Heat dissipation module, modular computing unit and autonomous mobile equipment

Abstract

The utility model discloses a heat dissipation module, a modular computing unit and an autonomous mobile device, the heat dissipation module comprises a heat conduction structure, the heat conduction structure comprises a heat conduction bottom plate, and the heat conduction bottom plate is provided with a first side surface used for being connected with a target heating element arranged on a circuit board; the cooling fan is connected with the heat conduction structure; the outer shell is used for containing the circuit board, the heat conduction structure and the heat dissipation fan are both arranged in the outer shell, the outer shell comprises an outer shell bottom plate, the outer shell bottom plate is provided with a heat dissipation flow channel structure, the heat dissipation flow channel structure is communicated with the arrangement position of the heat dissipation fan and / or the heat conduction structure and the exterior of the outer shell, and the heat conduction structure is arranged on the outer shell bottom plate and exposed out of the first side face. According to the utility model, the heat conduction structure and the heat dissipation fan are arranged in the outer shell, so that the size occupied by the heat dissipation module can be greatly reduced. And meanwhile, a connecting wire between the heat dissipation fan and the circuit board does not need to be exposed, so that the waterproof problem can be solved, and the cost of secondary waterproof design improvement on the heat dissipation module is reduced.

Description

Technical Field

[0001] This utility model relates to the field of heat exchange device technology, and in particular to a heat dissipation module, a modular computing unit, and an autonomous mobile device. Background Technology

[0002] With technological innovation and development, processing chips have been integrated into various technical fields. However, processing chips generate heat when powered on and operating, and this heat problem becomes increasingly serious as the chip's computing power increases. Excessive heat can lead to decreased chip performance or reduced reliability, and may even pose safety hazards.

[0003] In the automotive industry, chips are used in various solutions, such as vehicle controller systems or other similar product systems. These typically consist of two main parts: a circuit board and a housing. The chip is mounted on the circuit board, and the housing usually includes an outer cover and a bottom cover to enclose the circuit board and dissipate heat. Vehicle controllers are usually placed in small, enclosed spaces; without optimized cooling systems, chips are prone to overheating and system crashes.

[0004] Existing cooling systems mainly include air cooling and water cooling. Air cooling dissipates heat by adding features such as heat sink fins to the casing and placing a cooling fan above the fins. Water cooling, on the other hand, adds water channels inside the casing, filling it with flowing liquid to carry away the heat transferred to the casing.

[0005] Traditional air-cooled structures typically require large heatsink fins and additional installation space for airflow. Furthermore, because the fan needs to be connected to the circuit board for power, the circuit board is easily exposed, making waterproofing difficult. Traditional water-cooled structures, on the other hand, require an additional water pump to operate the entire system, a design that is also challenging to implement in automobiles. Utility Model Content

[0006] This utility model provides a heat dissipation module, a modular computing unit, and an autonomous mobile device to solve at least one of the problems in the prior art, such as the large volume occupied by the heat dissipation module of the chip and the difficulty of waterproof design, thereby effectively alleviating the heat dissipation problem of the automotive control system.

[0007] According to a first aspect of the present invention, a heat dissipation module is provided, comprising:

[0008] A thermally conductive structure includes a thermally conductive base plate having a first side surface for connecting to a target heat-generating element disposed on a circuit board;

[0009] Cooling fan, connected to the heat-conducting structure;

[0010] The outer casing is used to house the circuit board. The heat-conducting structure and the cooling fan are both disposed within the outer casing. The outer casing includes a bottom plate with a heat dissipation channel structure. The heat dissipation channel structure connects the location of the cooling fan and / or the heat-conducting structure with the outside of the outer casing. The heat-conducting structure is disposed on the bottom plate and exposes the first side surface.

[0011] This utility model's heat dissipation module houses both the heat-conducting structure and the cooling fan within the outer casing, and dissipates heat through a heat dissipation channel structure on the casing. This allows structures such as the fan, which would normally require an external installation, to be integrated inside the casing, significantly reducing the module's size while ensuring effective cooling of the target heat-generating components. Furthermore, the built-in design of the cooling fan eliminates the need for exposed wiring between the fan and the circuit board, effectively improving waterproofing and reducing the cost of secondary waterproofing design and modifications. For existing automotive control systems, this utility model's heat dissipation module effectively enhances heat dissipation capacity, significantly alleviates heat dissipation pressure, and improves the overall system performance and reliability.

[0012] In some embodiments, a sealing connection structure is provided between the outer casing base plate and the heat-conducting base plate. The sealing connection structure includes a stepped through groove provided on the outer casing base plate, and the heat-conducting base plate is disposed on the stepped through groove.

[0013] Therefore, this design enhances the seal between the outer casing and the heat-conducting structure by using stepped grooves, thereby improving the overall waterproof performance of the heat dissipation module.

[0014] In some embodiments, a semiconductor cooling module is provided on the first side, and the heat-conducting structure is connected to the target heat-generating element through the semiconductor cooling module.

[0015] Therefore, by setting it up in this way, the cold side of the semiconductor cooling module can be in contact with the target heat-generating component, and the hot side of the semiconductor cooling module can be in contact with the heat-conducting structure, thereby further and more effectively alleviating the heat generation of the target heat-generating component and improving the heat dissipation effect of the heat dissipation module.

[0016] In some embodiments, the first side is provided with a mounting groove for mounting a semiconductor cooling module.

[0017] Therefore, this design effectively alleviates the protrusion of the semiconductor cooling module, thereby reducing the overall volume occupied by the heat dissipation module.

[0018] In some embodiments, a heat insulation layer is provided on the inner wall of the mounting groove.

[0019] Therefore, by using this configuration, the heat insulation layer can be used to separate the semiconductor cooling module from the heat-conducting structure, preventing the heat transferred from the semiconductor cooling module to the heat-conducting structure from being transferred back to the semiconductor cooling module and affecting the overall heat dissipation efficiency.

[0020] In some embodiments, a thermally conductive layer is provided on the side of the semiconductor cooling module that is connected to the thermally conductive structure and / or on the side that is connected to the target heat-generating element.

[0021] Therefore, by using this configuration, the heat transfer efficiency between the semiconductor cooling module and the target heat-generating component and / or between the semiconductor cooling module and the heat-conducting structure can be further improved by utilizing the heat-conducting layer, thereby further improving the overall heat dissipation efficiency of the heat dissipation module.

[0022] In some embodiments, the heat dissipation channel structure includes a plurality of metal sheets disposed on the bottom plate of the outer casing, and the intervals between the plurality of metal sheets form heat dissipation channels.

[0023] Therefore, with this configuration, the hot air blown out by the cooling fan can be guided through the heat dissipation channel formed by the metal sheet. At the same time, since the heat dissipation channel is also formed by the metal sheet and the outer shell is connected to the heat-conducting structure, the outer shell can extend the heat-conducting structure. This allows the airflow of the cooling fan to carry away the heat from the metal sheet of the outer shell as it passes through the heat dissipation channel, thereby further improving the overall heat dissipation efficiency of the heat dissipation module.

[0024] In some embodiments, the heat-conducting structure further includes a plurality of heat-conducting pillars disposed on the heat-conducting base plate, and the cooling fan is disposed on the heat-conducting pillars.

[0025] Therefore, by using this configuration, the heat dissipation area of ​​the heat-conducting structure can be increased by utilizing the heat-conducting pillars, thereby effectively improving the heat dissipation efficiency of the overall heat dissipation module.

[0026] In some embodiments, the heat-conducting pillar includes a first heat-conducting pillar and a second heat-conducting pillar, wherein the second heat-conducting pillar is configured to be longer than the first heat-conducting pillar.

[0027] Therefore, with this configuration, the second heat-conducting pillar can be placed in a location other than where the cooling fan is located on the heat-conducting structure. Since the second heat-conducting pillar is longer, the heat dissipation area of ​​the heat-conducting structure can be further increased, thereby further improving the heat dissipation efficiency of the overall heat dissipation module.

[0028] In some embodiments, a reinforcing structure is provided on the first side, the reinforcing structure being used to connect to the circuit board, and an avoidance opening is provided in the middle of the reinforcing structure.

[0029] Therefore, by using this configuration, the circuit board can be structurally reinforced using reinforcing structural components. At the same time, since the reinforcing structural components are designed to protrude from the heat-conducting structure and have clearance openings, it is possible to prevent other structural components on the circuit board from colliding or coming into contact with the heat-conducting structure when the target heat-generating component is connected to it, thereby improving the safety and reliability of the overall heat dissipation module.

[0030] According to a second aspect of the present invention, a modular computing unit is provided, comprising:

[0031] A circuit board on which chips are disposed;

[0032] The heat dissipation module described in the first aspect above, wherein the first side is connected to the chip.

[0033] The modular computing unit provided by this invention is equipped with the heat dissipation module described in the first aspect, thereby possessing better heat dissipation capabilities and improving both its reliability and performance. Furthermore, the modular computing unit of this invention facilitates further development of subsequent products, ensuring that related products of this chip platform possess stable heat dissipation performance.

[0034] According to a third aspect of the present invention, an autonomous mobile device is provided, comprising: the modular computing unit described in the second aspect above. Attached Figure Description

[0035] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is an exploded view of a heat dissipation module according to one embodiment of the present invention;

[0037] Figure 2 Another exploded view of a heat dissipation module according to an embodiment of the present invention;

[0038] Figure 3 This is a cross-sectional view of the overall structure of a heat dissipation module according to an embodiment of the present invention.

[0039] Figure 4 This is an exploded view of a heat dissipation module according to another embodiment of the present invention (excluding the outer casing and cooling fan).

[0040] Figure 5 for Figure 4 Another exploded view of the heat dissipation module of the illustrated embodiment;

[0041] Figure 6 for Figure 4 A cross-sectional view of the overall structure of the heat dissipation module according to the embodiment shown.

[0042] Figure 7 This is an exploded view of a heat dissipation module according to another embodiment of the present invention;

[0043] Figure 8 for Figure 7 A cross-sectional view of the overall structure of the heat dissipation module according to the embodiment shown.

[0044] Explanation of reference numerals in the attached drawings: 1. Outer shell; 11. Bottom plate of the outer shell; 111. Placement slot; 12. Top cover of the outer shell; 121. Opening; 13. Heat dissipation channel structure; 14. Stepped through slot; 15. Bottom cover; 131. Metal sheet; 2. Cooling fan; 3. Thermal conduction structure; 31. Thermal conduction base plate; 311. First side; 312. Mounting slot; 32. Thermal conduction pillar; 321. First thermal conduction pillar; 322. Second thermal conduction pillar; 41. Semiconductor cooling module; 42. Insulation layer; 43. Thermal conduction layer; 51. Target heat-generating component; 52. Circuit board; 53. Circuit board motherboard; 6. Reinforcing structural component; 61. Clearance opening. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0046] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0047] In the description of this application, it should be understood that the use of terms such as "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings is solely for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Features defined with "first" and "second" are used to distinguish feature names and do not have special meanings. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] It should also be noted that, in this document, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0051] The present invention will now be described in further detail with reference to the accompanying drawings.

[0052] Figure 1 and Figure 2 The overall structure of the heat dissipation module according to one embodiment of this utility model is schematically shown, with reference to... Figure 1 and Figure 2 As shown, the heat dissipation module of this utility model includes a heat-conducting structure 3, a cooling fan 2, and a housing 1. The heat-conducting structure 3 is used to connect with a target heat-generating component 51 (such as a chip) to transfer heat from the target heat-generating component 51. It includes a heat-conducting base plate 31, which has a first side surface 311 for connecting with the target heat-generating component 51 disposed on a circuit board 52. The cooling fan 2 is disposed on the heat-conducting structure 3 to dissipate heat from the heat-conducting structure 3. The housing 1 is used to house the circuit board 52 on which the target heat-generating component 51 is disposed, and is a housing 1 disposed on the circuit board 52. Both the heat-conducting structure 3 and the cooling fan 2 are disposed inside the housing 1. The housing 1 includes a housing base plate 11, and the heat-conducting structure 3 is disposed on the housing base plate 11 and exposes the first side surface 311, so that the heat-conducting structure 3 can pass through the housing 1 to connect with the target heat-generating component 51 to achieve heat transfer. A heat dissipation channel structure 13 is provided on the bottom plate 11 of the outer casing. The heat dissipation channel structure 13 connects the location of the cooling fan 2 and / or the heat conduction structure 3 with the outside of the outer casing 1, thereby helping the air flow when the overall heat dissipation module dissipates heat and improving the heat dissipation efficiency of the heat dissipation module.

[0053] One of the functions of the outer casing 1 is to protect the circuit board 52. Therefore, a sealed connection structure can be provided between the outer casing base plate 11 and the heat-conducting base plate 31 to improve the waterproof performance of the overall heat dissipation module. Since the heat-conducting base plate 31 needs to expose the first side 311, in some possible embodiments, the sealed connection structure between the outer casing base plate 11 and the heat-conducting base plate 31 can be achieved by providing a stepped through groove 14 on the outer casing base plate 11, so that the heat-conducting base plate 31 is placed on the stepped through groove 14, thereby improving the waterproof sealing performance between the outer casing base plate 11 and the heat-conducting base plate 31. For example, referring to... Figure 2 As shown, in Figure 2In the illustrated embodiment, a stepped through groove 14 is provided on the bottom plate 11 of the outer casing, with the side of the stepped through groove 14 facing the circuit board 52 having a larger dimension. During installation, the heat-conducting base plate 31 is directly installed within the stepped through groove 14 from the side of the bottom plate 11 facing the circuit board 52. This arrangement increases the contact area between the heat-conducting base plate 31 and the bottom plate 11 of the outer casing, thereby prolonging the time it takes for water to seep into the gap between them, thus improving the waterproof performance. Alternatively, in the above embodiment, the stepped through groove 14 can also be configured such that the side of the bottom plate 11 furthest from the circuit board 52 has a larger dimension; in this case, the heat-conducting base plate 31 needs to be installed from the side of the outer casing 1 furthest from the circuit board 52. In this embodiment, in order to make the first side 311 on the heat-conducting base plate 31 flush with the side facing the circuit board 52 on the outer casing base plate 11, the heat-conducting base plate 31 may be provided with a boss that matches the structure of the stepped through groove 14, so that after the heat-conducting base plate 31 is installed on the outer casing base plate 11, the boss and the stepped through groove 14 are engaged.

[0054] In addition, the sealing connection structure can also be implemented using other structures commonly used in existing technologies. For example, a sealing ring can be provided between the heat-conducting base plate 31 and the outer casing base plate 11; the heat-conducting base plate 31 and the outer casing base plate 11 can be welded; bolts can be used to enhance the sealing between the heat-conducting base plate 31 and the outer casing base plate 11; and adhesive can be added between the heat-conducting base plate 31 and the outer casing base plate 11 to improve the sealing performance. Since in some application environments, such as automotive control systems, the dust and water protection rating between the outer casing 1 and the heat-conducting structure 3 needs to meet the IP52 protection level requirement, these methods can be combined to further improve the sealing performance between the outer casing 1 and the heat-conducting structure 3. For example, in some possible implementations, a stepped through groove 14 can be provided on the bottom plate 11 of the outer casing, and a sealing ring can be provided between the bottom plate 11 of the outer casing and the heat-conducting bottom plate 31. The bottom plate 11 of the outer casing, the heat-conducting bottom plate 31 and the sealing ring are connected by adhesive. The heat-conducting structure 3 is also installed on the outer casing 1 by bolts to further enhance the sealing between the heat-conducting bottom plate 31 and the bottom plate 11 of the outer casing, so that the dustproof and waterproof protection level between the outer casing 1 and the heat-conducting structure 3 needs to meet the IP52 protection level requirement.

[0055] The heat-conducting structure 3 can be formed by metal die casting to ensure its thermal conductivity efficiency. Specifically, it can be formed by die casting of aluminum or magnesium alloy. The heat-conducting structure 3 may include a plurality of heat-conducting pillars 32 disposed on the heat-conducting base plate 31, and the extension direction of the heat-conducting pillars 32 is not limited. The arrangement of the heat-conducting pillars 32 can increase the contact area between the heat-conducting structure 3 and the air, thereby improving the heat dissipation efficiency of the heat-conducting structure 3 itself. For example, refer to Figure 1 As shown, in Figure 1 In the embodiment shown, a plurality of heat-conducting pillars 32 extend from the heat-conducting base plate 31, and the extension direction of the heat-conducting pillars 32 is set to extend in a direction away from the first side surface 311.

[0056] The cooling fan 2 is mounted on the heat-conducting structure 3. It can be directly mounted on the heat-conducting structure 3 via a connecting structure, or it can be mounted on the outer casing 1. Alternatively, it can be configured to clamp and fix the cooling fan 2 using the structural design between the heat-conducting structure 3 and the outer casing 1, thereby using the cooling fan 2 to dissipate heat from the heat-conducting structure 3. The cooling fan 2 can be configured to have its air outlet facing the heat-conducting structure 3, or its air inlet facing the heat-conducting structure 3. For example, refer to... Figure 1 As shown, in Figure 1 In the illustrated embodiment, the cooling fan 2 is positioned above the heat-conducting column 32 of the heat-conducting structure 3, and the air outlet of the cooling fan 2 faces the heat-conducting structure 3. In this embodiment, the cooling fan 2 can be mounted on the outer casing 1 to achieve its position above the heat-conducting column 32. Simultaneously, the diameter of a portion of the heat-conducting column 32 can be increased to enhance the contact area between the heat-conducting column 32 and the air, and to provide some support for the cooling fan 2. In other embodiments, the cooling fan 2 can also be positioned on the side of the heat-conducting column 32, which also serves to dissipate heat from the heat-conducting structure 3. Similarly, there are other different combinations of the positions of the cooling fan 2 and the heat-conducting structure 3, which will not be listed in detail here. The power supply line of the cooling fan 2 can pass through the bottom plate 11 of the outer casing and connect to the circuit board 52 or other circuit boards located within the outer casing 1 to power the cooling fan 2. The power supply line of the cooling fan 2 can also be connected to other modules outside the outer casing 1 to power the cooling fan 2; this invention does not limit this.

[0057] Additionally, refer to Figure 1 As shown, in some possible embodiments, the heat-conducting pillars 32 on the heat-conducting structure 3 may further include a first heat-conducting pillar 321 and a second heat-conducting pillar 322. The first heat-conducting pillar 321 is located below the cooling fan 2, and the second heat-conducting pillar 322 is located outside the cooling fan 2. The location of the second heat-conducting pillar 322 is not limited by the structure of the cooling fan 2, and thus the second heat-conducting pillar 322 can be set to be longer than the first heat-conducting pillar 321, thereby increasing the contact area between the heat-conducting structure 3 and the air. The second heat-conducting pillar 322 can be installed in any location on the heat-conducting structure 3 where the cooling fan 2 is not located. The specific number and location can be designed according to the dimensions of the heat-conducting structure 3.

[0058] A top cover 12 is provided on the outer casing 1. The heat-conducting structure 3 and the cooling fan 2 are both disposed between the bottom plate 11 and the top cover 12, thereby fixing the heat-conducting structure 3 and the cooling fan 2 and improving the waterproof performance of the cooling fan 2's wiring to a certain extent. An opening 121 for exposing the air inlet of the cooling fan 2 can be provided in the middle of the top cover 12 to ensure the working performance of the cooling fan 2. A heat dissipation channel structure 13 is provided on the bottom plate 11 of the outer casing 1, so that the hot air blown from the location where the cooling fan 2 and the heat-conducting structure 3 are disposed can be guided to the outside of the outer casing 1. In some possible embodiments, the heat dissipation channel structure 13 can be configured as a plurality of metal plates 131 disposed on the bottom plate 11, with the intervals between the plurality of metal plates 131 forming heat dissipation channels. Specifically, these metal sheets 131 are disposed on the bottom plate 11 of the outer casing, which can further increase the contact area between the outer casing 1 and the air, forming heat dissipation fins, thereby effectively alleviating the heat accumulation of the outer casing 1 itself, and also forming heat dissipation channels to guide hot air to the outside of the outer casing 1. For example, referring to... Figure 1 As shown, in Figure 1 In the illustrated embodiment, fifteen metal sheets 131 are arranged on the bottom plate 11 of the outer casing, with each metal sheet 131 arranged in parallel to form a heat dissipation channel structure 13. The top cover 12 is disposed on the bottom plate 11 of the outer casing, and an opening 121 corresponding to the air inlet of the cooling fan 2 is provided in the center of the top cover 12. The position of the top cover 12 is offset from the position of the metal sheets 131 to expose the metal sheets 131. In some possible embodiments, the heat dissipation channel structure 13 can also be arranged such that each channel extends away from the cooling fan 2. In this case, the metal sheets 131 forming the heat dissipation channel structure 13 located on the left and right sides of the cooling fan 2 and the metal sheets 131 located on the top and bottom sides of the cooling fan 2 will be arranged perpendicularly to each other. If the outer casing of the cooling fan 2 is circular, the channels of the heat dissipation channel structure 13 can also be arranged to radiate outwards from the center of the cooling fan 2, and the arrangement of the corresponding metal sheets 131 can be changed accordingly. Other implementations of the heat dissipation channel structure 13 can be designed according to actual usage needs or aesthetics, and this utility model does not limit them.

[0059] The heat-conducting structure 3 and the target heat-generating element 51 need to be as close as possible to each other to improve the heat conduction effect of the heat-conducting structure 3. In some possible embodiments, a thermoelectric cooler (TEC) 41 is provided on the first side 311 of the heat-conducting structure 3, so that the thermoelectric cooler 41 can further dissipate heat from the target heat-generating element 51. The thermoelectric cooler 41 can be directly connected to the circuit board 52 or other circuit boards disposed in the housing 1 through wiring to provide power to the thermoelectric cooler 41, thereby ensuring the normal operation of the thermoelectric cooler 41. In the above embodiments, a mounting groove 312 for mounting the thermoelectric cooler 41 can also be provided on the first side 311 to avoid the protrusion of the contact surface between the heat-conducting structure 3 and the target heat-generating element 51 after the thermoelectric cooler 41 is mounted. In addition, a heat insulation layer 42 can be provided on the inner wall of the mounting groove 312 to prevent the side of the semiconductor cooling module 41 from contacting the heat-conducting structure 3, which would cause heat exchange between the side of the semiconductor cooling module 41 and the inner wall of the mounting groove 312, thus affecting the heat exchange efficiency of the semiconductor cooling module 41 and the overall heat dissipation performance. The heat insulation layer 42 is specifically made of heat-insulating material to isolate the heat exchange between the semiconductor cooling module 41 and the inner wall of the mounting groove 312, ensuring the cooling effect of the semiconductor cooling module 41 on the target heat-generating component 51, and keeping the efficiency of the semiconductor cooling module 41 at its highest. Since the semiconductor cooling module 41 requires power to operate, the heat insulation layer 42 can be provided with a wiring port for the power supply line of the semiconductor cooling module 41 to pass through and connect to the circuit board 52 or other circuit boards disposed in the housing 1 to supply power to the semiconductor cooling module 41. Meanwhile, to improve the heat transfer efficiency of the semiconductor cooling module 41, a heat-conducting layer 43 can be provided on the semiconductor cooling module 41. The heat-conducting layer 43 can be provided on only one side of the semiconductor cooling module 41, or it can be provided on both sides of the semiconductor cooling module 41. For example, referring to… Figure 2 As shown, in Figure 2In the illustrated embodiment, a mounting groove 312 is provided on the first side 311 of the heat-conducting structure 3. The shape of the mounting groove 312 corresponds to the shape of the semiconductor cooling module 41 to be mounted. A heat insulation layer 42 is provided on the inner wall of the mounting groove 312. The heat insulation layer 42 is formed into a square frame structure and can be made of plastic. The hot surface of the semiconductor cooling module 41 contacts the bottom surface of the mounting groove 312, and the cold surface of the semiconductor cooling module 41 is used to contact the target heat-generating component 51. Both the hot and cold surfaces of the semiconductor cooling module 41 are provided with a heat-conducting layer 43. The heat-conducting layer 43 can be made of thermally conductive adhesive, which is applied to the cold and hot surfaces of the semiconductor cooling module 41 to form the heat-conducting layer 43. In addition, thermally conductive adhesive can also be provided on the first side 311 of the heat-conducting structure 3 for other heat-generating components on the circuit board 52, so that multiple heat-generating components can be simultaneously conducted and dissipated.

[0060] In some possible implementations, a reinforcing structure 6 may also be provided on the first side surface 311. The reinforcing structure 6 is used to connect with the circuit board 52, and a clearance opening 61 is provided in the middle of the reinforcing structure 6. Specifically, the reinforcing structure 6 is a structure that protrudes from the first side surface 311. Since the circuit board 52 needs to continuously apply pressure to the part coated with the thermally conductive layer 43 during installation in order to thin the thermally conductive adhesive as much as possible, without the reinforcing effect of the reinforcing structure 6, the circuit board 52 is prone to deformation. The setting of the reinforcing structure 6 can provide a certain structural reinforcement effect for the circuit board 52. Meanwhile, in practical scenarios, besides the target heat-generating component 51, the circuit board 52 usually contains other circuit components. Since the reinforcing structure 6 is designed to protrude from the heat-conducting structure 3 and has an avoidance opening 61, some components on the circuit board 52 can be accommodated within the gap between the circuit board 52 and the first side surface 311 separated by the reinforcing structure 6. This prevents these components from colliding or contacting the heat-conducting structure 3, thereby improving the safety and reliability of the overall heat dissipation module. It is understood that the thickness of the reinforcing structure 6 is related to the gap between the circuit board 52 and the first side surface 311 after the circuit board 52 is installed. The specific structure of the reinforcing structure 6 can be designed according to the size of the circuit board 52 to be heat-generated, the size of the target heat-generating component 51, etc. This utility model does not limit the structure of the reinforcing structure 6. For example, refer to... Figures 4 to 6 As shown, in Figures 4 to 6 In the illustrated embodiment, the reinforcing structure 6 is a steel frame structure connected to the heat-conducting structure 3 by bolts. In use, the circuit board 52 can be glued to the reinforcing structure 6 to achieve structural reinforcement of the circuit board 52.

[0061] In some practical scenarios, the circuit of the system in which the heat dissipation module of this utility model is used includes a circuit board 52 with a target heat-generating component 51 and a circuit board motherboard 53. Furthermore, in some possible embodiments, a placement groove 111 for accommodating the circuit board motherboard 53 can be formed on the bottom of the housing 1, i.e., on the side of the housing base plate 11 facing the circuit board 52, and a bottom cover 15 can also be provided on the housing base plate 11 to completely cover the circuit structure such as the circuit board motherboard 53 and the circuit board 52. Specifically, refer to... Figure 7 and Figure 8 As shown, in Figure 7 and Figure 8 In the embodiment shown, a placement groove 111 is provided on the bottom plate 11 of the outer casing. The circuit board motherboard 53 and the circuit board 52 are both placed in the placement groove 111. The size of the placement groove 111 corresponds to the size of the circuit board motherboard 53. The bottom cover 15 is fixed to the outer casing 1 by bolts, thus completing the complete coverage of the circuit board motherboard 53, circuit board 52 and other circuit board 52 structures.

[0062] This utility model's heat dissipation module houses both the heat-conducting structure 3 and the cooling fan 2 within the outer casing 1, and dissipates heat through a heat dissipation channel structure 13 provided on the outer casing 1. This allows structures such as the fan, which would normally require external installation, to be integrated within the outer casing 1, significantly reducing the size of the heat dissipation module while ensuring effective cooling of the target heat-generating component 51. Furthermore, due to the built-in design of the cooling fan 2, the wiring between the cooling fan 2 and the circuit board 52 no longer needs to be exposed, effectively improving waterproofing and reducing the cost of secondary waterproofing design and improvements to the heat dissipation module. For existing automotive control systems, this utility model's heat dissipation module effectively improves heat dissipation capacity, significantly alleviates heat dissipation pressure, and enhances the overall system performance and reliability.

[0063] This utility model also provides a modular computing unit, which includes a circuit board 52, on which a chip is disposed, and on which a heat dissipation module as described in any of the above embodiments is disposed. The first side 311 of the heat dissipation module's heat-conducting structure 3 is connected to the chip, thereby achieving heat dissipation for the chip. The modular computing unit can be an electronic device such as a domain controller.

[0064] Because this modular computing unit utilizes the aforementioned heat dissipation module, its heat dissipation capacity, reliability, and performance are all effectively improved. Furthermore, this modular computing unit facilitates the further development of subsequent products, ensuring that related products of this chip platform possess relatively stable heat dissipation performance.

[0065] This utility model also provides an autonomous mobile device, wherein the autonomous mobile device is equipped with the aforementioned modular computing unit. Exemplarily, the modular computing unit can be a control system, etc. It should be noted that the autonomous mobile device described in the embodiments of this utility model can be, for example, a mobile robot, model aircraft, drone, robotic arm, car, ship, etc. It should also be pointed out that the structure of the autonomous mobile device is not limited to this; this embodiment is merely illustrative.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation module, characterized in that, include: A thermally conductive structure includes a thermally conductive base plate having a first side surface for connecting to a target heat-generating element disposed on a circuit board; Cooling fan, mounted on the heat-conducting structure; The outer casing is used to house the circuit board. The heat-conducting structure and the cooling fan are both disposed within the outer casing. The outer casing includes a bottom plate with a heat dissipation channel structure. The heat dissipation channel structure connects the location of the cooling fan and / or the heat-conducting structure with the outside of the outer casing. The heat-conducting structure is disposed on the bottom plate and exposes the first side surface.

2. The heat dissipation module according to claim 1, characterized in that, A sealing connection structure is provided between the outer shell base plate and the heat-conducting base plate. The sealing connection structure includes a stepped through groove provided on the outer shell base plate, and the heat-conducting base plate is disposed on the stepped through groove.

3. The heat dissipation module according to claim 1, characterized in that, A semiconductor cooling module is provided on the first side, and the heat-conducting structure is connected to the target heat-generating component through the semiconductor cooling module.

4. The heat dissipation module according to claim 3, characterized in that, The first side is provided with a mounting groove for mounting a semiconductor cooling module.

5. The heat dissipation module according to claim 4, characterized in that, A heat insulation layer is provided on the inner wall of the mounting groove.

6. The heat dissipation module according to any one of claims 3 to 5, characterized in that, A thermally conductive layer is provided on the side of the semiconductor cooling module that is connected to the thermally conductive structure and / or on the side that is connected to the target heat-generating element.

7. The heat dissipation module according to claim 1, characterized in that, The heat dissipation channel structure includes several metal sheets disposed on the bottom plate of the outer casing, and the intervals between the metal sheets form heat dissipation channels.

8. The heat dissipation module according to claim 1, characterized in that, The heat-conducting structure also includes several heat-conducting pillars disposed on the heat-conducting base plate, and the cooling fan is disposed on the heat-conducting pillars.

9. The heat dissipation module according to claim 8, characterized in that, The heat-conducting pillar includes a first heat-conducting pillar and a second heat-conducting pillar, wherein the second heat-conducting pillar is configured to be longer than the first heat-conducting pillar.

10. The heat dissipation module according to claim 1, characterized in that, A reinforcing structure is provided on the first side, the reinforcing structure is used to connect with the circuit board, and an avoidance opening is provided in the middle of the reinforcing structure.

11. A modular computing unit, characterized in that, include: A circuit board on which chips are disposed; The heat dissipation module according to any one of claims 1 to 10, wherein the first side is connected to the chip.

12. An autonomous mobile device, Its features are, include: The modular computing unit as described in claim 11 above.

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