the power supply pins).

[0054] Figure 13 This is a magnified view of a portion of the protrusion for riveting the power pin and the area near the riveting hole for the busbar (after the power pin is riveted).

[0055] Figure 14 This is a three-dimensional view of the substrate.

[0056] Figure 15 This is a partially enlarged view of the connector assembly.

[0057] Figure 16 for Figure 15 A perspective view of the connector shown (the connector body and cover are omitted).

[0058] Figure 17A This is a diagram related to the layer structure of the substrate.

[0059] Figure 17B Diagrams related to the layer structure of the substrate (continued from above) Figure 17A ).

[0060] Figure 18 To modify the perspective view of the substrate involved in Example 1.

[0061] Figure 19 for Figure 18 The image shows a partially enlarged view of the substrate.

[0062] Figure 20 For installation Figure 19 A perspective view of the connector on the substrate shown (the connector body and cover are omitted).

[0063] Figure 21 To change the 3D view of the busbar involved in Example 2.

[0064] Figure 22 To modify the side view of the connector assembly involved in Example 3 (cover omitted).

[0065] Figure 23 for Figure 22 The sectional view shown at section line XXIII-XXIII.

[0066] Figure 24 The simulation results represent the improvement in crosstalk.

[0067] Figure 25 This is a perspective view of the connector according to the second embodiment.

[0068] Figure 26 A perspective view of the connector with the cover decomposed.

[0069] Figure 27 This is an exploded 3D view of the connector (cover omitted).

[0070] Figure 28 An exploded 3D view of the busbar before the power supply pins are installed.

[0071] Figure 29A perspective view of a busbar with power supply pins installed.

[0072] Figure 30 This is a perspective view of the connector according to the third embodiment.

[0073] Figure 31 for Figure 30 The cross-sectional view shown at section line XXXI-XXXI (cross-section through the power supply pin).

[0074] Figure 32 This is an exploded perspective view of the connector according to the third embodiment.

[0075] Figure 33 An exploded 3D view of the busbar before the power supply pins are installed.

[0076] Figure 34 This is a perspective view of the connector according to the fourth embodiment.

[0077] Figure 35 A perspective view of the connector with the cover omitted.

[0078] Figure 36 for Figure 34 The sectional view shown is taken at the section line XXXVI-XXXVI.

[0079] Figure 37 This is a diagram showing the substrate on which the connector according to the fourth embodiment is installed, viewed from a first direction. Detailed Implementation

[0080] <First Implementation>

[0081] The first embodiment of this disclosure will be described.

[0082] [Connector Assembly]

[0083] like Figure 1 as well as Figure 2 As shown, the connector assembly 10 includes a printed wiring board 100 (hereinafter referred to as "board 100") and a plurality of connectors 200.

[0084] The connector 200 is mounted (fixed) on the front side of the substrate 100. In addition, an ASIC is provided on the back side of the substrate 100.

[0085] An optical module 300 (external module) with a module substrate 310 is mounted on the connector assembly 10. The module substrate 310 is inserted into the slot 211 of the connector 200.

[0086] The direction in which the module substrate 310 is inserted into the connector 200 and the direction in which the module substrate 310 is pulled out of the connector 200 are designated as "first direction D1". The direction orthogonal to "first direction D1" is designated as "second direction D2". The direction orthogonal to both first direction D1 and second direction D2 is designated as "third direction D3".

[0087] like Figure 1 as well as Figure 2 As shown, the first direction D1 aligns with the depth direction of the connector assembly 10. The second direction D2 aligns with the width direction of the connector assembly 10. The third direction D3 aligns with the height direction of the connector assembly 10. However, these directions are examples defined for illustrative purposes and do not limit the actual orientation of the connector assembly 10.

[0088] On the substrate 100, a number of ventilation openings 110 corresponding to the number of connectors 200 are formed. The ventilation openings 110 are openings for guiding cooling air that has passed through the heat sink of the optical module 300 to the back side of the substrate 100.

[0089] [Connector]

[0090] Connector 200 is a device for relaying between substrate 100 and module substrate 310 or for electrically connecting substrate 100 and module substrate 310.

[0091] like Figure 3 As shown, connector 200 is generally designed to be in a cuboid shape.

[0092] like Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 as well as Figure 10 As shown, connector 200 includes connector body 210, busbar 220, multiple contact pins 230, multiple power pins 240, and cover 250.

[0093] The connector body 210 is a roughly rectangular parallelepiped-shaped part.

[0094] The connector body 210 is formed of an insulating material (e.g., resin).

[0095] A slot 211 is formed in the center of the connector body 210, extending through in the first direction D1. The module substrate 310 is inserted into the slot 211.

[0096] On the inner peripheral wall (inner peripheral wall, peripheral wall of the defining slot 211) of the connector body 210, a plurality of slits 212 are formed along the first direction D1. Contact pins 230 are pressed into these slits 212 respectively. Thus, the contact pins 230 are held in the connector body 210.

[0097] A busbar 220 is installed on the outer peripheral wall (outer peripheral wall) / side / around of the connector body 210.

[0098] like Figure 9 As shown, busbar 220 includes a first busbar 220A and a second busbar 220B.

[0099] The first busbar 220A and the second busbar 220B are configured to be approximately symmetrical with respect to a plane orthogonal to the first direction D1, and are arranged opposite each other in the third direction D3. The following description uses the first busbar 220A as an example, and omits the description of the second busbar 220B.

[0100] like Figure 10 As shown, the first busbar 220A is a roughly U-shaped component.

[0101] The first busbar 220A is formed of a material with excellent conductivity (e.g., metal). Specifically, the first busbar 220A is configured to be formed by plating a copper-based material (e.g., nickel plating or gold plating).

[0102] The first busbar 220A has a main busbar surface 221 and two side busbar surfaces 222.

[0103] The main surface 221 of the busbar is a plate-shaped surface that coincides with the surface (one side surface) of the connector body 210 opposite to it in the third direction D3 (see reference). Figure 5 wait).

[0104] The side surface 222 of the busbar is connected to the side edge of the main surface 221 of the busbar in the second direction D2. The side surface 222 of the busbar is a plate-shaped surface that coincides with each surface of the connector body 210 opposite in the second direction D2 (see reference). Figure 5 (etc.). One busbar side 222 and another busbar side 222 are arranged opposite each other in the second direction D2. Thus, the first busbar 220A becomes approximately U-shaped. That is, becoming approximately U-shaped along the outer shape of the connector body 210, which is approximately cuboid in shape, minimizes the outer shape of the connector 200.

[0105] like Figure 9 , Figure 10 as well as Figure 11As shown, when the connector 200 is mounted on the substrate 100, an enlarged portion 221a extending in the first direction D1 is provided at the edge of the main surface 221 of the busbar opposite to the substrate 100. A plurality of riveting holes 221b are formed in this enlarged portion 221a. Riveting protrusions 243 of the power pin 240 are inserted into these riveting holes 221b.

[0106] When the connector 200 is mounted on the substrate 100, side tabs 222a are provided at the edges of each busbar side 222 opposite to the substrate 100, extending in a first direction D1 and bending outward in a second direction D2. These side tabs 222a are engaged with the power pads of the substrate 100 (e.g., soldered connections).

[0107] like Figure 7 As shown, the multiple contact pins 230 are elongated parts extending along the first direction D1.

[0108] Each contact pin 230 is formed of a material with excellent conductivity and elasticity (e.g., metal). Specifically, each contact pin 230 is configured to be formed by plating a copper-based material (e.g., nickel plating or gold plating).

[0109] Contact pin 230 includes signal pins for transmitting signals (high-speed signals and low-speed signals) and ground pins for serving as a reference potential, but does not include power supply pins.

[0110] Multiple protrusions 232a are provided on the contact pin 230. These protrusions 232a are inserted into the slit 212 formed on the connector body 210, thereby holding the contact pin 230 in the slit 212 (connector body 210).

[0111] Multiple contact pins 230 constitute two groups (a first group G1 and a second group G2). In each group, the multiple contact pins 230 are arranged at intervals (a predetermined spacing) in the second direction D2. A gap C (a spacing wider than the predetermined spacing) is provided between the contact pins 230 located at the center of the second direction D2 for configuring power supply pins 240. The first group G1 and the second group G2 are arranged opposite each other in the third direction D3. However, the contact pins 230 included in the first group G1 and the contact pins 230 included in the second group G2 are staggered by half a spacing (half of the predetermined spacing) in the second direction D2. The module substrate 310 of the optical module 300 is inserted into the gap between the first group G1 and the second group G2. Moreover, each contact pin 230 included in each group makes one-to-one contact with an electrode of the inserted module substrate 310 for purposes other than power supply. Electrodes for other applications include signal electrodes for transmitting signals (high-speed signals and low-speed signals) and grounding electrodes that serve as a reference potential.

[0112] like Figure 10 as well as Figure 11 As shown, the power supply pin 240 is a component having a base 241, multiple mounting portions 242, multiple riveting protrusions 243, and multiple pin portions 244. The base 241, multiple mounting portions 242, multiple riveting protrusions 243, and multiple pin portions 244 are integrally formed from a single component, for example.

[0113] The power supply pin 240 is formed of a material with excellent conductivity and elasticity (such as a metal). Specifically, the power supply pin 240 is configured to be formed by plating a copper-based material (such as nickel plating or gold plating).

[0114] The base 241 is a plate-shaped portion with the second direction D2 as its thickness direction.

[0115] Mounting portion 242 is a portion that extends from the edge of base 241 opposite to substrate 100 along a first direction D1 and then bends outward in a third direction D3 when connector 200 is mounted on substrate 100. These mounting portions 242 engage with power pads of substrate 100 (e.g., solder connection).

[0116] The riveting protrusion 243 is a portion that protrudes outward from the side edge of the base 241 towards D3. Two riveting protrusions 243 are provided at each side edge of the base 241. For example... Figure 12 as well as Figure 13As shown, these riveting protrusions 243 are inserted into the riveting holes 221b of the first busbar 220A and the second busbar 220B. The riveting protrusions 243 inserted into the riveting holes 221b are riveted by bending the portion protruding from the riveting holes 221b. Thus, the power pin 240 is fixed to the first busbar 220A and the second busbar 220B. Simultaneously, the power pin 240 is electrically connected to the first busbar 220A and the second busbar 220B.

[0117] like Figure 10 as well as Figure 11 As shown, the pin portion 244 is an elongated portion extending along the first direction D1 from the edge of the base 241 opposite to the slot 211 (the edge opposite to the edge of the base 241 opposite to the substrate 100 when the connector 200 is mounted on the substrate 100 / the edge facing the module substrate 310 when the module substrate 310 is inserted into the connector 200). The pin portion 244 is, for example, shaped to resemble the contact pin 230. Two pin portions 244 are provided on one base 241. The first pin portion 244A and the second pin portion 244B are configured to be opposite each other in the third direction D3, staggered in the second direction D2. Because two pin portions 244 staggered in the second direction D2 are provided on one base 241, the portion of the base 241 with the first pin portion 244A and the portion of the base 241 with the second pin portion 244B are staggered in the second direction D2, and these portions are smoothly connected.

[0118] Multiple power supply pins 240 configured as described above are overlapped (e.g., three) to form a power supply pin group 240. This power supply pin group 240 is positioned at the gap C between the contact pins 230 of the first group G1 and the gap C between the contact pins 230 of the second group G2. At this time, each pin portion 244 of each power supply pin 240 is arranged continuously with the contact pins 230 arranged in the second direction D2.

[0119] The module substrate 310 of the optical module 300 is inserted into the gap between a plurality of first pin portions 244A and a plurality of second pin portions 244B arranged opposite each other on the third-party direction D3. Furthermore, each pin portion 244 contacts a power supply electrode of the inserted module substrate 310. However, each pin portion 244 may not correspond one-to-one with a power supply electrode; it is sufficient for more than one pin portion 244 to contact at least one power supply electrode.

[0120] like Figure 3 as well as Figure 4 As shown, cover 250 includes a first cover 250A and a second cover 250B.

[0121] The first cover 250A and the second cover 250B are configured to be approximately symmetrical with respect to a plane orthogonal to the first direction D1, and are arranged opposite each other in the third direction D3. The following description uses the first cover 250A as an example, omitting the description of the second cover 250B.

[0122] The first cover 250A is a roughly U-shaped part.

[0123] The first cover 250A is formed of an insulating material (e.g., resin).

[0124] The first cover 250A has a main cover surface 251 and two side covers 252.

[0125] The cover surface 251 is a plate-shaped surface that coincides with the busbar surface 221 of the first busbar 220A. A cutout 251a is formed on the cover surface 251 to avoid interference with the riveting protrusion 243 of the power supply pin 240.

[0126] The cover side surface 252 is connected to the side edge of the cover main surface 251 in the second direction D2. The cover side surface 252 is a plate-like surface that coincides with the side surfaces 222 of each busbar of the first busbar 220A. One cover side surface 252 and the other cover side surface 252 are arranged opposite each other in the second direction D2. Thus, the first cover 250A becomes approximately U-shaped.

[0127] The first cover 250A and the second cover 250B are mounted in a manner that clamps the connector body 210, on the third direction D3, with the busbar 220 mounted thereon. At this time, the edges of each cover side 252 of the first cover 250A engage with the edges of each cover side 252 of the second cover 250B. The engagement is performed, for example, by ultrasonic welding.

[0128] In the connector 200 with the cover 250 installed, the busbar 220 (except for the side tabs 222a) is covered by the cover 250. Therefore, it is not easy for personnel to touch the busbar 220. This avoids the danger of electric shock to personnel due to the current flowing through the busbar 220, thus ensuring safety.

[0129] [Connector Assembly]

[0130] Connector 200 is assembled in the following manner.

[0131] First, such as Figure 10 as well as Figure 11 As shown, multiple power supply pins 240 are mounted on the first busbar 220A. Next, as... Figure 9As shown, multiple power pins 240, which are to be mounted on the first busbar 220A, are mounted on the second busbar 220B. Thus, the first busbar 220A and the second busbar 220B, configured relative to each other on the third-party direction D3, are connected via the power pins 240. In other words, the first busbar 220A, the second busbar 220B, and the power pins 240 form a single component or are integrated into one unit.

[0132] Next, the component is installed on the connector body 210. Specifically, as follows: Figure 8 As shown, the component is inserted from the bottom surface of the connector body 210 (the surface opposite to the substrate 100 when the connector 200 is mounted on the substrate 100). As a result, the side (surroundings) of the connector body 210 is covered by the busbar 220, and the pin portion 244 of the power pin 240 is housed inside the connector body 210.

[0133] Next, multiple contact pins 230 are mounted on the connector body 210. Specifically, as follows: Figure 7 As shown, each contact pin 230 is inserted from the bottom surface of the connector body 210 into each slit 212. At this time, the contact pin 230 is held in the connector body 210 by the protrusion 232a of the contact pin 230 inserting into the slit 212.

[0134] Next, as Figure 4 as well as Figure 3 As shown, the first cover 250A and the second cover 250B are installed to clamp the connector body 210 on the third direction D3. Then, the edges of each cover side 252 of the first cover 250A are joined with the edges of each cover side 252 of the second cover 250B to make the first cover 250A and the second cover 250B an integral unit.

[0135] [The flow of electric current]

[0136] like Figure 14 As shown, multiple pads are provided on the substrate 100.

[0137] The pads include power supply pads and pads for purposes other than power supply (other purpose pads 123). In addition, the power supply pads include a first power supply pad 121 and a second power supply pad 122.

[0138] The first power supply pad 121 is disposed on both sides of the second direction D2 within region Rc on the substrate 100 on which a connector 200 is mounted. Side tabs 222a of the busbar 220 are bonded to the first power supply pad 121 (see reference). Figure 15 ).

[0139] The second power supply pad 122 is positioned in the second direction D2 between (approximately in the middle) the first power supply pad 121 (first power supply pad 121Z) and the first power supply pad 121 (first power supply pad 121X). A mounting portion 242 for attaching multiple power supply pins 240 is attached to the second power supply pad 122 (see reference). Figure 15 ).

[0140] The other-purpose pads 123 include signal pads for transmitting signals (high-speed signals and low-speed signals) and ground pads for serving as a reference potential. Multiple other-purpose pads 123 are arranged in the second direction D2 between the first power supply pad 121 and the second power supply pad 122. Contact pins 230 are bonded to the other-purpose pads 123 (e.g., solder connections).

[0141] Other-purpose pads 123 correspond one-to-one with contact pins 230. Therefore, multiple other-purpose pads 123 are arranged at intervals (the same spacing as the contact pins 230) in the second direction D2, and are configured in two segments in the third direction D3, corresponding to the first group G1 and the second group G2 of the contact pins 230. Furthermore, the second power supply pad 122 is also configured in two segments in the third direction D3. On the other hand, the first power supply pad 121 is not separated in the third direction D3.

[0142] These pads are disposed on the first layer of the substrate 100. In addition, an SR layer (solder resist layer) may also be laminated on the surface of the first layer. However, the portions that engage with the busbar 220, power pin 240 and contact pin 230 (e.g., the surface of the pads) are exposed from the SR layer.

[0143] Other-purpose pads 123 are electrically connected to layers other than the first layer via vias 130. In contrast, the power pads separately arranged in the second direction D2 are not electrically connected to layers other than the first layer, nor are they electrically connected to other pads via vias 130 or inner layer wiring. However, a first power pad 121 (denoted as "first power pad 121X") located in region Rc on the substrate 100 on which one connector 200 is mounted, and a first power pad 121 (denoted as "first power pad 121Y") located in region Rc on the substrate 100 on which another connector 200 is mounted adjacent to one connector 200 in the second direction D2 and adjacent to the first power pad 121X, are integrally formed. That is, the first power pad 121X and the first power pad 121Y are essentially a single pad shared by two adjacent connectors 200. Therefore, the first power pad 121X is electrically connected to the first power pad 121Y.

[0144] like Figure 16As shown, power is supplied from the outside to a first power pad 121 (denoted as "first power pad 121Z") located at the end of the substrate 100 in the second direction D2. The current is, for example, set to 48A (amperes).

[0145] Connector 200 is mounted on substrate 100 configured as described above. At this time, the side tabs 222a of busbar 220 are engaged with each first power supply pad 121, the mounting portions 242 of the plurality of power supply pins 240 are engaged with each second power supply pad 122, and each contact pin 230 is engaged with each other purpose pad 123.

[0146] As described above, the power pin 240 and the busbar 220 are integrated. Therefore, the busbar 220 has the function of electrically connecting the first power pad 121 and the power pin 240, and the function of electrically connecting two first power pads 121 (e.g., first power pad 121Z and first power pad 121X) to each other in region Rc on the substrate 100 on which a connector 200 is mounted. At this time, the busbar 220 becomes a circuit / wire / wiring along the side of the connector body 210 (the faces opposite each other in the third direction D3 and the faces opposite each other in the second direction D2). Therefore, the power supplied from the first power pad 121 (e.g., first power pad 121Z) via the side tab 222a flows to the power pin 240 via the side surface 222 and the main surface 221 of the busbar and is supplied to the module substrate 310. Furthermore, the power supplied from the first power pad 121 (e.g., first power pad 121Z) via the side tab 222a flows through the busbar side surface 222, the busbar main surface 221, and another busbar side surface 222 to the other side tab 222a, thereby being supplied to another first power pad 121 (e.g., first power pad 121X). Additionally, the power supplied to the first power pad 121X flows to the first power pad 121Y and is supplied to another connector 200. In other words, even if the power layer is omitted from the substrate 100, the busbar 220 will replace that power layer. In other words, by providing the busbar 220 in the connector 200, the power layer can be omitted from the substrate 100. Furthermore, since the power layer can be omitted from the substrate 100, the thickness of the substrate 100 can be reduced (see reference). Figure 17A as well as Figure 17B (The dashed box) improves reliability. In addition, since the amount of power supply inner layer wiring is omitted from the inner layer of the substrate 100 to create a margin in the inner layer, the flexibility of laying out inner layer wiring for purposes other than power supply (signal / grounding) is increased.

[0147] Furthermore, when power is supplied only through busbar 220, since power is not supplied to power pin 240 from second power supply pad 122, the mounting portion 242 of power pin 240 may not be connected to second power supply pad 122. In other words, the mounting portion 242 may be omitted from power pin 240.

[0148] However, in order to make the connector 200 more securely bonded to the substrate 100, the mounting portion 242 of the power pin 240 can also be bonded to the second power pad 122.

[0149] Furthermore, when plugging or unplugging the module substrate 310, for example, forces may act on the power pins 240 in all directions. Under such force conditions, by pre-engaging the mounting portion 242 of the power pins 240 with the second power pad 122, such forces can be resisted. As a result, the durability of the connector 200 during plugging and unplugging relative to the module substrate 310 is improved.

[0150] [Modified Example 1]

[0151] In addition to busbar 220, power can also be supplied from layers other than the first layer of substrate 100 (e.g., the third layer). For example, as Figure 18 as well as Figure 19 As shown, the power supply pads and the third layer can also be electrically connected via via 130. In this case, as... Figure 20 As shown, the power supplied from the first power pad 121 (e.g., first power pad 121Z) via the side tab 222a flows to the power pin 240 via the busbar side surface 222 and the busbar main surface 221, and is supplied to the module substrate 310. Furthermore, the power flows to the power pin 240 via the third layer and the second power pad 122, and is supplied to the module substrate 310. Additionally, the power supplied from the first power pad 121 (e.g., first power pad 121Z) via the side tab 222a flows to the other side tab 222a via the busbar side surface 222, the busbar main surface 221, and another busbar side surface 222, and is supplied to another first power pad 121 (e.g., first power pad 121X). Furthermore, the power flows through the third layer and is supplied to another first power pad 121 (e.g., first power pad 121X).

[0152] By using two paths (busbar 220 and the third layer of substrate 100) to allow current to flow, the current flowing to busbar 220 is reduced, thereby reducing heat generation in busbar 220. This, in turn, suppresses the temperature rise of connector 200 and connector assembly 10 caused by the heat generated by busbar 220. However, a third layer needs to be provided in the inner layer of substrate 100. Nevertheless, while conventionally a total of four power layers were required in the inner layer of substrate 100, only one power layer is needed in the inner layer of substrate 100, thus maintaining the ability to reduce the thickness of substrate 100 compared to conventional methods. Furthermore, by providing the power layer closer to the surface layer than the signal layer, the vias 130 connected to the power layer do not penetrate the signal layer, thus increasing the flexibility of signal wiring layout in the signal layer.

[0153] Furthermore, unlike the case where power is supplied only through busbar 220, in this modified example, power is supplied to the power pin 240 from the second power supply pad 122. Therefore, it is necessary to connect the mounting portion 242 of the power pin 240 to the second power supply pad 122.

[0154] [Modified Example 2]

[0155] The power pin 240 is configured to contact the power electrode of the module substrate 310 and connect to the main surface 221 of the busbar, and can be configured to engage with the second power pad 122 as needed, and its shape can be changed appropriately.

[0156] For example, such as Figure 21 As shown, the board material with the second direction D2 as its width can also be used as the power pin 240. In this case, the power pin 240 is joined to the main surface 221 of the busbar, for example, by soldering. Furthermore, the contact force between the module substrate 310 and the power electrode can be optimized by adjusting the board thickness of the power pin 240.

[0157] [Modified Example 3]

[0158] The dimensions of the busbar 220 along the first direction D1 can be appropriately varied taking into account the magnitude of the flowing current, the allowable heat generation, and the impact of the busbar 220 on electrical characteristics (e.g., crosstalk between channels). For example, the dimensions of the busbar 220 can also be smaller than the dimensions of the connector body 210 along the first direction D1 (e.g., less than half).

[0159] Furthermore, by reducing the size of the busbar 220 along the first direction D1, the position of the busbar 220 along the first direction D1 can be appropriately varied within the range existing on the peripheral wall (outer peripheral wall) / side / around of the connector body 210.

[0160] The following describes the dimensions / positions / ranges of the busbar 220 along the first direction D1, using... Figure 22 , Figure 23 as well as Figure 24 And will be explained in detail. Furthermore, for ease of understanding, Figure 22 A portion of the contact pin 230 shown (the portion held on the connector body 210) is in a state where it passes through the connector body 210.

[0161] like Figure 23 As shown, each contact pin 230 is an elongated part extending in the first direction D1. Each contact pin 230 is divided into three parts: a mounting part 231, a holding part 232, and a contact part 233, from the end near the substrate 100 (hereinafter referred to as the "base end") toward the end away from the substrate 100 (hereinafter referred to as the "top end").

[0162] Mounting section 231 is a portion that includes a position for engaging with the other-purpose solder pads 123 of the substrate 100.

[0163] The retaining portion 232 is the portion held in the connector body 210. A protrusion 232a is formed on the retaining portion 232 that inserts into a slit 212 formed in the connector body 210. The retaining portion 232 extends along the inner peripheral wall of the connector body 210 and extends in a manner parallel to the first direction D1.

[0164] The contact portion 233 is a portion that includes a position that contacts the module substrate 310. The contact portion 233 is tilted away from the inner peripheral wall of the connector body 210 in a third direction D3. Specifically, each contact portion 233 of the contact pins 230 included in the first group G1 is tilted toward the second group G2, and each contact portion 233 of the contact pins 230 included in the second group G2 is tilted toward the first group G1.

[0165] Preferably, the main surface 221 of the busbar is positioned such that it does not overlap with the mounting portion 231 and the retaining portion 232 in the first direction D1 when viewed from a third direction D3. That is, preferably, the size / position / range of the main surface 221 of the busbar along the first direction D1 is designed so that it does not overlap with the mounting portion 231 and the retaining portion 232 in the first direction D1. Furthermore, the range that does not overlap with the mounting portion 231 and the retaining portion 232 includes, in addition to the range overlapping with the contact portion 233, a range where the contact pin 230 is not present.

[0166] By designing the busbar main surface 221 in this way, it is separated from the contact pin 230 in the third direction D3, and the area of ​​the busbar main surface 221 is reduced. Therefore, the radiated component of the signal transmitted through the contact pin 230 is less likely to transfer to the busbar main surface 221 (difficult to electromagnetically couple). As a result, the possibility of the radiated component of the signal affecting adjacent channels via the busbar main surface 221 is reduced, thereby reducing crosstalk between channels.

[0167] exist Figure 24 The diagram shows an example of simulation results where the horizontal axis represents frequency and the vertical axis represents crosstalk. The solid line represents the case where the size / position / range of the busbar main surface 221 along the first direction D1 converges within the aforementioned range (see reference). Figure 22 Crosstalk, the dashed line represents the situation where the size / position / range of the main surface 221 of the busbar along the first direction D1 is set to be equal to the size of the connector body 210 along the first direction D1 (refer to...). Figure 5 Crosstalk. For example, by Figure 24 As can be understood, the crosstalk of the modified example shown in solid lines is less than that of the comparative example (existing example) shown in dashed lines, especially in the range of 35 GHz to 55 GHz.

[0168] In addition, such as Figure 22 As shown, an enlarged portion 221a with a riveting hole 221b is provided on the main surface 221 of the busbar, but this enlarged portion 221a may not be converging within the aforementioned range. This is because a power supply pin 240 is located at a position corresponding to the enlarged portion 221a, and the channels (contact pins 230) are further apart than the predetermined spacing, thus making it difficult for crosstalk between channels to occur.

[0169] [Modified Example 4]

[0170] Busbar 220 is divided into first busbar 220A and second busbar 220B, but it is not necessary to divide them.

[0171] For example, the busbar 220 can also be manufactured as a single part, and the shape of the busbar 220 can be set as a cylindrical shape along the outer peripheral wall (outer peripheral wall) / side / around the connector body 210.

[0172] <Second Implementation>

[0173] The second embodiment of this disclosure will be described.

[0174] Furthermore, for structures identical to those in the first embodiment, the same symbols are used, and their descriptions are omitted.

[0175] As a busbar 220, the connector 200 according to the first embodiment includes a first busbar 220A and a second busbar 220B. However, as Figure 25 , Figure 26 as well as Figure 27 As shown, the second busbar 220B (or the first busbar 220A) can be omitted. This is a structure that can be implemented to provide two pin portions 244 on a base 241. In the connector 200 according to this embodiment, for example, the second busbar 220B is omitted.

[0176] In this case, such as Figure 28 as well as Figure 29 As shown, multiple power supply pins 240 are fixed only on the first busbar 220A. Therefore, the riveting protrusions 243 used to fix the base 241 to the second busbar 220B can be omitted from the power supply pins 240.

[0177] Furthermore, the second cover 250B used to cover the second busbar 220B can be omitted from the cover 250.

[0178] In this embodiment, modifications 1, 2 and 3 of the first embodiment can be adopted.

[0179] <Third Implementation Method>

[0180] The third embodiment of this disclosure will be described.

[0181] Furthermore, for structures identical to those in the first embodiment, the same symbols are used, and their descriptions are omitted.

[0182] [Connector]

[0183] Connector 200 is a device for relaying or electrically connecting substrate 100 and module substrate 310.

[0184] like Figure 30 , Figure 31 as well as Figure 32 As shown, the connector 200 is generally designed in a cuboid shape.

[0185] Connector 200 includes connector body 210, busbar 270, multiple contact pins 230, and multiple power pins 260.

[0186] The connector body 210 is a roughly rectangular parallelepiped-shaped part.

[0187] The connector body 210 is formed of an insulating material (e.g., resin).

[0188] like Figure 30 as well as Figure 31As shown, a slot 211 extending in the first direction D1 is formed in the center of the connector body 210. The module substrate 310 is inserted into this slot 211.

[0189] like Figure 30 As shown, a plurality of slits 212 are formed on the inner peripheral wall (inner peripheral wall, the peripheral wall that defines the slot 211) of the connector body 210 along the first direction D1. Contact pins 230 are pressed into these slits 212 respectively. Thus, the contact pins 230 are held in the connector body 210.

[0190] A busbar 270 is configured inside the connector body 210.

[0191] like Figure 33 As shown, the busbar 270 includes a central portion 271 and multiple side portions 272.

[0192] The central part 271 is a rod-shaped part that extends in the second direction D2.

[0193] The cross-sectional shape of the central portion 271 (the cross-section in a plane approximately orthogonal to the second direction D2) is, for example, set to a quadrilateral shape. However, the cross-sectional shape of the central portion 271 may also be other polygonal or circular shapes, etc.

[0194] The central portion 271 is formed of a material with excellent electrical conductivity (e.g., metal). Specifically, the central portion 271 is configured to be formed by plating a copper-based material (e.g., nickel plating or gold plating).

[0195] Side portions 272 are provided at both ends of the central portion 271 in the second direction D2.

[0196] Side portion 272 is a part having a side panel 272a and a mounting tab 272b. The side panel 272a and the mounting tab 272b are integrally formed, for example, from a single component.

[0197] The side panel 272a is a plate-shaped portion with the second direction D2 as the thickness direction.

[0198] The side panel 272a is connected to the end of the center portion 271 in the second direction D2. The side panels 272a of one side portion 272 and the side panels 272a of the other side portion 272 are arranged opposite each other in the second direction D2.

[0199] When the connector 200 is mounted on the substrate 100, a mounting tab 272b is provided on the edge of the side panel 272a opposite to the substrate 100, which is bent outward in a second direction D2. The mounting tab 272b engages with the power pads of the substrate 100 (e.g., solder connection).

[0200] like Figure 32 As shown, the multiple contact pins 230 are elongated parts extending in the first direction D1.

[0201] Each contact pin 230 is formed of a material with excellent conductivity and elasticity (e.g., metal). Specifically, each contact pin 230 is configured to be formed by plating a copper-based material (e.g., nickel plating or gold plating).

[0202] Contact pin 230 includes signal pins for transmitting signals (high-speed signals and low-speed signals) and ground pins for serving as a reference potential, but does not include power supply pins.

[0203] A plurality of protrusions 232a are provided at the base end portion of the contact pin 230 (the portion near the mounting portion 231 that engages with the substrate 100). The contact pin 230 is held in the slit 212 (connector body 210) by these protrusions 232a being inserted into the slit 212 formed on the connector body 210.

[0204] Multiple contact pins 230 constitute two groups (a first group G1 and a second group G2). In each group, the multiple contact pins 230 are arranged at intervals (a predetermined spacing) in the second direction D2. A gap C (a spacing wider than the predetermined spacing) is provided between the contact pins 230 located at the center of the second direction D2 for configuring power supply pins 260. The first group G1 and the second group G2 are arranged opposite each other in the third direction D3. However, the contact pins 230 included in the first group G1 and the contact pins 230 included in the second group G2 are staggered by half a spacing (half of the predetermined spacing) in the second direction D2. The module substrate 310 of the optical module 300 is inserted into the gap between the first group G1 and the second group G2. Moreover, each contact pin 230 included in each group makes one-to-one contact with other application electrodes of the inserted module substrate 310.

[0205] like Figure 31 , Figure 32 as well as Figure 33 As shown, the power supply pin 260 is a component having a base 261, a plurality of mounting portions 262, and a plurality of pin portions 264. The base 261, the plurality of mounting portions 262, and the plurality of pin portions 264 are integrally formed, for example, from a single component.

[0206] The power supply pin 260 is formed of a material with excellent conductivity and elasticity (such as a metal). Specifically, the power supply pin 260 is configured to be formed by plating a copper-based material (such as nickel plating or gold plating).

[0207] The base 261 is a plate-shaped portion with the second direction D2 as its thickness direction.

[0208] A notch 261a is formed on the base 261. The notch 261a is recessed along a first direction D1 from the edge of the base 261 opposite to the substrate 100 when the connector 200 is mounted on the substrate 100. The center portion 271 of the busbar 270 is inserted into this notch 261a. Therefore, the shape of the notch 261a is adapted to the shape of the center portion 271 of the busbar 270.

[0209] The base 261 is connected to the center portion 271 of the busbar 270 inserted into the cutout 261a (e.g., by welding).

[0210] The mounting portion 262 is a portion that, when the connector 200 is mounted on the substrate 100, extends outward from the edge of the base 261 opposite to the substrate 100 along a first direction D1, and then bends outward in a third direction D3. These mounting portions 262 engage with the power pads of the substrate 100 (e.g., solder connection).

[0211] The pin portion 264 is an elongated portion extending in the first direction D1 from the edge of the base 261 opposite to the slot 211 (the edge opposite to the edge of the base 261 opposite to the substrate 100 when the connector 200 is mounted on the substrate 100 / the edge facing the module substrate 310 when the module substrate 310 is inserted into the connector 200). The pin portion 264 is, for example, shaped to resemble the contact pin 230. Two pin portions 264 are provided on one base 261. The first pin portion 264A and the second pin portion 264B are configured to be opposite each other in the third direction D3, staggered in the second direction D2. Because two pin portions 264 staggered in the second direction D2 are provided on one base 261, the portion of the base 261 with the first pin portion 264A and the portion of the base 261 with the second pin portion 264B are staggered in the second direction D2, and these portions are smoothly connected.

[0212] Multiple power supply pins 260 configured as described above are overlapped (e.g., three), forming a power supply pin group 260. This power supply pin group 260 is disposed in the gap C between the contact pins 230 of the first group G1 and the gap C between the contact pins 230 of the second group G2. At this time, each pin portion 264 of each power supply pin 260 is arranged continuously with the contact pins 230 arranged in the second direction D2.

[0213] like Figure 31As shown, the module substrate 310 of the optical module 300 is inserted into the gap between a plurality of first pin portions 264A and a plurality of second pin portions 264B arranged opposite each other on the third direction D3. Furthermore, each pin portion 264 contacts a power supply electrode of the inserted module substrate 310. However, each pin portion 264 may not correspond one-to-one with a power supply electrode; it is sufficient for more than one pin portion 264 to contact at least one power supply electrode.

[0214] In the connector 200 configured as described above, the busbar 270 is housed inside the connector body 210.

[0215] Specifically, such as Figure 31 As shown, the center portion 271 of the busbar 270 is positioned in the gap between the first group G1 and the second group G2 of the contact pins 230 facing each other on the third direction D3. Furthermore, the center portion 271 of the busbar 270 is positioned in a location that does not contact the substrate 100 or the module substrate 310 when the connector 200 is mounted on the substrate 100 and the optical module 300 is inserted into the connector 200. Additionally, the base 261 of the power pin 260 connected to the busbar 270 is also positioned in a location that does not contact the module substrate 310 when the optical module 300 is inserted into the connector 200.

[0216] Furthermore, the side portion 272 of the busbar 270 is inserted into the wall of the connector body 210 opposite in the second direction D2.

[0217] Since the busbar 270 is not visible from the connector 200, it is not easily touched by personnel. This avoids the danger of electric shock to personnel due to the current flowing through the busbar 270, thus ensuring safety.

[0218] [The flow of electric current]

[0219] Mounting tabs 272b of the side portion 272 of the busbar 270 are attached to each first power supply pad 121.

[0220] As described above, since the power pin 260 and the busbar 270 are integrated, the busbar 270 has the function of electrically connecting the first power pad 121 and the power pin 260, and the function of electrically connecting the two first power pads 121 located in region Rc on the substrate 100 on which a connector 200 is mounted. At this time, the busbar 270 forms a circuit / wire / wiring along the second direction D2 inside the connector body 210. Therefore, the power supplied from the first power pad 121 (e.g., first power pad 121Z) via the side portion 272 flows to the power pin 260 via the center portion 271, thereby being supplied to the module substrate 310. In addition, the power supplied from the first power pad 121 (e.g., first power pad 121Z) via the side portion 272 flows to the other side portion 272 via the center portion 271, thereby being supplied to another first power pad 121 (e.g., first power pad 121X). Furthermore, the power supplied to the first power pad 121X flows to the first power pad 121Y and is supplied to another connector 200. That is, even if the power layer is omitted from the substrate 100, the busbar 270 will replace it. In other words, the power layer can be omitted from the substrate 100 by providing the busbar 270 on the connector 200. Moreover, since the power layer can be omitted from the substrate 100, the thickness of the substrate 100 can be reduced. Furthermore, since the inner layer wiring for power supply can be omitted from the inner layers of the substrate 100, the flexibility in laying out inner layer wiring for purposes other than power supply (signal / grounding) is increased.

[0221] Furthermore, when power is supplied solely through busbar 270, since power is not supplied to power pin 260 from second power supply pad 122, the mounting portion 262 of power pin 260 may not be connected to second power supply pad 122. In other words, the mounting portion 262 may be omitted from power pin 260.

[0222] However, in order to make the connector 200 more securely bonded to the substrate 100, the mounting portion 262 of the power pin 260 can also be bonded to the second power pad 122.

[0223] Furthermore, when plugging or unplugging the module substrate 310, forces may sometimes act on the power pins 240 in all directions. In the event of such forces, these forces can be counteracted by pre-engaging the mounting portion 242 of the power pins 240 with the second power pad 122. As a result, the durability of the connector 200 during plugging and unplugging relative to the module substrate 310 is improved.

[0224] In this embodiment, modified Example 1 and modified Example 2 of the first embodiment can be adopted.

[0225] <Fourth Implementation>

[0226] The fourth embodiment of this disclosure will be described.

[0227] Furthermore, for structures identical to those in the first embodiment, the same symbols are used, and their descriptions are omitted.

[0228] like Figure 34 as well as Figure 35 As shown, the connector 200' of this embodiment has a plurality of power supply pins 280.

[0229] The power supply pin 280 is designed to have the same shape as the contact pin 230. In other words, there is no need to distinguish the shape of the power supply pin 280 from the shapes of the other contact pins 230. This allows for component sharing.

[0230] like Figure 36 As shown, the mounting portion 281, which corresponds to the base portion of the power supply pin 280, is bonded to the second power supply common pad 522 of the printed wiring board 500 (hereinafter referred to as "board 500").

[0231] like Figure 37 As shown, substrate 500 is essentially the same as substrate 100 (refer to...). Figure 14 , Figure 15 The substrate 500 has the same structure as (etc.). Specifically, the substrate 500 has a vent opening 510, a first power supply pad 521, and other purpose pads 523.

[0232] However, in Figure 37 In this case, the other-purpose pad 523 is set to four segments on the third-party D3. Alternatively, the other-purpose pad 523 can also have two segments, the same as the substrate 100.

[0233] On substrate 500, instead of the second power supply pad 122 mentioned in substrate 100, a common pad 522 for the second power supply is provided.

[0234] Compared to the other-purpose pads 523 that are set as four segments on the third-direction D3, the second power supply common pad 522 is set as a continuous pad on the third-direction D3. The length of the second power supply common pad 522 along the third-direction is longer than the length from the first segment of the other-purpose pads 523 to the fourth segment of the other-purpose pads 523.

[0235] However, the shape of the second power supply common pad 522 does not necessarily need to be a straight line along the third direction D3, and can be appropriately modified according to the configuration of the other application pads 523. In addition, the second power supply common pad 522 can be divided, and the divided second power supply common pad 522 can be connected using the inner layer of the substrate 500.

[0236] like Figure 36 As shown, mounting portions 281 for all power supply pins 280 are bonded to the second power supply common pad 522. Furthermore, busbars 290 are bonded to the second power supply common pad 522.

[0237] like Figure 35 as well as Figure 36 As shown, the busbar 290 has, for example, a busbar main surface 291 and two busbar side surfaces 292.

[0238] At the edge of each busbar side 292 (the edge opposite to the substrate 500), a side protrusion 292a is provided, which engages with the first power supply pad 521 (521X, 521Z), similar to that in the first embodiment.

[0239] At approximately the center of the second direction D2 of the main surface 291 of the busbar (the edge opposite to the substrate 500), a central protrusion 291a is provided, which extends along the first direction D1 and then bends outward in a third direction D3.

[0240] The central protrusion 291a is bonded to the second power supply common pad 522 of the substrate 500. Thus, the busbar 290 is electrically connected to the second power supply common pad 522.

[0241] By connecting all power pins 280 to the second power common pad 522 and busbar 290 to the second power common pad 522, the busbar 290 and the power pins 280 are electrically connected via the second power common pad 522.

[0242] Therefore, as Figure 36 As shown, power can be supplied indirectly to the power pin 280 from the busbar 290 via the second power supply common pad 522.

[0243] [Modified Example 5]

[0244] Busbar 290 may also have two main busbar faces 291 and two side busbar faces 292.

[0245] In this case, the number of central tabs 291a is set to two. Each central tab 291a is bonded to the second power supply pad 522 of the substrate 500.

[0246] [Modified Example 6]

[0247] Alternatively, adjacent power supply pins 280 on the second direction D2 can be integrated. This increases the size (width) of the power supply pin 280 on the second direction D2. If the width of the power supply pin 280 increases, its resistance decreases, thus reducing heat generation relative to the same current value, or increasing the maximum allowable current value. Furthermore, increasing the width of the power supply pin 280 improves its heat dissipation performance.

[0248] In this embodiment, modifications 1 and 3 of the first embodiment can be adopted.

[0249] Symbol Explanation

[0250] 10 Connector Assembly

[0251] 100 Printed Wiring Board (Substrate)

[0252] 110 ventilation opening

[0253] 121 (121X, 121Y, 121Z) First power supply pads

[0254] 122 Second power supply pad

[0255] 123 Other Uses Pads

[0256] 130 via

[0257] 200, 200' connector

[0258] 210 Connector Body

[0259] 211 slot

[0260] 212 Slit

[0261] 220 (220A, 220B) busbar

[0262] 220A First Busbar

[0263] 221 Busbar Main Face

[0264] 221a Enlarged Section

[0265] 221b Riveting Hole

[0266] 222 Busbar side

[0267] 222a Side Convex Plate

[0268] 220B Second Busbar

[0269] 221 Busbar Main Face

[0270] 221a Enlarged Section

[0271] 221b Riveting Hole

[0272] 222 Busbar side

[0273] 222a Side Convex Plate

[0274] 230 contact pin

[0275] 231 Installation Department

[0276] 232 Maintenance Department

[0277] 232a protrusion

[0278] 233 Contact Department

[0279] 240 power supply pins

[0280] 241 Base

[0281] 242 Installation Department

[0282] 243 Riveting protrusion

[0283] 244-pin section

[0284] 244A First Pin Section

[0285] 244B Second Pin Section

[0286] 250 (250A, 250B) cover

[0287] 250A First Cover

[0288] 251 Cover the main face

[0289] 251a incision

[0290] 252 Cover side

[0291] 250B Second Cover

[0292] 251 Cover the main face

[0293] 252 Cover side

[0294] 260 power supply pin

[0295] 261 Base

[0296] 261a incision

[0297] 262 Installation Department

[0298] 264 pin section

[0299] 264A First Pin Section

[0300] 264B Second Pin Section

[0301] 270 busbar

[0302] 271 Central Department

[0303] 272 Side

[0304] 272a Side panel

[0305] 272b Mounting tabs

[0306] 280 power supply pins

[0307] 281 Installation Department

[0308] 290 busbars

[0309] 291 Busbar Main Face

[0310] 291a Central convex plate

[0311] 292 Busbar side

[0312] 292a Side Convex Plate

[0313] 300 optical module (external module)

[0314] 310 module baseboard

[0315] 500 Printed Wiring Board (Substrate)

[0316] 510 ventilation opening

[0317] 521 (521X, 521Z) First power supply pad

[0318] 522 Second power supply common pad

[0319] 523 Other Uses Pads

[0320] C gap

[0321] G1 Group 1

[0322] G2 Group 2

[0323] Rc region.

Claims

1. A connector, which is mounted on a substrate and into which a module substrate of an external module is inserted along a first direction, characterized in that, The substrate has a plurality of power supply pads arranged separately in a second direction that is substantially orthogonal to the first direction. The module substrate has multiple power supply electrodes. The connector includes: A connector body into which the module substrate is inserted; One or more power pins are housed inside the connector body and are in contact with a plurality of power electrodes on the module substrate; At least one busbar, The busbar is connected to one or more of the power pins and to a plurality of power pads that are separately configured in the second direction.

2. The connector as described in claim 1, characterized in that, The connector body has: Two second sides, facing each other in the second direction; The two third sides face each other in a third direction orthogonal to the first and second directions. The bus bar has: The main surface of the busbar coincides with the third side surface; The two busbar sides are connected to the main surface of the busbar and coincide with each of the second sides. Each of the busbars is connected to the power supply pad on its side.

3. The connector as described in claim 2, characterized in that, The substrate has a plurality of pads for purposes other than power supply arranged in the second direction. The module substrate has multiple electrodes for purposes other than power supply. The connector has multiple contact pins housed within the connector body, extending in the first direction, and contacting the other-purpose electrodes of the module substrate. Each of the aforementioned contact pins has: The mounting portion is engaged with the other-purpose electrodes of the substrate; A retaining part is held against the inner peripheral wall of the connector body; The contact portion, which tilts away from the inner peripheral wall of the connector body, includes a contact position that contacts the module substrate. The main surface of the busbar, as viewed from the third party, is configured in a region that does not overlap with the mounting portion and the retaining portion in the first direction.

4. The connector as described in claim 2, characterized in that, The number of busbars is set to two. One or more of the power supply pins are fixed to the two busbar main surfaces that are opposite each other on the third side.

5. The connector as described in claim 2, characterized in that, The number of busbars is set to one. One or more of the power supply pins are fixed to the main surface of one of the busbars.

6. The connector as claimed in claim 2, characterized in that, Each of the busbars has a convex side plate. Each of the side protrusions is bonded to each of the power supply pads of the substrate.

7. The connector as claimed in claim 2, characterized in that, It has at least one cover that covers the busbar.

8. The connector as claimed in claim 7, characterized in that, The number of covers is the same as the number of manifolds. The cover has: The main surface of the cover coincides with the main surface of the busbar; The two side surfaces of the cover are connected to the main surface of the cover and coincide with the side surfaces of each of the busbars.

9. The connector as claimed in claim 8, characterized in that, The number of covers is set to two. The two covers are configured opposite each other on the third side. The two covers are integrated by joining the respective cover sides of one cover to the respective cover sides of the other cover.

10. The connector as claimed in claim 1, characterized in that, The module substrate has multiple electrodes for purposes other than power supply. The connector has a first pin group and a second pin group housed inside the connector body. The first pin group and the second pin group have a plurality of contact pins extending in the first direction and in contact with the other purpose electrodes of the module substrate. The first pin group is formed by arranging a plurality of contact pins in the second direction. The second pin group is formed by arranging a plurality of contact pins in the second direction. The first pin group and the second pin group are configured relative to each other in a third direction orthogonal to the first direction and the second direction, respectively. The bus bar has: The central portion is disposed between the first pin group and the second pin group and extends in the second direction; The two side portions are connected to the two ends of the central portion in the second direction. Each of the sides is connected to the respective power supply pads.

11. The connector as claimed in claim 10, characterized in that, When the connector is mounted on the substrate and inserted into the module substrate. The central portion is located between the first pin group and the second pin group, which are opposite each other on the third side.

12. The connector as claimed in claim 1, characterized in that, The busbar is indirectly connected to one or more of the power pins.

13. A connector assembly, characterized in that, have: The connector as claimed in claim 1; The substrate is equipped with the connector. The substrate has a plurality of power supply pads that are separately arranged in the second direction.

14. The connector assembly as claimed in claim 13, characterized in that, The substrate has: The inner layer contains multiple signal layers and a power layer; The outer layer, which covers the surface of the inner layer; Multiple vias, The power pads are connected to the power layer of the inner layer via the vias. The power layer is positioned closer to the surface layer than the signal layer.

15. The connector assembly as claimed in claim 13, characterized in that, Furthermore, it includes the connector as described in claim 1. The first connector and the second connector are adjacent to each other in the second direction. On the shared power pad located between the first connector and the second connector, the busbar of the first connector and the busbar of the second connector are connected.

16. A connector assembly, characterized in that, have: The connector as claimed in claim 12; The substrate is equipped with the connector. One or more of the power supply pins are connected to pads disposed on the substrate. The busbar is connected to the pad on which one or more of the power supply pins are connected.

Images