High-thermal-conductivity packaging substrate for LED (light-emitting diode) lamp beads

Abstract

The utility model discloses an LED lamp bead high heat conduction packaging substrate which comprises a packaging substrate body, the bottom of the packaging substrate body is fixedly connected with connecting columns at equal intervals, one end, far away from the packaging substrate body, of each connecting column is fixedly connected with a circuit board, and one side of each circuit board is provided with radiating fins at equal intervals. The side, away from the heat dissipation fins, of the circuit board is fixedly connected with a lamp bead, and sliding rods are symmetrically and slidably connected into the packaging substrate body. The utility model relates to the technical field of packaging substrates, the LED lamp bead high-thermal-conductivity packaging substrate realizes the function of reserving a gap between the circuit board and the packaging substrate body through the arrangement of the connecting columns, can better realize the heat conduction and heat dissipation effects through the cooperation of the heat dissipation fins and the heat dissipation holes, and is better in heat dissipation effect; by arranging a connecting block, a connecting rod, an adjusting block, a rotating rod, a sliding rod, a second spring, a limiting block, a mounting block and a limiting groove, the function of quickly disassembling and assembling the lampshade is achieved, tools are not needed, and operation is convenient and fast.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of packaging substrate, specifically is a LED lamp pearl high heat conduction packaging substrate. BACKGROUND

[0002] LED lamp pearl is a kind of semiconductor device, and emits light by the recombination of electron and hole, has the advantages such as small size, low energy consumption, long life, fast response and environmental protection, is widely used in various lighting and display equipment.LED lamp pearl packaging substrate is a kind of substrate for packaging LED lamp pearl.

[0003] The LED lamp pearl packaging substrate in prior art is usually only heat dissipated by the way of setting heat dissipation hole, and the heat dissipation effect is poor, and usually a plurality of bolts are used to disassemble and assemble the lampshade in use, which needs to be screwed repeatedly by means of tools, and the operation is more complicated and inconvenient to use.Therefore, we provide a LED lamp pearl high heat conduction packaging substrate. UTILITY MODEL CONTENTS

[0004] In view of the defects of prior art, the utility model provides a LED lamp pearl high heat conduction packaging substrate, solves the problems that the LED lamp pearl packaging substrate is usually only heat dissipated by the way of setting heat dissipation hole, the heat dissipation effect is poor, and usually a plurality of bolts are used to disassemble and assemble the lampshade in use, which needs to be screwed repeatedly by means of tools, and the operation is more complicated.

[0005] To achieve the above object, the utility model realizes by the following technical scheme:

[0006] A kind of LED lamp pearl high heat conduction packaging substrate, including packaging substrate body, the bottom of the packaging substrate body is equidistantly connected with connecting column, the end of the connecting column away from the packaging substrate body is fixedly connected with circuit board, the side of the circuit board is equidistantly installed with heat dissipation fin, the side of the circuit board away from the heat dissipation fin is fixedly connected with lamp pearl, the inside of the packaging substrate body is symmetrically slidably connected with slide rod, second spring is equidistantly arranged between the slide rod and the packaging substrate body, the side of the slide rod is equidistantly fixedly connected with limit block, the limit block is slidably connected with the packaging substrate body, the side of the packaging substrate body is equipped with lampshade, the side of the lampshade is symmetrically fixedly connected with mounting block, the inside of the mounting block is equidistantly provided with limit slot matched with the limit block, the side of the lampshade is equidistantly provided with heat dissipation hole;When using, the gap between circuit board and packaging substrate body is reserved by connecting column, the heat conduction and heat dissipation effect can be better realized by cooperating heat dissipation fin and heat dissipation hole, heat is conveniently dissipated, the slide rod is driven to move and reset by second spring, the limit block is driven to move into the inside of limit slot by slide rod, so as to fix the position of mounting block, the lampshade is conveniently disassembled and assembled, and the operation is convenient.

[0007] Preferably, the inner wall of the packaging substrate body is symmetrically fixedly connected with a limiting rod, and the sliding rod is in sliding connection with the limiting rod.

[0008] Preferably, the inner wall of the packaging substrate body is in sliding connection with an adjusting block, the outer side of the adjusting block is symmetrically rotatably connected with a rotating rod, one side of the sliding rod is fixedly connected with a connecting seat, the rotating rod is in rotatable connection with the connecting seat, the rotating rod is driven to rotate through the movement of the adjusting block, the connecting seat is driven to move through the rotation of the rotating rod, and the sliding rod is driven to slide along the limiting rod.

[0009] Preferably, the inside of the packaging substrate body is in sliding connection with a connecting rod, the adjusting block is fixedly connected with the connecting rod, and the connecting rod is fixedly connected with a connecting block at an end away from the adjusting block, the connecting rod is driven to move through the connecting block, and the adjusting block is driven to move.

[0010] Preferably, a first spring is arranged on the outer side of the connecting rod and located at one side of the adjusting block, and the adjusting block is driven to move and reset through the first spring.

[0011] Preferably, the outer side of the packaging substrate body is symmetrically provided with mounting holes, and the mounting holes facilitate mounting and fixing of the packaging substrate body.

[0012] The utility model provides a kind of LED lamp pearl high heat-conducting packaging substrate.Compared with prior art, it has the following beneficial effects:

[0013] 1、The LED lamp pearl high heat-conducting packaging substrate, by being provided with connecting post, realize the function that reserve the gap between circuit board and packaging substrate body, cooperate with radiating fin and radiating hole, better realize the effect of heat conduction and heat dissipation, and the heat dissipation effect is better.

[0014] 2、The LED lamp pearl high heat-conducting packaging substrate, by being provided with connecting block, connecting rod, adjusting block, rotating rod, sliding rod, second spring, limiting block, mounting block and limiting groove, realize the function of quick disassembly and assembly of lampshade, without the aid of tool, convenient operation. DETAILED DESCRIPTION

[0015] Figure 1 It is the structure schematic view of the utility model;

[0016] Figure 2 It is the structure schematic view of the packaging substrate body of the utility model;

[0017] Figure 3 It is the internal structure schematic view of the packaging substrate body of the utility model;

[0018] Figure 4It is the structural schematic diagram of the adjusting block of the utility model.

[0019] Figure 5 It is the structural schematic diagram of the lampshade of the utility model.

[0020] In the drawing: 1, package substrate body;2, lampshade;3, connecting block;4, connecting column;5, circuit board;6, lamp pearl;7, heat dissipation fin;8, limit block;9, sliding rod;10, adjusting block;11, limit rod;12, connecting seat;13, connecting rod;14, first spring;15, second spring;16, rotating rod;17, heat dissipation hole;18, mounting block;19, limit slot. Specific implementation

[0021] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.

[0022] Please refer to Figures 1 to 5 The utility model provides a technical scheme:

[0023] A kind of LED lamp pearl high-thermal-conductivity package substrate, including package substrate body 1, connecting column 4 is fixedly connected with the bottom of package substrate body 1 equidistantly, circuit board 5 is fixedly connected with the end of connecting column 4 away from package substrate body 1, heat dissipation fin 7 is installed with one side of circuit board 5 equidistantly, lamp pearl 6 is fixedly connected with the side of circuit board 5 away from heat dissipation fin 7, sliding connection has sliding rod 9 in the inside symmetry of package substrate body 1, second spring 15 is equidistantly arranged between sliding rod 9 and package substrate body 1, limit block 8 is fixedly connected with one side of sliding rod 9 equidistantly, limit block 8 is slidingly connected with package substrate body 1, lampshade 2 is equipped on one side of package substrate body 1, mounting block 18 is fixedly connected with one side of lampshade 2 symmetry, limit slot 19 for cooperating with limit block 8 is equidistantly set in the inside of mounting block 18, heat dissipation hole 17 is equidistantly set in one side of lampshade 2;When using, the gap between circuit board 5 and package substrate body 1 is reserved by connecting column 4, and the effect of better heat conduction and heat dissipation can be realized by cooperating heat dissipation fin 7 and heat dissipation hole 17, heat is conveniently dissipated, sliding rod 9 is moved and reset by second spring 15, limit block 8 is moved and enters the inside of limit slot 19 by sliding rod 9, so as to fix the position of mounting block 18, lampshade 2 is conveniently disassembled and assembled, and it is convenient to operate.

[0024] Further, the inner wall of the packaging substrate body 1 is symmetrically fixedly connected with a limiting rod 11, the sliding rod 9 is slidably connected with the limiting rod 11, and the limiting rod 11 can limit the movement of the sliding rod 9 and prevent deviation.

[0025] Further, the inner wall of the packaging substrate body 1 is slidably connected with an adjusting block 10, the outer side of the adjusting block 10 is symmetrically rotatably connected with a rotating rod 16, one side of the sliding rod 9 is fixedly connected with a connecting seat 12, the rotating rod 16 is rotatably connected with the connecting seat 12, the rotating rod 16 is rotated by the movement of the adjusting block 10, the connecting seat 12 is moved by the rotation of the rotating rod 16, and the sliding rod 9 is slid along the limiting rod 11 by the connecting seat 12.

[0026] Further, the inner wall of the packaging substrate body 1 is slidably connected with an adjusting block 10, the outer side of the adjusting block 10 is symmetrically rotably connected with a rotating rod 16, one side of the sliding rod 9 is fixedly connected with a connecting seat 12, the rotating rod 16 is rotatably connected with the connecting seat 12, the rotating rod 16 is rotated by the movement of the adjusting block 10, the connecting seat 12 is moved by the rotation of the rotating rod 16, and the sliding rod 9 is slid along the limiting rod 11 by the connecting seat 12.

[0027] Further, the outer side of the connecting rod 13 and one side of the adjusting block 10 are provided with a first spring 14, and the first spring 14 drives the adjusting block 10 to move and reset.

[0028] Further, the outer side of the packaging substrate body 1 is symmetrically provided with a mounting hole, and the mounting hole facilitates the mounting and fixing of the packaging substrate body 1.

[0029] In use, a gap is reserved between the circuit board 5 and the packaging substrate body 1 through the connecting column 4, and the heat dissipation fins 7 and the heat dissipation holes 17 can better realize the heat conduction and heat dissipation effect, and the heat can be easily dissipated. When installing the lampshade 2, pull the connecting block 3, the connecting block 3 drives the adjusting block 10 to move through the connecting rod 13, the first spring 14 is compressed, the rotating rod 16 is rotated by the movement of the adjusting block 10, the connecting seat 12 is moved by the rotation of the rotating rod 16, the sliding rod 9 is slid along the limiting rod 11 by the connecting seat 12, the second spring 15 is compressed, the sliding rod 9 drives the limiting block 8 to move and is accommodated in the inside of the packaging substrate body 1, the mounting block 18 is pushed into the inside of the packaging substrate body 1, the connecting block 3 is released, the second spring 15 drives the sliding rod 9 to move and reset due to the elastic force, the sliding rod 9 drives the limiting block 8 to move into the inside of the limiting groove 19, thereby fixing the position of the mounting block 18, facilitating the disassembly and assembly of the lampshade 2, and the operation is convenient.

[0030] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.

[0031] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a... " does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0032] While embodiments of the present application have been shown and described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the spirit and scope of the present application, which should be limited only by the scope of the appended claims and the equivalents thereof.

Claims

1. A high thermal conductivity LED chip packaging substrate, comprising a packaging substrate body (1), characterized in that: The bottom of the encapsulation substrate body (1) is fixedly connected with connecting posts (4) at equal intervals. The end of the connecting post (4) away from the encapsulation substrate body (1) is fixedly connected with a circuit board (5). Heat dissipation fins (7) are installed at equal intervals on one side of the circuit board (5). LED beads (6) are fixedly connected on the side of the circuit board (5) away from the heat dissipation fins (7). Sliding rods (9) are symmetrically slidably connected inside the encapsulation substrate body (1). A second spring (15) is provided at equal intervals between the sliding rod (9) and the encapsulation substrate body (1). Limiting blocks (8) are fixedly connected at equal intervals on one side of the sliding rod (9). The limiting blocks (8) are slidably connected to the encapsulation substrate body (1). A lampshade (2) is provided on one side of the encapsulation substrate body (1). A mounting block (18) is symmetrically fixedly connected on one side of the lampshade (2). Limiting grooves (19) that cooperate with the limiting blocks (8) are opened at equal intervals inside the mounting block (18). Heat dissipation holes (17) are opened at equal intervals on one side of the lampshade (2).

2. The LED chip high thermal conductivity packaging substrate according to claim 1, characterized in that: Limiting rods (11) are symmetrically fixedly connected to the inner wall of the packaging substrate body (1), and the slide rod (9) is slidably connected to the limiting rods (11).

3. The LED chip high thermal conductivity packaging substrate according to claim 1, characterized in that: An adjusting block (10) is slidably connected to the inner wall of the packaging substrate body (1), and a rotating rod (16) is symmetrically rotatably connected to the outer side of the adjusting block (10). A connecting seat (12) is fixedly connected to one side of the slide rod (9), and the rotating rod (16) is rotatably connected to the connecting seat (12).

4. The LED bead high thermal conductivity packaging substrate according to claim 3, characterized in that: The packaging substrate body (1) is internally slidably connected to a connecting rod (13), the adjusting block (10) is fixedly connected to the connecting rod (13), and the end of the connecting rod (13) away from the adjusting block (10) is fixedly connected to a connecting block (3).

5. The LED chip high thermal conductivity packaging substrate according to claim 4, characterized in that: A first spring (14) is sleeved on the outside of the connecting rod (13) and on one side of the adjusting block (10).

6. The LED chip high thermal conductivity packaging substrate according to claim 1, characterized in that: The outer side of the packaging substrate body (1) is symmetrically provided with mounting holes.

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