Multilayer board structure

Abstract

A multi-layer board structure comprises a first top board structure and a first bottom board structure. The first top plate structure comprises a first top plate substrate layer, a first top plate metal layer, a first glue layer, a first top plate guide hole and a first top plate electroplated layer. The first top plate electroplated layer covers the first top plate metal layer and fills the first top plate guide hole. The first bottom plate structure is adhered to the first top plate structure through a first adhesive layer. The first bottom plate structure comprises a first bottom plate substrate layer, two first bottom plate metal layers, a first bottom plate guide hole and a first bottom plate electroplated layer. The first bottom plate electroplated layer covers one of the first bottom plate metal layers and fills the first bottom plate guide holes, and the first top plate guide holes and the first bottom plate guide holes are arranged in a mutually overlapping mode in the stacking direction of all the layers.

Description

Technical Field

[0001] A type of panel structure, particularly a multi-layer panel structure. Background Technology

[0002] Common multilayer board structures typically use a combination of through-holes and blind vias to connect the different layers. However, electroplating in this manner can easily result in an excessively thick plating layer on the surface of the multilayer board, which is detrimental to the production of multilayer boards with fine lines. Utility Model Content

[0003] In view of this, according to one embodiment, a multilayer board structure is provided, including a first top plate structure and a first bottom plate structure. The first top plate structure includes a first top plate substrate layer, a first top plate metal layer, a first adhesive layer, a first top plate via, and a first top plate electroplating layer. The first top plate metal layer is disposed on one side of the first top plate substrate layer. The first adhesive layer is disposed on the other side of the first top plate substrate layer where the first top plate metal layer is disposed. The first top plate electroplating layer covers the first top plate metal layer and fills the first top plate via. The first bottom plate structure is bonded to the first top plate structure through the first adhesive layer. The first bottom plate structure includes a first bottom plate substrate layer, two first bottom plate metal layers, a first bottom plate via, and a first bottom plate electroplating layer. The two first bottom plate metal layers are disposed on opposite sides of the first bottom plate substrate layer. The first bottom plate electroplating layer covers one of the first bottom plate metal layers and fills the first bottom plate via, and the first top plate via and the first bottom plate via are disposed overlapping each other in the stacking direction of each layer.

[0004] In some embodiments, the first top plate guide hole extends from the first top plate metal layer to the first adhesive layer, and the first bottom plate guide hole extends from one of the first bottom plate metal layers to the first bottom plate substrate layer.

[0005] In some embodiments, the first top plate structure further includes a first top plate hole, the first top plate electroplating layer filling the first top plate hole, the first bottom plate structure further includes a first bottom plate hole, the first bottom plate electroplating layer filling the first bottom plate hole, and the first top plate hole and the first bottom plate hole are arranged alternately in this direction.

[0006] In some embodiments, the first top plate hole extends from the first top plate metal layer to the first adhesive layer, and the first bottom plate hole extends from one of the first bottom plate metal layers to the first bottom plate substrate layer.

[0007] In some embodiments, the total thickness of the first top plate metal layer and the first top plate electroplating layer is less than 25 μm, and the total thickness of the first bottom plate metal layer and the first bottom plate electroplating layer is less than 25 μm.

[0008] In some embodiments, the first top plate electroplating layer and the first bottom plate electroplating layer are electroplated copper layers.

[0009] In some embodiments, the first top plate metal layer and the first bottom plate metal layer are copper metal layers.

[0010] In some embodiments, a second top plate structure is further included, comprising a second top plate substrate layer, a second top plate metal layer, a second adhesive layer, second top plate vias, and a second top plate electroplating layer. The second top plate metal layer is disposed on one side of the second top plate substrate layer. The second adhesive layer is disposed on the other side of the second top plate substrate layer where the second top plate metal layer is disposed. The second top plate structure is bonded to the first top plate structure via the second adhesive layer and is located on the side opposite to the first bottom plate structure. The second top plate electroplating layer covers the second top plate metal layer and fills the second top plate vias.

[0011] In some embodiments, a second base plate structure is further included, comprising a second base plate substrate layer, a second base plate metal layer, a second adhesive layer, second base plate vias, and a second base plate electroplating layer. The second base plate metal layer is disposed on one side of the second base plate substrate layer. The second adhesive layer is disposed on the other side of the second base plate substrate layer where the second base plate metal layer is disposed. The second base plate structure is bonded to the first base plate structure via the second adhesive layer and is located on the side opposite to the first top plate structure. The second base plate electroplating layer covers the second base plate metal layer and fills the second base plate vias.

[0012] In some embodiments, a second top plate structure is further included, comprising a second top plate structure and a second bottom plate structure. The second top plate structure includes a second top plate substrate layer, a second top plate metal layer, a second adhesive layer, second top plate vias, and a second top plate electroplating layer. The second top plate metal layer is disposed on one side of the second top plate substrate layer. The second adhesive layer is disposed on the other side of the second top plate substrate layer where the second top plate metal layer is disposed. The second top plate structure is bonded to the first top plate structure via the second adhesive layer and is located on the side opposite to the first bottom plate structure. The second top plate electroplating layer covers the second top plate metal layer and fills the second top plate vias. The second bottom plate structure includes a second bottom plate substrate layer, a second bottom plate metal layer, a third adhesive layer, second bottom plate vias, and a second bottom plate electroplating layer. The second bottom plate metal layer is disposed on one side of the second bottom plate substrate layer. The third adhesive layer is disposed on the other side of the second bottom plate substrate layer where the second bottom plate metal layer is disposed. The second bottom plate structure is bonded to the first bottom plate structure via the third adhesive layer and is located on the side opposite to the first top plate structure. The second base plate electroplating layer covers the second base plate metal layer and fills the second base plate guide hole.

[0013] In summary, according to one embodiment, a multilayer board structure is provided, wherein a first top plate structure and a first bottom plate structure are respectively provided with a first top plate guide hole and a first bottom plate guide hole, and the first top plate guide hole and the first bottom plate guide hole are arranged to overlap each other in the stacking direction of each layer. In this way, it is not necessary to provide through holes that penetrate the entire multilayer board, but to achieve interconnection through the stacked guide holes, and the thickness of the electroplating layer during hole filling can be effectively reduced, so as to produce multilayer boards with fine lines. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a multilayer board structure according to a first embodiment;

[0015] Figure 2 This is a schematic diagram of a multilayer board structure according to a second embodiment;

[0016] Figure 3 This is a schematic diagram of a multilayer board structure according to a third embodiment;

[0017] Figure 4 This is a schematic diagram of a multilayer board structure according to a fourth embodiment.

[0018] [Symbol Explanation]

[0019] 100: Multi-layer board structure

[0020] 110: First roof structure

[0021] 111: First top plate substrate layer

[0022] 112: First top plate metal layer

[0023] 113: First adhesive layer

[0024] 114: First top plate guide hole

[0025] 115: First top plate electroplating layer

[0026] 116: First top plate hole

[0027] 130: First base plate structure

[0028] 131: First base plate substrate layer

[0029] 132A, 132B: First base plate metal layer

[0030] 134: First bottom plate guide hole

[0031] 135: First base plate electroplating layer

[0032] 136: First base plate hole

[0033] 210: Second roof structure

[0034] 211: Second top plate substrate layer

[0035] 212: Second top plate metal layer

[0036] 213: Second adhesive layer

[0037] 214: Second top plate guide hole

[0038] 215: Second top plate electroplating layer

[0039] 230: Second base plate structure

[0040] 231: Second base plate substrate layer

[0041] 232: Second base metal layer

[0042] 233: Third adhesive layer

[0043] 234: Second bottom plate guide hole

[0044] 235: Second base plate electroplating layer Detailed Implementation

[0045] Please see Figure 1 . Figure 1 This is a schematic diagram of a multi-layer board structure according to a first embodiment. The multi-layer board structure 100 includes a first top plate structure 110 and a first bottom plate structure 130.

[0046] The first top plate structure 110 includes a first top plate substrate layer 111, a first top plate metal layer 112, a first adhesive layer 113, a first top plate guide hole 114, and a first top plate electroplating layer 115. The first top plate metal layer 112 and the first adhesive layer 113 are respectively disposed on opposite sides of the first top plate substrate layer 111. The first top plate electroplating layer 115 covers the first top plate metal layer 112 and fills the first top plate guide hole 114. In this embodiment, the first top plate structure 110 is a single-layer plate, and the first top plate metal layer 112 is disposed only on one side of the first top plate substrate layer 111. The first top plate guide hole 114 penetrates through this first top plate structure 110.

[0047] The first base plate structure 130 is bonded to the first top plate structure 110 via a first adhesive layer 113. The first base plate structure 130 includes a first base plate substrate layer 131, two first base plate metal layers 132A and 132B, a first base plate guide hole 134, and a first base plate electroplating layer 135. The two first base plate metal layers 132A and 132B are disposed on opposite sides of the first base plate substrate layer 131. In this embodiment, the first base plate guide hole 134 is... Figure 1 The first base plate metal layer 132B near the bottom conducts through this first base plate structure 130. A first base plate electroplating layer 135 covers the first base plate metal layer 132B and fills the first base plate guide hole 134, and the first top plate guide hole 114 and the first base plate guide hole 134 are arranged to overlap each other in the stacking direction of each layer. In this embodiment, the first base plate structure 130 is a double-layer plate, with first base plate metal layers 132A and 132B provided on opposite sides of the first base plate substrate layer 131. In this embodiment, a multilayer plate is formed by stacking the first top plate structure 110 (a single-layer plate) and the first base plate structure 130 (a double-layer plate).

[0048] Specifically, by positioning the first top plate guide hole 114 and the first bottom plate guide hole 134 in the stacking direction of each layer (i.e.) Figure 1 By having the vias overlap in the vertical direction, there is no need to set additional through holes to penetrate the entire multilayer board. The vias can be interconnected through the overlapped vias, which can effectively reduce the thickness of the electroplating layer when filling the vias, so as to produce multilayer boards with fine lines.

[0049] In this embodiment, as Figure 1 As shown, the first top plate guide hole 114 extends from the first top plate metal layer 112 to the first adhesive layer 113, and the first top plate electroplating layer 115 fills the first top plate guide hole 114 and covers the upper surface of the first top plate metal layer 112 and the surfaces of the first bottom plate metal layer 132A, the first adhesive layer 113, the first top plate substrate layer 111, and the exposed surfaces of the first top plate metal layer 112 due to the guide hole. The first bottom plate guide hole 134 extends from the first bottom plate metal layer 132B to the first bottom plate substrate layer 131, and the first bottom plate electroplating layer 135 fills the first bottom plate guide hole 134 and covers the lower surface of the first bottom plate metal layer 132B and the exposed surfaces of the first bottom plate metal layer 132A, the first bottom plate substrate layer 131, and the first bottom plate metal layer 132B due to the guide hole.

[0050] In this embodiment, as Figure 1 As shown, the first top plate structure 110 also includes a first top plate hole 116, in which a first top plate electroplating layer 115 fills the first top plate hole 116. The first bottom plate structure 130 also includes a first bottom plate hole 136, in which a first bottom plate electroplating layer 135 fills the first bottom plate hole 136, and the first top plate hole 116 and the first bottom plate hole 136 are staggered in the direction of the aforementioned layer stacking. This forms the desired circuit structure.

[0051] In this embodiment, the first top plate hole 116 extends from the first top plate metal layer 112 to the first adhesive layer 113, and the first top plate electroplating layer 115 further covers the exposed surfaces of the first bottom plate metal layer 132A, the first adhesive layer 113, the first top plate substrate layer 111, and the first top plate metal layer 112 due to the hole. The first bottom plate hole 136 extends from the first bottom plate metal layer 132B to the first bottom plate substrate layer 131, and the first bottom plate electroplating layer 135 further covers the exposed surfaces of the first bottom plate metal layer 132A, the first bottom plate substrate layer 131, and the first bottom plate metal layer 132B due to the hole.

[0052] In this embodiment, the total thickness of the first top plate metal layer 112 and the first top plate electroplated layer 115 is less than 25 μm. The total thickness of the first bottom plate metal layer 132B and the first bottom plate electroplated layer 135 is also less than 25 μm. Thus, the thickness of the low electroplated layer is effectively reduced through the overlapping vias.

[0053] In this embodiment, the first top plate electroplating layer 115 and the first bottom plate electroplating layer 135 are electroplated copper. The first top plate metal layer 112 and the first bottom plate metal layers 132A and 132B are copper.

[0054] Please see Figure 2 . Figure 2 This is a schematic diagram of a multilayer board structure according to a second embodiment. In this embodiment, the multilayer board structure 100 further includes a second top plate structure 210. The second top plate structure 210 includes a second top plate substrate layer 211, a second top plate metal layer 212, a second adhesive layer 213, a second top plate guide hole 214, and a second top plate electroplating layer 215. The second top plate metal layer 212 and the second adhesive layer 213 are disposed on opposite sides of the second top plate substrate layer 211. The second top plate structure 210 is bonded to the first top plate structure 110 through the second adhesive layer 213 and is located on one side opposite to the first bottom plate structure 130. The second top plate electroplating layer 215 covers the second top plate metal layer 212 and fills the second top plate guide hole 214. In this embodiment, the second top plate structure 210 is a single-layer board, with the second top plate metal layer 212 disposed only on one side of the second top plate substrate layer 211. The second top plate guide hole 214 extends from the second top plate metal layer 212 to the second adhesive layer 213. The second top plate electroplating layer 215 fills the second top plate guide hole 214 and covers the upper surface of the second top plate metal layer 212, as well as the first top plate electroplating layer 115, the second adhesive layer 213, the second top plate substrate layer 211, and the exposed surfaces of the second top plate metal layer 212 due to the guide hole. Furthermore, in this embodiment, the second top plate guide hole 214 is arranged to overlap with the first top plate guide hole 114 and the first bottom plate guide hole 134 in the stacking direction of each layer to ensure mutual communication. Thus, a four-layer multilayer board is formed through the structure of two single-layer boards and one double-layer board.

[0055] Furthermore, in order to form a four-layer multi-layer board, in addition to providing a second top plate structure 210 on one side of the first top plate structure 110, other plate structures can also be provided on one side of the first bottom plate structure 130. Please refer to [link / reference]. Figure 3 . Figure 3This is a schematic diagram of a multilayer board structure according to a third embodiment. In this embodiment, the multilayer board structure 100 further includes a second base plate structure 230. The second base plate structure 230 includes a second base plate substrate layer 231, a second base plate metal layer 232, a third adhesive layer 233, second base plate guide holes 234, and a second base plate electroplating layer 235. The second base plate metal layer 232 and the third adhesive layer 233 are disposed on opposite sides of the second base plate substrate layer 231. The second base plate structure 230 is bonded to the first base plate structure 130 through the third adhesive layer 233 and is located on one side opposite to the first top plate structure 110. The second base plate electroplating layer 235 covers the second base plate metal layer 232 and fills the second base plate guide holes 234. In this embodiment, the second base plate structure 230 is a single-layer board, with the second base plate metal layer 232 disposed only on one side of the second base plate substrate layer 231. The second bottom plate guide hole 234 extends from the second bottom plate metal layer 232 to the third adhesive layer 233. The second bottom plate electroplating layer 235 fills the second bottom plate guide hole 234 and covers the upper surface of the second bottom plate metal layer 232, as well as the first bottom plate electroplating layer 135, the third adhesive layer 233, the second bottom plate substrate layer 231, and the exposed surfaces of the second bottom plate metal layer 232 due to the guide hole. Furthermore, in this embodiment, the second bottom plate guide hole 234 is arranged to overlap with the first top plate guide hole 114 and the first bottom plate guide hole 134 in the stacking direction of each layer to ensure mutual communication. Thus, similar to the second embodiment, a four-layer multilayer board is formed through the structure of two single-layer boards and one double-layer board.

[0056] Also, please see Figure 4 . Figure 4 This is a schematic diagram of a multilayer board structure according to a fourth embodiment. The second and third embodiments disclose a four-layer board structure, but are not limited thereto. The multilayer board structure 100 may simultaneously include a second top plate structure 210 and a second bottom plate structure 230 to form a five-layer multilayer board structure. However, it is not limited to five layers; the layers may be further overlapped and stacked.

[0057] In summary, according to one embodiment, a multilayer board structure 100 is provided. By making the first top plate guide hole 114 and the first bottom plate guide hole 134 overlap each other in the stacking direction of each layer, it is not necessary to set additional through holes to penetrate the entire multilayer board. They can be interconnected through the overlapping guide holes, which can effectively reduce the thickness of the electroplating layer when filling the holes, so as to produce multilayer boards with fine lines.

Claims

1. A multi-layer plate structure, characterized in that, include: A first top plate structure, comprising: First top plate substrate layer; A first top plate metal layer is disposed on one side of the first top plate substrate layer; A first adhesive layer is disposed on the other side of the first top plate substrate layer on which the first top plate metal layer is disposed; A first top plate guide hole; and A first top plate electroplating layer, the first top plate electroplating layer covering the first top plate metal layer and filling the first top plate guide holes; and A first base plate structure is bonded to a first top plate structure via a first adhesive layer. The first base plate structure comprises: First base plate substrate layer; The first base metal layer is disposed on two opposite sides of the first base substrate layer; A first bottom plate guide hole; and A first base plate electroplating layer covers one of the first base plate metal layers and fills the first base plate guide hole, and the first top plate guide hole and the first base plate guide hole are arranged to overlap each other in one direction of the stacking of the layers.

2. The multi-layer plate structure as described in claim 1, characterized in that, The first top plate guide hole extends from the first top plate metal layer to the first adhesive layer, and the first bottom plate guide hole extends from one of the first bottom plate metal layers to the first bottom plate substrate layer.

3. The multi-layer plate structure as described in claim 1, characterized in that, The first top plate structure also includes a first top plate hole, the first top plate electroplating layer fills the first top plate hole, the first bottom plate structure also includes a first bottom plate hole, the first bottom plate electroplating layer fills the first bottom plate hole, and the first top plate hole and the first bottom plate hole are arranged alternately in the direction.

4. The multi-layer plate structure as described in claim 3, characterized in that, The first top plate hole extends from the first top plate metal layer to the first adhesive layer, and the first bottom plate hole extends from one of the first bottom plate metal layers to the first bottom plate substrate layer.

5. The multi-layer plate structure as described in claim 1, characterized in that, The total thickness of the first top plate metal layer and the first top plate electroplating layer is less than 25 μm, and the total thickness of the first bottom plate metal layer and the first bottom plate electroplating layer is less than 25 μm.

6. The multi-layer plate structure as described in claim 1, characterized in that, The first top plate electroplating layer and the first bottom plate electroplating layer are copper electroplating layers.

7. The multi-layer plate structure as described in claim 1, characterized in that, The first top plate metal layer and the first bottom plate metal layer are copper metal layers.

8. The multi-layer plate structure as described in claim 1, characterized in that, It also includes a second top plate structure, comprising: A second top plate substrate layer; A second top plate metal layer is disposed on one side of the second top plate substrate layer; A second adhesive layer is disposed on the other side of the second top plate substrate layer where the second top plate metal layer is disposed. The second top plate structure is bonded to the first top plate structure through the second adhesive layer and is located on the side opposite to the first bottom plate structure. A second top plate guide hole; and A second top plate electroplating layer, which covers the second top plate metal layer and fills the second top plate guide hole.

9. The multi-layer plate structure as described in claim 1, characterized in that, It also includes a second base plate structure, comprising: A second base plate substrate layer; A second base metal layer is disposed on one side of the second base substrate layer; A second adhesive layer is disposed on the other side of the second base plate substrate layer on which the second base plate metal layer is disposed. The second base plate structure is bonded to the first base plate structure through the second adhesive layer and is located on the side opposite to the first top plate structure. A second bottom plate guide hole; and A second base plate electroplating layer, which covers the second base plate metal layer and fills the second base plate guide hole.

10. The multilayer plate structure as described in claim 1, characterized in that, Also includes: A second top plate structure, comprising: A second top plate substrate layer; A second top plate metal layer is disposed on one side of the second top plate substrate layer; A second adhesive layer is disposed on the other side of the second top plate substrate layer where the second top plate metal layer is disposed. The second top plate structure is bonded to the first top plate structure through the second adhesive layer and is located on the side opposite to the first bottom plate structure. A second top plate guide hole; and A second top plate electroplating layer, the second top plate electroplating layer covering the second top plate metal layer and filling the second top plate guide holes; and A second base plate structure, comprising: A second base plate substrate layer; A second base metal layer is disposed on one side of the second base substrate layer; A third adhesive layer is disposed on the other side of the second base plate substrate layer where the second base plate metal layer is disposed. The second base plate structure is bonded to the first base plate structure through the third adhesive layer and is located on the side opposite to the first top plate structure. A second bottom plate guide hole; and A second base plate electroplating layer, which covers the second base plate metal layer and fills the second base plate guide hole.

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