Intelligent heat pipe type cabinet heat dissipation device for data center

Abstract

The utility model provides an intelligent heat pipe type cabinet heat dissipation device for a data center, which relates to the technical field of data cabinet heat dissipation, and comprises a data cabinet, a temperature monitor is arranged on the left side cabinet surface of the data cabinet, a heat dissipation network port and a ventilation network port are arranged on the rear cabinet surface of the data cabinet, and the ventilation network port is communicated with the temperature monitor. Heat pipe heat dissipation assemblies are arranged on the inner sides of the heat dissipation net opening and the ventilation net opening, the heat pipe heat dissipation assemblies are connected to the rear side of the heat pipe back plate, the outer surface of the heat dissipation net opening is covered with a heat conduction cover plate, the side end of the heat conduction cover plate is connected with an electric lifting sliding table through a connecting sliding block, and an air inlet net opening is formed in the concave face of the front end of the heat conduction cover plate. The rear side face of the heat conduction cover plate is connected with an exhaust fan body through an exhaust pipeline, and an exhaust outlet is formed in the upper end of the exhaust fan body. The heat pipe type cabinet solves the problems that when a plurality of groups of heat pipe type cabinets in a large data center or a high-performance computing cluster radiate heat to the outside of the cabinet through a heat pipe technology, the heat is easy to gather around the cabinet, so that the surrounding temperature rises, and the heat radiation is poor.

Description

TECHNICAL FIELD

[0001] The utility model relates to data cabinet heat dissipation technical field, concretely relates to a data center is with intelligent heat pipe formula cabinet heat dissipation device. BACKGROUND

[0002] Intelligent heat pipe formula cabinet refers to the heat pipe technology is used to the local heat dissipation of single cabinet in data center. Heat pipe formula cabinet carries out heat dissipation through the heat pipe technology. The heat pipe is filled with working medium (usually liquid), when the heat of one end of heat pipe increases, the working medium will evaporate and rise to the other end, condenses back flow after releasing heat, so on and so forth, the heat is conducted from the inside of cabinet to the outside, thereby realizing the unity of the sealing and heat dissipation of cabinet, has higher heat dissipation efficiency, the efficient refrigeration, energy saving and consumption reduction, space saving and intelligent management of intelligent heat pipe formula cabinet make the application of intelligent heat pipe formula cabinet in data center more convenient and efficient, but when multiple heat pipe formula cabinets in large data center or high-performance computing cluster dissipate heat to the outside of cabinet through heat pipe technology, heat is easy to gather around the cabinet, which leads to the problem of rising ambient temperature and poor heat dissipation. SUMMARY

[0003] In order to overcome the defects existing in the prior art, the present application provides an intelligent heat pipe formula cabinet heat dissipation device for data center, which solves the problem of heat gathering around the cabinet when multiple heat pipe formula cabinets in large data center or high-performance computing cluster dissipate heat to the outside of cabinet through heat pipe technology, which leads to the problem of rising ambient temperature and poor heat dissipation.

[0004] In order to achieve the above-mentioned purpose, an intelligent heat pipe formula cabinet heat dissipation device for data center is provided, which comprises: a data cabinet, a heat pipe back plate is installed in the cabinet,

[0005] A temperature monitor is installed on the left side of the cabinet, a heat dissipation net opening and a ventilation net opening are provided on the back of the cabinet, a heat pipe heat dissipation assembly is arranged inside the heat dissipation net opening and the ventilation net opening, a heat pipe heat dissipation assembly is connected to the back of the heat pipe back plate, a heat conduction cover plate is connected to the outside of the heat dissipation net opening, an electric lifting slide is connected to the side end of the heat conduction cover plate through a connecting slide, an air inlet net opening is provided on the front end of the heat conduction cover plate, an air exhaust fan body is connected to the back side of the heat conduction cover plate through an air exhaust duct, and an air outlet is provided on the upper end of the air exhaust fan body.

[0006] Further, a cabinet door is installed on the front end of the cabinet, and the heat dissipation net opening is located at the upper end of the ventilation net opening.

[0007] Further, a fixing frame is welded to the outside of the air exhaust fan body, the lower end of the fixing frame is fixed to the upper surface of the data cabinet through a damping support, and an air exhaust duct is connected to the lower port of the air exhaust fan body.

[0008] Further, the rear side of the data cabinet is externally provided with an electric lifting slide table, and the surface of the electric lifting slide table is fixed with an intelligent controller.

[0009] Further, the front surface of the heat conduction cover plate is bonded with a rubber pad, and the rubber pad is attached to the rear cabinet surface of the data cabinet.

[0010] Further, the heat conduction cover plate is internally provided with an air guide cavity, and the air inlet mesh is connected with the air extraction pipeline through the air guide cavity.

[0011] Further, the heat conduction cover plate is internally provided with an air guide cavity, and the air inlet mesh is connected with the air extraction pipeline through the air guide cavity.

[0012] The data center intelligent heat pipe type cabinet heat dissipation device of the utility model has the advantages that the temperature monitor is used to monitor the temperature change of the data cabinet in the environment, the electric lifting slide table drives the heat conduction cover plate to move downward and cover the heat dissipation mesh of the heat pipe heat dissipation assembly, the air extractor body extracts and discharges the hot air at the heat pipe heat dissipation assembly through the heat conduction cover plate and away from the data cabinet, the air pressure difference formed by the air extraction facilitates the cold air in the data center to be pressed into the heat pipe heat dissipation position, the high-temperature hot air is quickly taken away, the heat dissipation effect of the intelligent heat pipe type cabinet is enhanced, the heat generated by the heat dissipation of multiple heat pipe type cabinets in the large data center or high-performance computing cluster is prevented from gathering in the surrounding environment, the data processing equipment in the intelligent heat pipe type cabinet is guaranteed to be efficiently heat-dissipated and stably operated. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a front view structural schematic diagram of the data center intelligent heat pipe type cabinet heat dissipation device of the utility model embodiment.

[0014] Figure 2 It is a rear view partial section structural schematic diagram of the data center intelligent heat pipe type cabinet heat dissipation device of the utility model embodiment.

[0015] Figure 3 It is a rear view structural schematic diagram of the heat conduction cover plate of the utility model embodiment.

[0016] Figure 4 It is a side view section structural schematic diagram of the heat conduction cover plate of the utility model embodiment.

[0017] Figure 5 It is a three-dimensional structural schematic diagram of the heat conduction cover plate of the utility model embodiment.

[0018] In the figure: 1, data cabinet; 11, cabinet door; 12, heat dissipation mesh opening; 13, ventilation mesh opening; 2, temperature monitor; 3, exhaust fan body; 31, exhaust duct; 32, exhaust port; 33, fixing frame; 34, damping support; 4, heat pipe back plate; 41, heat pipe heat dissipation assembly; 5, heat conduction cover plate; 51, intelligent controller; 52, electric lifting slide; 53, connecting sliding block; 54, air guide cavity; 55, air inlet mesh opening; 56, rubber pad; 57, temperature sensor. DETAILED DESCRIPTION

[0019] Referring to Figures 1 to 5 The utility model provides a kind of intelligent heat pipe type cabinet heat dissipation device for data center, it include: data cabinet 1, heat pipe back plate 4 is installed in data cabinet 1 cabinet,

[0020] Temperature monitor 2 is installed on the left side cabinet face of data cabinet 1, heat dissipation mesh opening 12 and ventilation mesh opening 13 are opened in the rear cabinet face of data cabinet 1, heat pipe heat dissipation assembly 41 is arranged in the inside of heat dissipation mesh opening 12 and ventilation mesh opening 13, heat pipe back plate 4 is connected with heat pipe heat dissipation assembly 41, heat conduction cover plate 5 is connected with electric lifting slide 52 on the side end of heat conduction cover plate 5 by connecting sliding block 53, air inlet mesh opening 55 is arranged in the front end concave surface of heat conduction cover plate 5, exhaust fan body 3 is connected with heat conduction cover plate 5 rear side by exhaust duct 31, and exhaust port 32 is opened in the upper end of exhaust fan body 3.

[0021] When temperature monitor 2 on the side of large data center or high-performance computing cluster detects that the temperature outside cabinet rises, electric lifting slide 52 drives heat conduction cover plate 5 to be covered in heat dissipation mesh opening 12 by descending, exhaust fan body 3 starts, and hot air in the inside of heat dissipation mesh opening 12 is pumped to exhaust port 32 through air inlet mesh opening 55 on the surface of heat conduction cover plate 5, exhaust duct 31, so that the duct (not shown in the figure) connected with exhaust port 32 pumps and discharges hot air to far away from the surrounding of data cabinet 1, and the air pressure difference formed by exhaust forms cold air in data center to be pressed into the heat dissipation place of heat pipe heat dissipation assembly 41, so that high-temperature hot air is conveniently and quickly taken away, the heat dissipation effect of intelligent heat pipe type cabinet is enhanced, the heat of multiple heat pipe type cabinets in large data center or high-performance computing cluster is avoided to gather in the surrounding environment, and the efficient heat dissipation and stable operation of data processing equipment in intelligent heat pipe type cabinet are guaranteed.

[0022] In the embodiment, cabinet door 11 is installed on the front end face of data cabinet 1, and heat dissipation mesh opening 12 is located at the upper end of ventilation mesh opening 13.

[0023] As a preferred embodiment, the heat dissipation mesh opening 12 and the ventilation mesh opening 13 are both heat dissipation openings of the heat pipe heat dissipation assembly 41, so that the heat pipe heat dissipation assembly 41 can release heat of the heat-absorbed and evaporated medium in the heat pipe, condense and flow back, and continue the cycle of heat absorption and evaporation. When the heat dissipation mesh opening 12 covers the heat conduction cover plate 5, the air outside the cabinet enters the heat dissipation position of the heat pipe heat dissipation assembly 41 through the ventilation mesh opening 13.

[0024] In the embodiment, the suction fan body 3 is welded with a fixing frame 33 on the outer side, and the lower end of the fixing frame 33 is fixed to the upper surface of the data cabinet 1 through a damping support 34. The lower end of the suction fan body 3 is connected with a suction duct 31.

[0025] As a preferred embodiment, the damping support 34 plays a role of slow shock support, so as to avoid the vibration of the suction fan body 3 when starting to affect the stable operation of the equipment in the data cabinet 1. The suction fan body 3 transports the sucked hot air to the upper end exhaust port 32 through the suction duct 31. The exhaust port 32 can be connected with a pipeline, and the pipeline can transport the sucked hot air to the refrigeration equipment, so that the hot air is cooled and refrigerated and then flows to the data cabinet 1.

[0026] In the embodiment, an electric lifting slide 52 is installed on the rear cabinet surface of the data cabinet 1, and an intelligent controller 51 is fixed on the surface of the electric lifting slide 52. The intelligent controller 51 is electrically connected with the temperature monitor 2.

[0027] As a preferred embodiment, the electric lifting slide 52 drives the heat conduction cover plate 5 to move up and down through a connecting sliding block 53, so that the heat conduction cover plate 5 is moved away from or covers the heat dissipation mesh opening 12. The intelligent controller 51 receives the temperature change detected by the temperature monitor 2 around the cabinet. When the ambient temperature rises to a certain value, the heat conduction cover plate 5 is controlled to be lowered and covers the heat dissipation mesh opening 12, so as to prevent the hot air from continuing to be dissipated outward, and the hot air is sucked and discharged away from the data cabinet 1.

[0028] In the embodiment, a rubber pad 56 is attached to the front surface of the heat conduction cover plate 5, and the rubber pad 56 is attached to the rear cabinet surface of the data cabinet 1.

[0029] As a preferred embodiment, the rubber pad 56 facilitates the attachment of the heat conduction cover plate 5 to the rear cabinet surface of the data cabinet 1, so that the air sucked by the heat conduction cover plate 5 all comes from the inner side of the heat dissipation mesh opening 12, and the hot air at the heat pipe heat dissipation assembly 41 is sucked out, so as to avoid the hot air generated by the cabinet heat dissipation to be directly discharged into the surrounding environment, and effectively avoid the heat generated by multiple data cabinets 1 in a large data center or a high-performance computing cluster to affect the heat dissipation effect.

[0030] In the embodiment, a wind guide cavity 54 is formed in the heat conduction cover plate 5, and an air inlet mesh opening 55 is connected with the suction duct 31 through the wind guide cavity 54.

[0031] As a preferred embodiment, the air inlet mesh 55 is located in the upper half of the concave surface of the heat-conducting cover plate 5, and the air extraction duct 31 passes through the air guide cavity 54 to enable the air inlet mesh 55 to extract air at the heat pipe heat dissipation assembly 41 inside the heat dissipation mesh 12, at which time the atmospheric pressure outside the cabinet will press the cold air in the data center into the heat pipe heat dissipation assembly 41 through the ventilation mesh 13, so that the cold air contacts the heat pipe heat dissipation assembly 41, thereby accelerating the heat dissipation of the heat pipe heat dissipation assembly 41 and enhancing the heat dissipation effect of the intelligent heat pipe cabinet.

[0032] In this embodiment, the temperature sensor 57 is embedded and installed on the inner wall of the heat-conducting cover plate 5, and the temperature sensor 57 is located at the front side of the air inlet mesh 55.

[0033] As a preferred embodiment, the temperature sensor 57 is used to sense the temperature of the air extracted at the air inlet mesh 55 and transmit the sensed value to the intelligent controller 51, and when the sensed temperature is within the normal temperature range, the intelligent controller 51 controls the electric lifting platform 52 to drive the heat-conducting cover plate 5 to move upward, so that the heat-conducting cover plate 5 moves away from the heat dissipation mesh 12, and the heat dissipation mesh 12 is in normal flow and heat dissipation with the surrounding air.

[0034] The data center intelligent heat pipe cabinet heat dissipation device of the utility model can effectively solve the problem that when multiple heat pipe cabinets in a large data center or high-performance computing cluster dissipate heat to the outside of the cabinet through heat pipe technology, heat is easily accumulated around the cabinet, causing the surrounding temperature to rise and poor heat dissipation. The air pressure difference formed by air extraction can press the cold air in the data center into the heat dissipation position of the heat pipe, conveniently and quickly taking away the high-temperature hot air, enhancing the heat dissipation effect of the intelligent heat pipe cabinet, avoiding the heat generated by the heat dissipation of multiple heat pipe cabinets in a large data center or high-performance computing cluster from being accumulated in the surrounding environment, ensuring efficient heat dissipation and stable operation of the data processing equipment in the intelligent heat pipe cabinet, and being suitable for data center intelligent heat pipe cabinet heat dissipation devices.

Claims

1. A smart heat pipe type cabinet cooling device for data centers, comprising: A data cabinet (1), wherein a heat pipe backplate (4) is installed inside the data cabinet (1), characterized in that: A temperature monitor (2) is installed on the left side of the data cabinet (1). A heat dissipation mesh (12) and a ventilation mesh (13) are provided on the rear side of the data cabinet (1). A heat pipe heat dissipation assembly (41) is provided inside the heat dissipation mesh (12) and the ventilation mesh (13). A heat pipe heat dissipation assembly (41) is connected to the rear side of the heat pipe back plate (4). A heat-conducting cover plate (5) is covered on the outer surface of the heat dissipation mesh (12). An electric lifting slide (52) is connected to the side end of the heat-conducting cover plate (5) through a connecting slider (53). An air inlet (55) is provided on the concave surface of the front end of the heat-conducting cover plate (5). An exhaust fan (3) is connected to the rear side of the heat-conducting cover plate (5) through an exhaust pipe (31). An exhaust vent (32) is provided on the upper end of the exhaust fan (3).

2. The intelligent heat pipe rack cooling device for data centers according to claim 1, characterized in that, The front face of the data cabinet (1) is equipped with a cabinet door (11), and the heat dissipation mesh (12) is located at the upper end of the ventilation mesh (13).

3. The intelligent heat pipe rack cooling device for data centers according to claim 1, characterized in that, The exhaust fan body (3) has a fixed frame (33) welded to its outer side. The lower end of the fixed frame (33) is fixed to the upper surface of the data cabinet (1) through a damping support (34). The lower port of the exhaust fan body (3) is connected to an exhaust pipe (31).

4. The intelligent heat pipe rack cooling device for data centers according to claim 1, characterized in that, An electric lifting slide (52) is installed on the outer cabinet surface of the rear side of the data cabinet (1), and an intelligent controller (51) is fixed on the surface of the electric lifting slide (52); and the intelligent controller (51) is electrically connected to a temperature monitor (2).

5. The intelligent heat pipe rack cooling device for data centers according to claim 1, characterized in that, A rubber pad (56) is bonded to the front surface of the heat-conducting cover plate (5); and the rubber pad (56) is in contact with the rear cabinet surface of the data cabinet (1).

6. The intelligent heat pipe rack cooling device for data centers according to claim 1, characterized in that, The heat-conducting cover plate (5) has an air guide cavity (54) inside, and the air inlet (55) is connected to the exhaust pipe (31) through the air guide cavity (54).

7. A smart heat pipe rack cooling device for data centers according to claim 6, characterized in that, A temperature sensor (57) is embedded in the inner wall of the heat-conducting cover plate (5); and the temperature sensor (57) is located in front of the air inlet (55).

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