Middle frame assembly and electronic equipment

Abstract

The utility model discloses a middle frame assembly and electronic equipment, and relates to the technical field of electronic equipment. The middle frame assembly comprises a plurality of borders and a middle plate, the borders are titanium borders or titanium alloy borders, and the borders are opposite in an end-to-end mode to form an annular structure. The material of the middle plate is different from that of the plurality of frames, and the middle plate is located in the annular structure and is connected with the plurality of frames through plastic cement. The frame plays a main role in supporting the internal space of the whole electronic equipment, the frame is a titanium metal frame or a titanium alloy frame, certain structural strength is guaranteed while the weight is reduced, and the middle plate plays an auxiliary role in supporting the internal space of the whole electronic equipment. Compared with the frame, the electronic equipment can adopt the middle plate which is lighter in weight and weaker in structural strength and is made of other materials, so that the middle frame assembly is lighter in overall weight and higher in structural strength, and two parameters of strength and weight are considered.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and in particular to a mid-frame assembly and an electronic device. Background Technology

[0002] With the advancement of technology and the development of the communications field, electronic devices such as mobile phones and tablets are becoming increasingly popular. The mid-frame, as a supporting component of electronic devices, provides space for the internal components and is an indispensable part of electronic devices.

[0003] In related technologies, the mid-frame is often made of lightweight aluminum alloy or high-strength stainless steel. Aluminum alloy has a low density, which is beneficial for the lightweight design of electronic devices, but it has the disadvantage of low strength and easy deformation from drops. Stainless steel has high strength and provides good support for electronic devices, but it has the disadvantage of high density, heavy overall weight, and poor user experience.

[0004] How to balance strength and weight in the mid-frame has become a problem that needs to be solved in the field of electronic devices. Utility Model Content

[0005] This disclosure provides a mid-frame component and an electronic device, which can solve the aforementioned technical problems existing in related technologies. The technical solution is as follows:

[0006] In a first aspect, a mid-frame assembly is provided, the mid-frame assembly including a plurality of borders and a mid-plate;

[0007] The multiple frames are all titanium metal frames or titanium alloy frames, and the multiple frames are arranged in a ring structure with their ends facing each other.

[0008] The middle plate is made of a different material than the multiple frame plates. The middle plate is located in the annular structure and is connected to the multiple frame plates by plastic.

[0009] In some possible implementations, the middle plate is at least one of aluminum plate, aluminum alloy plate, magnesium plate, and magnesium alloy plate.

[0010] In some possible implementations, the middle plate has a grounding area for grounding the antenna circuit;

[0011] The frame is electrically connected to the grounding area.

[0012] In some possible implementations, the frame has a connecting portion, one of the connecting portion and the contact area having a connecting protrusion and the other having a connecting groove, the connecting protrusion abutting against the connecting groove.

[0013] In some possible implementations, the plurality of borders includes two U-shaped borders and two I-shaped borders, the two U-shaped borders being the same size and corresponding to the short side of the electronic device, and the two I-shaped borders being the same size and corresponding to the long side of the electronic device.

[0014] In some possible implementations, the plurality of frame edges each have a positioning protrusion, and the middle plate has a positioning groove, the positioning protrusion being adapted to the positioning groove.

[0015] In some possible implementations, the bend of the U-shaped frame has a positioning protrusion, and the corner of the middle plate has a positioning groove, wherein the positioning protrusion is adapted to the positioning groove.

[0016] In some possible implementations, at least a portion of the positioning protrusion has a first welding surface, and at least a portion of the positioning groove has a second welding surface, wherein the first welding surface and the second welding surface are welded together.

[0017] In some possible implementations, at least one of the frame edges has a plurality of positioning protrusions, and the middle plate has a plurality of positioning grooves, with the plurality of positioning protrusions and the plurality of positioning grooves being arranged in a one-to-one correspondence.

[0018] In a second aspect, an electronic device is provided, the electronic device comprising the mid-frame component described in any one of the first aspects.

[0019] The beneficial effects of the technical solution provided in this disclosure include at least the following:

[0020] In this disclosure, the frame plays a major role in supporting the internal space of the entire electronic device. The frame is made of titanium metal or titanium alloy, which reduces weight while ensuring a certain structural strength. The middle plate plays an auxiliary role in supporting the internal space of the entire electronic device. The electronic device can use a middle plate made of other materials that are lighter and have weaker structural strength than the frame. In this way, the overall weight of the middle frame assembly is lighter and the structural strength is greater, thus balancing both strength and weight parameters.

[0021] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a mid-frame component provided in an embodiment of this disclosure.

[0024] Figure 2 This is a partial cross-sectional view of a mid-frame component provided in an embodiment of this disclosure.

[0025] Figure 3 This is a schematic diagram of the structure of a border provided in an embodiment of this disclosure.

[0026] Figure 4 This is a partial cross-sectional view of a mid-frame component provided in an embodiment of this disclosure.

[0027] Figure 5 This is a partial cross-sectional view of a mid-frame component provided in an embodiment of this disclosure.

[0028] Figure 6 This is a partial schematic diagram of a middle plate provided in an embodiment of this disclosure.

[0029] Figure 7 This is an exploded view of a mid-frame component provided in an embodiment of this disclosure.

[0030] Figure label:

[0031] 1. Border;

[0032] 11. Connecting part; 111. Connecting protrusion;

[0033] 12. Positioning protrusion; 121. First welding surface;

[0034] 1a. U-shaped border; 1b. I-shaped border;

[0035] 2. Middle plate; 2a. Welding holes;

[0036] 21. Connecting area; 211. Connecting groove;

[0037] 22. Positioning groove; 221. Second welding surface.

[0038] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0040] In a first aspect, embodiments of this disclosure provide a mid-frame component, referring to... Figure 1As shown, the mid-frame component includes multiple borders 1 and a mid-plate 2.

[0041] Multiple frame frames 1 are made of titanium metal or titanium alloy and are arranged end to end to form a ring structure. The middle plate 2 is made of a different material from the multiple frame frames 1. The middle plate 2 is located in the ring structure and is connected to the multiple frame frames 1 by plastic.

[0042] Titanium metal and titanium alloys are characterized by high strength and low density, with a density typically around 4.5 g / cm³. 3 While its density is significantly lower than that of common metals like steel, its strength exceeds that of many alloy structural steels. Therefore, the specific strength (strength / density) of titanium and titanium alloys is much greater than that of other metallic structural materials. Thus, using titanium or titanium alloy frames can reduce the overall weight of multiple frame elements 1 while ensuring high structural strength.

[0043] The ring structure formed by multiple frame 1s facing each other end to end is the outer edge of the electronic device. Using titanium metal frame or titanium alloy frame makes the overall structural strength of the ring structure greater, which can effectively support the internal space of the ring structure and reduce the risk of damage to the internal components of the electronic device caused by external forces (such as drops, bumps, etc.).

[0044] This disclosure does not specifically limit the processing technology of titanium metal frame or titanium alloy frame. For example, the titanium alloy frame adopts the powder metallurgy process, which mixes titanium powder with powder of other alloy elements and then presses and sinters to form the original plate of frame 1. For another example, the titanium alloy frame adopts the smelting metallurgy process including vacuum melting, gas melting and electric arc melting.

[0045] The middle plate 2 is used to house various electronic components inside the electronic device and to realize the electrical connection of the corresponding components.

[0046] This disclosure does not specifically limit the internal structure and layout of the middle plate 2, and can be matched and set according to the size, shape, material and other parameters of the relevant components (e.g., battery, camera, antenna, etc.) inside different electronic devices.

[0047] The middle plate 2 is connected to multiple frame 1s by plastic (not shown in the attached figure). On the one hand, the plastic can support and fix components such as the display screen in the electronic device. On the other hand, the plastic material has a certain elasticity, which can effectively absorb and disperse the impact force, thereby protecting the internal components of the electronic device from breakage caused by external impact to a certain extent.

[0048] Meanwhile, during the production process, plastic helps control the gap tolerance between the middle plate 2 and multiple frame 1, thereby improving the pass rate of the middle frame assembly and the quality of the finished product.

[0049] In the aforementioned mid-frame assembly, the frame 1 plays a primary role in supporting the internal space of the entire electronic device. Therefore, the frame 1 is made of titanium or titanium alloy, which reduces weight while ensuring a certain level of structural strength. The middle plate 2 plays a secondary role in supporting the internal space of the entire electronic device. Therefore, the electronic device can use a middle plate 2 made of a material that is lighter and less structurally strong than the frame. In this way, the overall weight of the mid-frame assembly is relatively light, while the structural strength is relatively high, thus balancing both strength and weight parameters.

[0050] The surface of titanium metal or titanium alloy frames can also be treated with processes such as brushing. Taking brushing as an example, it is a metal surface treatment technology that uses specific equipment and processes to create fine line textures on the metal surface, thereby enhancing the metal's aesthetics and feel. Applying brushing to titanium metal or titanium alloy frames not only improves the appearance and aesthetics of electronic devices but also increases their resistance to fingerprints and oil stains.

[0051] In some embodiments, the middle plate 2 is at least one of aluminum plate, aluminum alloy plate, magnesium plate, and magnesium alloy plate.

[0052] Since the middle plate 2 is located inside the electronic device, unlike the location of the frame 1, the middle plate 2 does not need to be directly exposed to the external environment of the electronic device, nor is it directly subjected to external forces. Therefore, the structural strength requirements of the middle plate 2 for the electronic device are lower than the structural strength requirements for the frame 1.

[0053] The density and strength parameters of aluminum plates, aluminum alloy plates, magnesium plates, and magnesium alloy plates are all lower than those of titanium metal and titanium alloys. Therefore, the middle plate 2 is made of at least one of aluminum plates, aluminum alloy plates, magnesium plates, and magnesium alloy plates. While meeting the structural strength requirements of electronic devices for the middle plate 2, the weight of the middle plate 2 can be reduced, thereby making the overall weight of the middle frame assembly lighter, which is conducive to the pursuit of lightweight design of electronic devices.

[0054] Meanwhile, aluminum plates, aluminum alloy plates, magnesium plates, and magnesium alloy plates are less expensive than titanium metal and titanium alloys. Using these materials for the middle plate 2 helps reduce the overall cost of the middle frame components and enhance product competitiveness.

[0055] In some embodiments, refer to Figure 2 As shown, the middle plate 2 has a grounding area 21, which is used to ground the antenna circuit. The frame 1 is electrically connected to the grounding area 21.

[0056] The grounding area 21 can effectively protect the internal components of electronic devices from damage caused by external factors such as electrostatic discharge (ESD). On the other hand, the grounding area 21 can also prevent circuit failures caused by potential differences, thereby extending the service life of electronic devices.

[0057] Since frame 1 is made of metal, it serves as a radiating stub of the antenna circuit. For example, different frames 1 can be used as different radiating stubs to achieve dual-band characteristics of the antenna circuit, meaning that the antenna circuit can effectively radiate and receive signals on two different frequency bands.

[0058] As another example, the design of radiating stubs can also help improve the stability of antenna loop signals, preventing interference and attenuation in complex communication environments. By optimizing parameters such as the shape, size, and location of radiating stubs, signal distortion and attenuation during transmission can be reduced, improving signal stability and reliability.

[0059] Therefore, the electrical connection between frame 1 and grounding area 21 can ensure that the antenna circuit has a good grounding connection, improve the radiation efficiency and receiving sensitivity of the antenna circuit, and thus improve the communication quality between electronic equipment and the outside world.

[0060] In some embodiments, the frame 1 has a connecting portion 11, one of the connecting portion 11 and the contact area 21 has a connecting protrusion 111 and the other has a connecting groove 211, the connecting protrusion 111 abutting against the connecting groove 211.

[0061] Reference Figure 2 As shown, taking the connecting part 11 having a connecting protrusion 111 and the connecting area 21 having a connecting groove 211 as an example, the shape and size parameters of the connecting protrusion 111 and the connecting groove 211 are matched. The connecting protrusion 111 and the connecting groove 211 achieve electrical connection between them through the force generated by their mutual abutment during assembly. The connection method is simple and convenient, which helps to simplify the assembly steps of the middle frame assembly.

[0062] The contact direction between the connecting protrusion 111 and the connecting groove 211 is the same as the assembly direction between the frame 1 and the middle plate 2. The connecting protrusion 111 and the connecting groove 211 can also have a hook structure or a snap-fit ​​structure to improve the contact strength between the connecting protrusion 111 and the connecting groove 211.

[0063] Similarly, the case where the connecting portion 11 has a connecting groove 211 and the contact area 21 has a connecting protrusion 111 is similar to the case in the above embodiment, and will not be described again here.

[0064] In some other embodiments, the frame 1 and the grounding area 21 are connected by a conductive component, which can be a wire, copper foil, aluminum foil, etc. The conductive component is not only conductive, but also thin and light, which can save space and help achieve structural lightweighting while ensuring electrical connection.

[0065] In some embodiments, refer to Figure 3 As shown, the multiple borders 1 include two U-shaped borders 1a and two I-shaped borders 1b. The two U-shaped borders 1a are the same size and correspond to the short side of the electronic device, and the two I-shaped borders 1b are the same size and correspond to the long side of the electronic device.

[0066] Same size means that the corresponding frame 1 has the same size in the X-axis direction (i.e. the direction of the long side extension of the electronic device) and the Y-axis direction (i.e. the direction of the short side extension of the electronic device). There are no specific restrictions on the structure and size of each frame 1 facing the middle plate 2.

[0067] Having the same size for both U-shaped frames 1a and both I-shaped frames 1b simplifies the manufacturing process and avoids the use of different sizes for the frames 1 in the ring structure. The U-shaped frame 1a also prevents the connection area of ​​adjacent frames 1 from being located at the corner of the electronic device, which would otherwise lead to larger assembly deviations and lower yield rates in the mid-frame assembly.

[0068] The U-shaped frame 1a and the I-shaped frame 1b are attached but not connected. The attachment position is where the plastic partition of the antenna radiator is located. Further cutting and processing of the attachment position is required later. In this way, the U-shaped frame 1a and the I-shaped frame 1b do not need to be connected, which simplifies the assembly work of the middle frame assembly and improves the assembly efficiency of the middle frame assembly.

[0069] In some embodiments, refer to Figure 4 As shown, multiple frame 1s have positioning protrusions 12, and the middle plate 2 has positioning grooves 22, with the positioning protrusions 12 and positioning grooves 22 being adapted to each other.

[0070] The structure in which the positioning protrusion 12 and the positioning groove 22 cooperate can ensure that the frame 1 and the middle plate 2 can be accurately connected during assembly. This not only improves the assembly efficiency of the middle frame assembly, but also greatly reduces the quality problems caused by assembly errors.

[0071] Meanwhile, the structure in which the positioning protrusion 12 and the positioning groove 22 cooperate can effectively prevent the frame 1 and the middle plate 2 from becoming loose or displaced during use, thereby ensuring the overall stability and durability of the electronic device.

[0072] In some other embodiments, multiple frame 1s have positioning grooves 22 and positioning protrusions 12, and the middle plate 2 has positioning protrusions 12. The positioning protrusions 12 are adapted to the positioning grooves 22. This situation is similar to the situation in the above embodiments, and will not be described again here.

[0073] In some embodiments, refer to Figure 5 As shown, the bend of the U-shaped frame 1a has a positioning protrusion 12, and the corner of the middle plate 2 has a positioning groove 22. The positioning protrusion 12 and the positioning groove 22 are adapted to each other.

[0074] The positioning protrusion 12 is set at the bend of the U-shaped frame 1a. On the one hand, the positioning protrusion 12 can simultaneously constrain the relative positions of the U-shaped frame 1a and the middle plate 2 in the X-axis and Y-axis directions. On the other hand, the positioning protrusion 12 can also serve as a support structure for the bend area of ​​the U-shaped frame 1a, effectively increasing the strength and rigidity of the area and reducing the risk of breakage or deformation of the bend area of ​​the U-shaped frame 1a when subjected to external forces.

[0075] In some embodiments, refer to Figure 4 and Figure 6 As shown, the middle plate 2 has a welding hole 2a, at least a partial positioning protrusion 12 has a first welding surface 121, and at least a partial positioning groove 22 has a second welding surface 221. The first welding surface 121 and the second welding surface 221 are welded together through the welding hole 2a.

[0076] The first welding surface 121 and the second welding surface 221 overlap each other, and then the frame 1 and the middle plate 2 are lap-welded through the welding hole 2a. On the one hand, the lap welding in the Z-axis direction makes the frame 1 and the middle plate 2 a whole. On the basis of plastic connection, the connection strength between the frame 1 and the middle plate 2 is further increased, and the relative displacement of the frame 1 and the middle plate 2 is avoided when the electronic device is subjected to external force. On the other hand, the processing technology of lap welding in the Z-axis direction is relatively simple and has low processing cost, which is conducive to improving the processing efficiency of the middle frame assembly.

[0077] In some embodiments, refer to Figure 5 As shown, at least one frame 1 has multiple positioning protrusions 12, and the middle plate 2 has multiple positioning grooves 22. The multiple positioning protrusions 12 and the multiple positioning grooves 22 are arranged in a one-to-one correspondence.

[0078] A frame 1 has multiple positioning protrusions 12, which can work together to provide positioning and also allow for multiple welding positions between the frame 1 and the middle plate 2, thereby enhancing the connection strength between the frame 1 and the middle plate 2. For example, the two bends of the U-shaped frame 1a each have positioning protrusions 12, and the two corresponding corners of the middle plate 2 have positioning grooves 22, with the positioning protrusions 12 and positioning grooves 22 fitting together.

[0079] Based on the same concept, this disclosure also provides an electronic device, which may include the mid-frame component as in any of the above embodiments.

[0080] The electronic devices involved in this disclosure may also be referred to as terminals, mobile terminals, terminal devices, user equipment (UE), etc. For example, a terminal device may be a smartphone, tablet computer, laptop computer, wearable device (e.g., smartwatch), or it may be a digital camera, SLR camera / mirrorless camera, gimbal camera, action camera, drone, or other professional shooting equipment. It should be understood that this disclosure does not specifically limit the specific technology or device form used in the terminal device. In the description of the above embodiments, a mobile phone is used as an example, but this disclosure is not limited thereto.

[0081] In the aforementioned electronic device, the frame 1 plays a primary role in supporting the internal space of the entire device. Therefore, the frame 1 is made of titanium or titanium alloy, which reduces weight while ensuring a certain level of structural strength. The middle plate 2 plays a secondary role in supporting the internal space of the entire electronic device. Therefore, the electronic device can use a middle plate 2 made of a material that is lighter and less structurally strong than the frame. In this way, the overall weight of the middle frame assembly is lighter and the structural strength is greater, thus balancing both strength and weight parameters.

[0082] The surface of titanium metal or titanium alloy frames can also be treated with processes such as brushing. Taking brushing as an example, it is a metal surface treatment technology that uses specific equipment and processes to create fine line textures on the metal surface, thereby enhancing the metal's aesthetics and feel. Applying brushing to titanium metal or titanium alloy frames not only improves the appearance and aesthetics of electronic devices but also increases their resistance to fingerprints and oil stains.

[0083] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0084] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist; for example, "a and / or b" can represent: a alone, both a and b, or b alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0085] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0086] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0087] It is further understood that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the two components; they can refer to a direct connection between two components without the presence of other components, or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0088] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0089] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the solutions disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the scope of the claims.

[0090] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A mid-frame component, characterized in that, The mid-frame assembly includes multiple borders (1) and a mid-plate (2); The plurality of frames (1) are all titanium metal frames or titanium alloy frames, and the plurality of frames (1) are arranged in a ring structure with their ends facing each other; The middle plate (2) is made of a different material than the multiple frame plates (1). The middle plate (2) is located in the annular structure and is connected to the multiple frame plates (1) by plastic.

2. The mid-frame assembly according to claim 1, characterized in that, The middle plate (2) is at least one of aluminum plate, aluminum alloy plate, magnesium plate, and magnesium alloy plate.

3. The mid-frame assembly according to claim 1, characterized in that, The middle plate (2) has a grounding area (21) for grounding the antenna circuit; The frame (1) is electrically connected to the grounding area (21).

4. The mid-frame assembly according to claim 3, characterized in that, The frame (1) has a connecting portion (11), one of the connecting portion (11) and the contact area (21) has a connecting protrusion (111) and the other has a connecting groove (211), the connecting protrusion (111) abutting against the connecting groove (211).

5. The mid-frame assembly according to claim 1, characterized in that, The plurality of borders (1) includes two U-shaped borders (1a) and two I-shaped borders (1b). The two U-shaped borders (1a) are the same size and correspond to the short side of the electronic device, and the two I-shaped borders (1b) are the same size and correspond to the long side of the electronic device.

6. The mid-frame assembly according to claim 5, characterized in that, Each of the multiple frame edges (1) has a positioning protrusion (12), and the middle plate (2) has a positioning groove (22), wherein the positioning protrusion (12) is adapted to the positioning groove (22).

7. The mid-frame assembly according to claim 5, characterized in that, The U-shaped frame (1a) has a positioning protrusion (12) at the bend, and the middle plate (2) has a positioning groove (22) at the corresponding corner. The positioning protrusion (12) is adapted to the positioning groove (22).

8. The mid-frame assembly according to claim 6 or 7, characterized in that, The middle plate (2) has a welding hole (2a), at least a portion of the positioning protrusion (12) has a first welding surface (121), and at least a portion of the positioning groove (22) has a second welding surface (221). The first welding surface (121) and the second welding surface (221) are welded together through the welding hole (2a).

9. The mid-frame assembly according to claim 6, characterized in that, At least one of the frame (1) has a plurality of positioning protrusions (12), and the middle plate (2) has a plurality of positioning grooves (22), with the plurality of positioning protrusions (12) and the plurality of positioning grooves (22) being arranged in a one-to-one correspondence.

10. An electronic device, characterized in that, The electronic device includes a mid-frame assembly as described in any one of claims 1-9.

Images